CONTENTS

S.no      CHAPTER              PAGENO

1.           CHAPTER: 1 Introduction 3
1.1 Description of IR Music Transmitter & Receiver 4
1.2 Specifications 5

2. CHAPTER: 2 Fundamentals 6

2.1 How IR Music Transmitter & Receiver Works 7

2.2 List of Figures 8
2.2.1 Circuit Diagram of IR Music Transmitter & Receiver 8-9
2.2.2 PCB Layout of IR Music Transmitter & Receiver 10-11
2.2.3 Block Diagram of IR Music Transmitter & Receiver 12-13
2.3 List of Components 14-15
2.4 Datasheet 15
2.4.1 npn general purpose amplifier 15-17
2.4.2 pnp General purpose transistor 17
2.4.3 IC 741 Operational amplifier 18-19
2.4.4 IC LM386 20-22
2.5 PCB Manufacturing process 23
2.6 PCB Designing 24-29

3. CHAPTER :3 30

3.1 Result 31
3.2 Conclusion 32
3.3 Future Enhancement 33
3.4 Applications 34
3.5 Advantages & Disadvantages 35
3.6 References 36

1
LIST OF FIGURES :

FIGURES Page No

Circuit Diagram 8

Transmitter 8

Receiver 9

PCB layout 10

Transmitter 10

Receiver 11

Block Diagram 12

Transmitter 12

Receiver 13

2
 CHAPTER – 1
INTRODUCTION

3
 1.1 DESCRIPTION OF IR MUSIC TRANSMITTER &
RECEIVER :

The main idea behind the project is to generate musical notes by infrared
radiations. The infrared radiations are transmitted and received by IR
LED and Phototransistor respectively.

This project emphasizes the way by which music is generated and driven
by IR rays. This circuit uses a popular melody generator IC UM66 that
can continuously generate musical notes. The melody produced is heard
through the receiver’s loudspeaker.

For maximum sound transmission the IR LEDs should be oriented

towards IR phototransistor.

It can be used in wireless music systems, mobile gadgets and cc cameras.

4
1.2 Specifications :

1.2(a) Infrared (IR) LED - As normal PN junction diode provide current

as the output when subjected to forward bias, in the same way an IR led
gives IR radiation at its output in forward bias. Infrared light is
electromagnetic radiation with a wavelength longer than that of visible
light, measured from the nominal edge of visible red light at 0.7
micrometers, and extending conventionally to 300 micrometers. These
wavelengths correspond to a frequency range of approximately 430Hz to
1THz, and include most of the thermal radiation emitted by objects near
room temperature. Microscopically, IR light is typically emitted or
absorbed by molecules when they change their rotational or irrational
movements.

1.2(b) Photo Diode – A photodiode is a type of photo detector, capable

of converting light into either current or voltage, depending upon the
mode of operation. Photodiode works on the principle of
photoconductivity. When light is absorbed by a semiconductor material,
the number of free electrons and electron’s holes changes and raises its
electrical conductivity, this phenomenon is called photoconductivity. To
cause excitation, the light that strikes the semiconductor must have
enough energy to raise electrons across the band gap Photoconductivity
may also be defined as an electrical property of Light Emitting Diode
(LED) which is the fact that a LED produces a voltage difference across
its leads when it is subjected to light, as if it was in photo-cell, but with
much lower output current. In other words, the voltage generated by the
LED cannot be, in any way, used to generate electrical power from the
output voltage, it can barely be detected. This is why we used an Op-Amp
(operational Amplifier) to accurately detect very small voltage changes.
Photoconductivity is a phenomenon in which a material becomes more
electrically conductive due to the absorption of electromagnetic radiation
such as visible light, ultraviolet light, infrared light, or gamma radiation.
Photodiodes are similar to regular semiconductor diodes except that they
may be either exposed to (detect UV or X-rays) or an optical fiber
connection to allow light to reach the sensitive part of the device.

5
 CHAPTER – 2
FUNDAMENTALS

6
 2.1 HOW IR MUSIC TRANSMITTER & RECEIVER
WORKS

TRANSMITTER

The IR music transmitter works off a 9V battery. Figure (1) shows the
circuit of the IR music Transmitter. It uses popular melody generator IC
U M-66 (IC1) that can continuously generate musical tones. The output
of IC1 is fed to the IR driver stage (Built across the transistors T1 and T2)
to get the maximum range. Here the red LED (LED1) flickers according
to t he musical tones generated by UM66 IC, indicating modulation. IR
LED2 and LED3 are infrared transmitting LEDs. For maximum sound
transmission these should be oriented towards IR phototransistor L14F1
(T3).

RECEIVER

The IR music receiver uses popular op-amp IC µA741 and audio-

frequency amplifier IC LM386 along with phototransistor L14F1 and
some discrete components(Fig. 2).The melody generated by IC UM66 is
transmitted through IR LEDs, received by phototransistor T3 and fed to
pin 2 of IC µA741 (IC2). Its gain can be varied using pot meter VR1. The
output of IC µA741 is fed to IC LM386 (IC3) via capacitor C5 and pot
meter V- R 2 .The melody produced is heard through the receiver’s
loudspeaker. Pot meter VR2 is used to control the volume of Loudspeaker
LS1 (8-ohm, 1W).

7
 2.2 LIST OF FIGURES :

2.2.1. Circuit Diagram:

[a] Transmitter:
Fig: 1

8
[b] Receiver:
Fig: 2

9
2.2.2. PCB Layout:
[a] Transmitter:
Fig: 3

10
[b] Receiver:
Fig: 4

11
 2.2.3. Block Diagram:

[a] Transmitter:
Fig: 5

LED Music
Flicker +9v
Indicator

Melody
3.3 v Transistor
regulator Generator Driver

Stage - 1

Transistor
Driver

Stage - 2

IR LED

12
[b] Receiver:
Fig: 6

Gain Gain +9V

Control Control

Photo Audio Audio

Amplifier Amplifier
Transistor
stage-1 stage-2

Loud
Speaker

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 2.3 LIST OF COMPONENTS
S.No. Name Of The Component Quantity

1. IC UM-66(IC1) 1

2. IC LM741 (IC2) 1

3. IC LM386 (IC3) 1

4. RED LED(1) 1

5. IR LED(2 & 3) 2

6. Resistance R1 & R11 (1 K) 2

7. Resistance R2(4.7 K) 1

8. Resistance R3(22 K) 1

9. Resistance R4(82 ohm) 1

10. Resistance R5 & R12(10 ohm) 2

11. Resistance R6 & R7(10 K) 2

12. Resistance R8 & R13(15 K) 2

13. Resistance R9(100K) 1

14. Resistance R10(680 ohm) 1

15. Capacitor C1(1uF,16V) 1

16. Capacitor C2,C4,C8 & C10(220 uF, 25V) 4

17. Capacitor C3,C5,C7 & C9(0.1 uF) 4

18. Capacitor C6(10 uF,16V) 1

19. Transistor BC547(T1) & SK140/BD140(T2) 2

20. IR Phototransistor L14F1(T3) 1

21. Zener diode 3.3V 1/4W 2

14
 22. Speaker (8 ohm, 1W) 1
23. Preset VR1 (1M) & VR2 (10K) 2
24. 9V battery 2

2.4 DATASHEET

2.4.1 NPN General Purpose Amplifier

Absolute Maximum Ratings TA=25°C :-

Symbol Param Value Units

eter

VCEO Collector-Emitter Voltage 3 V

0
VCES Collector-Base Voltage 3 V
0
VEBO Emitter-Base Voltage 5. V
0
IC Collector Current - Continuous 50 m
0 A
TJ, Tstg Operating
Range
and Storage Junction Temperature -55 to
+150
C

NOTES:

1) These ratings are based on a maximum junction temperature of 150

degrees C.

2) These are steady state limits. The factory should be consulted on

applications involving pulsed or low duty cycle operations.

Thermal Characteristics TA=25°C :-

15
 Symbol Characteristic Ma Units
x

BC548 / A / B / C
PD Total Device Dissipation 6 m
2 W
Derate above 25 C 5

R JC Thermal Resistance, Junction to Case 83 C/

.3
W
R JA Thermal Resistance, Junction to 2 C/
Ambient 0
0 W

Electrical Characteristics TA = 25°C :-

Symbol Parameter Test Conditions Min Max Units

OFF CHARACTERISTICS

V(BR)CE Collector-Emitter Breakdown IC = 10 mA, IB =0 30 V

O Voltage
V(BR)CB Collector-Base Breakdown IC = 10 A, IE =0 30 V
O Voltage
V(BR)CE Collector-Base Breakdown IC = 10 A, IE =0 30 V
S Voltage
V(BR)EB Emitter-Base Breakdown IE = 10 A, IC =0 5.0 V
O Voltage
ICBO Collector Cutoff Current VCB = 30 V, IE =0 15 nA

VCB = 30 V, IE = 0, TA 5.0 A
= +150 C

ON CHARACTERISTICS

16
hFE DC Current Gain VCE = 5.0 V, IC = 2.0 110 800
mA 548
110 220
548A
200 450
548B
420 800
548C
VCE(sat) Collector-Emitter Saturation IC = 10 mA, IB = 0.5 0.25 V
Voltage mA IC = 100 mA, IB =
5.0 mA 0.60 V

VBE(on) Base-Emitter On Voltage VCE = 5.0 V, IC = 2.0 0.58 0.70 V

mA VCE = 5.0 V, IC =
10 mA 0.77 V

2.4.2 PNP General Purpose Transistor

General Description:-

FEATURES :-

1. Low current (max. 100 mA).

2. Low voltage (max. 65 V).

DESCRIPTION :-

PNP transistor in a TO-92; SOT54 plastic package.

NPN complements: BC546 and BC547.

17
 2.4.3 LM741 Operational Amplifier

General Description

The LM741 series are general purpose operational amplifiers which

feature improved performance over industry standards like the LM709.

They are direct, plug-in replacements for the 709C, LM201, MC1439 and
748 in most applications. The amplifiers offer many features which make
their application nearly foolproof: overload protection on the input and
output, no latch-up when the common mode range is exceeded, as well as
freedom from oscillations. The LM741C is identical to the
LM741/LM741A except that the LM741C has their performance
guaranteed over a 0˚C to+70˚C temperature range, instead of −55˚C to
+125˚C.

Electrical Characteristics

Note 1: “Absolute Maximum Ratings” indicate limits beyond which

damage to the device may occur. Operating Ratings indicate conditions
for which the device is functional, but do not guarantee specific
performance limits.

NOTE 2: For operation at elevated temperatures, these devices must be

derated based on thermal resistance, and Tj max. (Listed under “Absolute
Maximum
Ratings”). Tj = TA + (θjA PD).

Thermal Cerdip (J) DIP (N) HO8 (H) SO-8 (M)

Resistance
jA (Junction 100˚C/W 100˚C/W 170˚C/W 195˚C/W
to Ambient)
jC (Junction N/A N/A 25˚C/W N/A
to Case)

Note3: For supply voltages less than ± 15V, the absolute maximum input
Voltage is equal to the supply voltage.

Note 4: Unless otherwise specified, these specifications apply for VS = ±

18
15V, −55˚C ≤TA ≤+125˚C (LM741/LM741A). For the
LM741C/LM741E, these specifications are limited to 0˚C ≤TA
≤+70˚C.

Note 5: Calculated value from: BW (MHz) = 0.35/Rise Time(µs).

Connection Diagrams

Metal Can Package

Dual-In-Line or S.O. Package

19
 2.4.4 LM386 Low Voltage Audio Power Amplifier

General Description

The LM386 is a power amplifier designed for use in low voltage

consumer applications. The gain is internally set to 20 to keep external
part count low, but the addition of an external resistor and capacitor
between pins 1 and 8 will increase the gain to any value from20 to 200.
The inputs are ground referenced while the output automatically biases to
one-half the supply voltage. The quiescent power drain is only 24 mill
watts when operating from a 6 volt supply, making the LM386 ideal for
battery operation.

Features

 Battery operation
 Minimum external parts
 Wide supply voltage range: 4V–12V or 5V–18V
 Low quiescent current drain: 4mA
 Voltage gains from 20 to 200
 Ground referenced input
 Self-centering output quiescent voltage
 Low distortion: 0.2% (AV = 20, VS = 6V, RL = 8W, PO =
125mW, f = 1kHz)
 Available in 8 pin MSOP package

Applications

 AM-FM radio amplifiers

 Portable tape player amplifiers
 Intercoms
 TV sound systems
 Line drivers
 Ultrasonic drivers
 Small servo drivers
 Power converters

20
Parameter Conditions Min Typ Max Units
OperatingSupply Voltage 4 12 V
(VS) 5 18 V
LM386N1,3,LM386M1,
LM386MM
1LM386N-4
Quiescent Current (IQ) VS = 6V, VIN = 0 4 8 mA
Output Power (POUT) VS = 6V, 250 325 mW
LM386N-1, LM386M-1, RL=8THD=10% 500 700 mW
LM386MM-1LM386N- VS = 9V, RL = 8, 700 1000 mW
3LM386N-4 THD =10%,VS =
16V, RL = 32,
THD = 10%
Voltage Gain (AV) VS = 6V, f = 1 kHz 26 dB
10 μF from Pin1to8
Bandwidth (BW) VS = 6V, Pins 1 300 khz
and 8 Open
Total VS = 6V, RL = 0.2 %
HarmonicDistortion(THD 8W,POUT=125m
) W
f = 1 kHz, Pins1and
8 Open
Power Supply Rejection VS = 6V, f = 1 50 dB
Ratio (PSRR) kHz,CBYPASS=10
μF Pins 1 and 8
Open, Referred to
Output

Input Resistance (RIN) 50 kW

Input Bias Current 250 nA
(IBIAS) VS = 6V, Pins 2
and 3 Open

Absolute Maximum Ratings

Note 1: All voltages are measured with respect to the ground pin, unless
otherwise specified.

Note 2: Absolute Maximum Ratings indicate limits beyond which

damage to the device may occur. OperatingRatingsindicateconditions,for
which the device is functional, but do not guarantee specific performance
limits. Electrical Characteristics state DC and AC electrical specifications
under particular test conditions which guarantee specific performance
limits. This assumes that the device is within the Operating Ratings.
Specifications are not guaranteed for parameters where no limit is given,
however, the typical value is a good indication of device performance.

21
Note 3: For operation in ambient temperatures above 25°C, the device
must be derated based on a 150°C maximum junction temperature and 1)
a thermal resistance
of 107°C/W junction to ambient for the dual-in-line package and 2) a
thermal resistance of 170°C/W for the small outline package

Top View

LM 386 PIN OUT

LM 386 Audio Amplifier

22
2.5 PCB manufacturing process:

2.5(a) Design Specification

It is an important process in the fabrication of electronic equipment. The

design of PCBs (Printed circuit board) depends on circuit requirements
like noise immunity, working frequency and voltage levels etc. High
power PCBs requires a special design strategy. The fortification process
to the printed circuit board will determine to a large extent the price and
reliability of the equipment. A common target aimed is the fabrication of
small series of small series of highly reliable professional quality PCBs
with low investment.

The layout of a PCB has to incorporate all the information of the board
before one can go on the artwork preparation. This means that a concept
which clearly defines all the details of the circuit and partly defines the
final equipment is prerequisite before the actual layout can start.

2.5(b) Board types –

The two most popular PCB types are:

1.] Single Sided Boards ~

The single sided PCBs are mostly used in entertainment electronics where
manufacturing costs have to be kept at a minimum. However in industrial
electronics cost factors cannot be neglected and single sided boards
should be used wherever a particular circuit can be accommodated on
such boards.

2.] Double Sided Boards ~ Double sided PCBs can be made with or
without plated through holes. The production of boards with plated
through holes is fairly expensive. Therefore plated through hole boards
23
are only chosen where the circuit complexities and density of components
does not leave any other choice.

2.6 PCB Designing:

After the accomplishment of circuit designing, next step that follows is

PCB making. Among the various discoveries and development to bring
electronics to the level it has reached until now, PCB has definitely
contributed in a significant manner as a means to inter-connect electronic
components. The design of PCB can be considered as the last step in the
electronic circuit design as well as the first major step in the production
of PCB’s. Intimate knowledge of all implication is required. The
designing of PCB consist of designing of layout followed by generation
or preparation of artwork. The layout therefore includes all the relevant
aspects and details of the PCB design. The various steps involved in PCB
making are as follows:

a) Layout Planning
b) Component Hole
c) Graphic Layout
d) Etching
e) Drilling
f) Component Mounting
g) Soldering

24
2.6(a) Layout Planning –

The layout of PCB must incorporate all the information that clearly
defines all details of the circuit and partly of the final equipment. A detail
circuit diagram is an important prerequisite. Layout planning takes care
of component layout as well as their interconnection. The layout should
be developed in the direction of signal flow as far as possible, so that one
achieves shortest possible interconnections. Among the components, the
larger ones are placed first and the space between is filled with smaller
ones. Components requiring input/output connections come near the
connectors. In designing the interconnection, which are usually done with
pencil, actual space requirement in the artwork must be considered. The
end of the layout designing is the pencil sketched component and
conductor drawing, which is called layout sketch. Beside the component
outline, component holes and interconnecting pattern, the layout sketch
should also include information on:

2.6(b) Component holes –

Usually in a given PCB cost of the holes required is of one particular

diameter and this diameter is mentioned once in the layout sketch. Holes
of different diameter are shown with a code in the actual layout sketch.
The code must explain outside the layout area. For e.g. we have used two
kinds of holes are of 0.8mm and 1.1mm.0.8 mm for all the components
except jumpers and IC base. For jumpers and IC based we drilled 1mm
holes. Changing of our track from large to small and then back to large
again is known as “necking”. This is often required when we have to go
between IC or component pads. This allows having nice big low
impedance tracks, but still has the flexibility of route between tight spots.

25
In practice, the current flowing through it and the maximum temperature
rise of the track that can be tolerated will dictate track width. Every track
will have a certain amount of resistance, so the track will dissipate heat
just like a resistor. The wider the track, the lower is the resistance.

2.6(c) Graphic Layout –

The Graphic layout or the Artwork is the basic circuit design that is
required on the PCB. The circuit connections and the components are
together setup in a particular design which is printed on the Circuit
Board.

2.6(d) Etching (Patterning) –

Copper over the entire substrate, sometimes on both sides, (creating a

“blank PCB”) then removing unwanted copper after applying a temporary
mask (e.g. by chemical etching), leaving only the desired copper traces. A
few PCB’s are made by adding traces to the bare substrate (or a substrate
with a very thin layer of copper) usually by a complex process of multiple
electroplating steps.

1.] Chemical etching – Inexpensive ingredients, and with proper use and
maintenance, literally never wears out. The real beauty of this mixture of
hydrogen peroxide, sulphuric acid, copper sulphate and organic
stabilizers is that excess copper can be removed by simple precipitation,
after which, the bath is ready to consume more copper. In addition,
during operation, the etch ant is “self agitating”. The bubbles and heat
evolve during etching, so thoroughly stir up the bath the etch ant works
almost as well in a simple dip (immersion) tank as it does in a far more
expensive spray etcher. Screen printing ink is used according to the type
of etch ant used. For acid etching, an acid resistive ink is used, which is
soluble in alkaline solution
26
2.6(e) Drilling –

Drilling can be done using a CNC machine or manually.

1.] Manual Drilling ~

With the laminate stack formatted as detailed above, manual drilling is a

straightforward, if somewhat mind-numbing process. Items to consider
include: When using a conventional drill press, hole placement accuracy
can be improved and drill breakage minimized through the use of a
“sensitive drilling” or “finger” chuck. Small format, precision high-speed
drill presses, ideal for PCB fabrication, is also available from a number of
sources.

If available, position a work lamp on a flexible mount as close to the

work surface as possible. Minimize burr formation, and outlast HSS bits
almost 10 to 1. The carbide drills are easier to break and must be handled
carefully. Always use drill bits that have been fitted with depth setting
rings. This will allow you to set the plunge depth stop on your drill press
to a single value that will work for all bit diameters.

2.] Through-holes ~

Load the largest diameter bit to be used into the drill chuck, making sure
that the depth ring is pressed firmly against the ends of the chuck jaws
when they are fully tightened. Using a piece of scrap backing materials
as a gauge, adjust the spindle travel stop on your drill press to a depth that
insures that the entire tip of the drill bit penetrates at least half of the
material’s thickness. Under no circumstances allow a PCB drill bit to drill
into the table of your drill press. PCB bits are specially designed to drill
copper clad and will shatter if plunged into cast iron, steel, or aluminum.

27
Starting with largest diameter drill bit, drill all the through holes, stopping
periodically to insure that the drill bit has not snapped off and that the
spindle travel stop has not slipped.

As you drill each hole size check off that diameter on the drilling chart.
This is a good bookkeeping technique that will help you keep track of
your progress and insure that no holes size is missed.

Hold the stack up to the light for visual inspection. Ascertain that all of
the holes have been drilled through and that none are blocked by drill
debris. If some debris is seen, remove by carefully pushing a smaller
diameter bit through the hole.

2.6(f) Component Mounting – From the greatest variety of electronic

components available, which runs into thousands of different types 1, is
often a perplexing task to know which is right for a given job. There
could be damage such as hairline crack on PCB. If there are, then they
can be repaired by soldering a short link of bare copper wire over the
affected part. This holds the component in position ready for soldering.
Some components will be considerably larger. So it is best to start
mounting the smallest first and progressing through the largest. Next will
be probably the resistor, small signal diodes or other similar size
components. Some capacitors are also very small but it would be best to
fit it afterwards. Although transistors and integrated circuit are small
items there are good reasons for leaving the soldering of these until the
last step. All the components before mounting are rubbed with sand paper
so that oxide layer is removed from the tips. Now they are mounted
according to the component layout.

28
2.6(g) Soldering –

This is the operation of joining the components with PCB after this
operation the circuit will be ready to use to avoid any damage or fault
during this operation following care must be taken. A longer duration
contact between soldering iron bit and components lead can exceed the
temperature rating of the device and cause partial or total damage of the
device. Hence, before soldering we must read the maximum soldering
temperature and soldering time for device.

The wattage of soldering iron should be selected as maximum as

permissible for that soldering place. To protect the device by leakage
current of iron its bit should be earthed properly.

We should select soldering wire with proper ratio of Pb and Tn to provide

the suitable melting temperature. Proper amount of good quality flux
must be applied on the soldering point to avoid dry soldering.

29
CHAPTER – 3

30
 3.1 RESULT

The IR Musical Transmitter & Receiver we designed is working

properly. By doing the project we got a lot of experience with
the electronics components & more over we learn the PCB
designing.

31
 3.2 CONCLUSION

IR ray communication is very easy to understand and simple to

implement. It finds various applications in short distance field of
communications. It is one of the best ways of building wireless gadgets.

32
 3.3 FUTURE ENHANCEMENT

In future there is scope of building virtual environment using the

principles of IR ray transmission and reception. Virtual gaming which
also employs IR reception techniques is still in research process which is
soon going to rule the world of gaming.

33
 3.4 APPLICATIONS

1. Wireless Music Systems.

2. Mobile gadgets.

3. CC cameras.

4. Remote controls.

5. Infrared lasers are used in communications.

34
 3.5 [a] ADVANTAGES

1. Highly sensitive

2. Two stage Gain control

3. Very low noise

4. Low cost and reliable circuit

5. Can transmit up to 10 meter

3.5 [b] DISADVANTAGES

1. Not for long distance

2. Work in fixed range

3. Noise if object between transmitter and receiver

35
 3.6 REFERENCES

Electronics for you (jan 2007)

www.fairchild.com
www.national.com
www.scridb.com
www.wineyardtechnologies.com

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