Jul.

2010

DDR3 SDRAM Memory

Product Guide
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ⓒ 2010 Samsung Electronics Co., Ltd. All rights reserved.

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 Jul. 2010

Product Guide DDR3 SDRAM Memory

1. DDR3 SDRAM MEMORY ORDERING INFORMATION

1 2 3 4 5 6 7 8 9 10 11

K 4 B X X X X X X X - X X X X
SAMSUNG Memory Speed
DRAM Temp & Power
DRAM Type Package Type
Density Revision
Bit Organization Interface (VDD, VDDQ)
# of Internal Banks

1. SAMSUNG Memory : K 7. Interface ( VDD, VDDQ)

6 : SSTL (1.5V, 1.5V)

2. DRAM : 4
8. Revision
M : 1st Gen.
3. DRAM Type A : 2nd Gen.
B : DDR3 SDRAM B : 3rd Gen.
C : 4th Gen.
D : 5th Gen.
4. Density E : 6th Gen.
F : 7th Gen.
51 : 512Mb
G : 8th Gen.
1G : 1Gb
H : 9th Gen.
2G : 2Gb
4G : 4Gb

9. Package Type
Z : FBGA (Lead-free)
5. Bit Organization
H : FBGA (Halogen-free & Lead-free)
04 : x 4 J : FBGA (Lead-free, DDP)
08 : x 8 M : FBGA (Halogen-free & Lead-free, DDP)
16 : x16 B : FBGA (Halogen-free & Lead-free, Flip Chip)

10. Temp & Power

C : Commercial Temp.( 0°C ~ 85°C) & Normal Power
Y : Commercial Temp.( 0°C ~ 85°C) & Low VDD(1.35V)
6. # of Internal Banks
3 : 4 Banks
4 : 8 Banks 11. Speed
5 : 16 Banks F7 : DDR3-800 (400MHz @ CL=6, tRCD=6, tRP=6)
F8 : DDR3-1066 (533MHz @ CL=7, tRCD=7, tRP=7)
H9 : DDR3-1333 (667MHz @ CL=9, tRCD=9, tRP=9)
K0 : DDR3-1600 (800MHz @ CL=11, tRCD=11, tRP=11)
MA : DDR3-1866 (933MHz @ CL=13, tRCD=13, tRP=13)

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 Jul. 2010

Product Guide DDR3 SDRAM Memory

2. DDR3 SDRAM Component Product Guide
Package & Power,
Density Banks Part Number Org. VDD Voltage PKG Avail. NOTE
Temp. (-C/-L) & Speed
K4B1G0446F HC(L)F8/H9/K0 256M x 4
1.5V
K4B1G0846F HC(L)F8/H9/K0 128M x 8 78 ball
1Gb F-die 8Banks Now
K4B1G0446F HY(L)F8/H9 256M x 4 FBGA
1.35V
K4B1G0846F HY(L)F8/H9 128M x 8
K4B1G0446G BC(L)F8/H9/K0/MA 256M x 4
1.5V
K4B1G0846G BC(L)F8/H9/K0/MA 128M x 8 78 ball
1Gb G-die 8Banks Dec.’10
K4B1G0446G BY(L)F8/H9/K0 256M x 4 FBGA
1.35V
K4B1G0846G BY(L)F8/H9/K0 128M x 8
K4B2G0446C HC(L)F8/H9/K0 512M x 4
1.5V
K4B2G0846C HC(L)F8/H9/K0 256M x 8 78 ball
2Gb C-die 8Banks Now
K4B2G0446C HY(L)F8/H9 512M x 4 FBGA
1.35V
K4B2G0846C HY(L)F8/H9 256M x 8
K4B2G0446D HC(L)F8/H9/K0/MA 512M x 4
1.5V
K4B2G0846D HC(L)F8/H9/K0/MA 256M x 8 78 ball
2Gb D-die 8Banks Now
K4B2G0446D HY(L)F8/H9/K0 512M x 4 FBGA
1.35V
K4B2G0846D HY(L)F8/H9/K0 256M x 8
K4B4G0446A HC(L)F8/H9/K0 1G x 4
1.5V
K4B4G0846A HC(L)F8/H9/K0 512M x 8 78 ball
4Gb A-die 8Banks FBGA Now
K4B4G0446A HY(L)F8/H9/K0 1G x 4
1.35V
K4B4G0846A HY(L)F8/H9/K0 512M x 8
K4B4G0446B HC(L)F8/H9/K0/MA 1G x 4
1.5V
K4B4G0846B HC(L)F8/H9/K0/MA 512M x 8 78 ball
4Gb B-die 8Banks FBGA Jun.’11
K4B4G0446B HY(L)F8/H9/K0 1G x 4
1.35V
K4B4G0846B HY(L)F8/H9/K0 512M x 8
K4B4G0446C MC(L)F7/F8/H9 1G x 4 78 ball
DDP 4Gb C-die 8Banks 1.5V Now
K4B4G0846C MC(L)F7/F8/H9 512M x 8 FBGA

K4B4G0446D MC(L)F8/H9/K0/MA 1G x 4
1.5V
K4B4G0846D MC(L)F8/H9/K0/MA 512M x 8 78 ball
DDP 4Gb D-die 8Banks Dec.’10
K4B4G0446D MY(L)F8/H9/K0 1G x 4 FBGA
1.35V
K4B4G0846D MY(L)F8/H9/K0 512M x 8
* NOTE : 1.35V product is 1.5V operatable.

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 Jul. 2010

Product Guide DDR3 SDRAM Memory

3. DDR3 SDRAM Module Ordering Information
1 2 3 4 5 6 7 8 9 10 11 12

M X X X B X X X X X X X - X X X
Memory Module
DIMM Type
Data bits Speed
DRAM Component Type Temp & Power
Depth PCB Revision
# of Banks in Comp. & Interface Package
Bit Organization Component Revision

1. Memory Module : M 8. Component Revision

M : 1st Gen. A : 2nd Gen.
B : 3rd Gen. C : 4th Gen.
2. DIMM Type D : 5th Gen. E : 6th Gen.
F : 7th Gen. G : 8th Gen.
3 : DIMM
4 : SODIMM
9. Package
3. Data Bits Z : FBGA(Lead-free)
H : FBGA(Lead-free & Halogen-free)
71 : x64 204pin Unbuffered SODIMM J : FBGA(Lead-free, DDP)
78 : x64 240pin Unbuffered DIMM
91 : x72 240pin ECC unbuffered DIMM M : FBGA(Lead-free & Halogen-free, DDP)
92 : x72 240pin VLP Registered DIMM B : FBGA (Halogen-free & Lead-free, Flip Chip)
93 : x72 240pin Registered DIMM

10. PCB Revision

4. DRAM Component Type 0 : None 1 : 1st Rev.
B : DDR3 SDRAM (1.5V VDD) 2 : 2nd Rev. 3 : 3rd Rev.
4 : 4th Rev. S : Reduced Layer

5. Depth
11. Temp & Power
32 : 32M 33 : 32M (for 128Mb/512Mb) C : Commercial Temp.( 0°C ~ 85°C) & Normal Power
64 : 64M 65 : 64M (for 128Mb/512Mb) Y : Commercial Temp.( 0°C ~ 85°C) & Low VDD(1.35V)
28 : 128M 29 : 128M (for 128Mb/512Mb)
56 : 256M 57 : 256M (for 512Mb/2Gb)
51 : 512M 52 : 512M (for 512Mb/2Gb)
12. Speed
1G: 1G 1K : 1G (for 2Gb)
2G: 2G 2K : 2G (for 2Gb) F7 : DDR3-800 (400MHz @ CL=6, tRCD=6, tRP=6)
4G: 4G F8 : DDR3-1066 (533MHz @ CL=7, tRCD=7, tRP=7)
H9 : DDR3-1333 (667MHz @ CL=9, tRCD=9, tRP=9)
K0 : DDR3-1600 (800MHz @ CL=11, tRCD=11, tRP=11)
MA: DDR3-1866 (933MHz @ CL=13, tRCD=13, tRP=13)
6. # of Banks in comp. & Interface
7 : 8Banks & SSTL-1.5V
NOTE: PC3-6400(DDR3-800),PC3-8500(DDR3-1066),
PC3-10600(DDR3-1333), PC3-12800(DDR3-1600)
PC3-14900(DDR3-1866)

7. Bit Organization
0 : x4
3 : x8
4 : x16

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 Jul. 2010

Product Guide DDR3 SDRAM Memory

4. DDR3 SDRAM Module Product Guide
4.1 240Pin DDR3 Unbuffered DIMM (1.5V Product)
240Pin DDR3 Unbuffered DIMM
Comp. Internal
Org. Density Part Number Speed Raw Card Composition Rank PKG Height Avail. NOTE
Version Banks
M378B2873FH0 CF8/H9/K0 128M x 8 * 8 pcs 1Gb F-die 78 ball Now
128Mx 64 1GB A(1Rx8) 8 1 30mm
M378B2873GB0 CF8/H9/K0/MA 128M x 8 * 8 pcs 1Gb G-die FBGA Dec.’10
M391B2873FH0 CF8/H9/K0 128M x 8 * 9 pcs 1Gb F-die 78 ball Now
128Mx 72 1GB D(1Rx8) 8 1 30mm
M391B2873GB0 CF8/H9/K0/MA 128M x 8 * 9 pcs 1Gb G-die FBGA Dec.’10
M378B5673FH0 CF8/H9/K0 B(2Rx8) 128M x 8 * 16 pcs 1Gb F-die 8 2
78 ball
256Mx 64 2GB M378B5773CH0 CF8/H9/K0 256M x 8 * 8 pcs 2Gb C-die 30mm Now
A(1Rx8) 8 FBGA
M378B5773DH0 CF8/H9/K0/MA 256M x 8 * 8 pcs 2Gb D-die 1
M391B5673FH0 CF8/H9/K0 E(2Rx8) 128M x 8 * 18 pcs 1Gb F-die 8 2
78 ball
256Mx 72 2GB M391B5773CH0 CF8/H9/K0 256M x 8 * 9 pcs 2Gb C-die 30mm Now
D(1Rx8) 8 1 FBGA
M391B5773DH0 CF8/H9/K0/MA 256M x 8 * 9 pcs 2Gb D-die
M378B5273CH0 CF8/H9/K0 256M x 8 * 16 pcs 2Gb C-die 78 ball
512Mx 64 4GB B(2Rx8) 8 2 30mm Now
M378B5273DH0 CF8/H9/K0/MA 256M x 8 * 16 pcs 2Gb D-die FBGA

M391B5273CH0 CF8/H9/K0 256M x 8 * 18 pcs 2Gb C-die 78 ball

512Mx 72 4GB E(2Rx8) 8 2 30mm Now
M391B5273DH0 CF8/H9/K0/MA 256M x 8 * 18 pcs 2Gb D-die FBGA

M378B1G73AH0 CF8/H9/K0 512M x 8 * 16 pcs 4Gb A-die 78 ball Now

1Gx 64 8GB B(2Rx8) 8 2 30mm
M378B1G73BH0 CF8/H9/K0/MA 512M x 8 * 16 pcs 4Gb B-die FBGA May.’11
M391B1G73AH0 CF8/H9/K0 512M x 8 * 18 pcs 4Gb A-die 78 ball Now
1Gx 72 8GB E(2Rx8) 8 2 30mm
M391B1G73BH0 CF8/H9/K0/MA 512M x 8 * 18 pcs 4Gb B-die FBGA May.’11

4.2 240Pin DDR3 Unbuffered DIMM (1.35V Product)

240Pin DDR3 Unbuffered DIMM
Comp. Internal
Org. Density Part Number Speed Raw Card Composition Rank PKG Height Avail. NOTE
Version Banks
M391B2873FH0 YF8/H9 128M x 8 * 9 pcs 1Gb F-die 78 ball Now
128Mx 72 1GB D(1Rx8) 8 1 30mm
M391B2873GB0 YF8/H9/K0 128M x 8 * 9 pcs 1Gb G-die FBGA Dec.’10
78 ball
M391B5673FH0 YF8/H9 E(2Rx8) 128M x 8 * 18 pcs 1Gb F-die 8 2 30mm Now
FBGA
256Mx 72 2GB
M391B5773CH0 YF8/H9 256M x 8 * 9 pcs 2Gb C-die 78 ball
D(1Rx8) 8 1 30mm Now
M391B5773DH0 YF8/H9/K0 256M x 8 * 9 pcs 2Gb D-die FBGA

M391B5273CH0 YF8/H9 256M x 8 * 18 pcs 2Gb C-die 78 ball

512Mx 72 4GB E(2Rx8) 8 2 30mm Now
M391B5273DH0 YF8/H9/K0 256M x 8 * 18 pcs 2Gb D-die FBGA

M391B1G73AH0 YF8/H9 512M x 8 * 18 pcs 4Gb A-die 78 ball Now

1Gx 72 8GB E(2Rx8) 8 2 30mm
M391B1G73BH0 YF8/H9/K0 512M x 8 * 18 pcs 4Gb B-die FBGA May.’11

* NOTE : 1.35V product is 1.5V operatable.

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 Jul. 2010

Product Guide DDR3 SDRAM Memory

4.3 204Pin DDR3 SoDIMM (1.5V Product)
204Pin DDR3 SODIMM
Comp. Internal
Org. Density Part Number Speed Raw Card Composition Rank PKG Height Avail. NOTE
Version Banks
M471B2873FHS CF8/H9 64M x 16 * 8 pcs 1Gb F-die 78 ball Now
128Mx 64 1GB B(1Rx8) 8 1 30mm
M471B2873GB0 CF8/H9/K0/MA 64M x 16 * 8 pcs 1Gb G-die FBGA Dec.’10
78 ball
M471B5673FH0 CF8/H9 F(2Rx8) 128M x 8 * 16 pcs 1Gb F-die 8 2 30mm Now
FBGA
256Mx 64 2GB
M471B5773CHS CF8/H9 256M x 8 * 8 pcs 2Gb C-die 78 ball
B(1Rx8) 8 1 30mm Now
M471B5773DH0 CF8/H9/K0/MA 256M x 8 * 8 pcs 2Gb D-die FBGA

M471B5273CH0 CF8/H9 256M x 8 * 16 pcs 2Gb C-die 78 ball

512Mx 64 4GB F(2Rx8) 8 2 30mm Now
M471B5273DH0 CF8/H9/K0/MA 256M x 8 * 16 pcs 2Gb D-die FBGA

M471B1G73AH0 CF8/H9 512M x 8 * 16 pcs 4Gb A-die 78 ball Now

1Gx 64 8GB F(2Rx8) 8 2 30mm
M471B1G73BH0 CF8/H9/K0/MA 512M x 8 * 16 pcs 4Gb B-die FBGA May.’11

4.4 204Pin DDR3 SoDIMM (1.35V Product)

204Pin DDR3 SODIMM
Comp. Internal
Org. Density Part Number Speed Raw Card Composition Rank PKG Height Avail. NOTE
Version Banks
M471B2873FHS YF8/H9 128M x 8 * 8 pcs 1Gb F-die 78 ball Now
128Mx 64 1GB B(1Rx8) 8 1 30mm
M471B2873GB0 YF8/H9/K0 128M x 8 * 8 pcs 1Gb G-die FBGA Dec.’10
M471B5673FH0 YF8/H9 F(2Rx8) 128M x 8 * 16 pcs 1Gb F-die 8 2
78 ball
256Mx 64 2GB M471B5773CHS YF8/H9 256M x 8 * 8 pcs 2Gb C-die 30mm Now
B(1Rx8) 8 1 FBGA
M471B5773DH0 YF8/H9/K0 256M x 8 * 8 pcs 2Gb D-die
M471B5273CH0 YF8/H9 256M x 8 * 16 pcs 2Gb C-die 78 ball
512Mx 64 4GB F(2Rx8) 8 2 30mm Now
M471B5273DH0 YF8/H9/K0 256M x 8 * 16 pcs 2Gb D-die FBGA

M471B1G73AH0 YF8/H9 512M x 8 * 16 pcs 4Gb A-die 78 ball Now

1Gx 64 8GB F(2Rx8) 8 2 30mm
M471B1G73BH0 YF8/H9/K0 512M x 8 * 16 pcs 4Gb B-die FBGA May.’11

* NOTE : 1.35V product is 1.5V operatable.

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 Jul. 2010

Product Guide DDR3 SDRAM Memory

4.5 240Pin DDR3 Registered DIMM (1.5V Product)
240Pin DDR3 Registered DIMM
Comp. Internal
Org. Density Part Number Speed Raw Card Composition Rank PKG Height Avail. NOTE
Version Banks
M393B2873FH0 CF8/H9 128M x 8 * 9 pcs 1Gb F-die 78 ball Now
128Mx 72 1GB A(1Rx8) 8 1 30mm
M393B2873GB0 CF8/H9/K0/MA 128M x 8 * 9 pcs 1Gb G-die FBGA Jan.’11
M393B5673FH0 CF8/H9 128M x 8 * 18 pcs 1Gb F-die Now
B(2Rx8) 8 2
M393B5673GB0 CF8/H9/K0/MA 128M x 8 * 18 pcs 1Gb G-die Jan.’11
78 ball
256Mx 72 2GB M393B5670FH0 CF8/H9 C(1Rx4) 256M x 4 * 18 pcs 1Gb F-die 8 1 30mm
FBGA Now
M393B5773CH0 CF8/H9 256M x 8 * 9 pcs 2Gb C-die
A(1Rx8) 8 1
M393B5773DH0 CF8/H9/K0/MA 256M x 8 * 9 pcs 2Gb D-die Nov.’10
M393B5173FH0 CF8/H9 128M x 8 * 36 pcs 1Gb F-die Now
H(4Rx8) 8 4
M393B5173GB0 CF8/H9/K0/MA 128M x 8 * 36 pcs 1Gb G-die Jan.’11
M393B5170FH0 CF8/H9 E(2Rx4) 256M x 4 * 36 pcs 1Gb F-die 8 2
78 ball Now
512Mx 72 4GB M393B5273CH0 CF8/H9 256M x 8 * 18 pcs 2Gb C-die 30mm
B(2Rx8) 8 2 FBGA
M393B5273DH0 CF8/H9/K0/MA 256M x 8 * 18 pcs 2Gb D-die Nov.’10
M393B5270CH0 CF8/H9 512M x 4 * 18 pcs 2Gb C-die Now
C(1Rx4) 8 1
M393B5270DH0 CF8/H9/K0/MA 512M x 4 * 18 pcs 2Gb D-die Nov.’10
M393B1K73CH0 CF8/H9 256M x 8 * 36 pcs 2Gb C-die Now
H(4Rx8) 8 4
M393B1K73DH0 CF8/H9/K0/MA 256M x 8 * 36 pcs 2Gb D-die 78 ball Nov.’10
1Gx 72 8GB 30mm
M393B1K70CH0 CF8/H9 512M x 4 * 36 pcs 2Gb C-die FBGA Now
E(2Rx4) 8 2
M393B1K70DH0 CF8/H9/K0/MA 512M x 4 * 36 pcs 2Gb D-die Nov.’10
DDP
M393B2K70CM0 CF8/H9 x 4 * 36 pcs 2Gb C-die Now
1G
AB(4Rx4) 8 4
DDP
M393B2K70DM0 CF8/H9 x 4 * 36 pcs 2Gb D-die Dec.’10
1G
78 ball
2Gx 72 16GB M393B2G70AH0 CF8/H9 1G x 4 * 36 pcs 4Gb A-die 30mm Now
FBGA
E(2Rx4) 8 2
M393B2G70BH0 CF8/H9 1G x 4 * 36 pcs 4Gb B-die Jul.’11
M393B2G73AH0 CF8/H9 512M x 8 * 36 pcs 4Gb A-die Now
H(4Rx8) 8 4
M393B2G73BH0 CF8/H9 512M x 8 * 36 pcs 4Gb B-die Jul.’11
DDP
M393B4G70AM0 CF8/H9 x 4 * 36 pcs 4Gb A-die Now
2G 78 ball
4Gx 72 32GB AB(4Rx4) 8 4 30mm
DDP FBGA
M393B4G70BM0 CF8/H9 x 4 * 36 pcs 4Gb B-die Aug.’11
2G

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 Jul. 2010

Product Guide DDR3 SDRAM Memory

4.6 240Pin DDR3 Registered DIMM (1.35V Product)
240Pin DDR3 Registered DIMM
Comp. Internal
Org. Density Part Number Speed Raw Card Composition Rank PKG Height Avail. NOTE
Version Banks
M393B2873FH0 YF8/H9 128M x 8 * 9 pcs 1Gb F-die 78 ball Now
128Mx 72 1GB A(1Rx8) 8 1 30mm
M393B2873GB0 YF8/H9/K0 128M x 8 * 9 pcs 1Gb G-die FBGA Jan.’11
M393B5673FH0 YF8/H9 128M x 8 * 18 pcs 1Gb F-die Now
B(2Rx8) 8 2
M393B5673GB0 YF8/H9/K0 128M x 8 * 18 pcs 1Gb G-die Jan.’11
78 ball
256Mx 72 2GB M393B5670FH0 YF8/H9 C(1Rx4) 256M x 4 * 18 pcs 1Gb F-die 8 1 30mm
FBGA Now
M393B5773CH0 YF8/H9 256M x 8 * 9 pcs 2Gb C-die
A(1Rx8) 8 1
M393B5773DH0 YF8/H9/K0 256M x 8 * 9 pcs 2Gb D-die Nov.’10
M393B5173FH0 YF8/H9 128M x 8 * 36 pcs 1Gb F-die Now
H(4Rx8) 8 4
M393B5173GB0 YF8/H9/K0 128M x 8 * 36 pcs 1Gb G-die Jan.’11
M393B5170FH0 YF8/H9 E(2Rx4) 256M x 4 * 36 pcs 1Gb F-die 8 2
78 ball Now
512Mx 72 4GB M393B5273CH0 YF8/H9 256M x 8 * 18 pcs 2Gb C-die 30mm
B(2Rx8) 8 2 FBGA
M393B5273DH0 YF8/H9/K0 256M x 8 * 18 pcs 2Gb D-die Nov.’10
M393B5270CH0 YF8/H9 512M x 4 * 18 pcs 2Gb C-die Now
C(1Rx4) 8 1
M393B5270DH0 YF8/H9/K0 512M x 4 * 18 pcs 2Gb D-die Nov.’10
M393B1K73CH0 YF8/H9 256M x 8 * 36 pcs 2Gb C-die Now
H(4Rx8) 8 4
M393B1K73DH0 YF8/H9/K0 256M x 8 * 36 pcs 2Gb D-die 78 ball Nov.’10
1Gx 72 8GB 30mm
M393B1K70CH0 YF8/H9 512M x 4 * 36 pcs 2Gb C-die FBGA Now
E(2Rx4) 8 2
M393B1K70DH0 YF8/H9/K0 512M x 4 * 36 pcs 2Gb D-die Nov.’10
DDP
M393B2K70CM0 YF8/H9 x 4 * 36 pcs 2Gb C-die Now
1G
AB(4Rx4) 8 4
DDP
M393B2K70DM0 YF8 x 4 * 36 pcs 2Gb D-die Dec.’10
1G
78 ball
2Gx 72 16GB M393B2G70AH0 YF8/H9 1G x 4 * 36 pcs 4Gb A-die 30mm Now
FBGA
E(2Rx4) 8 2
M393B2G70BH0 YF8/H9/K0 1G x 4 * 36 pcs 4Gb B-die Jul.’11
M393B2G73AH0 YF8/H9 512M x 8 * 36 pcs 4Gb A-die Now
H(4Rx8) 8 4
M393B2G73BH0 YF8/H9 512M x 8 * 36 pcs 4Gb B-die Jul.’11
DDP
M393B4G70AM0 YF8/H9 AB(4Rx4) x 4 * 36 pcs 4Gb A-die Now
2G 78 ball
4Gx 72 32GB 8 4 30mm
DDP FBGA
M393B4G70BM0 YF8/H9 AB(4Rx4) x 4 * 36 pcs 4Gb B-die Aug.’11
2G

* NOTE : 1.35V product is 1.5V operatable.

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 Jul. 2010

Product Guide DDR3 SDRAM Memory

4.7 240Pin DDR3 VLP Registered DIMM (1.5V Product)
240Pin DDR3 VLP Registered DIMM
Comp. Internal
Org. Density Part Number Speed Raw Card Composition Rank PKG Height Avail. NOTE
Version Banks
M392B2873FH0 CF8/H9 128M x 8 * 9 pcs 1Gb F-die 78 ball Now
128Mx 72 1GB K(1Rx8) 8 1 18.75mm
M392B2873GB0 CF8/H9/K0/MA 128M x 8 * 9 pcs 1Gb G-die FBGA Feb.’11
M392B5673FH0 CF8/H9 128M x 8 * 18 pcs 1Gb F-die Now
L(2Rx8) 8 2
M392B5673GB0 CF8/H9/K0/MA 128M x 8 * 18 pcs 1Gb G-die Feb.’11
78 ball
256Mx 72 2GB M392B5670FH0 CF8/H9 M(1Rx4) 256M x 4 * 18 pcs 1Gb F-die 8 1 18.75mm
FBGA Now
M392B5773CH0 CF8/H9 256M x 8 * 9 pcs 2Gb C-die
K(1Rx8) 8 1
M392B5773DH0 CF8/H9/K0/MA 256M x 8 * 9 pcs 2Gb D-die Nov.’10
DDP
M392B5170FM0 CF8/H9 N(2Rx4) x 4 * 18 pcs 1Gb F-die 8 2
512M Now
M392B5273CH0 CF8/H9 256M x 8 * 18 pcs 2Gb C-die
L(2Rx8) 8 2 78 ball
512Mx 72 4GB 18.75mm
M392B5273DH0 CF8/H9/K0/MA 256M x 8 * 18 pcs 2Gb D-die FBGA Nov.’10
M392B5270CH0 CF8/H9 512M x 4 * 18 pcs 2Gb C-die Now
M(1Rx4) 8 1
M392B5270DH0 CF8/H9/K0/MA 512M x 4 * 18 pcs 2Gb D-die Nov.’10
DDP
M392B1K73CM0 CF8/H9 x 8 * 18 pcs 2Gb C-die Now
512M
V(4Rx8) 8 4
DDP
M392B1K73DM0 CF8/H9 x 8 * 18 pcs 2Gb D-die Dec.’10
512M
DDP 78 ball
1Gx 72 8GB M392B1K70CM0 CF8/H9 x 4 * 18 pcs 2Gb C-die 18.75mm Now
1G FBGA
N(2Rx4) 8 2
DDP
M392B1K70DM0 CF8/H9/K0/MA x 4 * 18 pcs 2Gb D-die Dec.’10
1G
M392B1G73BH0 CF8/H9/K0/MA L(1Rx8) 512M x8 * 18 pcs 4Gb B-die 8 1
Jul.’11
M392B1G70BH0 CF8/H9/K0/MA M(1Rx4) 1G x4 * 18 pcs 4Gb B-die 8 1
DDP
M392B2G70AM0 CF8/H9 x4 * 18 pcs 4Gb A-die Now
2G
N(2Rx4) 8 2
DDP
M392B2G70BM0 CF8/H9/K0/MA x4 * 18 pcs 4Gb B-die Aug.’11
2G 78 ball
2Gx 72 16GB 18.75mm
DDP FBGA
M392B2G73AM0 CF8/H9 x8 * 18 pcs 4Gb A-die Now
1G
V(4Rx8) 8 4
DDP
M392B2G73BM0 CF8/H9 x8 * 18 pcs 4Gb B-die Aug.’11
1G

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 Jul. 2010

Product Guide DDR3 SDRAM Memory

4.8 240Pin DDR3 VLP Registered DIMM (1.35V Product)
240Pin DDR3 VLP Registered DIMM
Comp. Internal
Org. Density Part Number Speed Raw Card Composition Rank PKG Height Avail. NOTE
Version Banks
M392B2873FH0 YF8/H9 128M x 8 * 9 pcs 1Gb F-die 78 ball Now
128Mx 72 1GB K(1Rx8) 8 1 18.75mm
M392B2873GB0 YF8/H9/K0 128M x 8 * 9 pcs 1Gb G-die FBGA Feb.’11
M392B5673FH0 YF8/H9 128M x 8 * 18 pcs 1Gb F-die Now
L(2Rx8) 8 2
M392B5673GB0 YF8/H9/K0 128M x 8 * 18 pcs 1Gb G-die Feb.’11
78 ball
256Mx 72 2GB M392B5670FH0 YF8/H9 M(1Rx4) 256M x 4 * 18 pcs 1Gb F-die 8 1 18.75mm
FBGA Now
M392B5773CH0 YF8/H9 512M x 4 * 9 pcs 2Gb C-die
K(1Rx8) 8 1
M392B5773DH0 YF8/H9/K0 512M x 4 * 9 pcs 2Gb C-die Nov.’10
DDP
M392B5170FM0 YF8/H9 N(2Rx4) x 4 * 18 pcs 1Gb F-die 8 2
512M Now
M392B5273CH0 YF8/H9 256M x 8 * 18 pcs 2Gb C-die
L(2Rx8) 8 2 78 ball
512Mx 72 4GB 18.75mm
M392B5273DH0 YF8/H9/K0 256M x 8 * 18 pcs 2Gb D-die FBGA Nov.’10
M392B5270CH0 YF8/H9 512M x 4 * 18 pcs 2Gb C-die Now
M(1Rx4) 8 1
M392B5270DH0 YF8/H9/K0 512M x 4 * 18 pcs 2Gb D-die Nov.’10
DDP
M392B1K73CM0 YF8 x 8 * 18 pcs 2Gb C-die Now
512M
V(4Rx8) 8 4
DDP
M392B1K73DM0 YF8 x 8 * 18 pcs 2Gb D-die Dec.’10
512M
DDP 78 ball
1Gx 72 8GB M392B1K70CM0 YF8/H9 x 4 * 18 pcs 2Gb C-die 18.75mm Now
1G FBGA
N(2Rx4) 8 2
DDP
M392B1K70DM0 YF8/H9/K0 x 4 * 18 pcs 2Gb D-die Dec.’10
1G
M392B1G73BH0 YF8/H9/K0 L(1Rx8) 512M x8 * 18 pcs 4Gb B-die 8 1
Jul.’11
M392B1G70BH0 YF8/H9/K0 M(1Rx4) 1G x4 * 18 pcs 4Gb B-die 8 1
DDP
M392B2G70AM0 YF8/H9 x4 * 18 pcs 4Gb A-die Now
2G
N(2Rx4) 8 2
DDP
M392B2G70BM0 YF8/H9/K0 x4 * 18 pcs 4Gb B-die Aug.’11
2G 78 ball
2Gx 72 16GB 18.75mm
DDP FBGA
M392B2G73AM0 YF8/H9 x8 * 18 pcs 4Gb A-die Now
1G
V(4Rx8) 8 4
DDP
M392B2G73BM0 YF8/H9 x8 * 18 pcs 4Gb B-die Aug.’11
1G
* NOTE : 1.35V product is 1.5V operatable.

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 Jul. 2010

Product Guide DDR3 SDRAM Memory

5. RDIMM RCD Information
5.1 5.1 RCD Identification in JEDEC Description in Module Label

5.2 5.2 Label Example

4GB 2Rx8 PC3 - 12800R - 11 - 10 - B1 - P2

Made in Korea M393B5270DH0-CK0 1020

5.3 RCD Information

- Example

Voltage Vendor Revision Module P/N JEDEC Description On Label

LV GS02 C0 M393B5170EH1-CH9 4GB 2Rx4 PC3-10600R-09-10-E1-P1

Inphi
UVGS02 M393B5270DH0-CK0 4GB 2Rx8 PC3-12800R-11-10-B1-P2
1.5V
LV DDR3 B0 M393B5170EH1-CH9 4GB 2Rx4 PC3-10600R-09-10-E1-D2
IDT
A1(evergreen) M393B5270DH0-CK0 4GB 2Rx8 PC3-12800R-11-10-B1-D3

LV GS02 C0 M393B5170EH1-YF8 4GB 2Rx4 PC3L-8500R-07-10-E1-P1

Inphi
UVGS02 M393B5273DH0-YH9 4GB 2Rx8 PC3L-10600R-09-10-B1-P2
1.35V
LV DDR3 B0 M393B5170EH1-YF8 4GB 2Rx4 PC3L-8500R-07-10-E1-D2
IDT
A1(evergreen) M393B5273DH0-YH9 4GB 2Rx8 PC3L-10600R-09-10-B1-D3

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 Jul. 2010

Product Guide DDR3 SDRAM Memory

6. Package Dimension
78Ball FBGA for 1Gb F-die (x4/x8) / 2Gb C-die (x4/x8) / 2Gb D-die (x4/x8)

7.50 ± 0.10

0.10MAX
A
0.80 x 8 = 6.40
#A1 INDEX MARK
(Datum A) 0.80 1.60 3.20
#A1 7.50 ± 0.10
9 8 7 6 5 4 3 2 1 B

A
B
C
(Datum B)
4.80
D
E 0.80 x 12 = 9.60

0.50 ± 0.05
0.80

11.00 ± 0.10

11.00 ± 0.10
F
G
H
J
K
0.80

L
M
N
0.35 ± 0.05
(0.95)
78 - ∅0.45 Solder ball
MOLDING AREA
(Post Reflow ∅0.05 ± 0.05) 1.10 ± 0.10
0.2 M A B (1.90)

Bottom Top

78Ball DDP for 2Gb C-die (x4/x8) / 2Gb D-die (x4/x8)

8.00 ± 0.10

0.10MAX
A
0.80 x 8 = 6.40
#A1 INDEX MARK
(Datum A) 0.80 1.60 3.20
#A1 8.00 ± 0.10
9 8 7 6 5 4 3 2 1 B

A
B
C
(Datum B)
4.80

D
E
0.80 x 12 = 9.60

11.00 ± 0.10
0.80

11.00 ± 0.10

F
G
H
J
K
0.80

L
M
N
0.35 ± 0.05
78 - ∅0.45 Solder ball
(Post Reflow ∅0.50 ± 0.05)
1.40 ± 0.10
0.2 M A B
BOTTOM VIEW TOP VIEW

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 Jul. 2010

Product Guide DDR3 SDRAM Memory

78Ball FBGA for 4Gb A-die (x4/x8)

10.00 ± 0.10
A

0.10MAX
0.80 x 8 = 6.40
3.20 #A1 INDEX MARK
(Datum A)
0.80 1.60
#A1 10.00 ± 0.10
B
9 8 7 6 5 4 3 2 1

A
B
C
(Datum B)
D 4.80

0.80 x 12 = 9.60
E
0.80

12.50 ± 0.10

12.50 ± 0.10
F
G
H
J
K
0.80

L
M
N

78 - ∅0.45 Solder ball (0.95) MOLDING AREA 0.35 ± 0.05

(Post Reflow ∅0.50 ± 0.05)
0.2 M A B (1.90) 1.10 ± 0.10

BOTTOM VIEW TOP VIEW

78Ball FBGA for 4Gb B-die (x4/x8)

10.00 ± 0.10
A

0.10MAX
0.80 x 8 = 6.40
3.20 #A1 INDEX MARK
(Datum A)
0.80 1.60 #A1 10.00 ± 0.10
B
9 8 7 6 5 4 3 2 1
A
B
C
(Datum B)
4.80

D
0.80 x 12 = 9.60

E
0.80

11.00 ± 0.10

11.00 ± 0.10

F
G
H
J
K
0.80

L
M
N

78 - ∅0.45 Solder ball 0.35 ± 0.05

(0.95) MOLDING AREA
(Post Reflow ∅0.50 ± 0.05)
1.10 ± 0.10
0.2 M A B (1.90)

BOTTOM VIEW TOP VIEW

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 Jul. 2010

Product Guide DDR3 SDRAM Memory

78Ball FBGA Flip chip for 1Gb G-die (x4/x8)

7.50 ± 0.10

0.10MAX
A
0.80 x 8 = 6.40
#A1 INDEX MARK
(Datum A) 0.80 1.60 3.20
#A1 7.50 ± 0.10
9 8 7 6 5 4 3 2 1 B

A
B
C
(Datum B) 4.80
D
E
0.80 x 12 = 9.60

0.50 ± 0.05
0.80

11.00 ± 0.10

11.00 ± 0.10
F
G
H
J
K
0.80

L
M
N
0.35 ± 0.05
78 - ∅0.48 Solder ball (0.30)
MOLDING AREA
(Post Reflow ∅0.05 ± 0.05) 1.10 ± 0.10
0.2 M A B (0.60)

Bottom Top

- 14 -
 Jul. 2010

Product Guide DDR3 SDRAM Memory

7. Module Dimension

x64/x72 240pin DDR3 SDRAM Unbuffered DIMM

Units : Millimeters

133.35 ± 0.15

(4X)3.00 ± 0.1
128.95

30.00 ± 0.15
N/A
9.50

(for x64)
SPD
ECC

17.30
(for x72)

2.30
(2)
2.50

54.675

A B
47.00 71.00 Max 4.0

N/A
(for x64)

ECC
(for x72)

1.270 ± 0.10
2.50 ± 0.20

5.00 2x 2.10 ± 0.15

0.80 ± 0.05

3.80 0.2 ± 0.15

1.50±0.10
1.00
2.50

Detail A Detail B

- 15 -
 Jul. 2010

Product Guide DDR3 SDRAM Memory

x64 204pin DDR3 SDRAM Unbuffered SODIMM

Units : Millimeters

67.60 0.10 M C A B

63.60
Max 3.8

30.00 ± 0.15
SPD
20.00

6
1.00 ± 0.10
24.80

A B

21.00 39.00
2X 1.80
0.10 M C A B
(OPTIONAL HOLES)

2X 4.00 ± 0.10
0.10 M C A B

0.60

0.45 ± 0.03
1.65

4.00 ± 0.10
2.55

1.00 ± 0.10 0.25 MAX

Detail A Detail B

- 16 -
 Jul. 2010

Product Guide DDR3 SDRAM Memory

x72 240pin DDR3 SDRAM Registered DIMM

Units : Millimeters
133.35 ± 0.15

(2X)3.00
128.95 Max 4.0
9.76 10.9 18.92 32.40 18.93 9.74

30.00 ± 0.15
9.50

Register

2.50

17.30
2.30
1.0 max
54.675
A B
1.27 ± 0.10
47.00 71.00
2.50 ± 0.20

5.00
0.80 ± 0.05

3.80 0.2 ± 0.15

10.9 0.4

2.50
50

1.50±0.10 1.00
0.
R

Detail A Detail B Detail C

2x 2.10 ± 0.15
Register

Address, Command and Control lines

- 17 -
 Jul. 2010

Product Guide DDR3 SDRAM Memory

Registered DIMM Heat Spreader Design

1. FRONT PART
Outside
133.15 ± 0.2
0.65 ± 0.2

1+0/ -0.3
130.45 ± 0.15
9.26 29.77
11.9 31.4 R0.2

23.6 ± 0.15
25.6 ± 0.15

25.6 ± 0.15
R
0.
1
4.65± 0.12

0.15
1.3 1

127 ± 0.12

2
2
2.6 ± 0.2

1.3

2 ± 0.1
Inside
0.4

Green Line : TIM Attatch Line

Reg. pedestal line

7.45

80.78
119.29
128.5

2. BACK PART
Outside

Inside
Green Line : TIM Attatch Line

- 18 -
 Jul. 2010

Product Guide DDR3 SDRAM Memory

3. CLIP PART
39.3 ± 0.2
Upper Bending
Tilting Gap
29.77
0.1 ~ 0.3

A
5
1.

B C
R

0.5

4. DDR3 RDIMM ASS’Y View

Reference thickness total (Maximum) : Mono Package : 7.55mm, DDP Package 7.71mm (With Clip thickness)

132.95 ± 133.45

1.05
1.27

39.3 ± 0.2
D
19 ± 0.1

19

text mark ’B’ or ’K’ E (Clip open size)

punch press_stamp

- 19 -
 Jul. 2010

Product Guide DDR3 SDRAM Memory

x72 240pin DDR3 SDRAM VLP Registered DIMM

Units : Millimeters

133.35 ± 0.15

128.95
C Max 4.0
9.76 20.92 32.40 20.93 9.74
18.75 ± 0.15

Register

54.675
A B
1.0 max
47.00 71.00
12.60

1.27 ± 0.10

SPD/TS

18.10
2.50 ± 0.20

5.00
0.80 ± 0.05
9.9

0.6
3.80
0.2 ± 0.15

1.50±0.10
50
0.

1.00
R

2.50

Detail A Detail B Detail C

Register
VTT

VTT
VTT
VTT

SPD/TS

Address, Command and Control lines

- 20 -
 Jul. 2010

Product Guide DDR3 SDRAM Memory

VLP Registered DIMM Heat Spreader Design

1. FRONT PART

Outside

130.45

67

8.69 20.82 17.9 6.4 20.82 8.69

0.4

14.3
Driver
IC(DP:0.18mm)

DRIVER IC 0.18 -0/+0.1

Inside

Driver
IC(DP:0.18mm)

2. BACK PART

Outside

Driver
IC(DP:0.18mm)

Inside

Driver
IC(DP:0.18mm)

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 Jul. 2010

Product Guide DDR3 SDRAM Memory

3. CLIP PART

7.4 ± 0.1 35.82 7.4 ± 0.1

9.16 ± 0.12

9.16 ± 0.12
9.16

Clip open size

3.2~4.5 0.1

SIDE-L FRONT SIDE-R

4. ASS’Y VIEW
Reference thickness total (Maximum) : 7.71 (With Clip thickness)
7.71

TIM Thickness 0.25

* Dimension Index

Mono DDP
Note
Min. Typ. Max. Min. Typ. Max.

A - 43.9 - - 44.4 -

B 6.7 6.8 6.9 7.2 7.3 7.4

C - 5.8 - - 6.3 -

D 6.7 6.8 6.9 7.2 7.3 7.4

E (Clip open size) 2.5 - 3.6 2.6 - 3.8

- 22 -