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2010/2011-2
DIGITALDESIGNTECHNOLOGY& TECHNIQUES
CADforElectronicDesign
L1:INTRODUCTION
2010/2011-2
INTEGRATEDCIRCUITS(IC)
Anintegratedcircuit(IC)consistscomplexelectroniccircuitriesand theirinterconnections. WilliamShockleyetal.ofBellLaboratoriesinvented transistor in 1948. Most current integrated circuits are built with MOSFET (metal oxidesemiconductorfieldeffecttransistor)transistors. ICscommerciallyavailablesinceearly1960s. Phenomenal advancement in IC design and fabrication technologies.
CADforElectronicDesign
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2010/2011-2
MoreandmoretransistorsarepackedinachipSSI,MSI,LSI,and VLSI. Currentlymillionsoftransistorsinasinglechip.E.g.,IntelPentium IVprocessorhas40milliontransistorsusing0.13mtechnology. Integration Scale SSI MSI LSI VLSI Number ofTransistors <10 101,000 1,00010,000 >10,000 Examples Logicgates Adders,counters Multipliers Microprocessors
CADforElectronicDesign
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CADforElectronicDesign
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DIGITALICIMPLEMENTATIONALTERNATIVES
Variousimplementationofdigitallogicdesigns TraditionalofftheshelfICchips,e.g.,SSIandMSITTL,performa fixedoperationdefinedbythedevicemanufacturer. ApplicationspecificIntegratedCircuits(ASICs)arecustomizedICs whoseinternalfunctionaloperationisuserdefined. CPLD or FPGA requiresuserhardwareprogrammingtoperform thedesiredoperation. The circuitlevel design of a VLSI or ASIC chip involves circuit componentsdesign,placement,andinterconnectrouting.
CADforElectronicDesign
L1:INTRODUCTION
2010/2011-2
Standard Components
SoC
(System-on-Chip)
Applications fixed
Applications by Programming
Reconfigurable ASIC
Semicustom VLSI
Structured ASIC
Full-custom VLSI
Prefabricated Logic Gates Software Hardware Reconfigurable Masked Gate & Logic Programming Programming Array (MGA) Microchip Modules CMOS TTL ECL Microprocessor & EPROM PLA PLD ROM Channeled GA Sea-of-gates GA master slice
FPGA CPLD
CADforElectronicDesign
L1:INTRODUCTION
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Fullcustom VLSI uses circuit elements, e.g., transistors and connectionsastheprimitivecomponents. Offers a designer flexibility to optimize circuit characteristics, placement,andtheirinterconnects,aslongascertaindesignrules aresatisfied. Very time consuming for complex ICs and requires a full knowledgeoftheoperationofthecomponentsatthecircuitlevel. Semicustomdesignusesalibraryofcircuitlevelcells(standardcells) specifiedbytheirfunctionsandcharacteristics. The use of standard cells at the logic level simplifies the design process,butreducesdesignflexibility.
CADforElectronicDesign
L1:INTRODUCTION
2010/2011-2
Anothersemicustomstyleisthegatearraydesign. Basic components (usually basic gates) are placed on a regular structurewithinachip,andthedesignconsistsofdeterminingthe connectionsbetweenthegates.
Horizontal routing channel a a' abd (y = abc + a'c + c'd) y
b b' a'c
c c' c'd
CADforElectronicDesign
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2010/2011-2
Acombinationoffullcustomandsemicustomdesignisbest,where thecriticalportionsofthesystemaredesignedusingfullcustom. ICTYPE Masklayers customized All All Some None Logiccells customized Some None None None Fabrication leadtime >2months ~2months ~1to2weeks
CADforElectronicDesign
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2010/2011-2
DIGITALDESIGNABSTRACTION
Todayscircuitsaremorecomplex. Timetomarketisoneofthecrucialfactors. Newtechniquesmustbeusedwhenwemovefromasmallscaleto largescaledesigns Digitaldesignersusetwotechniques Designabstraction Hierarchicalmodulardesign Need electronic design automation (EDA) or computeraided design(CAD)tools.
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Designabstraction
Ateachdesignlevel,theinternaldetailsofacomplexmodulemay beabstractedawayandreplacedbyablackboxviewormodel. This model contains virtually all the information needed to deal withtheblockatthenext(lower)levelofthedesignhierarchy. For all purposes, the model can be considered a black box with knowncharacteristics.Asthereisnoneedforthesystemdesigner tolookinsidethisbox,designcomplexityissubstantiallyreduced. Designabstractioniscrucialinhardwaresystemdesign. Hardwaredesignersusethesemultiplelevelsofdesignabstraction tomeetperformancegoalsforverylargedesignsandreducedesign leadtimes.
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CADforElectronicDesign
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Hierarchicalmodulardesigntechnique
The solution to working in any complex environment is modularization(divideandconquer) Thecomplexityofdesignisbrokendown(divided)intoahierarchy ofmodulesgeneral(top)tospecific(bottom). Benefitsto Focusonasinglemoduleatatime Createcustomizedlowlevelmodulesfordesignreuse.
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The topdown approach decomposes the system into smaller subsystemsuptoalevelwhichthesubsystemscanberealized. Thebottomupapproachconnectsavailablemodulestoformbigger, morecomplexsubsystems. Usually combined topdown decomposition and bottomup composition(reuseofprimitivemodules).
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Top Level
A B
Bottom Level
A B
(a)Topdownapproach (b)Bottomupapproach.
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ELECTRONICDESIGNPROCESS
System Specification
Circuit Design
Architectural Design
Physical Design
Functional Design
Fabrication
Logic Design
Packaging
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System Specification
Hardware Spec
Software Spec
Software
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COMPUTERAIDEDDESIGN(CAD)
A.k.a Electronic Design Automation (EDA) systems. Makes design process efficient, timely, and economical. CAD tools are intended to support all phases of a digital design: Description (specification), Design (synthesis), including various optimizations to reduce cost and improve performance, Verification (by simulation or formal approach) with respect to its specification. These three phases typically require several passes to obtain a suitable implementation.
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HDL(HardwareDescriptionLanguage)
It is replacing schematic capture Today, VHDL and Verilog are the two widely used languages These two description approaches can coexist.
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SchematicDesignvs.HDLDesign
Thetraditionalwayisby(schematiccapture) logicdiagramofthe system(modulesandtheirinterconnects). An alternative is using hardwaredescription language (HDL), e.g., VHDLandVerilogarethetwolanguageswidelyusedtomodel anddesigndigitalhardware. HDLsoffer/allow Reductionindevelopmenttimeandallowsmoreexplorationof designalternatives. Descriptioninhigherlevelsofabstraction. Ameantostandardizeormethodofspecifyingadesign. Representation of sequential logic and manipulation of data type.
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CADforElectronicDesign
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D e s ig n C o n ce p t
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P a rtitio n
D e s ig n o n e m o d u le
...
D e sig n o n e m o d u le
D e fin e in te rc o n n e ctio n b e tw e e n m o d u le s
C o rre ct? Ye s Te ch n o lo g y m a p p in g
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CADMethodologywithHDL
DesignentryinHDLformat(e.g. UTM VHDLmg, AlteraQuartus II). HDLbehaviouralsimulation(e.g.AldecActiveVHDL). Synthesis (e.g., Altera Quartus II, Synopsys FPGA Express), convertingthecodetoalogicnetlistfile. Functionalsimulationtoverifyfordesigncorrectness(e.g. Altera QuartusII). Implementationconvertingnetlistfiletoaphysicaldesigntothe targetimplementationtechnology. Timing Simulation the physical layout is verified with timing information.
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CADforElectronicDesign
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Design Entry VHDL DESIGN .vhd or .v (hdl source code )
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Compilation
Synthesis
LOGIC SYNTHESIS
Design Verification
.edif file DEVICE FITTING partitioning fitting place & route .pof file .sof file Implementation DEVICE PROGRAMMING
Physical Design
.snf file
FPGA
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LogicSynthesis
RTL Description
Translation
Unoptimized Intermediate Representation
Logic Optimization
Design Constraints
(Timing, Area, Power)
Technology Library
(library of available gates, and leaf-level cells)
Gate-level Netlist
(Optimized Gate-Level Representation)
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AlteraQuartusIICADTool
Modelsim
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EVOLVINGTRENDS
Increasing Design Density and Complexity Gate Count
Electronic System Level - ESL (systemC/ systemverilog) Behavioural or Algorithmic Synthesis Register-Transfer Level - RTL (VHDL/ Verilog)
1M
500K
100K
Schematicbased
10K 1K
1970's
1980's
1990's
2000
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FurtherReading
1.
2.
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