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Features

Mechanically and spectrally matchend to


the phototransistor.
Rohs compliant.

Package Dimensions

Description
This devices are made with PIN GaAs.

1ANODE
2CATHODE

28.0

5.8

0.5

8.7

4.9

2.54

1.5MAX

1.0

2.01.0mm
1

Dimension Tolerance (UNIT:mm)

Tolerance
Grade

0.5~3

3~6

6~30

30~120

0.1

0.2

0.3

0.5

Chip

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Lens Color

Material

Emitting Color

GaAs

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Water Clear

DATE:Jun/26/2010

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Selection Guide
Radiant Intensity(mW/sr)
IF=50mA

Part No

D+LED-LD5IR850

Viewing
Angle

Min

Typ

21/2
()

--

75

20

Note:
1. 21/2 is the angle from optical centerline where the luminous intensity is 1/2 the optical centerline value.
2.Tolerance of measurement of luminous intensity15%.

Electrical / Optical Characteristics at TA=25C


Typ

Units

1.5

--

10

uA

--

850

nm

1/2

--

50

nm

Item

Symbol

Forward Voltage

VF

Reverse Current

IR

Min

Test Conditions

IF=50mA
Peak Spectral Wavelength
Spectral Bandwidth

Note:
1.Tolerance of measurement of forward voltage0.1V.
2.Tolerance of measurement of peak Wavelength2.0nm.

Absolute Maximum ratings at Ta=25


Parameter

Symbol

IR1

Units

Power Dissipation

Pt

100

mW

DC Forward Current

IF

50

mA

Peak Forward Current[1]

iFS

300

mA

Operating Temperature

-30~80

Storage Temperature

-30~80

Note:
1.IFP ConditionsPulse Width10msec
2.Tsol Conditions3mm from the base of the epoxy bulb

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RELATIVE RADIANT INTENSITY

100

80

60

IR1
40

20

0
600

700

900

800

1000

WAVELENGTH (nm)

Forward Current vs.Forward Voltage


0 10 20

Relative Radaint Power

2.0

30

1.5

40
1.0

1.0

50

0.5

0.9
0.8
0.7

60
70
80
90

-40

-20

20

40

60

0.5 0.3 0.1 0.2 0.4 0.6

80

Ambient Temperature Ta()

Spatial Distribution

Radint Power Vs.Ambient Temperature


3.0

Radiant Power
Relative Value at IF=20mA

Forward Current If(mA)

60
50
40
30
20
10
0

0.8

1.0

1.2

1.4

1.6

1.8

2.0

Forward Voltage VF(V)

Forward Current Vs.Forward Voltage

2.5
2.0
1.5
1.0
0.5
0

10

20

30

40

50

60

If-Forward current (mA)

Radint Power Vs Forward Current

Remarks:
If special sorting is required (e.g.binning based on forward voltage or radiant intensity/luminous flux),the typical
accuracy of the sorting process is as follows:
1. Radiant intensity/Luminous Flux:15%.
2. Forward Voltage:0.1V.
Note:Accuracy may depend on the sorting parameters.

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DATE:Jun/26/2010

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Soldering:
1. Manual Of Soldering
The temperature of the iron tip should not be higher than 300and Soldering within 3 seconds per
solder-land is to be observed.
2. DIP soldering (Wave Soldering):
Preheating:120~150,within 120~180 sec.
Operation heating:2455 within 5 sec.260(Max)
Gradual Cooling (Avoid quenching).

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DATE:Jun/26/2010

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