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SOLDER PRODUCTS.
TECHNICAL
DATA
SHEET
Sn
Rem
Ag
0.2%
0.4%
Cu
0.6%
0.8%
Ni
0.04%
0.08%
Ge
0.005
0.02%
Bi
0.10%
Zn
0.001%
Al
0.001%
Sb
0.05%
Fe
0.02%
As
0.03%
Cd
Pb
0.002%
0.05%
Max
Max
Max
Max
Max
Max
Max
Max
Alloy
SnAg0.3Cu0.7
Shape
Rectangular Form
Density
7.4gm/cm at 20 C
Melting Temperature
217 C ~226 C.
Package Form
25Kgs
Application
Standards Considered
JIS-Z-3282
Shelf Life
10 Years
TECHNICAL SPECIFICATIONS
Technical Factors
Recommended
Specifications
260C to 272C
Dwell Time
3 Sec to 5 Sec
Immersion
Dross Recovery
In-House Specifications
Cu Content
<1%
Other Factors
Note: The recommendations stated above have been contributed for desired Solder Joints and shall
modify if required based on the end user Specifications.
For more details, please visit Our Website at www.persangalloy.com or write to us.
Regd Off & Works: