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January 2003
Features
j Wide dynamic range: j Low input noise
> 140dB
4.5nV/Hz 7 V/s (typ); 5V/s (min) 15MHz (typ); 10MHz (min) 120KHz 0.002% 0.3mV 60
voltage:
j High slew rate: j High gain bandwidth: j Wide power bandwidth: j Low distortion: j Low offset voltage: j Large phase margin: j Available in 8 pin MSOP
package
Schematic Diagram
(1/2 LM833)
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DS005218
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LM833
Connection Diagram
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Order Number LM833M, LM833MX, LM833N, LM833MM or LM833MMX See NS Package Number M08A, N08E or MUA08A
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LM833
Storage Temperature Range TSTG Soldering Information Dual-In-Line Package Soldering (10 seconds) Small Outline Package (SOIC and MSOP) Vapor Phase (60 seconds) Infrared (15 seconds) ESD tolerance (Note 5)
60 150C
260C
Differential Input Voltage (Note 3) VI Input Voltage Range (Note 3) VIC Power Dissipation (Note 4) PD Operating Temperature Range TOPR
30V 15V
500 mW 40 85C (Notes 1, 2)
DC Electrical Characteristics
(TA = 25C, VS = 15V) Symbol VOS IOS IB AV VOM VCM CMRR PSRR IQ Parameter Input Offset Voltage Input Offset Current Input Bias Current Voltage Gain Output Voltage Swing Input Common-Mode Range Common-Mode Rejection Ratio Power Supply Rejection Ratio Supply Current
Conditions RS = 10
Min
Units mV nA nA dB V V V dB dB
90
110
12 10 12
80 80
mA
AC Electrical Characteristics
(TA = 25C, VS = 15V, RL = 2 k) Symbol SR GBW Slew Rate Gain Bandwidth Product Parameter Conditions RL = 2 k f = 100 kHz Min 5 10 Typ 7 15 Max Units V/s MHz
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LM833
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Note 1: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is functional, but do not guarantee specific performance limits. Electrical Characteristics state DC and AC electrical specifications under particular test conditions which guarantee specific performance limits. This assumes that the device is within the Operating Ratings. Specifications are not guaranteed for parameters where no limit is given, however, the typical value is a good indication of device performance. Note 2: All voltages are measured with respect to the ground pin, unless otherwise specified. Note 3: If supply voltage is less than 15V, it is equal to supply voltage. Note 4: This is the permissible value at TA 85C. Note 5: Human body model, 1.5 k in series with 100 pF.
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LM833
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LM833
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CMR vs Frequency
Distortion vs Frequency
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PSRR vs Frequency
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LM833
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Noninverting Amp
Noninverting Amp
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LM833
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Application Hints
The LM833 is a high speed op amp with excellent phase margin and stability. Capacitive loads up to 50 pF will cause little change in the phase characteristics of the amplifiers and are therefore allowable. Capacitive loads greater than 50 pF must be isolated from the output. The most straightforward way to do this is to put
a resistor in series with the output. This resistor will also prevent excess power dissipation if the output is accidentally shorted.
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Complete shielding is required to prevent induced pick up from external sources. Always check with oscilloscope for power line noise.
Total Gain: 115 dB @f = 1 kHz Input Referred Noise Voltage: en = V0/560,000 (V)
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LM833
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Typical Applications
NAB Preamp NAB Preamp Voltage Gain vs Frequency
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Adder/Subtracter
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VO = V1 + V2 V3 V4
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VO = V1V2
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LM833
Typical Applications
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LM833
Typical Applications
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AC/DC Converter
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Line Driver
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LM833
Typical Applications
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Illustration is: fL = 32 Hz, fLB = 320 Hz fH =11 kHz, fHB = 1.1 kHz
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RIAA Preamp
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LM833
Typical Applications
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LM833
Typical Applications
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C1 0.12F 0.056F 0.033F 0.015F 8200pF 3900pF 2000pF 1100pF 510pF 330pF
C2 4.7F 3.3F 1.5F 0.82F 0.39F 0.22F 0.1F 0.056F 0.022F 0.012F
R1 75k 68k 62k 68k 62k 68k 68k 62k 68k 51k
R2 500 510 510 470 470 470 470 470 510 510
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LM833
Typical Applications
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DIE/WAFER CHARACTERISTICS
Fabrication Attributes Physical Die Identification Die Step Physical Attributes Wafer Diameter Dise Size (Drawn) Thickness Min Pitch Special Assembly Requirements: Note: Actual die size is rounded to the nearest micron. Die Bond Pad Coordinate Locations (A - Step) (Referenced to die center, coordinates in m) NC = No Connection SIGNAL NAME OUTPUT A INPUT AINPUT A+ VEEINPUT B+ INPUT BOUTPUT B VCC+ PAD# NUMBER 1 2 3 4 5 6 7 8 X/Y COORDINATES X -476 -476 -476 -0 476 476 476 0 Y 500 -212 -500 -500 -500 -212 500 500 X 110 110 110 110 110 110 110 110 x x x x x x x x PAD SIZE Y 110 110 110 110 110 110 110 110 150mm 1219m x 1270m 48mils x 50mils 406m Nominal 288m Nominal LM833A A General Die Information Bond Pad Opening Size (min) Bond Pad Metalization Passivation Back Side Metal Back Side Connection 110m x 110m ALUMINUM VOM NITRIDE BARE BACK Floating
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LM833
Typical Applications
Tel #: Fax:
(Continued)
IN U.S.A 1 877 Dial Die 1 877 342 5343 1 207 541 6140
IN EUROPE Tel: Fax: IN ASIA PACIFIC Tel: IN JAPAN Tel: 81 043 299 2308 (852) 27371701 49 (0) 8141 351492 / 1495 49 (0) 8141 351470
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LM833
Physical Dimensions
Molded Small Outline Package (M) Order Number LM833M or LM833MX NS Package Number M08A
Molded Dual-In-Line Package (N) Order Number LM833N NS Package Number N08E
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Physical Dimensions
8-Lead (0.118 Wide) Molded Mini Small Outline Package Order Number LM833MM or LM833MMX NS Package Number MUA08A
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