Thin Film Lithography The Process

Thin film lithography, in modern manufacturing, is a process that involves printing of specific patterns on to a flat surfaced substrate; it is analogous to the method of making printed circuits. It is considered to be one of the most important processes used in the industry, particularly in electronics and semiconductor productions. Below is the standard process a step-by-step guide used in the industry. Step 1: Surface preparation It is recognized that lithography involves delicate processes and therefore extra care is needed at every stage - as early as during the surface preparation. In this stage, the worker ensures that all surface contaminants are removed, including dust, lint, bacteria, water, and oil. To do this, the worker soaks and rinses the surface using various chemicals. Specific chemicals are also used to aid in the resist adhesion. Step 2: Resist coating Following the material preparation, the surface undergoes the process of resist coating that is usually done through a method called 'spin coating' wherein the surface is spun rapidly inside a vacuum while photoresist coats it. The photoresist creates uniform patterns on the surface, with the excess stripped off during spinning. Then, a coating solvent is applied to remove the buildup along the edge of the surface. Step 3: The Pre-bake stage This is the stage of heating the surface in a convection oven with the purpose of making the excess coating solvent to evaporate, leaving the surface with hardened photoresist. Step 4: The mask alignment This step includes the application of photomask - a desired pattern that can be transferred on to a surface by means of light waves. The most common method being applied is through the use of an electron beam. Various photomask references can be used for its placement onto the surface including contact, proximity, and projection. Step 5: The exposure The stage where the photoresist, surface, and mask are exposed to UV light using UV lamp. Step 6: The development stage The application of chemicals that results either positive or negative reaction; with negative photoresist, polymerzation exist and the non-polymerized sections decompose. With positive photoresist, sections of the resist are chemically modified to decompose when exposed to UV light. Step 7: Post bake The process that is aimed to stabilize and harden the photoresist; this is also the stage where traces of development chemicals are removed.

Step 8: The photoresist removal / processing Lastly, in this stage, the worker utilizes solvents to remove excess photoresist. The process results either Etch-back - the photoresist is applied overtop the layer that is desired to be patterned, etching away the unwanted - or Lift-off - wherein a layer is deposited over the top of the photoresist.

--Riza Deshpande writes and shares various industry-related topics. For more, visit: Thin Film Lithography Services, Campbell, CA.