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800 V, 4.5 W
Features
ESD DiodeProtected Gate 100% Avalanche Tested 100% Rg Tested These Devices are Pb-Free, Halogen Free/BFR Free and are RoHS Compliant
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V(BR)DSS 800 V RDS(ON) MAX 4.5 W @ 10 V
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. Limited by maximum junction temperature 2. IS = 3.3 A, di/dt 100 A/ms, VDD BVDSS, TJ = +150C
NDD03N80Z, NDF03N80Z
THERMAL RESISTANCE
Parameter JunctiontoCase (Drain) JunctiontoAmbient Steady State NDF03N80Z NDD03N80Z (Note 3) NDF03N80Z (Note 4) NDD03N80Z (Note 3) NDD03N80Z1 Symbol RqJC RqJA Value 4.0 1.3 50 33 96 Unit C/W
3. Insertion mounted 4. Surface mounted on FR4 board using 1 sq. pad size (Cu area = 1.127 sq [2 oz] including traces).
5. Pulse Width 380 ms, Duty Cycle 2%. 6. Guaranteed by design. 7. Switching characteristics are independent of operating junction temperatures.
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NDD03N80Z, NDF03N80Z
TYPICAL CHARACTERISTICS
3.0 2.5 2.0 1.5 6.0 V 1.0 0.5 0.0 5.0 V 5.2 V 5.8 V 5.6 V 5.4 V 25 5.0 VDS = 25 V ID, DRAIN CURRENT (A) 4.0 TJ = 55C 3.0 2.0 1.0 0.0 TJ = 150C TJ = 25C
VGS = 6.8 V to 10 V
10
12 11 10 9.0 8.0 7.0 6.0 5.0 4.0 3.0 2.0 1.0 0.0 5.0
ID = 1.2 A TJ = 25C
VGS = 10 V TJ = 25C
5.5
6.0
6.5
7.0
7.5
8.0
8.5
9.0
9.5 10
3.0 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 6.5 7.0 7.5
2.75 2.50 2.25 2.00 1.75 1.50 1.25 1.00 0.75 0.50 0.25 50 25 0 25 50 75 100 125 TJ, JUNCTION TEMPERATURE (C) ID = 1.2 A VGS = 10 V
1.15 BVDSS, NORMALIZED BREAKDOWN VOLTAGE (V) ID = 1 mA 1.10 1.05 1.00 0.95 0.90 50
150
25
125 150
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NDD03N80Z, NDF03N80Z
TYPICAL CHARACTERISTICS
10.0 10000
C, CAPACITANCE (pF)
TJ = 150C
1000
1.0
100
TJ = 125C
10
Crss
0.1
50
100 150 200 250 300 350 400 450 500 VDS, DRAINTOSOURCE VOLTAGE (V)
100
400 350 VGS 300 250 200 150 VDS = 400 V ID = 3.3 A TJ = 25C 100 50 0 20
QGS
QGD
18
t, TIME (ns)
100
10
10
td(on)
1.0
TJ = 150C
1.0
100
0.1 0.3
125C
450
55C 1.2
0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 VSD, SOURCETODRAIN VOLTAGE (V)
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NDD03N80Z, NDF03N80Z
TYPICAL CHARACTERISTICS
100 VGS 30 V SINGLE PULSE TC = 25C
10
100 ms 10 ms 1 ms 10 ms dc
0.1
0.01 0.1
Figure 12. Maximum Rated Forward Biased Safe Operating Area NDD03N80Z
10
1 R(t) (C/W)
10% 0.1 5.0% 2.0% 1.0% 0.01 0.000001 SINGLE PULSE 0.00001 0.0001 0.001 0.01 0.1 1 10 RqJC = 1.3C/W Steady State 100 1000
LEADS
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NDD03N80Z, NDF03N80Z
Table 1. ORDERING INFORMATION
Device NDD03N80Z1G NDD03N80ZT4G NDF03N80ZH (In Development) Package IPAK (Pb-Free, Halogen-Free) DPAK (Pb-Free, Halogen-Free) TO220FP (Pb-Free, Halogen-Free) Shipping 75 Units / Rail 2500 / Tape & Reel 50 Units / Rail
For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D.
MARKING DIAGRAMS
4 Drain YWW 3N 80ZG 4 Drain YWW 3N 80ZG NDF03N80ZH AYWW Gate Source
2 1 Drain 3 Gate Source DPAK = Location Code = Year = Work Week = PbFree, HalogenFree Package
Drain TO220FP
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NDD03N80Z, NDF03N80Z
PACKAGE DIMENSIONS
TO220 FULLPACK, 3LEAD CASE 221AH ISSUE C
E E/2
A P 0.14
M
B H1 A A1
SEATING PLANE
B A
Q
1 2 3
C
NOTE 3
NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. CONTOUR UNCONTROLLED IN THIS AREA. 4. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH AND GATE PROTRUSIONS. MOLD FLASH AND GATE PROTRUSIONS NOT TO EXCEED 0.13 PER SIDE. THESE DIMENSIONS ARE TO BE MEASURED AT OUTERMOST EXTREME OF THE PLASTIC BODY. 5. DIMENSION b2 DOES NOT INCLUDE DAMBAR PROTRUSION. LEAD WIDTH INCLUDING PROTRUSION SHALL NOT EXCEED 2.00. DIM A A1 A2 b b2 c D E e H1 L L1 P Q MILLIMETERS MIN MAX 4.30 4.70 2.50 2.90 2.50 2.70 0.54 0.84 1.10 1.40 0.49 0.79 14.70 15.30 9.70 10.30 2.54 BSC 6.70 7.10 12.70 14.73 --2.80 3.00 3.40 2.80 3.20
L1 b 0.25
M
3X 3X
c B A
M
b2 e
A2
C E Z
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. DIM A B C D E F G H J K R S V Z INCHES MIN MAX 0.235 0.245 0.250 0.265 0.086 0.094 0.027 0.035 0.018 0.023 0.037 0.045 0.090 BSC 0.034 0.040 0.018 0.023 0.350 0.380 0.180 0.215 0.025 0.040 0.035 0.050 0.155 MILLIMETERS MIN MAX 5.97 6.35 6.35 6.73 2.19 2.38 0.69 0.88 0.46 0.58 0.94 1.14 2.29 BSC 0.87 1.01 0.46 0.58 8.89 9.65 4.45 5.45 0.63 1.01 0.89 1.27 3.93
S T
SEATING PLANE
A
1 2 3
F D G
3 PL
H
M
0.13 (0.005)
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NDD03N80Z, NDF03N80Z
PACKAGE DIMENSIONS
DPAK (SINGLE GUAGE) CASE 369AA ISSUE B
A B C A c2
NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: INCHES. 3. THERMAL PAD CONTOUR OPTIONAL WITHIN DIMENSIONS b3, L3 and Z. 4. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH, PROTRUSIONS, OR BURRS. MOLD FLASH, PROTRUSIONS, OR GATE BURRS SHALL NOT EXCEED 0.006 INCHES PER SIDE. 5. DIMENSIONS D AND E ARE DETERMINED AT THE OUTERMOST EXTREMES OF THE PLASTIC BODY. 6. DATUMS A AND B ARE DETERMINED AT DATUM PLANE H. DIM A A1 b b2 b3 c c2 D E e H L L1 L2 L3 L4 Z INCHES MIN MAX 0.086 0.094 0.000 0.005 0.025 0.035 0.030 0.045 0.180 0.215 0.018 0.024 0.018 0.024 0.235 0.245 0.250 0.265 0.090 BSC 0.370 0.410 0.055 0.070 0.108 REF 0.020 BSC 0.035 0.050 0.040 0.155 MILLIMETERS MIN MAX 2.18 2.38 0.00 0.13 0.63 0.89 0.76 1.14 4.57 5.46 0.46 0.61 0.46 0.61 5.97 6.22 6.35 6.73 2.29 BSC 9.40 10.41 1.40 1.78 2.74 REF 0.51 BSC 0.89 1.27 1.01 3.93
E b3 L3
1 4
D
2 3
Z
DETAIL A
L4
b2 e
b 0.005 (0.13)
M
c C L2
GAUGE PLANE
H C L L1 DETAIL A
SEATING PLANE
A1
ROTATED 90 CW 5
SOLDERING FOOTPRINT*
6.20 0.244 3.00 0.118
2.58 0.102
5.80 0.228
1.60 0.063
6.17 0.243
SCALE 3:1
mm inches
*For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of SCILLCs product/patent coverage may be accessed at www.onsemi.com/site/pdf/PatentMarking.pdf. SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Typical parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including Typicals must be validated for each customer application by customers technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
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NDD03N80Z/D