A new microminiature monolithic capacitive pressure transducer (CPT I) is 20 times more sensitive than piezoresistive strain-gauge pressure transducers,

requires one percent of the power, and can be batch fabricated through current integrated circuit technology. A second device (CPT II) incorporates bipolar signal-processing electronics on the same silicon chip to produce a low-duty-cycle pulse-mode output with period related to pressure. This output format helps to re-solve the problem of shunting between leads, which is one of the principal causes of long-term drift in piezoresistive transducers designed for implantable medical applications. Because this device uses capacitance change as a transductional mechanism rather than piezo-resistivity, it is not susceptible to drift caused by temperature variations in the piezoresistive coefficient. Optimization for totally implantable biomedical applications places special emphasis on small size, high sensitivity, improved long-term baseline stability, and greatly reduced power consumption. These properties are also important for a wide range of pressure-sensing applications-from automotive to general industrial use.

Micromachined pressure sensors: review and recent developments

W P Eaton and J H Smith Show affiliations
ince the discovery of piezoresistivity in silicon in the mid 1950s, silicon-based pressure sensors have been widely produced. Micromachining technology has greatly benefited from the success of the integrated circuit industry, borrowing materials, processes, and toolsets. Because of this, microelectromechanical systems (MEMS) are now poised to capture large segments of existing sensor markets and to catalyse the development of new markets. Given the emerging importance of MEMS, it is instructive to review the history of micromachined pressure sensors, and to examine new developments in the field. Pressure sensors will be the focus of this paper, starting from metal diaphragm sensors with bonded silicon strain gauges, and moving to present developments of surface-micromachined, optical, resonant, and smart pressure sensors. Considerations for diaphragm design will be discussed in detail, as well as additional considerations for capacitive and piezoresistive devices. Results from surface-micromachined pressure sensors developed by the authors will be presented. Finally, advantages of micromachined sensors will be discussed.