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1. Circuit layout .......................................................................................................................................................... 2
1.1. Layout and various design flows ...................................................................................................................... 2
1.1.1. FPGA based design .................................................................................................................................... 3
1.1.2. Gate array based design .............................................................................................................................. 8
1.1.3. Standard-cell based design ......................................................................................................................... 9
1.1.4. Full-custom based design ......................................................................................................................... 13
1.2. Full-custom layout techniques ........................................................................................................................ 15
1.2.1. Transistor using multiple fingers .............................................................................................................. 16
1.2.2. Stacking of multiple transistors ................................................................................................................ 19
1.2.3. Matching of transistors ............................................................................................................................. 19
1.3. CMOS Latch-up ............................................................................................................................................. 22
1.4. Stick diagrams ................................................................................................................................................ 29
1.5. Resistor layout ................................................................................................................................................ 34
1.5.1. Sheet resistance ........................................................................................................................................ 34
1.6. Capacitor layout .............................................................................................................................................. 39
1. Circuit layout
Figure 3. FPGA based IC layout: Internal of a CLB – Xilinx XC3000 family example
Figure 4. FPGA based IC layout: Internal of a CLB – Xilinx XC4000 family example
Figure 5. FPGA based IC layout: internal of a 16x2 single-port memory block – Xilinx XC4000 family example
Standard-cell library
o Development resource and development time for full-custom
Each library-cell has the following information:
o Logic simulation model
o Delay-time vs. load capacitance
o Place-and-route information
System integration:
o Rows of cells channel
Figure 9. Standard-cell IC layout showing channel routing without using over-the-cell routing
Figure 13. Various transistor custom layout scheme and the effect on drain-capacitance
Figure 15. Transistor layout examples: 1 finger vs. 2 finger vs. 3 finger
Figure 16. Custom layout examples for 2-input NAND gate with and without fingers
Figure 20. Layout matching: (1) size matching, (2) gradient, (3) parasitic coupling
VDD
RWELL
RSUB
GND
Figure 22. CMOS inverter parasitic transistors: equivalent circuit for latch-up consideration
Example:
o Current surge from VDD
voltage drop across RWELL
VBE developed for the parasitic PNP transistor
o The current in-turn drops across RSUB
VBE developed for the parasitic NPN transistor
o The current in-turn drops across RWELL … and so on
Figure 23. Transistor with multiple gates: internal area may not be covered by tub / substrate contacts
Figure 26. inverter schematic and corresponding stick-diagram and its actual layout (standard-cell approach)
Figure 27. inverter schematic and corresponding stick-diagram using fingered transistors (standard-cell approach)
Figure 28. inverter layout using fingered transistors (standard-cell approach) and the equivalent circuit
Figure 29. CMOS NOR gate layout : stick-diagram and actual layout (standard-cell approach)
Figure 30. CMOS NAND2 gate layout : stick-diagram and actual layout (standard-cell approach)
1.5. Resistor
Resistance per-square
Let, conductor length = L, conductor width = W, conductor thickness = t, resistivity of material =
R = RS (L / W),
where, sheet resistance, RS = ( / t)
Resistance = (Sheet resistance) * (Length-to-width ratio)
o Poly-Si : 15 to 30
o Poly-Si with silicide (e.g. TiSi2) : 4 to 5
o Diffusion (n+, p+) : 50 to 150
o n-well / p-well : 1K to 2K
Figure 32. resistor: unit-cell and large resistor using multiple unit-cells
Figure 33. resistor: use of guard-rings to reduce noise injection from substrate
1.6. Capacitor
Figure 40. capacitor: poly-poly cap using unit-cell: close to circular shape (sharp corners avoided)
Typical capacitance values for thin-oxide / gate-oxide of thickness (xOX) 100 angstrom = 864 x 10-18 F / um2
Typical capacitance values (0.25 um process) for adjacent layers -- examples:
Typ. area-capacitance (10-18 F / um2) Typ. fringe-capacitance (10-18 F / um)
Metal1 – poly-Si 57 54
Metal2 – Metal1 36 45
Metal3 – Metal2 41 49
Metal4 – Metal3 35 45
Metal5 – Metal4 38 52