Naming Rule

Motherboards

1
 Naming Rule for Intel Solution (ATX)
Model name
GA-Power Saving+Chipset name + Specific Feature + “-” +E +UDQ6/ DS5/ DS4/ DS3/ S3 + Minor Feature
GA- E P45 T - UD3 / DS3 R
Power saving
 E: Dynamic Energy Saver
Specific Features
 C: Combo solution(DDR+DDR2 or DDR2+DDR3)
 T: DDR3
Easy Energy Saver : E
Suffix Definition
 Extreme :Durability +Overclocking + Water Cooling+ Hybrid Silent-Pipe2
 DQ6: Durability + Quad Cooling+ Quad BIOS+ Quad e-SATA+ Quad-Triple Phase+
Quad Core Optimized+ Quad DDR2/DDR3 Slots
 UD5 / DS5: U(2 OZ PCB)+Durability + CrossFire/SLI+ Silent Pipe+ Speed+ Smart+ Safe
 UD4 / DS4: U(2 OZ PCB)+Durability + CrossFire/SLI +Silent Pipe+ Speed+ Smart+ Safe
 UD3/ DS3: U(2 OZ PCB)+Durability + Speed+ Smart+ Safe
 US3 / S3 : U(2 OZ PCB) +Speed+ Smart+ Safe
Minor Feature
 “P”: Performance Plus
 “R”: ICH10R
 “L” / “C” / “E” / “G”: minor/customized spec change version

2
 Naming Rule for Intel Solution (mATX)
Model name
GA-Power Saving+ Chipset name + “M” + Specific Feature + “-” +E+ DS2/ S2 + Minor Feature
ex. GA- E G45 M - UD2 H
Power saving
 E: Dynamic Energy Saver
Form Factor
 M: Micro ATX
Specific Features
 C: Combo solution( DDR2+DDR3)
 T: DDR3
Easy Energy Saver : E
Suffix Definition
 UD2/DS2: U(2 OZ PCB)+Durability+ Smart+ Safe
 US2/S2: U(2 OZ PCB) + Smart+ Safe
Minor Feature
 “H”: HDMI
 “F”: Firewire
 “R”: ICH9R, ICH10R
 “L” / “C” / “E” / “G”: minor/customized spec change version

3
 Naming Rule for Intel 3rd party (ATX)

Model name =
GA- Chipset marketing name + Specific Feature + “-” + DQ6/ DS5/ DS4/ DS3/S3 + Minor
Feature

NV C72 P (Chipset Project name) nForce 750i SLI (Chipset marketing name)
=> 750SLI-DS4 (Model name)

Specific Features
 C: Combo solution(DDR+DDR2 or DDR2+DDR3)
 T: DDR3

Suffix Definition
 DQ6: Durability + Quad Cooling+ Quad BIOS+ Quad e-SATA+ Quad-Triple Phase+
Quad Core Optimized+ Quad DDR2/DDR3 Slots
 DS5: Durability + SLI + Silent Pipe + Speed+ Smart+ Safe
 DS4: Durability + Silent Pipe+ Speed+ Smart+ Safe
 DS3: Durability + Speed+ Smart+ Safe
 S3: Speed+ Smart+ Safe
Minor Feature
 “H”: HDMI
 “L” / “C” / “E” / “G”: minor/customized spec change version

4
 Naming Rule for Intel 3rd party (mATX)

Model name =
GA- Chipset engineer name + “M” + Specific Feature + “-” + DS2/ S2 + Minor
Feature
i.e., NV C73 PV (Chipset engineer name)
=> 73PVM-S2H (Model name);

NV C73V (Chipset engineer name)

=> 73VM-S2 (Model name)
Form Factor
 M: Micro ATX
Specific Features
 C: Combo solution(DDR+DDR2 or DDR2+DDR3)
 T: DDR3
Suffix Definition
 DS2: Durability + Smart+ Safe
 S2: + Smart+ Safe
Minor Feature
 “H”: HDMI
 “L” / “C” / “E” / “G”: minor/customized spec change version

5
 Naming Rule for AMD AM2+ (ATX)
Model name =
GA- M + A + Chipset marketing name + Specific Feature + “-” + DQ6/ DS5/ DS4/ DS3/ S3 + Minor
Feature
i.e., NV MCP72 P (Chipset engineer name) nForce 750a SLI (Chipset marketing name)
=> M750SLI-DS4 (Model name);
AMD RD790 (Chipset engineer name) AMD 790X (Chipset marketing name)
=> MA790XT-UD5P (Model name)
AMD RS780D (Chipset engineer name) AMD 790G (Chipset marketing name)
=> MA790GP-UD4H (Model name)

M
 AMD Platform
A
 AMD Chipset (if NV chipset, model name will remove this letter)
Specific Features
 C: Combo solution(DDR+DDR2 or DDR2+DDR3)
 T: DDR3
 P: Sideport Memory
Suffix Definition
 UD5: U(2 OZ PCB)+ Durability + Silent Pipe + SLI/ CrossFire + Speed+ Smart+ Safe
 UD4: U(2 OZ PCB)+ Durability + Silent Pipe + SLI/ CrossFire + Speed+ Smart+ Safe
 UD3: U(2 OZ PCB)+ Durability + Speed+ Smart+ Safe
 US3: U(2 OZ PCB)+ + Speed+ Smart+ Safe
Minor Feature
 “H”: HDMI
 “P”: Performance Plus
 “L” / “C” / “E” / “G”: minor/customized spec change version

6
 Naming Rule for AMD AM2+ Solution (mATX)
Model name =
GA- “M” + “A” + Chipset engineer name + “M” + Specific Feature + “-” + DS2/ S2 + Minor Feature
i.e., NV MCP78S(renamed to 85) (Chipset engineer name)
=> M85M-US2H (Model name)
AMD RS780G (Chipset engineer name)
=> MA78GM-UDS2H (Model name)

M
 AMD Platform
A
 AMD Chipset (if NV chipset, model name will remove this letter)

Form Factor
 M: Micro ATX

Specific Features
 C: Combo solution(DDR+DDR2 or DDR2+DDR3)
 T: DDR3
 P: Sideport Memory
Suffix Definition
 UD2/ DS2: U(2 OZ PCB) +Durability + Smart+ Safe
 US2/S2: U(2 OZ PCB) + Smart+ Safe

Minor Feature
 “H”: HDMI
 “P”: Performance Plus
 “L” / “C” / “E” / “G”: Minor/customized spec change version