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    Materials for Electronic Packaging
    Unavailable
    Materials for Electronic Packaging
    Unavailable
    Materials for Electronic Packaging
    Ebook297 pages7 hours

    Materials for Electronic Packaging

    By Deborah D.L. Chung

    ()

    Currently unavailable

    Currently unavailable

    About this ebook

    Although materials play a critical role in electronic packaging, the vast majority of attention has been given to the systems aspect. Materials for Electronic Packaging targets materials engineers and scientists by focusing on the materials perspective.

    The last few decades have seen tremendous progress in semiconductor technology, creating a need for effective electronic packaging. Materials for Electronic Packaging examines the interconnections, encapsulations, substrates, heat sinks and other components involved in the packaging of integrated circuit chips. These packaging schemes are crucial to the overall reliability and performance of electronic systems.

    • Consists of 16 self-contained chapters, contributed by a variety of active researchers from industrial, academic and governmental sectors
    • Addresses the need of materials scientists/engineers, electrical engineers, mechanical engineers, physicists and chemists to acquire a thorough knowledge of materials science
    • Explains how the materials for electronic packaging determine the overall effectiveness of electronic systems
    LanguageEnglish
    PublisherElsevier Science
    Release dateMar 31, 1995
    ISBN9780080511177
    Unavailable
    Materials for Electronic Packaging
    Author

    Deborah D.L. Chung

    Professor Deborah D.L. Chung, Composite Materials Research Laboratory, University at Buffalo, State University of New York

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