ZTE ZXMP S385 Product Description

Operator Logo
ZXMP S385 V2.50 Product Description

Version R0 R1 Date 2009-09-20 2010-05-20 Author ZhangQiSheng LiXiongFei Approved By WangQiang,QinYong WangQiang,QinYong Remarks Not open to the Third Party Not open to the Third Party
2011 ZTE Corporation. All rights reserved. ZTE CONFIDENTIAL: This document contains proprietary information of ZTE and is not to be disclosed or used without the prior written permission of ZTE. Due to update and improvement of ZTE products and technologies, information in this document is subjected to change without notice.
ZTE Confidential Proprietary
2011 ZTE Corporation. All rights reserved.
TABLE OF CONTENTS
1 2 2.1 2.2 2.3 2.4 2.5 2.6 3 3.1 3.2 3.2.1 3.2.2 3.2.3 3.3 3.4 3.5 3.6 3.7 3.8 3.9 3.10 3.11 3.12 4 4.1 4.1.1 4.1.2 4.2 4.3 5 5.1 5.1.1 5.1.2 5.1.3 5.2 5.3 5.4 5.5 5.6 5.7 5.7.1 5.7.2 5.7.3 5.7.4 5.7.5 5.8 Overview ................................................................................................................... 1 Features .................................................................................................................... 2 Flexible networking & dispatching function raises profit-making ability and reduces CAPEX ...................................................................................................................... 2 Superior scalability protects CAPEX and reduces OPEX .......................................... 2 Leading RPR function supports IP evolution and protects CAPEX ............................ 2 Powerful embedded WDM function saves fiber resource .......................................... 2 Flexible design facilitates network planning & optimization........................................ 2 Wide application, mature technology and high reliability............................................ 2 Functions.................................................................................................................. 4 Cross-connection and extension capabilities ............................................................. 4 Powerful Service Access Ability................................................................................. 4 Optical Interfaces ...................................................................................................... 4 Electrical Interfaces ................................................................................................... 5 Data Interfaces .......................................................................................................... 5 Integrated WDM Function .......................................................................................... 6 Complete Equipment Protection Ability...................................................................... 6 Perfect Network Protection Ability ............................................................................. 7 Reliable Timing Synchronization Processing ............................................................. 7 System control and communication ........................................................................... 8 Overhead Processing ................................................................................................ 8 Easy For Maintenance And Upgrade ....................................................................... 10 Alarm input/output ................................................................................................... 10 System power supply .............................................................................................. 10 Perfect EMC and Operation Safety ......................................................................... 11 System Architecture .............................................................................................. 12 Product Physical Structure ...................................................................................... 12 System architecture ................................................................................................. 12 System mapping structure ....................................................................................... 13 Hardware Architecture ............................................................................................. 14 Software Architecture .............................................................................................. 15 Technical Specifications ....................................................................................... 17 Physical Indices ....................................................................................................... 17 Subrack and cabinet appearance ............................................................................ 17 Subrack backplane .................................................................................................. 18 Fan plug-in box ........................................................................................................ 18 Appearance and dimensions ................................................................................... 19 System subrack and slot diagram ............................................................................ 21 System board list and description ............................................................................ 22 STM-N optical interfaces performance .................................................................... 26 PDH interfaces performance and indexes ............................................................... 27 Performance of data boards .................................................................................... 29 Performance of SEE ................................................................................................ 29 Performance of TGE2B ........................................................................................... 29 Performance of RSEB ............................................................................................. 31 Performance of AP18 ............................................................................................ 32 Performance of TGSA8 ......................................................................................... 33 Physical Performance of Ethernet ........................................................................... 33
II
5.8.1 5.8.2 5.9 5.10 5.11 5.12 5.13 5.14 5.14.1 5.14.2 5.14.3 5.14.4 5.14.5 5.14.6 5.15 6 6.1 6.2 6.3 6.3.1 6.3.2 6.3.3 6.3.4 6.3.5 6.4 7
Ethernet interface types and followed standard ....................................................... 33 GE interface types and followed standard ............................................................... 36 Performance of OAD ............................................................................................... 38 Performance of OBA ............................................................................................... 39 Performance of OPA ............................................................................................... 40 Performance of DCM ............................................................................................... 41 Error Performance ................................................................................................... 42 Jitter index at interfaces ........................................................................................... 42 Jitter and wander tolerance of PDH input interface.................................................. 42 Jitter and wander tolerance of SDH input interface.................................................. 44 Inherent output jitter of STM-N interface .................................................................. 46 Mapping jitter of PDH tributary................................................................................. 47 Combined Jitter ....................................................................................................... 47 Jitter transfer function of the regeneration relay....................................................... 48 Clock timing and synchronous characteristics ......................................................... 48 Environment Adaptability...................................................................................... 51 Power supply requirements ..................................................................................... 51 Grounding requirements .......................................................................................... 51 Environment requirements ...................................................................................... 52 Operation Environment ............................................................................................ 52 Environment for Storage .......................................................................................... 53 Cleanness requirements .......................................................................................... 54 Bearing Requirements of the Equipment Room....................................................... 54 Electronic Static Discharge (ESD) ........................................................................... 55 Safety requirements ................................................................................................ 57 Glossary ................................................................................................................. 60
III
FIGURES
Figure 1 Figure 2 Figure 3 Figure 4 Figure 5 Figure 6 Figure 7 Figure 8 Figure 9 Figure 10 Figure 11 Figure 12 Figure 13 Figure 14 ZXMP S385 functional block diagram ........................................................................ 12 Appearance of S385 Sub-rack................................................................................... 13 Multiplexing/mapping structure adopted by ZXMP S385 ........................................... 13 Functional relationships of the hardware platforms .................................................... 14 Hierarchical structure diagram of NM software .......................................................... 16 Subrack structure diagram......................................................................................... 17 Structure of fan box ................................................................................................... 18 Fan box structure....................................................................................................... 19 Board slot layout of sub-rack ..................................................................................... 22 The jitter and wander tolerance at E1 PDH input interface ........................................ 43 The jitter and wander tolerance at T1 PDH input interface ........................................ 43 The jitter tolerance of STM-N terminal multiplexer input interface.............................. 45 The input jitter tolerance of STM-N SDH regenerator ................................................ 46 The jitter transfer characteristics of a regeneration relay ........................................... 48
TABLES
Table 1 Table 2 Table 3 Table 4 Table 5 Table 6 Table 7 Table 8 Table 9 Table 10 Table 11 Table 12 Table 13 Table 14 Table 15 Table 16 Table 17 Table 18 Table 19 Table 20 Table 21 Table 22 Table 23 Table 24 Optical Interfaces Provided by ZXMP S385 ................................................................. 5 Electrical Interfaces Provided by ZXMP S385 ............................................................. 5 Ethernet services Provided by ZXMP S385 ................................................................. 6 Equipment level protection provided by ZXMP S385 ................................................... 7 Overhead-Byte Usage List........................................................................................... 9 Dimensions and weights of structural parts ............................................................... 19 ZXMP S385 own configuration .................................................................................. 20 ZXMP S385 is configured with other products ........................................................... 20 Boards/unit list (with power consumption) ................................................................. 22 Performance of the STM-1 optical interface............................................................... 26 Performance of the STM-4 optical interface............................................................... 26 Performance of the STM-16 optical interface............................................................. 26 Performance of the STM-64/OTU2 optical interface of ZXMP S385 .......................... 27 Performance of the PDH electrical interface .............................................................. 27 Input port permitted attenuation, frequency deviation and output port signal bit rate tolerance.................................................................................................................... 28 Requirements for the input/output port reflection attenuation .................................... 28 Performance of TGE2B of ZXMP S385 ..................................................................... 30 Ethernet interface index ............................................................................................. 33 Transmission index of FE MMF optical interface ....................................................... 34 Receiver index of FE MMF optical interface .............................................................. 34 index of FE short distance SMF optical interface ....................................................... 35 receiver index of FE short distance optical interface .................................................. 35 Transmission index of FE long distance SMF optical interface .................................. 35 Receiver index of FE long distance optical interface ................................................. 36
IV
Table 25 Table 26 Table 27 Table 28 Table 29 Table 30 Table 31 Table 32 Table 33 Table 34 Table 35 Table 36 Table 37 Table 38 Table 39 Table 40 Table 41 Table 42 Table 43 Table 44 Table 45 Table 46 Table 47 Table 48 Table 49 Table 50 Table 51 Table 52 Table 53 Table 54 Table 55 Table 56 Table 57 Table 58 Table 59 Table 60 Table 61 Table 62 Table 63 Table 64 Table 65 Table 66 Table 67
GE interface index ..................................................................................................... 36 Transmission index of GE MMF optical interface ....................................................... 36 Receiver index of GE MMF optical interface .............................................................. 37 Transmission index of GE short distance SMF optical interface ................................ 37 Receiver index of GE short distance optical interface ................................................ 37 Transmission index of FE long distance SMF optical interface .................................. 38 Receiver index of GE long distance optical interface ................................................. 38 Performance of OADD ............................................................................................... 39 Performance of OADC ............................................................................................... 39 Performance of OBA Module ..................................................................................... 40 Performance of OPA Module ..................................................................................... 40 Performance of the DCM ........................................................................................... 41 SDH system error performance ................................................................................. 42 The input jitter and wander tolerance of PDH interface.............................................. 43 The output jitter and wander tolerance of the PDH interface ..................................... 44 Input jitter and wander tolerance (UIP-P) of SDH ...................................................... 45 Input jitter and wander tolerance of the SDH ............................................................. 45 Input jitter tolerances of STM-N regenerators ............................................................ 46 STM-N interface inherent output jitter indexes of SDH .............................................. 46 STM-N network interface output jitter indexes of SDH ............................................... 47 Mapping jitter specifications....................................................................................... 47 Combined jitter .......................................................................................................... 47 Jitter transmission parameters of a regeneration relay .............................................. 48 The SEC Index list ..................................................................................................... 49 The wander limit value under constant temperature (MTIE) ...................................... 49 The wander limit value under temperature impact (MTIE) ......................................... 49 The wander limit value under constant temperature (TDEV) ..................................... 49 Climate requirement .................................................................................................. 52 Density requirements for chemical active substances ............................................... 52 Density requirements for mechanical active substances ........................................... 53 Requirements for mechanical stress.......................................................................... 53 Climate requirement .................................................................................................. 53 Requirements for mechanical stress.......................................................................... 54 Static discharge anti-interference .............................................................................. 55 RF electromagnetic radiated susceptibility ................................................................ 55 Electrical fast transient burst susceptibility at the DC power port ............................... 56 Electrical fast transient burst susceptibilities at the signal cable and control cable ports .......................................................................................................................... 56 Surge susceptibility of DC power ............................................................................... 56 Surge susceptibility of the outdoor signal cable ......................................................... 56 Surge susceptibility of the indoor signal cable ........................................................... 56 Conductivity susceptibility of RF field......................................................................... 57 Conductive emission electromagnetic interference at the direct current port ............. 57 Radioactive emission electromagnetic interference ................................................... 57
Overview
ZXMP S385 is an optical transmission platform newly released by ZTE. ZXMP S385 targets the backbone or large capacity convergent layer of network which can satisfy present and future network requirements. It is an ideal transmission system in constructing broadband transmission networks. ZXMP S385 provides rich service access functions and complete protection mechanism, facilitating its wide applications. ZXMP S385 adopts modular design, incorporating SDH, Ethernet, ATM, PDH and other technologies. It can transmit voice and data services efficiently on the same platform. This document is based on ZXMP S385 V2.50.
2
2.1
Features
Flexible networking & dispatching function raises profit-making ability and reduces CAPEX
It has high-integration service interface boards to access a lot of PDH, SDH and data services.
2.2
Superior scalability protects CAPEX and reduces OPEX

ZXMP S385 can be constantly evolved and upgraded. The user will just add or replace boards to expand the network capacity, which will reduce CAPEX of the expansion project.It adapts itself to the characteristics of metro services to maximize the equipment investment return of clients.
2.3
Leading RPR function supports IP evolution and protects CAPEX

It has powerful data service processing function. It supports two rings working at the same time, unicast/multicast/broadcat services and bandwidth statistical multiplexing. It features high bandwidth utilization rate, fast service provision, service priority access control and fair mechanism and high QOS. It supports the RPR multi-ring spanning in the networking and avoids service termination & conversion to reduce faulty points.
2.4
Powerful embedded WDM function saves fiber resource

It can add/drop wavelength-level optical signals.
2.5
Flexible design facilitates network planning & optimization

The boards can be inserted into any slot and flexible design facilitates service configuration, maintenance and network planning & optimization.
2.6
Wide application, mature technology and high reliability
Due to mature technology and superior performance, ZXMP S385 is widely deployed in major carriers and private networks as well as other countries and regions, e.g., Korea, Pakistan, Morocco and Vietnam.
3
3.1
Functions
Cross-connection and extension capabilities
Cross Clock board (CSF/CSE/CSA) of ZXMP S385 provides the cross-connect function and fulfill the straight-through, broadcast, add/drop, and cross-connection of services. CSF board implements high-order and low-order cross-switching functions. CSF has a space-division switching capacity of 1536 1536 VC4. In which, 256256 VC4s are assigned to the time-division cross-connect service unit, the others are allocated to the space-division cross-connect unit of the system. CSE board implements high-order and low-order cross-switching functions. CSE has a space-division switching capacity of 1152 1152 VC4. In which, 256256 VC4s are assigned to the time-division cross-connect service unit, the others are allocated to the space-division cross-connect unit of the system. CSA board implements high-order and low-order cross-switching functions. CSA has a space-division switching capacity of 256 256 VC4. In which, 3232 VC4s are assigned to the time-division cross-connect service unit, the others are allocated to the spacedivision cross-connect unit of the system. The equipment can supports maximum 14 service slots and access a large amount of PDH, SDH and data services. It can process 176-path ECC, and support the network topologies as linear, ring, hinge, ring with chain, tangent ring and cross ring of STM-N levels meeting the complex networking requirements thoroughly.
3.2
Powerful Service Access Ability

ZXMP S385 adopts modular structure, with its hardware including cross-connect card, clock card, control card, service card and service interface card. The service access capacity is shown in following table. A single sub-rack of ZXMP S385 has 14 slots for service boards and 10 slots for interface boards. The equipment can access a large amount of PDH, SDH and data services at one time.
3.2.1
Optical Interfaces
ZXMP S385 provides five types of optical interfaces: OTU2, STM-64, STM-16, STM-4 and STM-1, as shown in Table 1 .
Table 1
Optical Interfaces Provided by ZXMP S385
Board Type OTU2 STM-64 STM-16 STM-4 STM-1
Rate (Mbit/s) 10709.225 9953.280 2488.320 622.080 155.520
Board Integration (channel/board) 1 1/2 4/8 1/2/4 2/4/8/16
Maximum Access Quantity 14 14/28 56/72 56 208
ZXMP S385 has the one-interface OTU2 optical line board to support AFEC or G.709 standard FEC function. By increasing the line rate, the board can correct the bit errors in the line transmission. It may increase the receiving sensitivity by about 2dB or the OSNR tolerance by 5-7dB, and work with OBA+OPA and Dispersion Compensation Module (DCM) to implement the LH transmission without electrical regeneration. ZXMP S385 also provides OTU2/STM-64/STM-16 colored interfaces comply with ITU-T G.692 and ITU-T G.695, which can be connected to DWDM/CWDM directly without the OTU board. ZXMP S385 provides OTU2/STM-64/STM-16 DWDM wavelength interface with ITU-T standard 50GHz grid in C-band.
3.2.2
Electrical Interfaces
ZXMP S385 provides STM-1 electrical interface and PDH electrical interfaces, as listed in Table 2
Table 2 Electrical Interfaces Provided by ZXMP S385
Board Type STM-1 E3 T3 E1 T1
Rate (Mbit/s) 155.520 34.368 44.736 2.048 1.544
Board Integration (channel/board) 4/8/16 6 6 63 63
Maximum Access Quantity 208 96 96 1260 1260
3.2.3
Data Interfaces
There are several data boards in ZXMP S385 V2.50:SEE,TGE2B, RSEB, AP18 and TGSA8, as shown in Table 3 . SEE board provide 810M/100M+2GE Ethernet services which support L2 switching function and EPS protection function. TGE2B board provides 2GE adaptive Ethernet services.
RSEB board provides 810M/100M+2GE interfaces which employs the bandwidth of SDH/MSTP ring network to provide the dual-ring topology and implement the ring interconnection of RPR nodes. FE Ethernet interfaces of each Ethernet board above can be optical or electrical. It provides FE optical interface via ESFE8 and optical interface via OIS18 respectively. 10M/100M optical or electrical interfaces are available via replacing interface board. AP18 board is mainly used to converge or aggregate ATM service to SDH transmission network. It provides 8155 Mbit/s optical interfaces at the ATM side and 1622 Mbit/s non-concatenation data flow at the system side. TGSA8 board supports 8 user interfaces which adopt SFP optical module. The first 4 user interfaces may respectively offer GE or SAN service. SAN service includes 1G Fiber Channel and 1G FICON services. The other 4 user interfaces may offer 4GE services.
Table 3 Ethernet services Provided by ZXMP S385
Board Name Interface Type SEE TGE2B RSEB AP18 TGSA8 810M/100 M +2GE 2GE 810M/100 M +2GE 8155 Mbit/s (4SAN+4GE) or 8GE
Board Integration (channel/board) 8+2 2 8+2 8 (4+4) or 8
Maximum Access Capacity 128+32 56 128+32 112 (56+56) or 112
3.3
Integrated WDM Function

ZXMP S385 has OAD (Optical Add/Drop) board to add/drop or multiplex/demultiplex 4 fixed-wavelengths of optical signals. OAD board consists of two types in all: OADD is for DWDM signals and OADC is for CWDM signals. ZXMP S385 optical line board has DWDM or CWDM optical interfaces, and OAD board can add/drop DWDM or CWDM optical signals. Both of them work together to actualize OAD interface function. ZXMP S385 single sub-rack supports at most 56 channels of DWDM OAD interfaces or 56 channels of CWDM OAD interfaces. ZXMP S385 V2.50 extension sub-rack can support at most 56 channels of DWDM OADM interfaces or 56 channels of CWDM OADM interfaces.
3.4
Complete Equipment Protection Ability

Table 4 shows the equipment level protection of ZXMP S385.
Table 4
Equipment level protection provided by ZXMP S385
Items protected E1/T1 processing board E3/T3 processing board STM-1 processing board(except OEL116 board) FE board CSF/CSE/CSA(Cross-switch and Synchronous-clock board) NCP/ENCP board 48 V power interface board
Protection scheme 1:N (N9) tributary protection switching (TPS) 1:N (N4) TPS 1:N (N4) TPS 1:N (N4) TPS 1+1 hot backup 1+1 hot backup 1+1 hot backup
ZXMP S385 supports the co-existence of several different TPS protection. ZXMP S385 adopts a dual-bus hierarchical design for service bus, overhead bus and clock bus, which improves system reliability and stability.
3.5
Perfect Network Protection Ability

In terms of the network level protection, ZXMP S385 supports multiplex section protection (MSP) ring, linear MSP, unidirectional path switched ring (UPSR), subnet connection protection (SNCP) and logical subnet protection (LSNP), etc. ZXMP S385 can implement all networking features recommended by ITU-T. It supports the route reconstruction of Ethernet and IP, and meets IEEE802.3E.
3.6
Reliable Timing Synchronization Processing

The clock timing/synchronization unit is composed of Cross Clock board (CSF/CSE/CSA) and SCI board. The unit completes system timing and network synchronization. It implements the following functions: Providing system clock signals and system frame header signals for all the units of the SDH equipment. Providing overhead bus clock and frame header Providing the corresponding interface for upper-level controller to configure and monitor the clock unit.
SCI board of ZXMP S385 provides four external reference clock output and four external reference clock input. The interface type is 2Mbit/s or 2MHz. SCI can be configured with four external 2.048M clock input references and 28 lines (or tributary) 8K timing input references. Synchronization can select external clocks, line clocks or E1/T1 tributary clocks.
The protection switching of clock reference sources bases on the alarm information and clock synchronization status message (SSM) algorithm-based automatic switching. ZXMP S385 provides E1 tributary re-timing function. It supports synchronous priority switching based on the SSM algorithm, optimizes synchronous timing distribution of the network, prevents the occurrence of timing loops and keeps network synchronization the optimal status. A software-controlled or a hardware phase lock circuit is used to implement four working modes: a. Fast pull-in; b. Locked; c. Holdover; d. Free run.
3.7
System control and communication

The Net Control Processor (NCP) and Enhanced Net Control Processor (ENCP) implement the system control and communication function, which includes sending the configuration commands to all MCUs via S interface and collecting their performance and alarm information. With ENCP, the extension subrack can be accessed. NM information intercommunicates between NEs via the ECC channel. The order-wire board (OW) performs the order-wire function. It actualizes the intercommunication of order-wire phones between NEs via E1 and E2 bytes. It employs an independent CPU for order-wire and communicating with NCP processor via S interface. The Qx interface board is the communication interface between NE and subnet management control center (SMCC). With Qx interface, NCP/ENCP can report to SMCC the alarm and performance information of the NE and subnet and receive the commands and configurations sent from SMCC to the NE and subnet. The f interface is the LMT access interface of local NM, which is for the access management of portable PC. The reset and ring trip are on the rack. Other interfaces are on QXI and SCI boards. The NCP/ENCP boards monitor the fan plug-box of the NE. The power distribution unit performs the over/under voltage monitoring of input voltage. The alarm I/O: the NCP/ENCP boards offers 8-path external alarm switch quantity interfaces, collects the alarm signal of NE and transmits it to the alarm box and the firstcabinet-in-a-row. It offers 2-path switch quantity (UC) interface and may output 2-path switch quantity for user.
3.8
Overhead Processing
The overhead process of ZXMP S385 is performed by NCP/ENCP board, OW board, CSF/CSE/CSA board, optical line boards and ATM board. ZXMP S385 supports overhead transparent transmission, i.e. low rate service signal and overhead can transfer transparently in STM-16 frame. It greatly improves the network
construction flexibility, abates the tension of insufficient optical fiber resources, and ensures the NM integrity and the NM information continuity.Overhead-Byte Usage List is show in Table 5 .
Table 5 Overhead-Byte Usage List
Overhead type
Overhead name A1, A2 J0 Z0 D1~D12 E1, E2
ZXMP S385 application Frame position indication for regeneration section, A1:11110110,A2:00101000 S385 may identify, set and transparent transmit J0 byte Not applied S385 may set DCC of D1~D3 or D1~D12, and support the transparent transmission of D1~D12 S385 supports E1, E2 order wire telephone, as well as E1, E2 transparent transmission. S385 provides F1 64kbps co-directional data interface, and the transparent transmission of F1 byte Used for the error code monitor of regeneration section Used for the error code monitor of MS Used for the auto-protection switchover (APS) command of MS b5~b8 used for synchronous status message Used for MS far-end difference indication The rate adjustment on AU level Used for high-order path trace, able to be set Used for path error code monitoring Used for expressing the composition or maintenance status of VC-3/VC-4/VC-4X, able to read and write Used for returning the status and performance of path terminal to the path origin of VC3/VC4/VC4XC Not applying Affording the general position indication to payload, as well as the special payload Position (i.e. H4 may be the multi-frame position indication of VC12 and VC2); and performing VC3/VC4 virtual concatenation Not applied Not applied Providing the functions of error code test, signal mark and channel status for VC1/VC2 VC1, VC2 path trace byte, able to be set Not supported
RSOH/MSOH F1 B1 B2 K1, K2 S1 M1 AU pointer AU PTR J1 B3 C2 G1 F2, F3 POH H4 K3 N1 V5 J2 N2
Overhead type
Overhead name K4
ZXMP S385 application Used for the virtual concatenation process of low-order path
3.9
Easy For Maintenance And Upgrade

With the following functions, the system becomes more reliable, featuring good maintainability and easy scalability: It supports optical power monitoring functions. It supports online loading and remote upgrading of card software (including FPGA logic). It provides the daily maintenance function. In case of a fault, it can quickly locate the fault to the card level. All cards provide the temperature monitoring function. Pluggable optical module (SFP module, LC connector).
3.10
Alarm input/output
NCP/ENCP provides 8 external alarm Boolean value input interfaces and two control output interface. NCP/ENCP collects alarm indication signals from NEs and sends them to the alarm box and the first cabinet of the line. There are four alarm output interfaces. The system provides two user alarm output interfaces and level alarms. It shares a DB9 interface with F1 interface at the backplane side.
3.11
System power supply

ZXMP S385 equipment employs the dual-power system to access the -48V power in the equipment room and distributes the -48V DC power in the power distribution box. It adopts separate power supply mode. No power boards in the sub-rack, the -48V power directly powers each board via the MB board through a DC/AC conversion module. Two lines of independent external -48V DC power supply, -48VGND and the system protection GND are led from the connectors on the distribution frame and then connected to the sub-rack power distribution board. The power distribution (PD) board provides the equipment with the following functions such as -48V power switch, distribution, isolation, EMI filtering, protection against lightening and surge, fan power supply and control
10
3.12
Perfect EMC and Operation Safety

EMC, operation safety and fire/explosion protection of the equipment are fully considered in the circuit board design.
11
4
4.1
4.1.1
System Architecture
Product Physical Structure
System architecture
ZXMP S385 functional block diagram is shown in Error! Reference source not found.
Figure 1 ZXMP S385 functional block diagram
ZXMP S385 SDH Based Multi-Service Node Equipment
SDH Equipment (TM, ADM, REG)
ZXONM E300 EMS/SNMS
Security management
Overhead Processing Platform
System management
In terms of functional hierarchy, ZXMP S385 can be divided into hardware system and network management (NM) software system, which are independent of each other and work coordinately. The hardware system is the main body of the ZXMP S385. It can work independently of the NM software system. A standard "IEC cabinet + sub-rack" structure is used for ZXMP S385. Both the cabinet and sub-rack unit are designed in the principle of front-facing installation and maintenance to save equipment space and allow for back-to-back installation, frontfacing operations and maintenance. Appearance of S385 Sub-rack is show in Figure 2 .
NE Control Platform
Clock Processing Platform
Hardware System
Sverice Crossconnect Platform
Power Support Platform
Sverice Acess Platform
NE Management Software System
Configuration management
Performance management
Maintenance management
Fault management
12
Figure 2
Appearance of S385 Sub-rack
4.1.2
System mapping structure

ZXMP S385 adopts the latest mapping structure of ITU-T recommendation, as shown in Figure 3.
Figure 3 Multiplexing/mapping structure adopted by ZXMP S385
STM-N
AUG
AU-4
VC-4
3
TUG-3
1 7
TU-3
VC-3 C-3
44736kbit/s 34368kbit/s
Pointer processing Multiplexing Alignment Mapping
TUG-2
3
TU-12
VC-12 VC-11
C-12 C-11
2048kbit/s
1544kbit/s
Note: In above mapping structure, ZXMP S385 V2.00 and above version supports E1/T1, E3/T3, STM-1 (optical/electrical), STM-4, STM-16, STM-64 and Ethernet services. V2.20
13
and later versions support SAN service. The service enters STM-N via AU-4 multiplexing/mapping route instead of AU-3 multiplexing/mapping route. T1 service supports VC11-TU12 mapping route.
4.2
Hardware Architecture
With the platform design concept, the ZXMP S385 hardware system consists of the NE control platform, clock processing platform, service cross platform, overhead processing platform, power supply support platform and service access platform. By means of platform establishment, transplant and integration, ZXMP S385 forms different functional units or boards, which are connected in a specific way to form the SDH equipment with perfect functions and flexible configurations. ZXMP S385 can be configured as a TM, ADM, or REG equipment, depending on the networking requirements. Configurations of REG at rates of 2.5G and 10G are available in V2.00 and above version. The relationships of all the platforms are shown in Figure 4
Figure 4 Functional relationships of the hardware platforms
Service access platform
. . .
Service crossconnect platform Clock processing platform
. . .
Overhead processing platform
. . .
. . .
Power supply support platform
NE control platform
NE control platform As the interface between NE equipment and background NMS, the NE control platform is the agent for other platforms to receive or report network management information.
Power supply support platform With the distributed power supply style, power supply modules installed in each board provide power to corresponding boards.
14
This platform supports the access of SDH, PDH, Ethernet, ATM and SAN services. It converts accessed services to corresponding formats, and then forwards them to the service cross platform for aggregation and distribution. 4 Overhead processing platform This platform provides orderwire voice channel and some auxiliary data digital channels through section overhead (SOH) bytes while transmitting payloads. 5 Clock processing platform As one of the core part of the hardware system, this platform provides the system clock for all platforms in the equipment. 6 Service cross platform This platform receives service signals and various information from service access platform and overhead processing platform, and implements service orientation and information aggregation/distribution/switching. ZXMP S385 backplane uses the unified service bus, clock bus, overhead bus and control bus, and adopts the star structure centered on cross and clock board.
4.3
Software Architecture
ZXMP S385 employs ZXONM E300 to manage and monitor the hardware system and transmission network, and coordinate the work of the transmission network. 1 Brief introduction to NM structure ZXONM E300 system adopts four-layered structure, including equipment layer, NE layer, NE management layer and sub-network management layer. It can also provide Corba interface for the network management layer. The hierarchical structure of ZXONM E300 system is shown in Figure 5 .
15
Figure 5
Hierarchical structure diagram of NM software
NE management scope ZXONM E300 features forward and backward compatibility, capable of managing all SDH-based multi-service node equipments. ZXONM E300 V3.19 supports management of ZXMP S385 V2.50 version.
Function introduction It can perform NE-layer network management functions such as configuration management, fault management, performance management, security management, system management, and maintenance management. Please refer to relevant documentation of ZXONM E300 for details of NMS.
16
5
5.1
5.1.1
Technical Specifications
Physical Indices
Subrack and cabinet appearance
The subrack adopts 19 high rack with dimension of 888.2mm (height) 482.6mm (width) 270mm (depth). It consists of side panels, beams and metal guide rails, with the functions of heat dissipation and shielding. At the bottom of the subrack is a separate fan plug-in box equipped with 3 independent fan module boxes, each fan module box separately connects to fan backplane to facilitate maintenance. At the top of the subrack a decoration door featuring decoration, ventilation and shielding functions can be detached flexibly. ZXMP S385 Subrack structure diagram is show in Figure 6 .
Figure 6 Subrack structure diagram
1. Top outlet 2. Decoration door 3. Board area 4. Lower cabling area 5. Fan plug-in box The subrack consists of four parts: 1 Backplane: the carrier for boards, connects ZXMP S385 to the connection interface of external signals. The boards are connected to the buses via the board connection sockets on the backplane.
17
2 3
Plug-in board area: it is dual-layer structure used to install ZXMP S385 boards. Fan plug-in box: located at the bottom of the subrack, it provides forced air cooling for the equipment to dissipate heat.
The rear part of ZXMP S385 is equipped with one left and one right mounting lugs which are used to fix the equipment subracks in the cabinet. ZXMP S385 subrack adopts back fixing installation mode, it can be fixed in the cabinet from the front without obstructing cable layout, satisfying requirements for front-facing installation, front-facing maintenance, against wall and back-to-back installation of equipment cabinet. ZXMP S385 cabinet is 19 cabinet compliant with ETSI standards. It is made of excellent steel plate and features good electromagnetic shielding and heat dissipation performances.
5.1.2
Subrack backplane
ZXMP S385 backplane is fixed at the subrack, serving the carrier for connecting all the boards. It is divided into upper and lower parts, in which, the upper part connects various functional interface boards, and the lower part connects various functional boards. The backplane contains service bus, overhead bus, clock bus, board-in-position bus, connects all the boards, equipment and external signals via interfaces and sockets. Backplane adopts unified arrangement of bus arrays of payload services, auxiliary services, internal board-to-board communication and clock, thus ensures the equipment to add boards with various types of interfaces according to customers requirements.
5.1.3
Fan plug-in box

The structure of the fan plug-in box of the ZXMP S385 is shown in Figure 7. Three independent fan boxes are installed in the fan plug-in box, the structure of fan box is shown in Figure 8. Each fan module is electrically connected to the fan backplane via the socket at the back of the box. The fan box features independent locking function. It has running and alarm indicators on the front panel.
Figure 7 Structure of fan box
1.Fan box mounting bracket 2. Fan box
18
Figure 8
Fan box structure
1. Fan box 2. Fan 3. Indicator 4. Button switch The fan system of ZXMP S385 is the component for cooling and heat dissipation. Each subrack contains a fan backplane and three independent fan units side by side. Each fan unit is composed of a fan box, a fan and a FAN board. The FAN board is control by ENCP and provides rotation-blocking signal for ENCP monitor. The FAN board controls the fan operation if the FAN board loses contact with ENCP.
5.2
Appearance and dimensions

Dimensions and weight indexes of structural parts of ZXMP S385 are shown in Table 6
Table 6 Dimensions and weights of structural parts
Structural part
Dimension (mm) 2000 (height)600 (width)300 (depth)
Weight (kg) 70 80 90 25 5 -2 3 ---
ZXMP S385 cabinet
2200 (height)600 (width)300 (depth) 2600 (height)600 (width)300 (depth) 888.2mm (height)482.6mm (width)270mm (depth) 132.5 (height)482.6 (width)269.5 (depth) 43.6mm (height)436mm (width)245mm (depth) 43.6mm (height)482.6mm (width)250 (depth) 43.6mm (height)482.6mm (width)250 (depth) 133 mm (height)482.6mm (width)250mm (depth) PCB: 320 (height)210 (depth)2 (depth) Front panel: 345.6 mm (height) 8 HP (width)
ZXMP S385 sub-rack Power distribution box Fan plug-in box Dustproof plug-in box Ventilation unit Upper cabling area Cross-connect clock board (CSA/CSE/CSF)
19
Structural part Service interface board and ENCP, OW Service board (lower layer boards of subrack)
Dimension (mm) PCB: 277.8mm (height)160mm (depth)2mm (width) Front panel: None PCB: 320mm (height)210mm (depth)2mm (width) Front panel: 345.6 mm (height)5HP (width)
Weight (kg) --
--
Note: The cabinet weight is the weight of an empty cabinet. 1HP=5.08 mm ZXMP S385 offers cabinets with height of 2000mm, 2200mm and 2600mm. Subrack, the core component, is installed in ZXMP S385 cabinet. A 2000mm-high cabinet can accommodate only one subrack. A 2200mm- or 2600mm-high cabinet can accommodate one or two subracks. Various functions of the equipment can be realized via different configurations of subrack boards. In accordance with current situation of transmission cabinet, overall structure layout can be classified into 3 scenarios based on cabinet height, which are shown in Table 7 ,Table 8 .
Table 7 ZXMP S385 own configuration
Cabinet height 2.0m (with effective height of 42U) 2.2m (with effective height of 47U) 2.6 m (with effective height of 56U)
Power distribution box 3U
Subrack 20U+1U (subrack and cabling area+dustproof plug-in box) 20U+1U+1U+20U+1U (2 subracks and cabling area+2 dustproof plug-in boxes+1 ventilation unit) 20U+1U+1U+20U+1U (2 subracks and cabling area+2 dustproof plug-in boxes+1 ventilation unit)
3U
3U
Table 8
ZXMP S385 is configured with other products
Cabinet height
Power distribution box 3U 3U 3U 3U
Subrack ZXMP S385 (20U+2U)+ ZXMP S320 (4U+1U) ZXMP S385 (20U+2U)+ ZXMP S330 (10U+3U) ZXMP S385 (20U+2U)+ ZXMP S320 (4U+1U) ZXMP S385 (20U+2U)+ ZXMP S330 (10U+3U)
2.0m (with effective height of 42U)
20
Cabinet height
Power distribution box 3U
Subrack ZXMP S385 (20U+2U)+ ZXMP S320 (4U+1U) ZXMP S385 (20U+2U)+ ZXMP S330 (10U+3U) ZXMP S385 (20U+2U)+ ZXMP S360 (21U+2U) ZXMP S385 (20U+2U)+ ZXMP S390 (23U+2U)
3U 3U 3U
+1U,+2U,+3U in the table are space reserved for dustproof, ventilation and cabling.
5.3
System subrack and slot diagram

ZXMP S385 sub-rack includes board, fan plug-in box and dustproof unit. Structure of sub-rack is shown in Figure 9. The plug-in board area of ZXMP S385 is separated into 2 layers, where, the top layer is for interface boards with 15 slots and the low layer is for functional boards with 16 slots. The sub-rack bottom contains a 1U fan plug-in box that contains three fans working independently.
21
Figure 9
Board slot layout of sub-rack
5.4
System board list and description

Common board name (code), applying rule and unit power consumption of ZXMP S385 are shown in Table 9 .The maximum input current of subrack is 16A.
Table 9 Boards/unit list (with power consumption)
Board
Board name and configuring explanation
Power Consum ption in Common Temperat ure (25 ) (W) 4.8
Max. Power Consum ption (45 ) (W)
Weight (Kg)
NCP
Net Control Processor, 1 for standard configuration, 2 able to practice 1+1 protection Enhanced Net Control Processor, 1 for standard configuration, 2 able to practice 1+1 protection Order-wire Qx interface 1 for standard configuration Cross-switch and Synchronous-clock (256x256 VC4 high order with 32x32 VC4 low order)
0.44
ENCP OW QxI CSA
9.6 5.3 3.9 27.4
9.9 5.4 4.1 28.2
0.46 0.47 0.52 1.14
22
Board
Power Consum ption in Common Temperat ure (25 ) (W) 32.4 17.3 36.5 60.5 3.9 4.4 25
Max. Power Consum ption (45 ) (W) 33.4 17.8 37.6 62.3 4.0 4.5 27.3
Weight (Kg)
CSF TCS64 TCS128 TCS256 SCIB SCIH OL64FE C OL64
Cross-switch and Synchronous-clock (1440x1440 VC4 high order) Cross-switch with low-order Cross-switch with low-order Cross-switch with low-order B-type clock interface board (2Mbit/s) H-type clock interface board (2MHz) Optical Line of out2, with L-64.2cIf, L64.2c IIf or L-64.2pf. Supports FEC function Optical Line of STM-64, with S-64.2b, L-64.2cI, L-64.2cII, P1L1-2D2 or L64.2p. STM-642 optical line board. Optical module types configurable include S64.2b, L-64.2c1, L-64.2c2 and L64.2p. Refer to ECC information for details. Optical Line of STM-16, with S-16.1, L-16.2, L-16.2JE, L-16.2U or L-16.2P Optical Line of STM-164, with S16.1, L-16.2 or L-16.2U STM-168 optical line board. Optical module types configurable include S16.1, L-16.2, L-16.2u and L-16.2p. Refer to ECC information for details. Optical Line of STM-42 Optical Line of STM-44 Optical Line of STM-14 Optical Line of STM-18 Optical Line/Electrical Line Process of STM-116 Optical /Electrical interface of STM18 Line Process of STM-14, used together with electric interface switchover board or bridge board Line Process of STM-18, used together with electric interface switchover board or bridge board
1.46 0.56 0.95 0.98 0.51 0.61 1.12
28.8
31.2
0.95
OL64x2
31.9
34.3
1.12
OL16 OL164
14.9 23.6
16.3 28.3
0.65 1.30
OL168 OL42 OL44 OL14 OL18 OEL116 OEIS1x8 LP14
33.5 10.1 16.8 8.9 14.4 18.1 6.4 5.8
38.2 10.4 17.3 9.2 14.8 18.6 6.4 6
1.43 0.70 0.74 0.74 0.80 0.87 0.38 0.65
LP18
5.8
0.68
23
Board
Power Consum ption in Common Temperat ure (25 ) (W) Before switchove r 0.5, after switchove r 8.2 Before switchove r 0.5, after switchove r 8.2 12.5 Before switchove r 0.5, after switchove r 5.3 0.5 19 0.5 Before switchove r 0.5, after switchove r 21.6 19 15.4 0.5 Before switchove r 0.5, after switchove r 21.1
Max. Power Consum ption (45 ) (W) Before switchove r 0.6, after switchove r 8.4 Before switchove r 0.6, after switchove r 8.4 12.9 Before switchove r 0.6, after switchove r 5.4 0.6 19.6 0.6 Before switchove r 0.6, after switchove r 22.2 19.6 15.8 0.6 Before switchove r 0.6, after switchove r 21.8
Weight (Kg)
ESS14
4-path STM-1 electric interface switchover board, used for interface slot
0.40
ESS18
Electrical Interface of STM-14
0.47
EP36
Electrical Process of E3/T36
0.71
ESE36
Electrical Interface Switching of E3/T36
0.40
BIE3 EPE163 (75) EIE163( 75)
Bridge Interface of STM1e/E3/T3/FE,used for the interface slot corresponding to protection board Electrical Process of E163 (75) Electrical Interface of E163 (75)
0.37 0.81 0.36 Before switcho ver 0.6, after switcho ver 8.4 0.83 0.81 0.35
ESE163 (75)
Electrical Interface Switching of E163 (75)
EPE163 (120) EPT163 (100) EIT163
Electrical Process of E163 (120) Electrical Process of T163 (100) Electrical Interface of T163 (100) or E163 (120)
EST163
Electrical Interface Switching of T163 (100) or E163 (120)
0.54
24
Board
Power Consum ption in Common Temperat ure (25 ) (W) 0.5 26.4
Max. Power Consum ption (45 ) (W) 0.6 27
Weight (Kg)
BIE1 SEE
Bridge Interface of E1/T1 Enhanced Intelligent Ethernet Processing Board(48:1),customer side 8FE(optical or electrical)+2GE Embedded RPR Ethernet Processing Board, customer side 8FE(optical or electrical)+2GE 8155Mbit/s optical board at the ATM side and 1622Mbit/s nonconcatenation data flow at the system side. GE transparent process board SAN service processing board, customer side 4SAN+4GE or 8GE Optical interface board cooperating with Ethernet board RSEB Optical /electric interface board cooperating with SEE board Ethernet electric board cooperating with Ethernet board including RSEB/SEE Optical add/drop unit board for 4 channels of fixed wavelength DWDM optical signals. Optical add/drop unit board for 4 channels of fixed wavelength CWDM optical signals. Fan board Optical Booster Amplifier board(12dBm) built-in Optical Booster Amplifier board(14dBm), built-in Optical Booster Amplifier board(17dBm), built-in Optical Booster Amplifier board(19dBm), built-in Optical Pre-Amplifier(-32dBm), builtin Optical Pre-Amplifier(-38dBm), builtin
0.39 0.75
RSEB
29.4
30.3
0.98
AP18 TGE2B TGSA8 OIS18 OEIFEx8 ESFE8
24.1 19.1 36.5 7.0 8.5 0.6
24.9 19.7 37.6 7.2 8.5 0.7
0.85 0.73 0.99 0.45 0.45 0.38
OADD
4.1
0.75
OADC FAN OBA12 OBA14 OBA17 OBA19 OPA32 OPA38
3.5 4.2 6.1 6.1 6.1 6.1 4.8 4.8
3.6 4.3 11.6 11.6 11.6 11.6 10.3 10.3
0.75 0.36 1.15 1.15 1.15 1.15 1.18 1.18
25
5.5
STM-N optical interfaces performance

Performance of the OTU2/STM-64/16/4/1 optical interfaces is shown in Table 10 ,Table 11 ,Table 12 ,Table 13 .
Table 10 Performance of the STM-1 optical interface
Nominal bit rate Classification code Working wavelength (nm) Source type Min transmitting optical power (dBm) Max transmitting optical power (dBm) Minimum extinction ratio (dB) Poorest sensitivity (dBm) Minimum overload point (dBm) Transmitter at reference point S Optical path between Point S and R Receiver at reference point R
155520kbit/s S-1.1 1310 MLM -15 -8 8.2 -28 -8 L-1.1 1310 SLM -5 0 10 -34 -10 L-1.2 1550 SLM -5 0 10 -34 -10
G.957-compliant
Table 11
Performance of the STM-4 optical interface
622080kbit/s S-4.1 1310 MLM -15 -8 8.2 -28 -8 L-4.1 1310 SLM -3 2 10 -28 -8 L-4.2 1550 SLM -3 2 10 -28 -8
G.957-compliant
Table 12
Performance of the STM-16 optical interface
Nominal bit rate Classification code Working wavelength (nm) Source type
2488320kbit/s S16.1 1310 SLM L16.2 1550 SLM L16.2JE 1550 SLM L16.2P 1550 SLM L16.2U 1550 SLM
26
Nominal bit rate Min transmitting optical power (dBm) Max transmitting optical power (dBm) Minimum extinction ratio (dB) Poorest sensitivity (dBm) Minimum overload point (dBm) Transmitter at reference point S Optical path between Point S and R Receiver at reference point R
2488320kbit/s -5 0 8.2 -18 0 -2 3 8.2 -28 -9 +2 5 8.2 -28 -9 -2 3 8.2 -28 -9 -2 3 8.2 -28 -9
G.957-compliant
Table 13
Performance of the STM-64/OTU2 optical interface of ZXMP S385
9953280kbit/s S64.2b 1550 SLM -1 2 8.2 -14 -1 L64.2c1 1550 SLM -2 2 8.2 -22 -9 L64.2c2 1550 SLM 3 6 8.2 -22 -9 P1L12D2 1550 SLM 0 4 9 -24 -7
10709225kbit/s P1L1-2D2 1550 SLM 0 4 9 -24 -7 G.709compliant
G.691 or G.959.1-compliant
5.6
PDH interfaces performance and indexes

Performance of PDH electrical interfaces is shown as Table 14 .
Table 14 Performance of the PDH electrical interface
Type Code pattern Bit rate of signals at output port Attenuation tolerance at input port
1544 kbit/s AMI or B8ZS G.703complia nt
2048 kbit/s HDB3 code G.703complia nt
34368 kbit/s HDB3 code G.703complian t
44736 kbit/s B3ZS code G.703complian t
155520 kbit/s CMI code G.703compliant
27
Type Frequency deviation tolerance at input port Anti-interference capability of input port
1544 kbit/s
2048 kbit/s
34368 kbit/s
44736 kbit/s
155520 kbit/s
Permitted input port attenuation, permitted frequency deviation and output port signal bit rate tolerance are listed in the following Table 15 .
Table 15 Input port permitted attenuation, frequency deviation and output port signal bit rate tolerance
Interface rate 1544kbit/s 2048 kbit/s 34368 kbit/s 44736 kbit/s 155520 kbit/s
Permitted input port frequency deviation(regular squared attenuation) -0dB~6dB, 1024kHz 0dB~12dB, 17,184kHz -0dB~12.7dB, 78MHz
Permitted input port frequency deviation Greater than 32ppm Greater than 50ppm Greater than 20ppm Greater than 20ppm Greater than 20ppm
Output port rate tolerance Less than 32ppm Less than 50ppm Less than 20ppm Less than 20ppm Less than 20ppm
Reflection attenuation at the input/output ports For input/output port reflection attenuation index of various electronic ports of ZXMP S385, please refer to Table 16 .
Table 16
Requirements for the input/output port reflection attenuation
Interface bit rate
Test frequency range 51.2kHz~102.4kHz 102.4kHz~2048kHz 2048kHz~3072kHz 860kHz~1720kHz
Reflection attenuation (dB) 12 18 14 12 18 14 15
2048Kbit/s input port
34368Kbit/s input port 155520Kbit/s input/output port
1720kHz~34368kHz 34368kHz~51550kHz 8MHz~240MHz
Anti-interference capability of the input port The ratio of main signals to interference signals is 18dB.
28
Output port waveform The output port Recommendation. waveform complies with template specified in G.703
Over-voltage protection of the input and output interfaces The input and output interfaces must bear 10 continuous standard pulses (5 positive and 5 negative) without being damaged. The rising time of a standard pulse is 1.2s, the width is 50s and the voltage amplitude is 20V.
5.7
Performance of data boards

There are several data boards in ZXMP S385 V2.50:SEE, TGE2B, RSEB, AP18 and TGSA8.
5.7.1
Performance of SEE
Providing 810M/100M+2GE interfaces. Support 48VCG. VCG mapping mode may be VC-12-Xv/VC-3-Xv/VC-4-Xv. VCG supports at most 1.25G bandwidth. The total mapping bandwidth of SDH backplane is 1.25Gbps. Support E-Line, E-Tree and E-LAN services. Configure S-VLAN according to port or customer CE-VLAN. Support Ethernet OAM to facilitate fault locating and performance inspection. Support GFP RDI-CSF alarm. Support Ethernet access rate control and DifferServ. Support EPS protection. Support port dispatching fairness of best-effort service.
5.7.2
Performance of TGE2B
TGE2B board provides 2GE adaptive Ethernet services.The performance is show as Table 17 .
29
Table 17
Performance of TGE2B of ZXMP S385
Characteristics of Ethernet board Property sort Board name Ethernet port characteristics Connector Ethernet port QTY of board interface Port work mode (rate, full duplex and auto-negotiation) Optical module able to plug Interface mode Remote download and upgrade Max. Port QTY at system SDH side (WAN port)
Explanation of board function TGE2B 1000BASE-SX/LX LC 2 Support Support Front-outlet on panel Support 2 2.5G Support 16VC4 (Each VCG supports at most 8VC4), or 48VC3 (Each VCG supports at most 24VC3). Support (The delay supported by VC3 is 8ms. The board adopts the V3-AU3-AUG mode and the mapping is not made via VC4. Some problems occur in the interconnection with other vendors equipment and in the test. The interconnection and test adopt VC4 instead of VC3. ) Support (The delay tolerance supported by VC4 is 8ms.) Support (The dynamic service bandwidth adjustment leads to 100ms loss. There is no problem in the function and interconnection.) Support Support Support Support Support Support (maximum 9600 byte)
Total backplane mapping bandwidth
Virtual concatenation
VC3 Virtual concatenation
VC4 Virtual concatenation Dynamic VCG bandwidth increase/decrease, no damage with service LCAS protocol LCAS management functions (enable, alarm, event report) Multi-path protection of VCG level, protecting time <300ms Support GFP encapsulation, satisfy ITU-T G.7041 standard Encapsulation protocol support LAPS protocol, satisfy ITU-T X.86 standard support PPP encapsulation protocol Support Jumbo frame
30
Characteristics of Ethernet board Support the flow control based on port Support port transparent transmit, the service frame format might be (Eth II, 802.3, 802.1QTAG) The transparent transmit performance satisfies MSTP recommendation, refer to MSTP standard 6.2.1 for details, key performance parameters: package losing rate, burst interval, transfer rate, and delay
Explanation of board function Full duplex 802.3x PAUSE flow control Support. Support the transfer of the port Link state to the opposite end, and the Link State Transfer technique (LST), which will greatly reduce the switching time of the router.
Point-to-point transparent transmit (private service mode)
Support
The intercommunic ation of different products inside company Ethernet performance
VC4 level intercommunication
VC4-level intercommunicating with EOS series boards, RPR functional RSEB board
Support Ethernet performance monitor of port level
Support
5.7.3
Performance of RSEB
RSEB maps Ethernet service to RPR, and performs the unique functions of RPR. It uses the channel bandwidth resource of SDH/MSTP ring network to provide the dual-ring topology required by RPR and implement the ring interconnection of RPR nodes. RSEB provides user Ethernet interfaces as 8FE (optical/electrical) +2GE (optical). It provides FE optical or electrical board by cooperating with OIS18 or ESFE interface board respectively. RSEB board provides two RPR ports and four EOS port at system side: RPR at system side contains two RPR SPAN: RPR SPAN1 and RPR SPAN2 with mapping methods of VC-4-Xv, VC-3-Xv, backplane bandwidth is 2.5G, capable of constructing 1.25G RPR. RPR board at system side provides four EOS ports with mapping method of VC-12Xv and a maximum bandwidth of 63VC12.
EOS system port can be used for RPR service cross-ring, or intercommunication with EOS boards as SEE . It supports LCAS protocol. RPR SPAN port and EOS system port share the 2.5 Gbit/s SDH processing bandwidth. They support maximum 2.5 Gbit/s of RPR ring total bandwidth, and maximum 155 Mbit/s
ZTE Confidential Proprietary 2009 ZTE Corporation. All rights reserved. 31
of EOS bandwidth (RPR ring total bandwidth and EOS bandwidth cannot reach the maximum values simultaneously). RSEB board has the following functions: Switching capacity: 5G, backplane bandwidth:2.5G; Providing 8FE+2GE user Ethernet interfaces; Compliant with IEEE802.17, support for two RPR SPAN, capable of forming 1.25G bidirectional ring at most; Support for interoperation of RPR ring and EOS chain, implementing conversion of mapping granules; Support for Bypass RPR MAC function, used as EOS transparent transmission board to support transparent transmission of two GE+4 FEs; EOS port supporting CSF OAM function, with point-to-point LST function available; Support for IGMP Snooping broadcast protocol, support for IPTV application; Support for LACP protocol, providing large-capacity dynamic link aggregation function with protection; Good service security isolation, support for Q in Q-based VLAN VPN; Support for VC-12-Xv/VC-3-Xv/VC-4-Xv, LCAS and GFP.
5.7.4
Performance of AP18
AP18 board is mainly used to converge or aggregate ATM service data to SDH transmission network. It provides 8155 Mbit/s optical interfaces at the ATM side to perform functions as ATM layer processing and mapping from ATM cell to VC-4. It provides 1622 Mbit/s non-concatenation data flow at the system side. With 622M backplane bandwidth and 622Mbps cell switching capacity, it can select 1-4 VC-4 channels to transmit ATM services. Backplane bandwidth: 622M, cell switching capacity: 622Mbps. Supports four ATM service types as constant bit rate (CBR), realtime variable bit rate (rt-VBR), non-realtime variable bit rate (nrt-VBR) and unspecific bit rate (UBR). Supports VP/VC switching. Support VP uni-directional/bidirectional 1+1 and 1:1, supports VPRing, VCRing functions.
32
Support OAM function of ATM, supports VP protection switching, the switching request can be alarms as VP-AIS (Virtual path-based alarm indication signal), LOS (loss of signal), LOF (loss of frame), OOF (out of frame), LAIS (line alarm indication signal), LCD (loss of cell delineation), and LOP (loss of pointer). Supports ATM space, logic multicast, when performing ATM exchange, it can copy one input ATM cell flow (VP, VC) to multiple output ATM links.
5.7.5
Performance of TGSA8
TGSA8 has SAN and GE transparent transmission interface. It supports 8 user interfaces which adopt SFP optical module. The first 4 user interfaces may respectively offer GE or SAN service. SAN service includes 1G Fiber Channel and 1G FICON services. The other 4 user interfaces may offer 4GE services. TGSAx8 provides 42.5G service bus at the system side. The total bandwidth is 10G. Other characteristics of TGSAx8 are showed as follows: Support GFP and comply with G.7041. Support LOF, OOF, AU-AIS and AU-LOP alarm check. Provide line-side and user-side loopback functions of user interface. Support VC-3 and VC-4 mixed concatenation. Any VCG may be respectively configured to VC-3 or VC-4 virtual concatenation. VC-3 supports VC-3-->TU-3->AU-4 mapping path. Support LCAS protocol and complies with G.7042.
5.8
5.8.1
Physical Performance of Ethernet

Ethernet interface types and followed standard
Ethernet interface index is show in Table 18 .
Table 18 Ethernet interface index
Type 10BASE-T
Rate (bps) 10M
followed standard IEEE 802.3
Interface type Electronic interface Electronic interface
interface RJ45, category 3 UTP RJ45, category 3 UTP

33
100BASE-TX
100M
IEEE 802.3u
Type 100BASE-FX
Rate (bps) 100M
followed standard IEEE 802.3u
Interface type M-1.1/S-1.1/L-1.1
interface SFP-LC
All optical interface indices are described as following table. 1 FE MMF optical interface(M-1.1) FE MMF optical interface(M-1.1)as show in Table 19 ,Table 20 .
Table 19 Transmission index of FE MMF optical interface
Item Transmission unit type Transmission distance Interface Wavelength (, range) Trise/Tfall (maximum;10%~90%) RMS spectrum width (maximum) Output optical power (maximum) Output optical power (minimum) Output optical power when the LD is shut down (maximum) Extinction ratio (minimum)
62.5/125m MMF MMF LD 2 SFP-LC 1270~1380 3 63 -14 -20 -45 10
Unit KM nm ns nm dBm dBm dBm dB
Table 20
Receiver index of FE MMF optical interface
Item Wavelength(, range) input optical power (maximum) Receiver sensitivity 2
62.5/125m MMF 1270~1380 -14 -30
Unit Nm dBm dBm
FE short distance SMF optical interface(S-1.1) FE short distance SMF optical interface(S-1.1) as show in Table 21 ,Table 22
34
Table 21
index of FE short distance SMF optical interface
Item Transmission unit type Transmission distance Interface type Wavelength(, range) Trise/Tfall (maximum;20%~80%) RMS spectrum width(maximum) output optical power(maximum) output optical power(minimum) Output optical power when the LD is shut down(maximum) Extinction ratio(minimum)
10/125m SMF SMF LD 15 SFP-LC 1261~1360 2.5 7.7 -8 -11.5 -45 9
Table 22
receiver index of FE short distance optical interface
Item Wavelength (, range) Input optical power (maximum) Receiver sensitivity 3
10/125m SMF 1261~1360 -8 -31
Unit nm dBm dBm
FE long distance SMF optical interface(L-1.1) FE long distance SMF optical interface(L-1.1) as show in Table 23 ,Table 24 .
Table 23
Transmission index of FE long distance SMF optical interface
Item Transmission unit type Transmission distance Interface type Wavelength (,range) Trise/Tfall (maximum; 20%~80%) RMS spectrum width (maximum) output optical power(maximum) output optical power(minimum) Output optical power when the LD is shut down(maximum) Extinction ratio (minimum)
10/125m SMF SMF LD 40 SFP-LC 1261~1360 2.5 3 0 -5 -45 10
35
Table 24
Receiver index of FE long distance optical interface
Item Wavelength ( range) Input optical power (maximum) Receiver sensitivity
10/125m SMF 1261~1360 -9 -34
Unit Nm dBm dBm
5.8.2
GE interface types and followed standard

GE interface index is show in Table 25 .
Table 25 GE interface index
Type 1000BASE-SX 1000BASE-FX
Rate(bps) 1000M 1000M
followed standard IEEE 802.3z IEEE 802.3z
Interface type M-1.8 S-1.1 or L-1.2
interface SFP-LC SFP-LC
All optical interface indices are described as following table. 1 GE MMF optical interface(M-1.8) GE MMF optical interface(M-1.8) as show in Table 26 ,Table 27 .
Table 26 Transmission index of GE MMF optical interface
Item Transmission unit type Transmission distance Interface Wavelength (, range) Trise/Tfall (maximum;10%~90%) RMS spectrum width(maximum) Output optical power(maximum) Output optical power(minimum) Output optical power when the LD is shut down(maximum) RIN(maximum) Extinction ratio(minimum)
62.5/125m MMF MMF LD 275 SFP-LC 830~860 0.26 0.85 -4 -9.5 -35 -117 9
Unit m nm ns nm dBm dBm dBm dB/Hz dB
36
Table 27
Receiver index of GE MMF optical interface
Item Wavelength(,range) input optical power(maximum) Receiver sensitivity Minimum return loss Intensified receiving sensitivity (maximum) 2
62.5/125m MMF 770~860 0 -17 12 -12.5
Unit nm dBm dBm dB dBm
GE short distance SMF optical interface(S-1.1) GE short distance SMF optical interface(S-1.1) as show in Table 28 ,Table 29 .
Table 28
Transmission index of GE short distance SMF optical interface
Item Transmission unit type Transmission distance Interface type Wavelength(,range) Trise/Tfall (maximum;20%~80%) RMS spectrum width(maximum) output optical power(maximum) output optical power(minimum) Output optical power when the LD is shut down(maximum) Extinction ratio(minimum) RIN(maximum)
10/125m SMF SMF LD 10 SFP-LC 1270~1355 0.26 2.8 -3 -9.5 -35 9 -120
Unit KM nm ns nm dBm dBm dBm dB dB/Hz
Table 29
Receiver index of GE short distance optical interface
Item Wavelength ( ,range) Input optical power (maximum) Receiver sensitivity Intensified receiving sensitivity (maximum) 3
10/125m SMF 1270~1355 -3 -20 -14.4
unit nm dBm dBm dBm
GE long distance SMF optical interface(L-1.2) GE long distance SMF optical interface(L-1.2)as show in Table 30 ,Table 31 .
37
Table 30
Transmission index of FE long distance SMF optical interface
Item Transmission unit type Transmission distance Interface type Wavelength (,range) Trise/Tfall (maximum;20%~80%) RMS spectrum width (maximum) output optical power(maximum) output optical power(minimum) Output optical power when the LD is shut down(maximum) Extinction ratio(minimum) RIN(maximum)
10/125m SMF SMF LD 80 SFP-LC 1540~1570 2.5 0.16 5 0 -45 9 -120
Unit Km nm ns nm dBm dBm dBm dB dB/Hz
Table 31
Receiver index of GE long distance optical interface
Item Wavelength(,range) Input optical power(maximum) Receiver sensitivity Intensified receiving sensitivity (maximum)
10/125m SMF 1270~1600 0 -22 -14.5
Unit nm dBm dBm dBm
5.9
Performance of OAD
OAD board consists of OADD and OADC. OADD can add/drop 4 wavelengths of DWDM optical signals. These 4 wavelengths are among C-band 40 wavelengths. OADC can multiplex/demultiplex 4 wavelengths of CWDM optical signals and 1 channel of 1310nm optical signal. These 4 wavelengths are 1471/1491/1511/1531nm or 1551/1571/1591/1611nm. OADD/OADC can be upgraded. With board cascading, it can multiplex/demultiplex 8 wavelengths of optical signals. OAD board may process the control commands from NM to make the online upgrade of board software.
Performance of OADD and OADC are show in Table 32 ,Table 33 .
38
Table 32
Performance of OADD
Item Frequency Range Wavelength Range Channel Spacing 0.5 dB Passband 20dB Passband In-drop Insertion Loss Add-out In-out Insertion Loss Uniformity
Unit THz nm GHz nm nm dB dB dB dB
Parameter Min 192.1 1529.55 100 0.11 2.5 2.5 1.20 3.3 3.3 2.4 1.0 Max 196.0 1560.61
Table 33
Performance of OADC
Item Channel Number Central wavelength Passband @ 0.5dB Wavelength range of upgrade port Ripple @ 1310 Port LnCWDM Insertion Loss (Including connectors) UPGCWDM Ln UPG Ln 1310nm
Unit
Parameter 6 5 1471/1491/15 11/1531 6.5 1544.5~1621 0.5 2.0 2.0 4 1551/1571/15 91/1611 6.5 0.5 1.7 1471/1491/1511/ 1531 6.5 1544.5~1621 0.5 0.7 1260~1360 2.3 2.3 1.2
nm nm nm dB dB nm dB dB dB dB
Passband @ 1310 Port
5.10
Performance of OBA
Performacen of OBA is show in Table 34 .
39
Table 34
Performance of OBA Module
Performance Operating wavelength Input power Output power(maximum) Dynamic range of output power (dB) Gain Small Signal Gain Noise Index Input return loss output return loss Output pump leakage Input pump leakage PDG PMD Power(full temperature range) Operating temperature Operating humidity Storage temperature Optical Connector
Unit nm dBm dBm dB dB dB dB dB dB dBm dBm dB ps W
OBA12 1530~1565 -12~4 12 3 5~24 >25 5 45 45 -30 -30 0.5 1 <25 -15~65
OBA14 1530~1565 -12~4 14 3 7~26 >25 5 45 45 -30 -30 0.5 1 <25 -15~65 5~95 -40~75 LC/PC
OBA17 1530~1565 -6~4 17 3 10~23 >25 5 45 45 -30 -30 0.5 1 <25 -15~65 5~95 -40~75 LC/PC
5~95 -40~75 LC/PC
Note:OBA19 Only operating at 155M and 622M bit rate.
5.11
Performance of OPA
Performance of OPA is show in Table 35 .
Table 35 Performance of OPA Module
Performance Operating wavelength Filter-3dB bandwidth Filter -20dB bandwidth Input power Output power(maximum) Dynamic range of output power (dB) Gain Small Signal Gain Noise Index
unit nm nm nm dBm dBm dB dB dB dB
OPA38 1550.12 0.45 1.2 -38~20 -9 3 26~32 30 4.5
OPA32 1550.12 0.45 1.2 -32~15 -6 3 25~31 30 4.5
40
Performance Input return loss output return loss Output pump leakage Input pump leakage Forward ASE level Backward ASE power level Pump wavelength PDG PMD Power Power supply Operating temperature Operating humidity Storage temperature Optical Connector
unit dB dB dBm dBm dBm dBm nm dB ps W V %
OPA38 45 45 -30 -50 -30 -30 980 0.2 1 15 -4810% -15~65 5~95 -40~75 LC/PC
OPA32 45 45 -30 -50 -30 -30 980 0.2 1 15 -4810% -15~65 5~95 -40~75 LC/PC
5.12
Performance of DCM
The Dispersion Compensating Modules compensates the dispersion of conventional single mode fiber (G.652/G.655) Performance of the DCM is show in Table 36 .
Table 36 Performance of the DCM
Type Dispersion compensated range(ps/nm) Insert loss(dB) typical value PMD(2-step) PMD(Typical)(ps) PMD cost(dB) Note:
DCM-20 -32915 4.1 -3.2 0.5 -0.4
DCM-40 -68021 5.1 -4.4 1.0 -0.4 0.1
DCM-60 102031 7.0 -6 1.2 -0.5 0.1
DCM-80 -136041 8.9 -7.7 1.3 -0.6 0.1
DCM-100 -164041 12.1 -11.5
Each DCM needs a 1U-high DCM-Box.; Generally Only 10G system need to consider dispersion problem; DCM80 can only be located in front of OBA and cannot be located after OPA
41
5.13
Error Performance
For each circuit direction and for bi-directional section and path, the error performance is monitored separately, the SDH performance of ZXMP complies with ITU-T G.784, G.828 and G.826. The SDH performance includes performance items such as BBE, ES, SES, FBBE, FEES, FESES, PSC, PJC+, PJC-, UAS, etc. The long term and short-term error performances of ZXMP S385 are complied with ITUT G.828 and M.2101 recommendation. According to ITU-T G.821 and G.826, in 420km HRDP (Hypothetical Reference Digital Path), SDH system error performance of ZTEs transmission product is as follows, these figures are tested in field and test duration is not less than 24 hour. SDH system error performance is show in Table 37 .
Table 37 SDH system error performance
Bit rate(kbit/s) ESR SESR BBER
2048 1.84810 9.2410 9.2410

-6
44736 3.46610 9.2410 9.2410

-6
155520 7.39210 9.2410 9.2410

-6
622080 1.84810 9.2410 9.2410

-5
2488320 3.710
-5 -8 -9
-8 -9
-8 -9
-8 -9
-8 -9
9.2410 9.2410
The performance is better than ITU-T recommendation.
5.14
Jitter index at interfaces

For ZXMP S385, the jitter and wander tolerance for G.703 PDH and SDH interface conform to ITU-T G.823, G.824 (45Mbps) and G.825 respectively.
5.14.1
Jitter and wander tolerance of PDH input interface

The jitter and wander tolerance at ZXMP S385 PDH input interface meets the requirements shown in Figure 10, Figure 11 and Table 38 ,Table 39 .
42
Figure 10 The jitter and wander tolerance at E1 PDH input interface
Peak-peak jitter and wander (logarithm)
A0 A3 A1 A2
Slope: -20dB/10 octave
f0
f10 f9
f8
f1
f2
f3
f4
Jitter frequency (logarithm)
Figure 11 The jitter and wander tolerance at T1 PDH input interface
Table 38
The input jitter and wander tolerance of PDH interface
Interfa ce rate (kbit/s)
UIp-p A 3
Frequency (Hz) f10(T1 /T3 is f0) 1.210 5 18 ffs 4.881 0-3 ffs 1.2 105 0.0 1 ffs 1.6 67 ffs
Pseudo random f1 f2 12 0 2.4 k 1k 60 0 f3 f4 40 K 10 0k 80 0k 40 0k signal
A0
A1 5.0 UI 18 1.5 5.0 UI
A2 0. 1U I 0. 2 0. 15 0. 1U I
f9
f8
1544 2048 34368 44736
18 36. 9 618 .6 18
10 20 10 0 10
6k 18 k 10 k 30 k
220 1 215-1 223-1 220 1
Jitter and wander tolerance of PDH output interface
43
Table 39
The output jitter and wander tolerance of the PDH interface
Parameter value
Network limit B1 unit interval B2 unit interval peak-topeak
Measurement filter bandwidth Band-pass filter having a lower cutoff frequency f1 or f3 and an upper cutoff frequency f4 f1 f3 8kHz 18 kHz (700 Hz) 10 kHz 30kHz f4 40KHz 100 kHz 800 kHz 400kHz
Digit rate (kbit/s)
peak-to-peak
1 544 2 048 34 368 44736 Note:
5 1.5 1.5 5
0.1 0.2 0.15 0.1
10Hz 20 Hz 100 Hz 10Hz
For the co directional interface only. The frequency values shown in parenthesis only apply to certain national interfaces. UI Unit Interval: for 2048 Kbit/s 1 UI = 488 ns; for 34 368 Kbit/s 1 UI = 29.1 ns
5.14.2
Jitter and wander tolerance of SDH input interface

The capability of STM-N input interface to stand jitter and wander is specified and tested with the digital test signal of sine modulated phase. The input jitter and wander tolerance of ZXMP S385 SDH terminal multiplexer satisfies the requirements in Figure 12, Table 40 and Table 41 . The input jitter and wander tolerance of ZXMP S385 SDH regenerator satisfies the requirements shown in Figure 13 and Table 42 .
44
Figure 12 The jitter tolerance of STM-N terminal multiplexer input interface
Peak-peak jitter and wander (logarithm)

A0 A1

A2 A3 A4
f0
f12
f11
f10
f9
f8
f1
f2
f3
f4
Frequency
Table 40
Input jitter and wander tolerance (UIP-P) of SDH
STM interface STM-1 STM-4 STM-16
A0 (18s) 2800 11200 44790
A1 (2 s) 311 1244 4977
A2 (0.25 s) 39 156 622
A3 1.5 1.5 1.5
A4 0.15 0.15 0.15
Table 41
Input jitter and wander tolerance of the SDH
f0 1.2 10-5 1.2 10-5 1.2 10-5
f12 1.78 10-4 1.78 10-4 1.78 10-4
f11 1.6 10-3 1.6 10-3 1.6 10-3
f10 1.56 10-2 1.56 10-2 1.56 10-2
f9 0.125 0.125 0.125
f8 19.3 9.65 12.1
f1 500 1000 5000
f2 6.5k 25k 100k
f3 65k 250k 1M
f4 1.3M 5M 20M
45
Figure 13 The input jitter tolerance of STM-N SDH regenerator
Input jitter amplitude
UI
P-P
A2
A1
f2
f1
Frequency
Table 42
Input jitter tolerances of STM-N regenerators
STM interface STM-1 STM-4 STM-16 A B A B A B
f1 (kHz) 65 12 250 12 1000 12
f2 (kHz) 6.5 1.2 25 1.2 100 1.2
A1 (UIP-P) 0.15 0.15 0.15 0.15 0.15 0.15
A2 (UIP-P) 1.5 1.5 1.5 1.5 1.5 1.5
5.14.3
Inherent output jitter of STM-N interface

For the ADM, TM and DXC equipment of ZXMP S385, the STM-N output jittering indexes meet the requirements in Table 43 and Table 44 . Because of the randomness of jitter, the test value might exceed, and it is acceptable when over 99% test values satisfy the indexes during the test (for 1 to 2 minutes).
Table 43 STM-N interface inherent output jitter indexes of SDH
Test filter 500Hz~1.3MHz 65kHz~1.3MHz 1000Hz~5MHz 250kHz~5MHz 5000Hz~20MHz 1MHz~20MHz
Peak value of jitter 0.50 UI 0.10 UI 0.50 UI 0.10 UI 0.50 UI 0.10 UI
46
Table 44
STM-N network interface output jitter indexes of SDH
STM interface STM-1 optical interface STM-1 electrical interface STM-4 optical interface STM-16 optical interface
f1 (Hz) 500 500 1000 5000
f3 (kHz) 65 65 250 1M
f4 (MHz) 1.3 1.3 5 20
B1 (UIp-p) 1.5 1.5 1.5 1.5
B2 (UIp-p) 0.15 0.075 0.15 0.15
For the REG equipment, when the test filter adopts 12 kHz high-pass filter, its root mean square value (RMS) created from jitter should not be greater than 0.01UIrms.
5.14.4
Mapping jitter of PDH tributary

The mapping jitter at the ZXMP S385 PDH tributary can satisfy the requirements listed in Table 45 .
Table 45 Mapping jitter specifications
G.703 interface (kbit/s) 2048 34368 44736
Tolerance (ppm) 50 20 20
High-pass filter 20dB/10 multiplication f1 (Hz) 20 100 100 f3 (Hz) 18k 10k 10k f4 (Hz) 100k 800k 800k
Maximum peak value of mapping jitter f1~f4 Undetermined Undetermined Undetermined f3~f4 0.08 0.08 0.08
5.14.5
Combined Jitter
In the SDH system, generally, there are both mapping jitter and pointer adjusting jitter. The combined jitter of both is called the combined jitter. Under various test sequences, the value detected by ZXMP S385 should meet the ones listed in Table 46 .
Table 46 Combined jitter
PDH inter face (kbit/ s) 2048 3436 8
Bit rate toler ance (ppm ) 50 30
High pass filter 20dB/10 octave f1 (Hz) 20 100 f3 (Hz) 18k 10k f4 (Hz) 100 k 800 k
Maximum peak-peak value combined jitter UIP-P f1~f4 (UIp-p) 0.4 0.4 0.4 0.4 0.4 0.4 0. 75 f3~f4 (UIp-p) 0.0 75 0.0 75 0.0 75 0.0 75 0.0 75 0.0 75 0.0 75
47
PDH inter face 4473 6
Bit rate toler ance 30
High pass filter 20dB/10 octave 100 10k 800 k
Maximum peak-peak value combined jitter UIP-P 0.4 a 0.4 b 0.4 c 0. 75 d 0.0 75 A 0.0 75 B 0.0 75 c 0.0 75 d
Test sequence
5.14.6
Jitter transfer function of the regeneration relay

The jitter transfer function of the regeneration relay is defined the ratio of output STM-N signal jitter to the input STM-N signal jitter versus frequency. The jitter transmission characteristic of ZXMP S385 SDH regeneration relay is shown in Figure 14.
Figure 14 The jitter transfer characteristics of a regeneration relay
Input jitter amplitude
(UI P-P ) A2
A1
f2
f1
Frequency
The jitter transmission parameters of regeneration relay are shown in Table 47 .

Table 47 Jitter transmission parameters of a regeneration relay
STM-N STM-1 STM-4 STM-16 A B A B A B
fc (kHz) 130 30 500 30 2000 30
P (dB) 0.1 0.1 0.1 0.1 0.1 0.1
5.15
Clock timing and synchronous characteristics

The SEC Index list is show in Table 48 .
48
Table 48
The SEC Index list
Vendor Type Standard Central Frequency Day aging rate Year aging rate Central frequency precision Short time stability Temperature characteristic Output jitter
ISOTEMP OCXO 77.76MHz 110-8 510-7 110-7(0V) 110-10/s 510-8(0~50C)
When there is no input jitter, the inhered jitter of ZXMP S385 2M clock output interface should not be over 0.05 UIP-P. The test is conducted at an interval of every 60 seconds with a single-pole band-pass filter in 20Hz and 100kHz turnover frequencies. Permitted input/output attenuation and others For ZXMP S385 the bit rate tolerance of clock output signal is 4.6ppm. Long-term phase variation in clock locking mode The long-term phase variation in the clock locking mode refers to the phase noise generated at the SEC output terminal when there is an ideal input reference signal. Usually, they are expressed by the Maximum Time Interval Error (MTIE) and time deviation error (MTIE). ZXMP S385 can satisfy the requirements shown in Table 49 Table 50 and Table 51 .
Table 49 The wander limit value under constant temperature (MTIE)
MTIE limits 40 ns 40 0.1 ns 25.25 0.2 ns
Observation interval 0.1s 1s 1s 100s 100s 1000s
Table 50
The wander limit value under temperature impact (MTIE)
Additional MTIE permitted value 0.5ns 50ns
Observation interval 0.1s 118s 100s
Table 51
The wander limit value under constant temperature (TDEV)
MTIE limits 3.2 ns
Observation interval 0.1s 25s
49
MTIE limits 0.64 6.4 ns 0.5 ns
Observation interval 25s 100s 100s 1000s
Clock accuracy in the hold mode Once all the timing references are lost, SEC will enter the hold mode after instantaneous phase variation. Now, SEC will use the last frequency information saved before the timing reference signal loss as its timing reference. Meanwhile, the oscillation frequency of the oscillator will slowly wander, but can still ensure that SEC frequency only has very small frequency deviation from the reference frequency in a long time base; therefore, the sliding loss will be within the allowed index requirement. This mode can be used to deal with an external clock failure lasting several days. When SEC loses its reference source and enters the hold mode, the phase error T of the SEC output signal to the input signal should not be over the following limits when observation time S is greater than 15s from the moment that the reference source loses. T (S) = [(a1+a2)S+0.5bS2+c] ns a1= 50ns/s corresponds to the initial frequency deviation of 510-8. a2=2000ns/s refers to the frequency deviation caused by the temperature change after the clock enters the hold mode. If there is no temperature change in 2 10-6, there will be no a2S in the phase error. b = 1.1610-4ns/s. It is caused by aging, corresponding to 110-8/day frequency wander. c = 120ns, includes any additional phase deviation that might be generated after entering the transition stage of hold mode. ZXMP S385 meets the above requirements.
Frequency Accuracy of Internal Oscillator in the Free-run Mode When the internal oscillator of SEC works in the free-run mode if SEC loses all of the clock references, and their memories or SEC has no hold mode at all, it is required that its output frequency accuracy be within a certain range.
For a reference that can follow the G.811 clock, the SEC output frequency accuracy in the free-run mode should not be greater than 4.6ppm for SDH terminal equipment and 20ppm for REG equipment. ZXMP S385 can satisfy the above requirements.
50
6
6.1
Environment Adaptability
Power supply requirements
Working voltage and current: Rated working voltage: -48V Rated working current: 16A Nominal voltage: -48VDC Range: -57VDC~-40VDC
6.2
Grounding requirements
If separate grounding is adopted in the equipment room, the grounding resistance should meet the following requirements: The grounding resistance in case of 48V DC is less than or equal to 4. The grounding resistance for the system working ground is less than or equal to 4. The grounding resistance for the lightning protection ground is less than or equal to 4.
If the combined grounding is adopted in the user equipment room, the grounding resistance should be less than or equal to 1. The voltage difference among lightning protection ground, system working ground and 48V GND should be less than 1V. The tandem requirements between all groundings are as follows: The -48V ground of the board is isolated from the -48V GND. The board shielding plate is connected to the cabinet via the front panel, and there is an electrical connection with the co-module filter capacitor inside a board.
The lightening protection GND only connects to the protection component, and converges with the system working GND at the grounding terminal on the bus bar of the rack. The -48V GND can converge with the PGND, or the combined GND on the bus bar of the rack, or be grounded outside.
51
6.3
6.3.1
Environment requirements
Operation Environment
1 Climate Climate requirement is show in Table 52 .
Table 52 Climate requirement
Item Altitude Air pressure Temperature (Long-term Operating) Temperature (Short-term Operating) Temperature change rate Relative humidity (Short-term Operating) Relative humidity (Long-term Operating) Heat radiation
Range 4000m 70 ~ 106kPa +5 ~+40 0 ~+45 0.5 /min 20%~80% 10%~90% 300W/s
In the normal working environment, the measuring point of the temperature and humidity refers to data obtained at the place 1.5 meters above the floor and 0.4m meters in front of the equipment. The short-term working refers to working continuously for no more than 48 hours and no more than accumulated 15 days in a year. 2 Biological environment Avoid multiplication of microbe, such as eumycete and mycete. Avoid the rodent, e.g., mice. 3 Air cleanliness Density requirements for chemical active substances is show in Table 53
Table 53 Density requirements for chemical active substances
Chemical active substance SO2 H2S NH3 Cl2 HCl HF
Content mean (mg/m) 0.3 0.1 1 0.1 0.1 0.01 Max( mg/m) 1 0.5 3 0.3 0.5 0.03
52
Chemical active substance O3 NO2
Content mean (mg/m) 0.05 0.5 Max( mg/m) 0.1 1
Density requirements for mechanical active substances is show in Table 54 .

Table 54 Density requirements for mechanical active substances
Mechanical active substance Perceivable dust 4 Mechanical stress
Content = 15 mg/mh
Requirements for mechanical stress is show in Table 55 .

Table 55 Requirements for mechanical stress
Item Acceleration Frequency range direction duration 5 Condition of earthquake According with:NEBS GR-63
Unit m/S2 Hz X,Y,Z Min
Value 0.1 5~100, 100~5 90
IEC721-2-6 Environmental conditions appearing in nature-Earthquake vibration IEC68-3-3 Environmental testing - Part 3: Background information - Subpart 3: Guidance. Seismic test methods for equipment
6.3.2
Environment for Storage

The following Table 56 ,Table 57 international standards are taken as the reference for framing the environment requirements: IEC721-3-1 Classes 1K4/1Z2/1Z3/1Z5/1B2/1C2/1S3/1M2 1 Climate
Climate requirement
Table 56
Item Altitude Air pressure
Range 4000m 70 ~ 106kPa
53
Item Temperature Temperature change rate Relative humidity Solar radiation Air speed 2 Mechanical stress
Requirements for mechanical stress
Range -40 ~ +70 0.5C/min 10% ~ 100% 600W/s 30m/s
Table 57
Item Acceleration Frequency range direction duration
unit m/S2 Hz X,Y,Z Min
value 0.1 5~100, 100~5 90
The earthquake-proof performance of the whole equipment complies with Earthquakeproof Performance Detection for SDH Optical Communications Equipment (Provisional) and Earthquake-proof Performance Detection for SDH Optical Communications Equipment (Provisional). The earthquake-proof performance detection reaches the eight-level intensity.
6.3.3
Cleanness requirements
Cleanness involves dust and harmful gases in the air. The equipment should be operated in the equipment room that meets the cleanness requirements described below: In the transmission equipment room, there is no explosive, electrically conductive, magnetically conductive or corrosive dust. The density of dust particles with the diameter greater than 5m should be no more than 3104 particles/m3. No corrosive metal or gases that are detrimental to the insulation exist in the equipment room, such as SO2 and NH3. The equipment room should be always kept clean, with doors and windows being closed.
6.3.4
Bearing Requirements of the Equipment Room

The bearing capability of the equipment room should be over 450kg/m2 to hold ZXMP S385 equipment. Electromagnetic Compatibility (EMC) requirements
54
Before introducing the EMC requirements, firstly specifies 3 criteria for test results: Performance A: Continuous phenomenon. Neither error nor alarm is allowed. After the electromagnetic interference, the number of errors shall not exceed the maximum of the normal requirement. Performance B: Transient phenomenon. During the electromagnetic interference, the degradation of function is allowed, the equipment can work as expected without the operators interference, the loss of frame and synchronization is not allowed, and neither pattern out-of-sync, nor AIS alarm is generated. The equipment shall work normally after the electromagnetic interference. Performance R: Resistive phenomenon. The fuse or other special devices can be replaced or restarted.
6.3.5
Electronic Static Discharge (ESD)

1 Anti-interference for static discharging The static discharge anti-interference index of ZXMP S385 equipment is shown in Table 58 . During the operation in the interface area, be sure to wear an antistatic wrist strap.
Table 58 Static discharge anti-interference
Contact discharge 6kV 8kV 2
Air discharge 8kV 15kV
Criterion for test results Performance B Performance R
RF electromagnetic radiated susceptibility The RF electromagnetic radiated susceptibility of ZXMP S385 equipment is shown in Table 59 .
Table 59
RF electromagnetic radiated susceptibility
Test frequency (80MHz~1000MHz) Electric field intensity 10V/m 3 Amplitude modulation 80%AM (1kHz) Criterion for test results Performance A
Electrical fast transient burst susceptibility The electrical fast transient burst susceptibility of ZXMP S385 equipment is shown in Table 60 and Table 61 .
55
Table 60
Electrical fast transient burst susceptibility at the DC power port
Generator waveform 5/50ns Test voltage 1kV Repeated frequency 5kHz Criterion for test results Performance B
Table 61
Electrical fast transient burst susceptibilities at the signal cable and control cable ports
Generator waveform 5/50ns Test voltage 1kV 4 Surge susceptibility The surge susceptibility of ZXMP S385 equipment is shown in Table 62 , Table 63 and Table 64 .
Table 62 Surge susceptibility of DC power
Repeated frequency 5kHz
Criterion for test results Performance B
The waveform of generators 1.2/50us (8/20s), internal resistance 12 Test mode Line to ground Line to ground Test voltage 1kV 2kV Criterion for test results Performance B Performance R
Table 63
Surge susceptibility of the outdoor signal cable
The waveform of generators 10/700s, internal resistance 40 Test mode Line to line Line to ground Line to line Line to ground Test voltage 2kV 4kV Criterion for test results Performance B Performance R
Table 64
Surge susceptibility of the indoor signal cable
Generator waveform 1.2/50s (8/20s), internal resistance 42 Test mode Line to ground Line to ground 5 Test voltage 1kV 2kV Criterion for test results Performance B Performance R
Conductivity susceptibility of RF field The conductivity susceptibility of RF field of ZXMP S385 equipment is shown in Table 65 .
56
Table 65
Conductivity susceptibility of RF field
Test frequency 0.15MHz ~ 80MHz Test intensity 3V Amplitude modulation 80%AM (1kHz) Electromagnetic Interference (EMI) 6 Conductive emission electromagnetic interference The conductive emission electromagnetic interference of ZXMP S385 equipment is shown in Table 66 .
Table 66 Conductive emission electromagnetic interference at the direct current port
Criterion for test results Performance A
Testing frequency (MHz) 0.02~0.15 0.15~0.5 0.5~30 7
Limits (dBuV) Quasi-peak 79 79 73 Mean value -66 60
Radioactive emission electromagnetic interference The radioactive emission electromagnetic interference of the ZXMP S385 equipment is shown in Table 67 .
Table 67
Radioactive emission electromagnetic interference
Testing frequency (MHz) 30~230 230~1000 230~1000
Quasi-peak demodulating limit (dBV/m) 10m 40 47 47 3m 50 57 57
6.4
Safety requirements
This product adopts the technical requirements specified in the following standard: IEC/EN 60950:2000 Safety of information technology equipment Working voltage and current Rated working voltage: -48V Max. working voltage: -57V Min. working voltage: -40V
57
Rated working current: 16A Insulation classification of the equipment The power supply of the equipment provides the SELV circuit with safe and excessively low voltage, without self-generating dangerous voltage. It belongs to the equipment of the class III insulation (Class III equipment). Optical interface The optical module of the maximum power belongs to (Class 3A). All the optical modules shall be under strict control and certified by authorities (such as UL, TUV and NEMKO), and comply with EN60825. Fuse All the fuses and power modules, including recoverable fuses, shall be certified by authorities such as CE, UL and TUV. Safety mark On the package of the equipment, there are striking labels about antistatic, fragile, waterproof, and damp-proof. The maximum optical power satisfies the 3A safety standard. An obvious label warning against the laser shall be pasted at the optical interface. Cables of different colors shall be used for the power input, shielding GND and lightening protection GND to avoid incorrect connection. Different power connectors shall use coding keys. There shall be a power label at the power inlet. Both the equipment and each board shall have an antistatic label. Grounding symbol Mechanical structure In installation, four bolts are designed at the rack bottom (may also be used to adjust balance) to fix the rack to the ground. At the rack top, the corresponding screws are designed to fix the rack to the cabling rack. When installed in the equipment room, the rack shall be fixed both at the top and bottom to ensure the stability and safety of the equipment. The corners of both the rack and sub-rack are processed to avoid hurting people. Fire protection The materials of the circuit boards in the equipment use the fireproof materials of the V-2 level to prevent the circuits from burning in case of failure. The structural parts use unburnable materials with a good fireproof performance, including surface processing materials. . indicates switch-on, and indicates switch-off.
58
With the effective heat dissipation design, it ensures that the temperature does not exceed 70C to prevent heat aggregation and reduce the possibility of burning. Safe parts passing the safety authentication (CE, UL, etc.) are used. High temperature protection In abnormal conditions, the temperature does not exceed 70C. The plastic parts, components, wires and cables, and safety labels shall all comply with the requirements specified in the safety standard-GB4943/EN60950. Lightening protection In this system, good grounding and isolation and protection of electrical interfaces are used to prevent the dangerous voltage of lightening.
59
Glossary
Abbreviations ADM AFEC AIS ANSI APS ASIC ASON ATM AU AUG AU-n AU-PTR BBE BBER BER BITS BML CBR CDM CLP CMI C-n CORBA CV CWDM DB DBMS DCC DCE DCF DCN DDN DLL DNA DNI Full Name Add-Drop Multiplexer Advanced Forward Error Correction Alarm Indication Signal American National Standards Institute Automatic Protection Switching Application Specific Integrated Circuit Automatically Switched Optical Network Asynchronous Transfer Mode Administrative Unit Administration Unit Group Administration Unit, level n Administration Unit Pointer Background Block Error Background Block Error Ratio Bit Error Ratio Building Integrated Timing Supply Business Management Layer Constant Bit Rate Code Division Multiplexing Cell Loss Priority Coded Mark Inversion Container- n Common Object Request Broker Architecture Code Violation Coarse Wavelength Division Multiplexing Data Base Data Base Management System Data Communications Channel Data Circuit-terminating Equipment Data Communications Function Data Communications Network Digital Data Network Dynamic Link Libraries Distributed Network Architecture Dual Node Interconnection
60
Abbreviations DQDB DTE DWDM DXC ECC EDFA EM EMC EMI EML EMS EOS ES ESD ESR ETS ETSI FDDI FDM FE FEBBE FEC FEES FESES GUI HDLC HPC HW IEC IEEE IP ITU-T L2 LAN LAPD
Full Name Distributed Queue Double Bus Data Terminal Equipment Dense Wavelength-division Multiplexing Digital Cross Connect Embedded Control Channel Erbium Doped Fiber Amplifier Element Management Electromagnetic Compatibility Electromagnetic Interference Element Management Layer Element Management System Ethernet Over SDH Error Second Electronic Static Discharge Error Second Ratio European Telecommunication Standards European Telecommunication Standards Institute Fiber Distributed Data Interface Frequency Division Multiplexing Fast Ethernet Far End Background Block Error Forward Error Correction Far End Error Second Far End Severely Error Second Graphical User Interface High Digital Link Control Higher order Path Connection High-Way International Electro technical Commission Institute of Electrical & Electronic Engineers Internet Protocol International Telecommunication UnionTelecommunication Standardization Sector Layer 2 Local Area Network Link Access Procedure On D-channel
61
Abbreviations LAPS LCD LCT LOF LOP LOS LPC MAC MAN MCF MCU MD MF MII MM MS MS-AIS MSOH MSP MS-PSC MS-PSD MS-SPRing MST MTIE NE NEF NEL NML NMS NRZ OAM OFS OOF OS OSF
Full Name Link Access Procedure for SDH Loss of ATM Cell Delineation Local Craft Terminal Loss Of Frame Loss Of Pointer Loss Of Signal Lower order Path Connection Medium Access Control Metropolitan Area Network Message Communication Function Micro Control Unit Mediation Device Mediation Function Medium Independent Interface Multi Mode Multiplex Section Multiplex Sections - Alarm Indication Signal Multiplex Section OverHead Multiplex Section Protection Multiplex Sections - Protection Switching Count Multiplex Sections - Protection Switching Duration Multiplexer Section Shared Protection Ring Multiplex Section Terminal Maximum Time Interval Error Network Element Network Element Function Network Element Layer Network Manager Layer Network Management System Non-Return-to-Zero Operation, Administration and Maintenance Out of Frame Second Out of Frame Operation System Operation System Function
62
Abbreviations OSI PCB PCM PDH PGND PHY PJEPJE+ POH PPP PRC QA QAF QoS RAM RDI REG REI RFI RIP RMII RS RSOH SAR SDH SEC SEMF SES SESR SETS SM SMCC SML SMN SMS SMT SNC SNCP
Full Name Open System Interconnect Printed Circuit Board Pulse Code Modulation Plesiochronous Digital Hierarchy Protection GND physical Layer Device Pointer Justification Event Pointer Justification Event + Path OverHead Point to Point Protocol Primary Reference Clock Q Adaptor Q Adaptor Function Quality of Service Random Access Memory Remote Defect Indication Regenerator Remote Error Indication Remote Failure Indication Router Information Protocol Reduced Medium Independent Interface Regenerator Section Regenerator Section OverHead Segmentation and Reassembly Synchronous Digital Hierarchy SDH Equipment Clock Synchronous Equipment Manage Function Severely Error Second Severely Error Second Ratio Synchronous Equipment Timing Source Single Mode Sub-network management control center Service Management Layer SDH Management Network SDH Management Sub-Network Surface Mount Technology Sub-network Connection Sub-network Connection Protection
63
Abbreviations SOH SPRING SSF SSM SSM STM-N TCP TDEV TDM TM TMN TTL TU TUG-m TU-m UART UAS UBR UNI UPC VBR VC VC VCI VC-n VDN VLAN VP VPI VPG WAN WDM WS WSF ZXMP
Full Name Section Overhead Shared Protection Ring Service Signal Fail Synchronization status messaging Synchronous State Message Synchronous Transport Module Level-N Transport Control Protocol Time Deviation Time Division Multiplex Terminal Multiplexer Telecommunications Management Network Transistor-Transistor Logic Tributary Unit Tributary Unit Group, level m Tributary Unit, level m Universal Asynchronous Receiver Transmitter Unavailable Second Unspecified Bit Rate User-Network Interface Usage Parameter Control Variable Bit Rate Virtual Channel Virtual Container Virtual channel Indicator Virtual Container, level n Virtual Data Network Virtual Local Area Network Virtual Path Virtual Path Indicator VP Group Wide Area Network Wavelength Division Multiplexing Work Station Work Station Function Zhong Xing MSTP
64

ZTE ZXMP S385 Product Description

Încărcat de

Informații document

Descriere originală:

Drepturi de autor

Formate disponibile

Partajați acest document

Partajați sau inserați document

Opțiuni de partajare

Vi se pare util acest document?

Este necorespunzător acest conținut?

Drepturi de autor:

Formate disponibile

ZTE ZXMP S385 Product Description

Încărcat de

Drepturi de autor:

Formate disponibile

Operator Logo

ZXMP S385 V2.50 Product Description

ZXMP S385 V2.50 Product Description

ZXMP S385 V2.50 Product Description

ZTE Confidential Proprietary

2011 ZTE Corporation. All rights reserved.

ZXMP S385 V2.50 Product Description

2011 ZTE Corporation. All rights reserved.

ZTE Confidential Proprietary

ZXMP S385 V2.50 Product Description

ZTE Confidential Proprietary

2011 ZTE Corporation. All rights reserved.

ZXMP S385 V2.50 Product Description

2011 ZTE Corporation. All rights reserved.

ZTE Confidential Proprietary

ZXMP S385 V2.50 Product Description

ZTE Confidential Proprietary

2011 ZTE Corporation. All rights reserved.

ZXMP S385 V2.50 Product Description

ZTE Confidential Proprietary

2009 ZTE Corporation. All rights reserved.

ZXMP S385 V2.50 Product Description

Superior scalability protects CAPEX and reduces OPEX

Leading RPR function supports IP evolution and protects CAPEX

Powerful embedded WDM function saves fiber resource

Flexible design facilitates network planning & optimization

Wide application, mature technology and high reliability

2011 ZTE Corporation. All rights reserved.

ZTE Confidential Proprietary

ZXMP S385 V2.50 Product Description

ZTE Confidential Proprietary

2009 ZTE Corporation. All rights reserved.

ZXMP S385 V2.50 Product Description

Powerful Service Access Ability

2011 ZTE Corporation. All rights reserved.

ZTE Confidential Proprietary

ZXMP S385 V2.50 Product Description

Optical Interfaces Provided by ZXMP S385

Board Type OTU2 STM-64 STM-16 STM-4 STM-1

Rate (Mbit/s) 10709.225 9953.280 2488.320 622.080 155.520

Board Integration (channel/board) 1 1/2 4/8 1/2/4 2/4/8/16

Maximum Access Quantity 14 14/28 56/72 56 208

Board Type STM-1 E3 T3 E1 T1

Rate (Mbit/s) 155.520 34.368 44.736 2.048 1.544

Board Integration (channel/board) 4/8/16 6 6 63 63

Maximum Access Quantity 208 96 96 1260 1260

ZTE Confidential Proprietary

2009 ZTE Corporation. All rights reserved.

ZXMP S385 V2.50 Product Description

Board Integration (channel/board) 8+2 2 8+2 8 (4+4) or 8

Maximum Access Capacity 128+32 56 128+32 112 (56+56) or 112

Integrated WDM Function

Complete Equipment Protection Ability

2011 ZTE Corporation. All rights reserved.

ZTE Confidential Proprietary

ZXMP S385 V2.50 Product Description

Equipment level protection provided by ZXMP S385

Perfect Network Protection Ability

Reliable Timing Synchronization Processing

ZTE Confidential Proprietary

2009 ZTE Corporation. All rights reserved.

ZXMP S385 V2.50 Product Description

System control and communication