BEST SYMPOSIUM PAPER AWARD NOMINEES PCB Conductor Surface Roughness as a Layer with Effective Material Parameters

Marina Koledintseva1, Alexander Razmadze1, Scott Hinaga2, Aleksandr Gafarov1 and James Drewniak1, (1)EMC Laboratory, Missouri University of Science and Technology, Rolla, MO, (2)PCB Technology Group, Cisco Systems, San Jose, CA

Characterizing Reverberation Chambers with Measurements of the Enhanced Backscatter Coefficient

Christopher Holloway, NIST, Boulder, CO

Efficient Aanlysis of Radiated Immunity of Complex Printed Circuit Boards Using SPICE
Huapeng Zhao, Department of Electronics and Photonics, Institute of High Performance Computing, Singapore, Singapore

On Different Methods to Combine Cable Information into Near-field Data for Farfield Estimation
Keong Kam, Andriy Radchenko and David Pommerenke, EMC Laboratory, Missouri S&T, Rolla, MO

Unified Circuit Modeling Technique for the Simulation of Electrostatic Discharge (ESD) Injected by an ESD Generator
Tadatoshi Sekine, Information Science and Technology, Graduate School of Science and Technology, Shizuoka University, Hamamatsu-shi, Japan, Hideki Asai, Systems Engineering, Shizuoka University, Hamamatsu-shi, Japan and John Lee, Samsung Electronics, Gyeonggi-do, South Korea

Corona Noise Considerations for Smart Grid Wireless Communication and Control Network Planning
Dheena Moongilan, Bell Laboratories, Alcatel-Lucent, Murray Hill, NJ

Characterization of Mutual Coupling Effects among Multi-Antennas Mounted on a PEC Tower Platform in the Presence of Intentional Electromagnetic Pulses (IEMPs)
Wei Luo1, Wen-Yan Yin1,2, Ming-Da Zhu1, Jun-Fa Mao3 and Jian-Yao Zhao2, (1)Key Lab of Ministry of Education of Design and EMC of High-Speed Electronic Systems, Shanghai Jiao Tong University, Shanghai, China, (2)Centre for Optical and EM Research (COER), State Key Lab of MOI, Zhejiang University, Hangzhou, China, (3)Key Lab of Ministry of Education of Design and EMC of High-Speed Electronic Systems, Shanghai Jiao Tong University, Shanghai, China

A Novel Vector Near-field Scanning System for Emission Measurements in TimeDomain

Johannes Russer, Electrical Engineering, Technische Universitaet Muenchen, Munich, Germany and Stephan Braun, GAUSS INSTRUMENTS GmbH, Munich, Germany

Speed-Up of PEEC EM/Ckt Solver Using Rank-Reduced Waveform Relaxation

Giulio Antonini, Ingegneria Elettrica e dell'Informazione, Universit degli Studi dell'Aquila, L'Aquila, Italy and Albert Ruehli, EMC Laboratory, Missouri University of Science and Technology, Windham, NH

Unintended Passive Resonant Structures in Interconnect Design for Multi-Gigabit Signaling

Kai Xiao, Intel Corp, DuPont, WA

Protection of a Delay-Locked Loop from Simultaneous Switching Noise Coupling using an On-Chip Electromagnetic Bandgap Structure
Chulsoon Hwang, KAIST, Deajeon, South Korea

Numerical Evaluation of Near-Field to Far-Field Transformation Robustness for EMC

Andriy Radchenko, Ji Zhang, Keong Kam and David Pommerenke, EMC Laboratory, Missouri S&T, Rolla, MO

Novel Common-Mode Current Detector using Metamaterial CRLH TransmissionLine Structure

Dajeong Eom, Sungtek Kahng, Boram Lee, Se-gyoon Mok and Seongryong Yoo, Information and telecommunication engineering, University of Incheon, Incheon, South Korea

Measurement-Based Modeling of Dual Loop Magnetic Near-Field Probe

Hiroki Funato1, Takashi Suga1 and Michihiko Suhara2, (1)Yokohama Research Lab, Hitachi, Ltd., Yokohama, Japan, (2)Department of Electrical and Electronic Engineering, Graduate School of Science and Engineering, Tokyo Metropolitan University, Hachioji, Japan

Efficient mapping of EM radiation associated with information leakage for cryptographic devices
Haruki Shimada1, Yu-ichi Hayashi1, Naofumi Homma1, Takaaki Mizuki1, Takafumi Aoki1, Hideaki Sone1, Laurent Sauvage, Dr2 and Jean-Luc Danger, Pr2, (1)Tohoku University, Sendai, Japan, (2)COMELEC, Institut Tlcom, Paris, France