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MODEL : 32LF15R
CAUTION
32LF15R-MA
BEFORE SERVICING THE CHASSIS, READ THE SAFETY PRECAUTIONS IN THIS MANUAL.
Printed in Korea
CONTENTS
CONTENTS .............................................................................................. 2 SAFETY PRECAUTIONS ......................................................................... 3 SPECIFICATION ....................................................................................... 6 ADJUSTMENT INSTRUCTION ................................................................ 9 TROUBLE SHOOTING ........................................................................... 13 BLOCK DIAGRAM.................................................................................. 18 EXPLODED VIEW .................................................................................. 19 SVC. SHEET ...............................................................................................
Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
-2-
SAFETY PRECAUTIONS
IMPORTANT SAFETY NOTICE
Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in the Schematic Diagram and Exploded View. It is essential that these special safety parts should be replaced with the same components as recommended in this manual to prevent Shock, Fire, or other Hazards. Do not modify the original design without permission of manufacturer.
General Guidance
An isolation Transformer should always be used during the servicing of a receiver whose chassis is not isolated from the AC power line. Use a transformer of adequate power rating as this protects the technician from accidents resulting in personal injury from electrical shocks. It will also protect the receiver and it's components from being damaged by accidental shorts of the circuitry that may be inadvertently introduced during the service operation. If any fuse (or Fusible Resistor) in this TV receiver is blown, replace it with the specified. When replacing a high wattage resistor (Oxide Metal Film Resistor, over 1W), keep the resistor 10mm away from PCB. Keep wires away from high voltage or high temperature parts.
Leakage Current Hot Check (See below Figure) Plug the AC cord directly into the AC outlet.
Do not use a line Isolation Transformer during this check. Connect 1.5K/10watt resistor in parallel with a 0.15uF capacitor between a known good earth ground (Water Pipe, Conduit, etc.) and the exposed metallic parts. Measure the AC voltage across the resistor using AC voltmeter with 1000 ohms/volt or more sensitivity. Reverse plug the AC cord into the AC outlet and repeat AC voltage measurements for each exposed metallic part. Any voltage measured must not exceed 0.75 volt RMS which is corresponds to 0.5mA. In case any measurement is out of the limits specified, there is possibility of shock hazard and the set must be checked and repaired before it is returned to the customer.
AC Volt-meter
Before returning the receiver to the customer,
always perform an AC leakage current check on the exposed metallic parts of the cabinet, such as antennas, terminals, etc., to be sure the set is safe to operate without damage of electrical shock.
1.5 Kohm/10W
Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
-3-
SERVICING PRECAUTIONS
CAUTION: Before servicing receivers covered by this service manual and its supplements and addenda, read and follow the SAFETY PRECAUTIONS on page 3 of this publication. NOTE: If unforeseen circumstances create conflict between the following servicing precautions and any of the safety precautions on page 3 of this publication, always follow the safety precautions. Remember: Safety First. General Servicing Precautions 1. Always unplug the receiver AC power cord from the AC power source before; a. Removing or reinstalling any component, circuit board module or any other receiver assembly. b. Disconnecting or reconnecting any receiver electrical plug or other electrical connection. c. Connecting a test substitute in parallel with an electrolytic capacitor in the receiver. CAUTION: A wrong part substitution or incorrect polarity installation of electrolytic capacitors may result in an explosion hazard. 2. Test high voltage only by measuring it with an appropriate high voltage meter or other voltage measuring device (DVM, FETVOM, etc) equipped with a suitable high voltage probe. Do not test high voltage by "drawing an arc". 3. Do not spray chemicals on or near this receiver or any of its assemblies. 4. Unless specified otherwise in this service manual, clean electrical contacts only by applying the following mixture to the contacts with a pipe cleaner, cotton-tipped stick or comparable non-abrasive applicator; 10% (by volume) Acetone and 90% (by volume) isopropyl alcohol (90%-99% strength) CAUTION: This is a flammable mixture. Unless specified otherwise in this service manual, lubrication of contacts in not required. 5. Do not defeat any plug/socket B+ voltage interlocks with which receivers covered by this service manual might be equipped. 6. Do not apply AC power to this instrument and/or any of its electrical assemblies unless all solid-state device heat sinks are correctly installed. 7. Always connect the test receiver ground lead to the receiver chassis ground before connecting the test receiver positive lead. Always remove the test receiver ground lead last. 8. Use with this receiver only the test fixtures specified in this service manual. CAUTION: Do not connect the test fixture ground strap to any heat sink in this receiver. Electrostatically Sensitive (ES) Devices Some semiconductor (solid-state) devices can be damaged easily by static electricity. Such components commonly are called Electrostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect transistors and semiconductor "chip" components. The following techniques should be used to help reduce the incidence of component damage caused by static by static electricity. 1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any electrostatic charge on your body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging wrist strap device, which should be removed to prevent potential shock reasons prior to applying power to the
Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
unit under test. 2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as aluminum foil, to prevent electrostatic charge buildup or exposure of the assembly. 3. Use only a grounded-tip soldering iron to solder or unsolder ES devices. 4. Use only an anti-static type solder removal device. Some solder removal devices not classified as "anti-static" can generate electrical charges sufficient to damage ES devices. 5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices. 6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or comparable conductive material). 7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material to the chassis or circuit assembly into which the device will be installed. CAUTION: Be sure no power is applied to the chassis or circuit, and observe all other safety precautions. 8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise harmless motion such as the brushing together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity sufficient to damage an ES device.) General Soldering Guidelines 1. Use a grounded-tip, low-wattage soldering iron and appropriate tip size and shape that will maintain tip temperature within the range or 500F to 600F. 2. Use an appropriate gauge of RMA resin-core solder composed of 60 parts tin/40 parts lead. 3. Keep the soldering iron tip clean and well tinned. 4. Thoroughly clean the surfaces to be soldered. Use a mall wirebristle (0.5 inch, or 1.25cm) brush with a metal handle. Do not use freon-propelled spray-on cleaners. 5. Use the following unsoldering technique a. Allow the soldering iron tip to reach normal temperature. (500F to 600F) b. Heat the component lead until the solder melts. c. Quickly draw the melted solder with an anti-static, suctiontype solder removal device or with solder braid. CAUTION: Work quickly to avoid overheating the circuit board printed foil. 6. Use the following soldering technique. a. Allow the soldering iron tip to reach a normal temperature (500F to 600F) b. First, hold the soldering iron tip and solder the strand against the component lead until the solder melts. c. Quickly move the soldering iron tip to the junction of the component lead and the printed circuit foil, and hold it there only until the solder flows onto and around both the component lead and the foil. CAUTION: Work quickly to avoid overheating the circuit board printed foil. d. Closely inspect the solder area and remove any excess or splashed solder with a small wire-bristle brush.
-4-
IC Remove/Replacement Some chassis circuit boards have slotted holes (oblong) through which the IC leads are inserted and then bent flat against the circuit foil. When holes are the slotted type, the following technique should be used to remove and replace the IC. When working with boards using the familiar round hole, use the standard technique as outlined in paragraphs 5 and 6 above. Removal 1. Desolder and straighten each IC lead in one operation by gently prying up on the lead with the soldering iron tip as the solder melts. 2. Draw away the melted solder with an anti-static suction-type solder removal device (or with solder braid) before removing the IC. Replacement 1. Carefully insert the replacement IC in the circuit board. 2. Carefully bend each IC lead against the circuit foil pad and solder it. 3. Clean the soldered areas with a small wire-bristle brush. (It is not necessary to reapply acrylic coating to the areas). "Small-Signal" Discrete Transistor Removal/Replacement 1. Remove the defective transistor by clipping its leads as close as possible to the component body. 2. Bend into a "U" shape the end of each of three leads remaining on the circuit board. 3. Bend into a "U" shape the replacement transistor leads. 4. Connect the replacement transistor leads to the corresponding leads extending from the circuit board and crimp the "U" with long nose pliers to insure metal to metal contact then solder each connection. Power Output, Transistor Device Removal/Replacement 1. Heat and remove all solder from around the transistor leads. 2. Remove the heat sink mounting screw (if so equipped). 3. Carefully remove the transistor from the heat sink of the circuit board. 4. Insert new transistor in the circuit board. 5. Solder each transistor lead, and clip off excess lead. 6. Replace heat sink. Diode Removal/Replacement 1. Remove defective diode by clipping its leads as close as possible to diode body. 2. Bend the two remaining leads perpendicular y to the circuit board. 3. Observing diode polarity, wrap each lead of the new diode around the corresponding lead on the circuit board. 4. Securely crimp each connection and solder it. 5. Inspect (on the circuit board copper side) the solder joints of the two "original" leads. If they are not shiny, reheat them and if necessary, apply additional solder. Fuse and Conventional Resistor Removal/Replacement 1. Clip each fuse or resistor lead at top of the circuit board hollow stake. 2. Securely crimp the leads of replacement component around notch at stake top. 3. Solder the connections. CAUTION: Maintain original spacing between the replaced component and adjacent components and the circuit board to prevent excessive component temperatures.
Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
Circuit Board Foil Repair Excessive heat applied to the copper foil of any printed circuit board will weaken the adhesive that bonds the foil to the circuit board causing the foil to separate from or "lift-off" the board. The following guidelines and procedures should be followed whenever this condition is encountered. At IC Connections To repair a defective copper pattern at IC connections use the following procedure to install a jumper wire on the copper pattern side of the circuit board. (Use this technique only on IC connections). 1. Carefully remove the damaged copper pattern with a sharp knife. (Remove only as much copper as absolutely necessary). 2. carefully scratch away the solder resist and acrylic coating (if used) from the end of the remaining copper pattern. 3. Bend a small "U" in one end of a small gauge jumper wire and carefully crimp it around the IC pin. Solder the IC connection. 4. Route the jumper wire along the path of the out-away copper pattern and let it overlap the previously scraped end of the good copper pattern. Solder the overlapped area and clip off any excess jumper wire. At Other Connections Use the following technique to repair the defective copper pattern at connections other than IC Pins. This technique involves the installation of a jumper wire on the component side of the circuit board. 1. Remove the defective copper pattern with a sharp knife. Remove at least 1/4 inch of copper, to ensure that a hazardous condition will not exist if the jumper wire opens. 2. Trace along the copper pattern from both sides of the pattern break and locate the nearest component that is directly connected to the affected copper pattern. 3. Connect insulated 20-gauge jumper wire from the lead of the nearest component on one side of the pattern break to the lead of the nearest component on the other side. Carefully crimp and solder the connections. CAUTION: Be sure the insulated jumper wire is dressed so the it does not touch components or sharp edges.
-5-
SPECIFICATION
NOTE : Specifications and others are subject to change without notice for improvement.
1. Application range
This specification is applied to LP81A chassis.
3. Test method
(1) Performance : LGE TV test method followed (2) Demanded other specification Safety : CE, IEC Specification EMC : CE, IEC
Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
-6-
Upper Heterodyne PAL, SECAM, NTSC PAL, SECAM, NTSC Y/Cb/Cr, Y/ Pb/Pr HDMI-DTV, Only PCM MODE Component (1EA), AV (1EA) L/R Input Rear Rear, Audio Out (8) for commercial china Rear
Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
-7-
Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
-8-
ADJUSTMENT INSTRUCTION
1. Application Range
This spec. sheet is applied all of the 26/32 LCD TV, LP81A chassis (HURRICANE 5) by manufacturing LG TV Plant all over the world. 2) Click the connect button and confirm Dialog Box.
2. Specification
1) Because this is not a hot chassis, it is not necessary to use an isolation transformer. However, the use of isolation transformer will help protect test instrument. 2) Adjustment must be done in the correct order. 3) The adjustment must be performed in the circumstance of 255C of temperature and 6510% of relative humidity if there is no specific designation. 4) The input voltage of the receiver must keep 100-220V, 50/60Hz. 5) The receiver must be operated for about 5 minutes prior to the adjustment when module is in the circumstance of over 15. In case of keeping module is in the circumstance of 0C, it should be placed in the circumstance of above 15C for 2 hours. In case of keeping module is in the circumstance of below 20C, it should be placed in the circumstance of above 15C for 3 hours.
3) Click the Config button and Change speed E2PROM Device setting : over the 350Khz
2) Connect the download jig to D-sub jack (2) Download steps 1) Execute ISP Tool program in PC, then a main window will be opened 5) Click Auto(2) tab and set as below 6) click Run(3). 7) After downloading, check OK(4) message.
(2) f i l ex x x .bi n (4) .......... OK
Double click
(3)
Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
-9-
4. EDID (The Extended Display Identification Data ) /DDC (Display Data Channel) download
* Caution Use the proper signal cable for EDID Download
3) Adjust by commanding AUTO_COLOR_ADJUST (0xF1) 0x00 0x02 instruction (2) Confirmation 1) We confirm whether 0xF3 (offset), 0xF4 (gain) address of EEPROM 0xBC is 0xAA or not. 2) If 0xF3, 0xF4 address of EEPROM 0xBC isnt 0xAA, we adjust once more. 3) We can confirm the ADC values from 0x06~0x0B addresses in a page 0xBC. * Manual ADC process using Service Remocon. After enter Service Mode by pushing ADJ key, execute Auto-RGB by pushing _ key at Auto-RGB.
* EDID Data Item Manufacturer ID Version Revision Condition GSM Digital : 1 Digital :3 01 03 Data 1E6D
-> Physical address(F) : HDMI 1 -> 10 - Detail EDID Options are below (A, B, C, D, E, F) A. Product ID Model Name HD Dec 4018(A) 4018(D) Product ID Hex 9CF5 9CF6 EDID table F59C F69C
B. Serial No: Controlled on production line C. Month, Year: Controlled on production line: ex) Monthly: 09 09 Year: 2007 -> 11 D. Model Name(Hex):
Model name Model Name(HEX) LG TV 00 00 00 FC 00 4C 47 20 54 56 0A 20 20 20 20 20 20 20
Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
- 10 -
3) Enter the adjust mode of white balance - Enter the white balance adjustment mode with aging command(F3, 00, FF) * Luminance min value is 200cd/m2 in the cool mode (For LCD)
1) Enter the adjustment mode of DDC - Set command delay time : 50ms - Enter the DDC adjustment mode at the same time heat-run mode when pushing the power on by power only key - Maintain the DDC adjustment mode with same condition of Heat-run (Maintain after AC off/on in status of Heat-run pattern display) 2) Release the DDC adjustment mode - Release the adjust mode after AC off/on or std-by off/on in status of finishing the Hear-run mode - Release the Adjust mode when receiving the aging off command(F3 00 00) from adjustment equipment - Need to transmit the aging off command to TV set after finishing the adjustment. - Check DDC adjust mode release by exit key and release DDC adjust mode
Warm
To check the Coordinates of White Balance, you have to measure at the below conditions. Picture Mode : User 1 XD : Manual XD Contrast : Off, XD Colour : Off (If you miss the upper condition, the coordinates of W/B can be lower than the spec.)
Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
- 11 -
128 Bytes
2) COMMAND SET
Adjustment contents CMD(hex) ADH(hex) ADL(hex) EEPROM READ E7 A0 0 80 A2 0 80 A4 0 80 A6 0 80 Details 0-Page 0~7F Read 0-Page 80~FF Read 1-Page 0~7F Read 1-Page 80~FF Read 2-Page 0~7F Read 2-Page 80~FF Read 3-Page 0~7F Read 3-Page 80~FF Read
Delay 20m
LEN : 84h+Bytes CMD : E8h ADH : E2PROM Slave Address (A0,A2,A4,A6), Not 00h (Reserved by BufferToEEPROM) ADL : E2PROM Sub Address(00~FF) Data : Write data Delay : 20ms (2) Command Set
Adjustment contents EEPROM WRITE CMD(hex) E8h LEN 94 (84+n)h Details 16-Byte Write n-byte Write
* Purpose 1) EDID write : 16-byte by 16-byte, 8 order (128-byte) write(TO 00 7F of EEPROM). 2) FOS Default write : 14-mode data write (SyncFlags, HPeriodH, HPeriodL, VtotalH, VtotalL, SrcHTotalH, SrcHTotalL, SrcHStartH, SrcHStartL, SrcVStartH, SrcVStartL, HsyncPhase). 3) Random Data write : write the appointment Address of E2PROM.
Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
- 12 -
RF (Tuner)
MAIN NVM x0.55 x4 LINE OUT LINE OUT LM324 X4 AMP SERIAL PART_I2C FLASH DDR MEM
TUNER_I2C CVBS IN
LINE IN
SIF IN CVBS IN
AV in
LINE IN
CVBS OUT
AV out
Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
LINE_MUTE
DISPLAY MODULE
LINE_MUTE Mstar Romeo LGE6891CD AUDIO_SW LINE IN LVDS
Comp in
TROUBLESHOOTING
- 13 DSUB_DDC HDMI_SEL TMDS(HDMI in) DDC/HPD [HDMI MUX, direct JACK to MAIN IC]
LINE IN
RGB in (D/L)
TMDS(HDMI in)
HDMI
EDID NVM
DDC
1. No power
(1) Symptom
1) It is not discharged minutely from module. 2) Light does not come into the front LED.
No
Yes
No
Yes
No
Yes
No
Yes
After all cables connect is removed to PSU, the AC voltage marking is authorized on manual. When ST-BY 5V is not operated. replace PSU.
Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
- 14 -
2. No Raster
(1) Symptom
1) No OSD and image occur at screen. 2) It maintains the condition where the front LED is green.
No
Yes
No
No
Yes
Block A
Is the LVDS Cable connected? well Yes No Cable inserts well.
Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
- 15 -
Yes
Same as Block A.
Yes
Change IC801.
Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
- 16 -
6. No Sound
(1) Symptom
1) LED is green 2) Screen display but sound is not output.
No
No
Yes
Yes
No
No
Yes
Yes
No
No Replace IC600.
Yes
No Replace IC801.
Yes
No Replace IC601.
Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
- 17 -
24C64 EEPROM
( IC300) ( IC900)
DDR
DDC
( IC302)
TMDS Mux
( JK301)
RGB ( SVC Only) MADR[ 0: 11] MDATA[ 0: 15] LGE6891DD TXCO[ 0: 4] / TXCE[ 0: 4] / TXCLKO / TXCLKE
( P403) ( IC801)
IIC_DSUB
( JK104)
Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
LCD ( LVDS)
AMP GAIN X 4
( IC601) ( IC600)
AV IN
( JK200)
MNT_OUT
BLOCK DIAGRAM
( JK200)
COMP IN
( JK101)
COMP_LR
RF
( TU500)
LVDS_PWR_12V/ RL_ON
+ 12V
EXPLODED VIEW
IMPORTANT SAFETY NOTICE
Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in the Schematic Diagram and EXPLODED VIEW. It is essential that these special safety parts should be replaced with the same components as recommended in this manual to prevent X-RADIATION, Shock, Fire, or other Hazards. Do not modify the original design without permission of manufacturer.
400
521
540
LV1
530
821
550
804
803
800
802
801
805
200
120
910
122
510
Copyright LG Electronics. Inc. All right reserved. Only for training and service purposes
300
500
- 19 -
900
A2
A10
P_16V
*PANEL OPTION
P_12V
AC_DET
+5V_ST
R1138 4.7K
R1197 R1122 C1114 R1127 R1183 R1155 R1103 R1185 R1186 R1187 R1104 Sharp 52" O X O O O X X X X X X AUO O O O X O X X X X X X CMO 32/42/47 4.7K 0.47uF O X X X X O O X O X X CMO 57" X X O O O O 4.7K 0.47uF X Sharp 32" X O X X X X X X X X X the Rest(w/CMO26") X O O X X X X 4.7K 0.47uF O X P_5V P_16V C1122 0.1uF P_12V +5V_ST +5V_ST R1184 10K 0 R1135 10K C1137 47uF25V
AC_RST
PANEL_STATUS
C1114 0.47uF R1197 0 SHARP 52",AUO
R1192 1K
*12V AUDIO and PANEL L1112 +12V MBW3216-501TF +12V EAM30764101 C1144 0.01uF
RL_ON
3 Q1102 2 2SC3875S 1
R1105
I_DIMMING
P_5V R1188 0 READY
DC_DIM R1139 1K 1/10W 5%
DISP_EN E_DIMMING
*SHARP 32" : DC DIMMING
L1107 C1138 220uF 16V C1140 0.1uF C1146 0.01uF UBW2012-121F R1163 0 C1123 0.1uF
16V GND 12V GND 5V 5V GND GND Error out Power ON A.Dim Select
1 3 5 7 9 11 13 15 17 19 21 23
+5V_ST
2 4 6 8 10 12 14 16 18 20 22 24
DC_DIM C1125 2.2uF 25VPWM_DIM CMO 32,42,47,57 R1103 0
R1139-*1 100 1/10W 5%
16V P_16V GND 12V P_12V GND 5V P_5V 5V GND R1125 0 R1126 2.7K AGND ACD Inverter ON R1187 PWM Dim R1132 0 R1104 0 CMO 57" 0 NOT CMO 32,42,47,57 SYNC
+5VST_MST
NOT (CMO 32,42,47,57, SHARP 32") R1183 0 C1116 2.2uF 25V R1191 0 CMO 32,42,47,57 READY R1155 0
P1100 SMAW200-24C
R1185 0 CMO 32,42,47 R1186 0 CMO 57"
EN 7 6 VO +3.3V_MULTI_MST
*Applied to SIF,HDMI,ADC,MPLL,AUD
32 Sharp UBW2012-121F
D1102 S2A
2 R1106 18K R1141 33K C B E Q1100 RT1C3904-T112 R1134 10K R1140 33K C1126 1uF 25V
ADJ
R1
+5VST_MST
5 NC_3 C1109 100uF6V 1 C1152 10uF
IC1103 AZ1117H-ADJTRE1(EH11A) D1103 MBRS190T3G INPUT 3 2 OUTPUT R1166 3.3K 1% 5% 1 ADJ/GND R1165 51 90V
50V +5VST_MST
VIN
R1107 5.6K
120OHM L1110
120OHM L1111
C1105 100uF 16V R1111 59K READY IC1101 8 RUN C1112 0.1uF R1123 110 1%
C1115 0.1uF
READY
C1100 220uF 16V R1110 12K USB INPUT 3 2 USB C1120 0.1uF OUTPUT 1% R1195 110 1% +5V_USB USB 1 ADJ/GND USB R1120 7.5K R1194 330
C1101 0.1uF
AZ1117H-ADJTRE1(EH11A) USB
+2.5V_VDDM_MST
R1
R1169 OPT
READY
READY
Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
P_5V
IC1100 SC4215ISTRT
P_5V
R1115
0
+12V
NC_1 8 GND
R2
1 +3.3V_MST
Q1101 SI4925BDY EBK32753101 S1 G1 1 2 S2 3 G2 4 8 D1_2 7 D1_1 6 D2_2 5 D2_1 L1105 UBW2012-121F C1135 EAM38769505 L1104 UBW2012-121F EAM38769505 C1136 0.1uF R1152 2.2K R1153 2.2K R1154 2.2K
C1134 0.01uF
C1117 4.7uF
C1102 0.1uF
NC_2
VCC_LCD
C1149 100uF 16V
PANEL_ON
P_5V
R1130 22K C1124 1uF R1131 1.6K R1128 10K C B E Q1107 RT1C3904-T112
+5V_MULTI
0.1uF C1141 100uF 16V C1142 0.1uF
OUT:1.25V
ST 5V->3.3V->1.2V RL_ON
SCHEMATIC DIAGRAM
DCDC_7.22V_PIP
(8)
IC1104 AZ1117H-ADJTRE1(EH11A) INPUT 3 2 OUTPUT 1% 1 ADJ/GND R1124 330
DC-DC CONVERTER
+5V_MULTI
R2
USB
L1103
C1129
C1130
+5V_MULTI
OUT:UNDER 7.22V
22uF
16V
0.1uF
IC1102 MP2355DN-LF-Z
L1108 120OHM
AZ1117H-ADJTRE1(EH11A)
SS
L1109
COMP
R1102 47 7
BST
MBW3216-501TF
+5V_TUNER +5V_MULTI
INPUT 3
R1149 0
MAX 1A 1 2 ADJ/GND
R2 R1144 402 1%
INPUT
ADJ/GND
+12V
6 GND IC1107 C1119 100uF 16V FB 5 C1113 2700pF 50V
L1100 MBW3216-501TF
C1106 0.01uF
VIN
110mA 20mA
INPUT
R2
OUTPUT
C1132 0.01uF 5%
2 OUTPUT
R1151 0 5% R1150 OPT +1.8V C1147 *NTP.USB,TW9910 0.1uF C1145 47uF 16V
C1110 100uF 16V C1111 0.1uF C1155 47uF 16V C1156 0.1uF
C1103 0.01uF
L1101 22uH
LX
C1108 0.01uF
12V->5V_TUNER
+5V_USB
SWITCH 5V->3.3V->1.8V
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION. FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
MSTAR
2008/01/08
POWER
11
11
C1005 22pF
C1007 22pF
READY
R1007 0
+1.8V_AVD
C1012 0.01uF
XTO XTI
VD[0]/SIAD0
VD[4]
VD[5]
48
47
46
45
44
43
42
41
40
39
38
VDDE_1 1 36 35 34 33 VDD NC_3 VD[11] 30 29 28 27 26 25 13 14 15 16 17 18 19 20 21 22 23 24 VD[12] VD[13] VD[14] VD[15] VDDE_2 VD[9] VD[10] VD[8] 2 3 4 5 7 8 9 10 11 12 VD[7]
R1003 R1002 100 100
37
+3.3V
SCL_Part SDA_Part
SDAT PDN RSTB TMODE
R1006 4.7K R1001 4.7K
READY 100
SW_RESET
NC_1
R1004
IC1000 32 6 TW9910DANA2-GR 31
+1.8V_AVD
AVD_1
C1003 C1004 0.1uF 0.1uF C1001 0.01uF
AR1001 51
PIP_V
R1000 75
C1002
0.1uF
+3.3V
VS
HS
CIN0
NC_2
AVS_1
AVD_2
AVS_2
VSS_1
CLKX2
YMUX0
MPOUT
VSSE_1
C1011 0.1uF
0.1uF
R1009 0.1uF
C1008 0.1uF
DEC_656_CLK
+1.8V_AVD
TW9910
DEC_656[0-7]
Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
C1000 0.1uF
VD[6]
+3.3V
AR1000 51
DEC_656[0-7]
SCLK
DEC_656[0]
MSTAR TW9909
2008/01/08 10 11
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION. FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
#9.DDR
+2.5V_VDDM_MST
MDATA[0-15]
MDATA[0-15]
AR902 56 1/16W
C902 0.1uF VDD_1 1 66 65 64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49 48 47 46 45 44 43 42 41 40 28 A0 A1 A2 A3 VDD_3 29 30 31 32 33 39 38 37 36 35 34 VREF VSS_2 UDM C907 1000pF C909 0.1uF R906 1K NC_7 UDQS VSSQ_3 NC_8 DQ8 C906 0.1uF VDDQ_4 DQ9 DQ10 VSSQ_4 DQ11 DQ12 C908 0.1uF VDDQ_5 DQ13 DQ14 VSSQ_5 DQ15 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 DQ0 VDDQ_1 DQ1 DQ2 C903 0.1uF DQ3 DQ4 VDDQ_2 DQ5 DQ6 VSSQ_2 C904 0.1uF DQ7 NC_1 VDDQ_3 LDQS DQS1 C905 0.1uF VDD_2 NC_3 C900 0.1uF LDM WE WEZ CAS CASZ RAS RASZ CS NC_4 BA0 SBA0 BA1 SBA1 MADR[10] MADR[11] MADR[10] MADR[1] MADR[2] MADR[3] MADR[3] MADR[2] MADR[1] MADR[9] MADR[8] MADR[7] MADR[6] MADR[5] MADR[4] MADR[3] MADR[2] MADR[1] MADR[0] C901 0.1uF MADR[0] MADR[0] MADR[10] A10/AP UDQM A13/NC_2 MDATA[12] MDATA[13] MDATA[14] MDATA[15] VSSQ_1 VSS_3
AR901 56 1/16W
MDATA[7] MDATA[6] MDATA[5] MDATA[4]
Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
MDATA[3] MDATA[2] MDATA[1] MDATA[0]
AR903 56 1/16W
AR900 56 1/16W
MDATA[0-15]
IC900 HYB25DC256163CE-4
+2.5V_VDDM_MST
DQS0 R909 1K
LDQM CK CK CKE CKE NC_6 A12/NC_5 A11 A9 A8 A7 A6 A5 A4 VSS_1 MADR[11] MADR[11] MADR[9] MADR[9] MADR[8] MADR[8] MADR[7] MADR[7] MADR[6] MADR[6] MADR[5] MADR[5] MADR[4] MADR[4] READY R903 150 R905 150 MCLK MCLKZ
MADR[11]
MADR[10]
MADR[9]
MADR[8]
MADR[7]
MADR[6]
MADR[5]
MADR[4]
MADR[3]
MADR[2]
MADR[1]
MADR[0]
MADR[0-11]
MADR[0-11]
MSTAR DDR
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION. FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
2008/01/08 9 11
H/W OPTION #3
+3.3V_MST +3.3V_MST FLASH_WP_ZORAN SPI_DO 2 SCLK SPI_CLK SI R8179 100 SPI_DI 7 SO HOLD# READY R8105 1K R8005 3 6 100 WP# PWM0 +3.3V_MST 4 5 R8106 READY FLASH_WP Q803 E R8067 B 10K R8108 1K R8112 READY R8110 1K GND R8001 0 R8172 100 R8187 10K 1 SPI_CZ CS# R8171 100
<Mode Selection>
+3.3V_MST VCC +3.3V_MST
MX25L1605AM2C-15G
8
120HZ: H Normal: L
R8090 4.7K READY R8174 4.7K R8061 0 READY C RT1C3904-T112 R8111 R8109 R8107 3.3K READY READY PWM1 PWM2 PWM3
+3.3V_MULTI_MST
RXB0P
RXB0N
AVDD_33_254
RXBCKP
RXBCKN
AVDD_MPLL
XIN
XOUT
HWRESET
DI[13]
DI[12]
DI[11]
DI[10]
DI[9]
DI[8]
GND_241
VDDC_240
DI[7]
DI[6]
DI[5]
DI[4]
VDDP_235
DI[3]
DI[2]
DI[1]
DI[0]
IVSYNC
IHSYNC
IDE
ICLK
GPIOE[0]
GPIOE[1]
GPIOE[2]
GPIOE[3]
GND_222
VDDP_221
LVB0M
LVB0P
LVB1M
LVB1P
LVB2M
LVB2P
LVBCKM
LVBCKP
LVB3M
LVB3P
NC_210
NC_209
GND_208
VDDP_207
LVA0M
LVA0P
LVA1M
LVA1P
LVA2M
LVA2P
LVACKM
LVACKP
LVA3M
LVA3P
NC_196
NC_195
VDDP_194
VDDC_193
HDMI2_5V_DET
HDMI3_5V_DET
HDMI_SEL2
HDMI_SEL1
I2S_CLK_IN
I2S_WS_IN
+3.3V_MULTI_MST TXCLKO+,TXCLKO-,TXCO0+,TXCO0-,TXCO1+,TXCO1-,TXCO2+,TXCO2-,TXCO3+,TXCO3-,TXCO4+,TXCO4TXCE0+,TXCE0-,TXCE1+,TXCE1-,TXCE2+,TXCE2-,TXCE3+,TXCE3-,TXCE4+,TXCE4-,TXCLKE+,TXCLKE-
256
255
254
253
252
251
250
249
248
247
246
245
244
243
242
241
240
239
238
237
236
235
234
233
232
231
230
229
228
227
226
225
224
223
222
221
220
219
218
217
216
215
214
213
212
211
210
209
208
207
206
205
204
203
202
201
200
199
198
197
196
195
194
RXB1N
193
192
PWM3
RXB1P
191
PWM2
GND_3
190
NC_190
RXB2N
189
NC_189
20pF
I2S_SDO
I2S_SCK
DDCDB_CK
185
VDDC_185
RXACKN
184
GND_184
I2S_WS
I2S_MCLK
DDCDB_DA
186
GPIOB[4]
0.1uF
HPLUGB
187
GPIOB[5]
RXB2P
188
GPIOB[6]
HPD_MST_2 FLASH_WP
#8. MSTAR
+3.3V_MST
SDA_TUNER
SCL_TUNER
IC802 AT24C64AN-10SU-2.7
A0 1 VCC
RXACKP
10
183
VDDP_183
+3.3V_MST
GND_11
11
182
IRIN
C838
AVDD_33_14
14
179
DDCA_DA
RXA1N
15
178
DDCR_CK
RXA1P
16
177
DDCR_DA
RXA0P
13
180
DDCA_CK
TXCE3-
TXCE2-
TXCE1TXCE0+
TXCE2+
TXCO3-
TXCO2-
TXCO1-
C882
TXCO4+
TXCO4TXCO3+
TXCO2+
TXCO1+
0.1uF
0.1uF
100
100 100
100
R8080 0 100 RS232C TXD 100 RS232C RXD RS232C 100 PANEL_ON 0 R8058 R8057 0 HPD_MST_3 READY
DDCDA_CK
23
170
SDO
HSYNC1
24
169
CSZ
0.1uF
22
171
100 100
DDCDA_DA
SAR0
0.1uF
TXCLKO+
21
172
TXCLKO-
REXT
SAR1
TXCLKE+
20
173
TXCLKE-
HPLUGA
SAR2
TXCO0+
RXA2P
19
174
SAR3
TXCO0-
TXCE4+
TXCE4TXCE3+
TXCE1+
RXA2N
18
175
PWM0
TXCE0-
GND_17
17
176
PWM1
0.1uF
RXA0N
12
181
INT
0.1uF
C801
100
100
100
0.1uF
VSYNC1
25
168
SDI
+3.3V_MST A1 2 7
VCLAMP
26
167
SCK
WP
REFP
27
166
GND_166
REFM
28
165
VDDP_165
BIN1P
29
164
ALE
SOGIN1
30
163
RDZ
RIN1P
32
161
AD[7]
VCOM3
33
160
AD[6]
C850
R8074
R8077
C852
R8082
R8085
R8087
R8089
R8092
R8094
R8095
C859
BIN0P
34
159
AD[5]
C862
GIN1P
31
162
WZ R
R8022 A2 3 R8027 R8028 R8023 GND 4 10K 3.3K 3.3K 0READY READY
SCL 6
VCOM2
35
158
AD[4]
GIN0P
36
157
AD[3]
SOGIN0
37
156
AD[2]
R8065
R8066
38
155
AVDD_33_39
39
154
AD[0]
READY 0 READY 0
GND_40
40
153
MADR[11]
HSYNC0
VSYNC0
IC801-*1 LGE6891DD HD
R8015 RXB0P RXB0N AVDD_33_254 RXBCKP RXBCKN AVDD_MPLL XIN XOUT HWRESET DI[13] DI[12] DI[11] DI[10] DI[9] DI[8] GND_241 VDDC_240 DI[7] DI[6] DI[5] DI[4] VDDP_235 DI[3] DI[2] DI[1] DI[0] IVSYNC IHSYNC IDE ICLK GPIOE[0] GPIOE[1] GPIOE[2] GPIOE[3] GND_222 VDDP_221 LVB0M LVB0P LVB1M LVB1P LVB2M LVB2P LVBCKM LVBCKP LVB3M LVB3P NC_210 NC_209 GND_208 VDDP_207 LVA0M LVA0P LVA1M LVA1P LVA2M LVA2P LVACKM LVACKP LVA3M LVA3P NC_196 NC_195 VDDP_194 VDDC_193 PWM2 PWM3 R8157 R8158 READY
RIN0P
AD[1]
41
152
MADR[10]
42
151
MADR[9]
VSYNC2
43
150
MADR[8]
BIN2P
44
149
VDDC_149
SOGIN2
45
148
GND_148
GIN2P
46
147
VDDM_147
RIN2P
47
146
MADR[7]
C1
48
145
MADR[6]
Y1
49
144
MADR[5]
R8176 0
C0
50
143
MADR[4]
Y0
51
142
MADR[3]
CVBS3
52
141
MADR[2]
CVBS2
53
140
MADR[1]
CVBS1
54
139
MADR[0]
VCOM1
55
138
WEZ
CVBS0
56
137
CASZ
VCOM0
57
136
AVDD_MEMPLL
AVDD_33_58
58
135
VDDM_135
CVBSOUT1
59
134
GND_134
CVBSOUT0
60
133
RASZ
256
255
254
253
252
251
250
249
248
247
246
245
244
243
242
241
240
239
238
237
236
235
234
233
232
231
230
229
228
227
226
225
224
223
222
221
220
219
218
217
216
215
214
213
212
211
210
209
208
207
206
205
204
203
202
201
200
199
198
197
196
195
194
SIP0P
62
131
BADR[1]
193
AVDD_SIF
R8029 PWM3 R8126 R8127 R866 R8115 R8116 R8117 C868 C869 R8118 R8120 R8121 R8122 R8123 0 R8131 0 0 0 100 0.1uF 0.1uF 100 100 100 100 LG60 AC_DET 100 100 PWM2 NC_190 NC_189 GPIOB[6] GPIOB[5] GPIOB[4] VDDC_185 GND_184 VDDP_183 IRIN INT DDCA_CK DDCA_DA DDCR_CK DDCR_DA PWM1 PWM0 SAR3 SAR2 SAR1 SAR0 SDO CSZ SDI SCK GND_166 VDDP_165 ALE RDZ WRZ AD[7] AD[6] AD[5] AD[4] AD[3] AD[2] AD[1] AD[0] MADR[11] 153 152 151 150 149 148 147 146 145 144 143 142 141 140 139 138 137 136 135 134 133 132 131 130 129 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 81 82 83 84 85 86 87 88 89 90 91 92 93 94 95 96 97 98 99 100 101 102 103 104 105 106 107 108 109 110 111 112 113 114 115 116 117 118 119 120 121 122 123 124 125 126 127 128 MADR[10] MADR[9] MADR[8] VDDC_149 GND_148 VDDM_147 MADR[7] MADR[6] MADR[5] MADR[4] MADR[3] MADR[2] MADR[1] MADR[0] WEZ CASZ AVDD_MEMPLL VDDM_135 GND_134 RASZ BADR[0] BADR[1] MCLK C802 MCLKZ R8143 R8144 R8145 R8146 R8147 0.1uF R8148 MVREF MCLKE R8149 R8150 R8151 R8152 R8153 D802 5.1K 100 0.1uF 1uF 2.2uF 2.2uF 2.2uF 2.2uF 0.1uF 2.2uF 2.2uF 2.2uF C833 10uF 16V C834 C835 4.7uF 0.1uF 2.2uF 100 KDS181 R8154 MDATA[15] MDATA[14] MDATA[13] MDATA[12] MDATA[11] MDATA[10] MDATA[9] MDATA[8] MDATA[7] MDATA[6] MDATA[5] MDATA[4] MDATA[3] MDATA[2] MDATA[1] MDATA[0] LDQM 100 100 100 100 100 39 39 100 100 100 100 100 +3.3V_MULTI_MST C873 0.1uF AR800 100 AR801 100 C872 0.1uF MADR[7] MADR[6] MADR[5] MADR[4] MADR[3] MADR[2] MADR[1] MADR[0] C871 0.1uF AR802 100 USE LG50_60_70 R8086 R8168 R8169 R8139 R8140 0 100 100 CEC_C DISP_EN C870 0.1uF R8178 100 100 R8134 R8135 100 1 192 191 190 189 188 187 186 185 184 183 182 181 180 179 178 177 176 175 174 173 172 171 170 169 168 167 166 165 164 163 162 161 160 159 158 157 156 155 154 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 R8024 RXB1P GND_3 RXB2N RXB2P HPLUGB DDCDB_DA DDCDB_CK RXACKN RXACKP GND_11 RXA0N RXA0P AVDD_33_14 RXA1N RXA1P GND_17 RXA2N RXA2P HPLUGA C805 HDMI_SDA HDMI_SCL HSYNC1 C806 C807 REFP REFM BIN1P R8030 SOGIN1 GIN1P RIN1P VCOM3 BIN0P VCOM2 GIN0P SOGIN0 R8031 COMP1_Y R8032 R8033 R8034 PC_B R8035 R8036 PC_G R8037 R8038 PC_R R8039 +3.3V_MULTI_MST C855 PC_HS PC_VS R8181 4.7K VSYNC2 BIN2P SOGIN2 GIN2P RIN2P C1 Y1 SIDE_C R8041 C826 Y0 CVBS3 C827 CVBS2 CVBS1 VCOM1 CVBS0 VCOM0 CVBSOUT1 CVBSOUT0 GND_61 C832 SIP0P AVDD_SIF SIF1P C803 0.1uF 0.1uF +3.3V_MULTI_MST 0.1uF C828 C829 C830 C831 AVDD_33_58 R8048 TW9910 block R8049 47 47 0.047uF 0.047uF 0.047uF 0.047uF 0.047uF 0.047uF R8042 R8043 R8044 R8045 TV_MAIN R8047 47 R8046 47 47 47 47 47 47 SIDE_Y SIDE_V CVBS_VIN C825 C0 0.047uF 0.047uF 1000pF 0.047uF 0.047uF C820 C821 C822 C823 R8012 R8017 R8011 R8013 47 47 47 47 VSYNC0 HSYNC0 0.1uF GND_40 47 C819 RIN0P 0 . 0 4 7 u F AVDD_33_39 47 C818 0.047uF 47 C817 0.047uF 47 C816 0.047uF 47 C815 0.047uF 47 C814 0.047uF 47 C813 0.047uF 47 C812 0.047uF COMP1_Pr 47 C811 1000pF 47 C810 0.047uF C808 COMP1_Pb 0.1uF 0.1uF C809 0.1uF VCLAMP 0.1uF VSYNC1 R8056 22 DDCDA_CK R8055 22 DDCDA_DA 0.1uF R8054 390 REXT R8025 R8026 HPD_MST_1 R8052 HDMI_CHDMI_C+ HDMI_0HDMI_0+ +3.3V_MULTI_MST HDMI_1HDMI_1+ HDMI_2HDMI_2+ READY 22 READY READY R8053 22 0 READY 0 READY 0 READY
RXB1N
NOT LG60
63
130
MCLK
SIF1P
64
129
MCLKZ
65
66
67
68
69
70
71
72
73
74
75
76
77
78
79
80
81
82
83
84
85
86
87
88
89
90
91
92
93
94
95
96
97
98
99
100
101
102
103
104
105
106
107
108
109
110
111
112
113
114
115
116
117
118
119
120
121
122
123
124
125
126
127
128
R8102
GND_61
61
132
BADR[0]
SIFM
AUL0
AUL1
AUL2
AUR0
AUR1
AUR2
AUL3
AUR3
L Q D M
DQS[1]
DQS[0]
UQ DM
MVREF
GND_66
AUVREF
A C M UO
GPIOF[0]
GPIOF[1]
GPIOF[2]
GPIOF[3]
GPIOF[4]
GPIOF[5]
GPIOF[6]
GPIOF[7]
GPIOF[8]
GPIOF[9]
GND_100
GND_105
A M N U O O
AUOUTL3
AUOUTL2
AUOUTL1
AUOUTR3
AUOUTR2
AUOUTR1
AUOUTL0
AUVRADP
AVDD_AU
AUOUTR0
VDDP_99
VDDC_101
MDATA[9]
MDATA[8]
GND_113
MDATA[7]
MDATA[6]
MDATA[5]
MDATA[4]
MDATA[3]
MDATA[2]
MDATA[1]
AUVRADN
VDDM_108
VDDM_114
MDATA[15]
MDATA[14]
MDATA[13]
MDATA[12]
MDATA[11]
MDATA[10]
VDDM_119
MDATA[0]
MCLKE
TX_MPEG RX_MPEG PWM1 PWM0 IR PANEL_STATUS DSUB_SCL DSUB_SDA SCL_Part SDA_Part E_DIMMING 100 R8132 1K LPL_CMO I_DIMMING
MPEG UART
H/W OPTION #1
+3.3V_MST
R865 4.7K
HD
MADR[0-11]
C881
AUL0
AUL1
AUL2
AUR0
AUR1
AUR2
AUL3
AUR3
DQS[1]
GND_66
AUVREF
GPIOF[0]
GPIOF[1]
GPIOF[2]
GPIOF[3]
GPIOF[4]
GPIOF[5]
GPIOF[6]
GPIOF[7]
GPIOF[8]
GPIOF[9]
GND_100
GND_105
VDDP_99
GND_113
AUMONO
AUOUTL3
AUOUTL2
AUOUTL1
AUOUTR3
AUOUTR2
AUOUTR1
AUOUTL0
AVDD_AU
AUOUTR0
MDATA[9]
MDATA[8]
MDATA[7]
MDATA[6]
MDATA[5]
MDATA[4]
MDATA[3]
MDATA[2]
MDATA[1]
AUVRADP
VDDM_108
VDDM_114
MDATA[15]
MDATA[14]
MDATA[13]
MDATA[12]
MDATA[11]
R8019 100
MDATA[10]
VDDM_119
AUVRADN
VDDC_101
MDATA[0]
R8010
100
AC_RST
AUCOM
DQS[0]
UDQM
SIFM
READY
C800 4.7uF 10V HWRESET R8018 R8016 100 33K READY READY C824 0.1uF 50V
C836
C837
R8073
R8075
C839
C840
C842
C843
C847
C848
DEC_656[0]
DEC_656[1]
DEC_656[2]
DEC_656[3]
DEC_656[4]
DEC_656[5]
DEC_656[6]
DEC_656[7]
D801 KDS181
R8078
R8003
100
C861 0.1uF
C863 0.1uF
C864 0.1uF
+2.5V_VDDM_MST
DCDC_7.22V_PIP R8081 0 2.2K E B C B E R8020 402 COMP2_L R870 402 R8051 68 1608 PIP_VOUT Q805 RT1C3904-T112 SW_L COMP2_R C Q804 R8014 75 R8050 470 R8060 100 TW9910 block
TW9910 block
DCDC_7.22V_PIP
+1.2V_VDDC_MST
C860 0.1uF 2.2K C875 10uF 16V
R8006 470
2SA1530A-T112-1R
+3.3V_MULTI_MST
Q801
10K
470pF
MNT_VOUT_T
22KREADY 470pF
2SA1530A-T112-1R
1000pF
R8167 1K READY R8071 R8183 C876 0.1uF R8076 C851 C878 1000pF R8163 1K
+2.5V_VDDM_MST
R8000 0
Q802
PIP_V
MNT_VOUT
C853
R8088
SW_R
C854
R8004 402 1%
RT1C3904-T112
PC_AUD_L
PC_AUD_R
SPK-N
MNT_L_AMP
CVBS_LIN
CVBS_RIN AM_AUDIO
MNT_R_AMP
GAIN X 4
R868 402
R8007 68 1608
+3.3V_MST
GAIN X 4
DDR SDRAM
Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
MPEG_RESET KEY1 KEY2 SPI_DO SPI_CZ SPI_DI SPI_CLK USE LG50_60_70 R8184 2.2K USE LG50_60_70 R8137 100 R8185 2.2K R8070 4.7K SDA_LED MUTE_LINE R8062 10BIT 4.7K +3.3V_MST +3.3V_MST R867 4.7K FHD
HPD_MST_2
R8021 READY
H/W OPTION #2
SCL_LED
8BIT
DONT USE(156,157)
MADR[11] MADR[10] MADR[9] MADR[8] C883 2.2uF 25V RL_ON
NON_EU OPTION
COMP2_Pb
COMP2_Y
COMP2_Pr
CVBS_V
MADR[0-11]
+3.3V_MULTI_MST
WEZ CASZ RASZ SBA0 SBA1 MCLK MCLKZ CKE UDQM LDQM DQS0 DQS1
2008/01/08 8 11
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION. FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
+1.8V
+3.3VDDP
L713
+1.8VDDC
+3.3VDDA
+3.3VDDP SFCS 1
READY 16V
UBW2012-121F C726 0.1uF C727 0.1uF C728 0.1uF C729 0.1uF C730 0.1uF C731 0.1uF C732 0.1uF
+3.3VDDP
TOP SIDE! FLASH_WP_ZORAN
10K R710
SFDI SO 2 3
+3.3VDDA
+1.8VDDA
R740 0
READY 1/10W 5% ZORAN SRAM Board F/W Download C712 0.1uF 16V External F/W Download
GND SI +3.3VDDP
SFDO
UBW2012-121F
JK700 12505WS-04A00
R705 1K
50V
C736 0.1uF
C737 0.1uF
C738 0.1uF
C739 0.1uF
50V
C740 0.1uF
50V
C741 0.1uF
50V
C742 0.1uF
50V
C743 0.1uF
50V
C744 0.1uF
JP700
JP701
JP702
4 50V
JP703
50V
C749 0.1uF
50V
C750 0.1uF
50V
C751 0.1uF
50V
C752 0.1uF
50V
C753 0.1uF
DEC_656[0] : DUPTD0
L717
Connect to Main IC(CCIR656 Interface) READY 120OHM
+5V_MULTI DEC_656[0-7]
UBW2012-121F +5V_USB 0 0 0 L715 C724 R717 R718 R719 R720 R721 R722 R723 R724 R744 R725 10uF R726 15K
1% 50V READY L716 OPT
DEC_656[7]
DEC_656[6]
DEC_656[5]
DEC_656[4]
DEC_656[3]
DEC_656[2]
DEC_656[1]
50V 16V
0.1uF
66
68
73
72
71
70
76
75
79
78
84
83
82
87
86
90
89
94
93
92
97
96
99
102
101
100
KJA-UB-4-0004
USB_DP
98 95 91 ILIMIT 5 2 GND
88
85
81
80
77
74
69
67
65
5 4
6.19K X702
113 114
R732
53 52 51 50
MPEG_RESET
ZORAN I2C strobe ready
IC707
18pF 18pF
R738
118 119 120 121 122 123 124 125 126 127 37 33 34 35 28 29 30 31 23 24 25 26 20 21 14 15 16 17 18 9 10 11 12 7 1 2 3 4 5 6 8 13 19 22 27 32 36 38 128 49 48 47 46 45 44 43 42 41 40 39
0
1/10W 5%
220K
+3.3VDDP RAMDAT[8-15]
ZR36966PQCG-XD
5% 1/10W
RAMADD[4] RAMADD[5]
RAMADD[6] RAMADD[7]
RAMADD[8]
RAMADD[9]
RAMDAT[8]
RAMDAT[9] RAMDAT[10]
RAMDAT[11] RAMDAT[12]
RAMDAT[13]
RAMDAT[14]
VSS1
A4
A6
A7
A8
A5
A9
A11
NC1
DQ10
DQ11
DQ12
DQ13
DQ14
DQ8
CKE
CLK
28
29
30
31
32
33
34
35
36
37
38
39
UDQM
42
43
44
DQ9
45
46
47
48
40
41
49
50
51
52
53
DQ15
RAMDAT[15]
54
IC704 HY57V641620FTP
27
26
25
22
21
20
19
24
23
18
17
16
15
14
13
12
11
10
USB
A3
CS
A2
A1
A0
BA1
BA0
RAS
CAS
WE
DQ7
DQ6
DQ5
DQ4
VDD3
LDQM
VDD2
DQ3
A10/AP
VSSQ2
VDDQ2
RAMDAT[7]
RAMDAT[6] RAMDAT[5]
RAMDAT[4] RAMDAT[3]
RAMDAT[2]
RAMDAT[1]
RAMADD[0-3]
RAMADD[0]
RAMDAT[0]
RAMCS RAMRAS
RAMCAS
RAMWE RAMDQM
Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
0 0 0 0 0
120OHM
22 0
L718
DEC_656[0]
100uF
16V
USB
IC705 MIC2009YM6-TR * Analog Video Option * R732 Video Output Level Reference Originally 392 ohm 1%
P701
**
1A Design
R700 27 USB_DN
VOUT 6 1 VIN
C725 0.1uF
R701 27 SFCS
104 105 106 107 108 ENABLE
R733 390
64 63 62 61 60 59 58 57 56 55 54
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION. FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
R711
103
75 75 75 75
109 110 111 112
75 75 75 75
* R732 Video Output Level Reference
R702 5.1K
FAULT/ 4 3
READY
READY
C746
L719
22pF DUPRD0
MLF2012A2R7JT000 C755 READY 220pF 50V READY
RAMADD[11]
RAMADD[4-9]
R706 4.7K
IPCLK
+3.3VDDP
RAMDAT[0] RAMDAT[15] RAMDAT[1] RAMDAT[14] RAMDAT[2] RAMDAT[13] RAMDAT[3] RAMDAT[12] RAMDAT[4] RAMDAT[11] RAMDAT[5] RAMDAT[10] RAMDAT[6] RAMDAT[9] RAMDAT[7] RAMDAT[8] RAMDAT[0-15]
2008/01/08 7 11
C615 0.1uF C617 0.1uF C613 0.01uF R607 3.9 L603 2S DA-8580 2F C637 0.1uF
120OHM
R604 C612 3 . 3 35V 330uF L611 UBW2012-121F EAM38769505 UBW2012-121F R624 4.7K +1.8V_DVDD UBW2012-121F EAM38769505
3
C622 1000pF
SPK_L+
1
+1.8V_AVDD
SPK_RSPK_R+
2
EAM38769505 L615
SPK_LSPK_L+
4
R608 3.9 R610 3.9 C636 0.1uF C638 0.01uF L610 UBW2012-121F EAM38769505 R623 4.7K
D607 READY 1N4148W D606 READY 1N4148W
1S 1F EAP38319001
PGND1A_2
PGND1A_1
OUT1A_2
OUT1A_1
PVDD1A_2
PVDD1A_1
PVDD1B_2
PVDD1B_1
OUT1B_2
OUT1B_1
PGND1B_2
PGND1B_1
C619 1000pF
C621 1000pF
SPK_L-
BST1B 44 43
56
55
54
53
52
51
50
49
48
47
46
45
VDR1B
1 VDR2A +16V_NTP BST2A PGND2A_2 PGND2A_1 OUT2A_2 OUT2A_1 PVDD2A_2 PVDD2A_1 PVDD2B_2 C626 0.1uF R635 3.3 C647 0.01uF
READY 30V D600 READY
NC_2
C608 READY 1uF D602 30V C625 C631 22000pF 1000pF C635 1000pF R618 3.9 C648 0.01uF R622 3.9 L613 UBW2012-121F EAM38769505
VDR1A
SW_RESET
C606 1000pF
R601 100
/RESET
AD
+16V_NTP
JP600 HOTEL_OPT 1
I2S_MCLK
36 35 34 33 C640 0.47uF C629 0.1uF 1S 1F EAP38319001 L607 2S DA-8580 2F R636 3.3 +16V_NTP C644 R628 0.1uF 4.7K
D605 READY 1N4148W
VSS_IO
CLK_I
0.1uF
+1.8V_AVDD
C642 100pF
CLK_O
+3.3V
READY
VDD_IO
C646
AUDIO_R
JP601
C605 0.1uF
DGNDPLL
AGNDPLL
10
SPK_RHOTEL_OPT
10K R648
C601 100pF R600 3.3K C643 R627 0.1uF 4.7K 31 30 29 R617 3.9 R621 3.9 L612 UBW2012-121F EAM38769505
SW_RESET
LFM
11
12
+1.8V_AVDD
DVDDPLL
13
15
16
17
18
19
20
21
22
23
24
25
26
27
28
DVSS
FAULT
SDATA
PROTECT
VDR2B
PGND2B_1
C607 0.1uF
PWM_3B/PWM_HP2
PWM_3A/PWM_HP1
DVDD
WCK
BCK
SDA
SCL
HOTEL_OPT
AMP_MUTE_HOTEL R642
+12V
+5V_MULTI +5V_MULTI
XA 1 14
R633 4.7K C641 0.1uF
SDA_Part SCL_Part
R629 680K
XB 4
R638 680K
11 YD
XD
+12V
Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
AMP_MUTE_HOTEL
C630 1000pF C634 1000pF
SPK_R-_HOTEL 9 10
NC_1
14
C602 0.1uF
+1.8V_DVDD
R605
0
READY
R606
Q608 2SA1530A-T112-1R
B C 100 R651
AC_DET
R602 100
R603 100
AMP :GAIN X 4
+12V
HOTEL_OPT C B Q606 RT1C3904-T112 E R645 1K NON HOTEL_OPT
IC602 MC74HC4066ADR2G
IC601
R616-*1 15K
R611 680K
+5V_MULTI
1 OUT1 LM324DOUT4 14
R616 10K
VCC
SIDE_LIN
YA 2 13
C B
C662
MNT_LOUT
R641 10K
R647 4.7K
C649 6800pF
SW_L
YB 3 12 CONTROL_D
Q600 RT1C3904-T112 E
CONTROL_A
3 INPUT1+ INPUT4+ 12
L606
120OHM
+5V_MULTI +5V_MULTI
UBW2012-121F EAM38769505
4 VCC
C633 0.1uF
COMP1_L
CONTROL_B 5 YC 10
C663 2.2uF
R630 680K
5 INPUT2+ INPUT3+ 10
NON HOTEL_OPT
+5V_MULTI
CONTROL_C 6 XC 9
SW_R
+5V_MULTI
R639 680K C665 2.2uF R640 680K
C Q607 RT1C3904-T112 B
R613 10K
HOTEL_OPT
6 INPUT2- INPUT3- 9
R613-*1 15K
R646 1K
R634 4.7K
AUDIO_SW
GND 7 8
R619 6.8K
OUT3 8
for COMP1
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION. FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
TU500 TAFT-Z703D
NON EU TUNER
1 2 3
NC_1 GND_1 +B[5V] 4 5 NC_2 RF_AGC 6 TP[33V_OPTION] NC_3 7 8 9 10 GND_2 DATA CLOCK 11 12 13 AS NC_4 V-OUT 14 15 AFT A-OUT
Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
Near the pin
R507
READY READY READY
4 NC_2 5 RF_AGC
100 C507 0.01uF +5V_TUNER C510 4.7uF 35V
READY
6 7 8 9
R506 330 R504 4.7K +5V_TUNER R518 0 R508 4.7K
R505 330 C501 27pF C502 27pF C520 0.1uF R522 220 E R503 4.7K B Q502 2SA1530A-T112-1R C C513 56pF LG70_TUNER R521 220
R519
SCL_TUNER
TV_MAIN
+5V_TUNER
16
C B E R515 R513 1K 1K C512 0.027uF Q501 RT1C3904-T112
SIF-OUT 17 NC_5
AM_AUDIO
18 19 20 21 SHIELD
17 NC_5
READY
R553 OPT
21
SHIELD
MSTAR TUNER
2008/01/08 5 11
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION. FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
FHD
HD_NORMAL
3 5 7 9 11 13 15 17 VCC_LCD 19 1
2 4 6 8 10 12 14 16 18 20
P402 SMAW200-40C
P403 SMW200-26C
VCC_LCD
PANEL WAFER
1 2 1 3
R438 HD 0
2 4 6 8 10 12 14 16 18 20 22 24 26
R432 0 READY TXCE0+ TXCE1+ TXCE2+ TXCLKE+ TXCE3+ R428 CPT 0
21 23 25
22 24 26
3 5 7 7 9
FHD 8BIT:NC
TXCE0+ TXCE0-
4 6 5 8 10 12 14 16 15 17 19
NC
TXCE2+ TXCLKE+ TXCE3+ TXCE4+ TXCE3TXCLKETXCE2TXCE1+ TXCE1R408 0
9
TXCE0-
FHD 8BIT:NC
11 13 15 17 19 20 22 24
R431 READY 0
11 13
+12V_FHD
TXCE2TXCLKEVCC_LCD +3.3V TXCE4TXCE3-
R428 O X X
18 21 23 25
FHD 8BIT:NC
TXCO0+ TXCO1+ READY TXCO2+ TXCLKO+ TXCO3+
TXCO4+
21 23 25 26 28
+3.3V
NC
TXCO0+3.3V_HD TXCO1-
FHD 8BIT:NC
27 29 31 33 35 37
R401
30 32 34 36 38 40
X X X X X X 0 X 0 X
R402 8BIT or 52 sharp 0 R401 4.7K
TXCO2TXCLKOTXCO3TXCO4-
R405
L407 USE LG50_60_70 120OHM NOT LG60 R444 E R445 3.3K LG60 B C LG60 3.3K LG60 R404 0 0 UBW2012-121F USE LG50_60_70 L404 120OHM UBW2012-121F
ZD400 5.6B
LG60
Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
R402
HD
39
R415 0 READY
L410-*1 0
FHD
TXCLKO+,TXCLKO-,TXCO0+,TXCO0-,TXCO1+,TXCO1-,TXCO2+,TXCO2-,TXCO3+,TXCO3-,TXCO4+,TXCO4-
R_USE LG50_60_70
BEAD_USE LG50_60_70
L411 BG1608B501F
SCL_LED
+3.3V_MST
R420 BG1608B121F 4.7K L403 EAM38769502
KEY1
R423
SDA_LED
R421 4.7K
P400
12505WS-15A00
L406
EAM38769502
KEY2
+5V_ST
+3.3V_MST
C412 470pF C404 470pF Q406 2SA1530A-T112-1R C411 0.1uF C408 0.1uF
+5V_ST_SW
R444 X X 3.3K X
R404 O O X O
R445 Q406 L410 L411 L407 X X X X X BEAD BEAD BEAD X X O 3.3K BEAD BEAD BEAD BEAD BEAD BEAD X X
R414 X X 10K X
LED_R_PWM_Big EYEQ_RESET
IR
+5V_ST
R443 10K
IR-OUT IR-OUT R441 10K C B E IR-OUT Q404 2SC3052 C Q405 2SC3052 READY E R442 IR-OUT 22 IR-OUT
+5V_ST
IR_OUT
R440 10K
IR-OUT R439 47K B IR-OUT
10
L402
EAM38769502
C402 OPT
12
SPK-N
13
14
C400 0.1uF
NOT LG60
15
EAM38769502
AC_DET
16
C401 470pF
NOT LG60
NOT LG60
+5V_ST
R434 10K LED_R/PWM
NOT LG60 3.3K R417 READY B 3.3K R435 NOT LG60
Q403 KRC102S
CONTROL KEY
MSTAR LVDS,CTR KEY 2008/01/08 4 11
NOT LG60
NOT LG60
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION. FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
+5V_ST
OPTION
A1
+5V_ST
+5V_HDMI_3
SIDE_HDMI
HPD_S/W_2
R344 1K R335 10K
B RT1C3904-T112 E A0 1 WP 8 VCC SIDE_HDMI A1 2 SCL 7
2SC3875S
A1
+5V_HDMI_2
A2 KDS184
+5V_HDMI_2
SIDE_HDMI
D303 KDS184S
Q300 D300 KDS184S C313 R353 R354 0.01uF 50V 47K 47K R349 100 +3.3V_MULTI_MST
GND 19 HPD R323 100 18 +5V_POWER 17DDC/CEC_GND SDA JP1115 READY 15 SCL 14 NC JP1116 30V R322 100 16 SDA A 4 5 SDA C
HPD_MST_3
R301 10K
8 WP 20 VCC JACK_GND 3 6 A2
IC301 AT24C02BN-10SU-1.8 C301 R330 R331 0.01uF 47K 47K 50V R348 100 R333 51K CEC_C R376 0 R383 0
READY
A0
A1 7 SCL
A2 KDS184
HPD_MST_2
RT1C3904-T112
R319 1K
+3.3V_MULTI_MST
READY
A2 6
30K
22 5
GND
19 HPD
18 +5V_POWER
DDC_SDA3 DDC_SCL3
CEC D302 30V R332 200 READY
CDS3C30GTH
JP1117
13 CEC
15
SCL
14 NC
JP1118
DDC_SDA2 DDC_SCL2
+5V_HDMI_3 R352 10K +5V_HDMI_2
9 DATA08 DATA0_SHIELD 7 DATA0+ 6 DATA15 DATA1_SHIELD 4 DATA1+ 3 DATA22 DATA2_SHIELD 1 DATA2+
C MMBD301LT1G D304
17 DDC/CEC_GND
13 CEC
12
CLK-
11 CLK_SHIELD
R351 10K
HDMI3_5V_DET
10 CLK+
9 DATA0-
HDMI2_5V_DET
+5V_MULTI +5V_ST
A1 A2 0 R359 READY
8 DATA0_SHIELD
7 DATA0+
TMDS2_RX1+ TMDS2_RX1-
TMDS2_RX0+ TMDS2_RX0-
5 DATA1_SHIELD
6 DATA1-
D305 KDS184S
C KDS184
4 DATA1+
3 DATA2-
C311
C314
R382
HPD3
A24
B24
VCC_8
A23
B23
GND_7
A22
B22
VCC_7
A21
B21
SCL2
SDA2
HPD2
63
62
61
60
59
58
57
56
55
54
53
52
51 50
49
VDD
JK302 QJ41193-FEE2-7F
SIDE_HDMI
R381
A1
HPD_MST_1
C
R300 10K
1 WP 8 VCC
Q301C IC300 AT24C02BN-10SU-1.8 C300 R326 R327 0.01uF 50V 47K 47K R321 100 R320 100
A2 KDS184
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
Z4
Z3
Z2
Y4
Y3
Y2
8 DATA0_SHIELD
R325 10K
Y1
Z1
S1
VCC_3
GND_4
GND_5
VCC_4
SCL_SINK
4 DATA1+
R345 R346 0 0
DATA2-
2 DATA2_SHIELD
TMDS1_RX1+ TMDS1_RX2-
SDA_SINK
HPD_SINK
4.7K
20 JACK_GND
TMDS1_RX2+
C312 0.01uF
C310 0.01uF
21
4.7K
R361
R362
HDMI_2+ HDMI_2-
HDMI_1+ HDMI_1-
HDMI_0+ HDMI_0-
HDMI_C+ HDMI_C-
HDMI_SCL HDMI_SDA
Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
DC1R019NBH JK303 SIDE_HDMI R373 0
2 DATA2_SHIELD
1 DATA2+
20 JACK_GND
TMDS2_RX1+ TMDS2_RX2TMDS2_RX2+
+3.3V_HDMI_SW
21
1 2 3 4 5 6
48 47 46 45 44 43
HPD_S/W_1
D301 KDS184S
+5V_HDMI_1
R310 1K
RT1C3904-T112
2SC3875S
A0
IC302 TMDS351PAGR
42 41 40 39 38 37
C308 0.01uF
A12 B12 VCC_5 A11 B11 SCL1 B34 A34 GND_3 VSADJ 13 14 15 16
R372 4.7K 1% R379 22 C315 0.01uF
TMDS1_RX0+ TMDS1_RX0-
A1 2 SCL 7
A2 3 SDA 6
22 4 5
19 HPD
GND
TMDS3_RX1TMDS3_RX1+ TMDS3_RX2TMDS3_RX2+
18 +5V_POWER
17 DDC/CEC_GND JP1119
36 35 34 33
SDA1 HPD1 EQ S2
R380
R368 0 READY
22
16 SDA
15 JP1120
SCL
14 NC
DDC_SDA1 DDC_SCL1
+5V_HDMI_1 R324 10K
13 CEC
12
CLK-
11 CLK_SHIELD
10 CLK+
DATA0-
7 DATA0+
HDMI_SEL2
R366 4.7K READY
DATA1-
5 DATA1_SHIELD
TMDS1_RX0+ TMDS1_RX1-
DATA2+
R347 R350 0 0
+3.3V_MULTI_MST
R355 R356 0 0 R357 R358 0 0 +3.3V +3.3V R371 47K R365 READY 0 R360 4.7K READY
HDMI_SEL1
JK301 QJ41193-FEE2-7F
2008/01/08 3 11
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION. FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
SIDE AV
2F [YL]1P_CAN2 3E [WH]0_SPRING2
R222 0
CVBS_VIN
JK204
PPJ218-01
R218
10K
C211 100pF 50V READY
4A
[YL]O_SPRING
SIDE_V
2E [WH]1P_CAN2 4D [RD]CONTACT2 3D [RD]O_SPRING2
R223 0
D202 5.6V
R209 220K
CVBS_LIN
R219 12K
5A
[YL]CONTACT
D214 SD05
R241 75
2A
R251 0
[YL]U_CAN
R220 10K
GROUND
D217 SD05
R245 75
4A [RD]CONTACT1 3A [RD]O_SPRING1
NON HOTEL_OPT
SIDE_Y
NON HOTEL_OPT
NON HOTEL_OPT
4A
NON HOTEL_OPT
Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
CVBS_RIN
R212 220K
C212 100pF 50V READY
3B
R247 10K R248 12K
[WH]C_LUG
SIDE_LIN
2D [RD]1P_CAN2 4C[YL]CONTACT1
D204 5.6V
R221 12K
2B
R252 0
[WH]U_CAN
D215 5.6V
R242 220K
4C
R249 10K
[RD]O_SPRING
SIDE_RIN
3C [YL]O_SPRING1
R250 12K
[RD]CONTACT
D216 5.6V
C215 100pF 50V READY
R244 220K
R227
HOTEL_OPT R213 0
MNT_VOUT SPK_R-_HOTEL
NON HOTEL_OPT
2C
[RD]U_CAN
R236
C216 100pF 50V READY
MNT_LOUT
JK205
PSJ015-02
AUDIO_R
R237 D209 5.6V 1K R230 C 470K E C209 10uF 16V
C217 100pF 50V READY
4D
C_LUG_S_2
4C
C_LUG_L_2
4B
C_LUG_S_1
D218 SD05
R246 75
SIDE_C
MNT_ROUT
B Q202 RT1C3904-T112
2A [RD]1P_CAN1
MUTE_LINE
POP NOISE
C_LUG_L_1
O_SPRING
S_VIDEO_DET
D219 SD05
SHIELD 7
PPJ150-09 JK200
HOTEL_OPT R214 0
SPK_R+_HOTEL
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION. FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
11
COMPONENT2
R138 10K
PPJ209-02 [RD]O_SPRING
R148 0
JK103 KCN-DS-1-0088
[RD]O_SPRING COMP2_R
R139 12K D115 5.6V R119 220K
C113 1000pF READY
3E 4E [RD]CONTACT 2E [RD]1P_CAN2
IC101 MAX3232CDR
R149 0 R147 0
[RD]CONTACT
+5V_ST
1
C110 0.1uF 16 15 14 13 12 100 V6 100 7 10 9 ROUT2 8 DIN2 11 R129 DIN1 ROUT1 R128 RIN1 R131 100 DOUT1 C111 OPT GND R130 100 VCC
4E
C109 0.1uF R136 10K
[RD]1P_CAN2
R140 10K
2E 5D [WH]C_LUG_L COMP2_L
1 2 3 4 5 SIGN1420 R141 12K
6 2 7
D120 CDS3C30GTH 30V
[WH]C_LUG_L COMP1_L
R137 12K C107 0.1uF C1V+ C1+ D116 5.6V R120 220K
C114 1000pF READY
5D 2D [WH]1P_CAN 5C [RD]C_LUG_L
C2+ D104 5.6V R108 220K
[WH]1P_CAN
2D COMP2_Pr
D117 SD05 R121 75
3 8
C112 OPT D121 CDS3C30GTH 30V
IR_OUT
[RD]C_LUG_L COMP1_Pr
D105 SD05 R109 75 C2C106 0.1uF
[RD]1P_CAN1 5B
DOUT2 C108 0.1uF
2C COMP2_Pb
D118 SD05 R122 75
+3.3V_MST +5V_ST
READY
IR_OUT
R150 4.7K R151 4.7K
9 5 10
5B
[BL]1P_CAN 3A COMP2_Y
D119 SD05 R123 75
2B
KCN-DS-1-0089
AC AC AC A
D108 ENKMC2837-T112
D109 ENKMC2837-T112
6
R116 75
RED_GND
D111 ENKMC2837-T112
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RXD TXD
4A [GN]CONTACT
SDC 15 applying check
[GN]O_SPRING
3A
[GN]CONTACT
4A 2A [GN]1P_CAN
*RS232C TX
MAIN : EAN41348201(TI) SUB : 0IMCRSG010A(STM)
[GN]1P_CAN
2A
PC SOUND
PC
C100 0.1uF C102 0.1uF C101 0.1uF
+5V_MULTI
JK104
6630TGA004K
PC_R
1 DSUB_SDA
GND_2
11
D114 30V CDS3C30GTH
RED
7 PC_G
R115 68
GREEN_GND
12
DDC_DATA
GREEN
PC_AUD_R
8 PC_HS PC_B
R117 75 R114 68 R118 75
BLUE_GND
13
H_SYNC
BLUE
9 PC_VS
C104 68pF IC100 R113 4.7K C103 68pF
NC
4
D110 30V CDS3C30GTH R112 D112 30V 4.7K CDS3C30GTH
14
V_SYNC
GND_1
PC_AUD_L
10 DSUB_SCL
D113 30V CDS3C30GTH A0 A1 A2 GND 1 2 3 4
SYNC_GND
15
DDC_CLOCK
AT24C02BN-10SU-1.8
DDC_GND
6B
8 7 6 5 VCC WP SCL SDA R124 100 R125 100 R126 4.7K R127 4.7K C105 0.1uF
T_TERMINAL2 8 SHIELD_PLATE
16
SHILED
DSUB_SCL DSUB_SDA
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION. FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.