m





  

V Each bitcell requires 1
transisitor and 1
capacitor.
V Needs to be refreshed
every milliseconds to
retain data because
the charge of the
capacitor leaks.
V Memory density is
less.
V Each cell which can
store a single bit
requires 6 transistors.
V Does not need to be
refreshed periodically
as ip op retains the data
V Faster access time
compared to DRAM,
therefore used as caches
mostly.
V Very less memory
density.
THYRISTOR RANDOM ACCESS MEMORY
V Combined strengths of SRAM and DRAM.

V Use Thyristor instead of Transistor.

TWIN TRANSISTOR RANDOM ACCESS

MEMORY
V Use transistor instead of capacitor.

V SOI tecnology based.

V Its a hybrid RAM having the qualities of SRAM
combined with the chip density of DRAM.
V It uses a transistor (same as DRAM) but does
not need a capacitor to store charge.
V Its the cheapest RAM as it uses just a transistor
and no additional circuitry.
V Its fabrication is easier.
V High memory density.
V Silicon on insulator technology (SOI) refers to the
use of a layered silicon-insulator-silicon substrate
in place of conventional silicon substrates in
semiconductor manufacturing
V Speeds up the circuit by 30%
V As transistors shrink there is increase in leakage
current,the insulator blocks this leakage current.
V System-on-a-chip or system on chip (SoC or SOC)
refers to integrating all components of a computer
or other electronic system into a single integrated
circuit (chip)
V mRAM read/write performance is far better
than conventional DRAM
V mRAM is twice as dense as conventional
DRAM and about 5 times denser than SRAM
V Its fabrication is quite simple
V Soft Error Rate is comparatively lower in
mRAM.
V Lower power consumption
V Lithography friendly
V It isn't fast enough to replace SRAM in L1 cache
V SOI substrate is costlier to be implemented
V Requires a large investment in new fabrication
V Same latency as DRAM. Latency is the delay
incurred when a
V System tries to access data from memory
V m-RAM is still a volatile memory
V Isi is working with Hynix semiconductors to
manufacture memory modules commercially.
V AMD has started implementing mRAM in there
processors.
V In the new design, the transistors are aligned
vertically so that the gates are on either side
and the junctions are at top and bottom
V This provides the same isolation and same
floating body effect.