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1.1 Introduction:
Printed Circuit Board (PCB) provides both the physical structures for mounted and holding of electronic components as well as the electrical interconnection between components. That means a PCB is a platform upon which electronic components such as integrated circuit chips and chips are mounted. A PCB consist of non conducting substrate upon which a conductive pattern or circuitry is formed. Copper is the most prevalent conductor, although nickel, silver, tin, tin-lead and gold may also be used as top level metal. There are different types of PCBs: single sided, double sided, multi layer. Single sided PCBs have conductive pattern on one side only, double sided have conducting pattern on both sides, multi layer consist of alternating layers of conductor and insulating material bounded together. The conductive layers are connected by plated through holes, which are also used to mount and electrically connect components. PCB may also be rigid, flexible, or a combination of two. The combination of PCB and components is an electronic assembly, also called printed circuit board assembly.
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FR-2 Laminates are composed of paper and phenol-resin and are cheap. But the absorb water and should not be used in producing PTH PCBs. These are useful in applications where tight dimensional stability is not required. FR-4 Laminates are made of epoxy resin impregnated with woven glass fiber. The have very good thermal, mechanical and electrical properties and are mostly extensively used material in the PCB industry. General Components of the Base-Material in the manufacturing of PCB are comprised of three basic building blocks: Resin, Reinforcement& metal cladding. Resins are used to impregnate the selected reinforcement. The selection of a particular resin is dependent on electrical, temperature and process parameters. The selection of particular resin is dependent on electrical, temperature and process parameters. Epoxy resins, which are most commonly used are modified with additives to achieve higher thermal properties or improve chemical resistance. The resins used in the manufacture of base material are thermosetting resins which are highly cross linked polymeric structures and do not melt on heating. Phenol, Polyester, Epoxy, Polyimide are some of the resins in use.[1]
Chapter 2
2.1 Metal cladding:
Metal cladding as conductive layer can be made of copper, nickel, stainless steel or beryllium copper. But the mostly used substrate is copper due to its availability, cost and functionality. Copper foil can be adhered on one side or on both sides of the composite. There are two different types of copper foils: Electro-Deposited (ED) copper foils are produced by depositing copper on stainless drum that rotates in a plating tank with anodes of very pure copper. The finished copper foil is then removed from the drum and wound on a roll. The finished copper is very smooth and shiny on the drum side and has a matte and rough side on the other side. The rough side gives the strong adhesion to the dielectric material. HTE or Rolled copper is produced by annealing Electro-Deposited copper at a higher temperature.
2.2 Reinforcement Reinforcement provides mechanical strength, stability and rigidity to the
lamination. Paper sheet, Cotton fabric, Asbestos sheet, Glass cloth, Ceramic materials are the some of the reinforcement. Fiber glass has gained popularity because of high tensile strength and dimensional stability, and resistance to temperature variation, moisture and corrosion. [5]
BLANK CUTTING BRUSHING IMAGE TRANSFER EATCHING DRILLING MASKING LEGEND PRINTING ROUTING BARE BOARD TEST Fig:1 Basic steps of PCB designing[1]
Chapter 3
3.1 PCB Design Softwares:
1. 2. 3. 4. 5. 6. 7. OrCAD. TANGO. Eagle. PADS. REDCAD. P-CAD. Mentor.
transition temperature. The next four numbers designates the normal dielectric thickness in um. C stands for copper clad. The thirteenth character denotes the pits and dents allowed in copper foil.
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All I/O voltage and ground conductors should have minimum conductor length to achieve more efficiency of the circuit.
3.12 Capacitance:
Capacitance between two signal conductors is given by the relation: C = .886* r * A/b A = Total overlapping area b = thickness of dielectric r = dielectric constant
3.13 Resistance:
Specific resistance is given by the relation:
R = > *I/A
I = conductor length A = conductor cross section.[5]
Chapter 4
4.1 Mechanical design consideration:
1. Board size should be compatible with PCB manufacturing process. 2. Board mounting hole should be provided. 3. Heavy components should be adequately placed. 4. Proper hole dia should be provided.
4.3.2 Developing:
For developing of the film, the developer used has to be a type recommended by the film manufacturer for that particular film. The best recommended temperature is 2022 degree for best result. The developer tray should be of stainless steel in order to avoid scratches created by plastic-trays. While developing put sufficient developer in the tray so that the film can get completely converted with it. Film should be held from the corners only. To start the 10
development procedure, dive the exposed film sheet with the emulsion up through the solution so as to wet the emulsion. Start immediately to lift the tray rotationally on each side by about 2cm. This lifting should continue for the whole developing period.
4.3.6 Drying:
After washing, the film should be dried slowly at room temperature. For good results, drying should be take place at room temperature. Avoid forced drying which may effect the dimensional stability of film.[3]
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GLOSSARY
1: ADHESIVE:- A substance such as glue or cement used to fasten object together. In surface mounting, an epoxy adhesive is used to adhere SMD to the substrate. 2: ANSI:- American National Standard Institute, an organization formed by industry and the US government to develop trade and communication standard. 3: Assembly drawing:- A drawing depicting the location of components, with their 4: Bare board:- An unassembled PCB. 5: Base material:- An insulating material as well as copper foil bondeor both sides. 6: BGA:- Ball grid array. 7: Bill of material:- An itemized list of all components, hardware, wire, on PCB. 8: Blind via:- A via that reaches only one layer beneath the outer layer on one side 9: Bridging:- Short circuit of the pads to an adjacent track or pad on a board during soldering. 10: Buried via:- A via that does not reach a surface layer on either side of a multilayer board. 11: Card:- Another name of a printed circuit board. 12: Capture:- Graphical representation of the circuit. 13: Clad:- A copper object on the board. 14: Clearance:- Metal to metal gaps on the board.
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15: Datum:- A specific location that serves as a reference 16: Die:- The uncased and normally leadless form of an electronic component that is either active or passive. 17: DRC:- Design rule check. 18: Electroless copper:- A thin layer of copper deposited on PCB without the use of electric current. 19: Electrolytic copper:- A thin layer of copper clad on conductive areas of PCB by means of electric current. 20: Footprint:- The pattern and space on a board taken up by the component. 21: Gerber file:- Data file used to control a photo plotter. 22: Land:- Synonym for pad and terminal area. 23: Legend:- Pattern printed onto the surface of aboard which defines the position of components to be mounted on board. 24: NC drill:- Numerical control drill machine. 25: NC drill file:- A text file which tell NC drill where to drill is holes. 26: Netlist:- List of parts and their connection points. 27: Photoplotter:- Device used to generate artwork photographically by plotting objects(opposed to copying an entire image at once as with a camera) on to the film used in manufacturing PCB. 28: Prepreg:- B-stage sheets of glass cloth pre-impregnated with epoxy resin, used to bound multi layer boards. 19
29: SMD:- Surface mount devices. 30: Silkscreen:- In is used as reference designators on the printed wiring board. 31: Routing:- Placing tracks between components. 32: Track:- Trace. 33: Wire:- Wire on a printed board also means a route on track. 34: Zero reference line:- Also called zero datum line.[3]
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CONCLUSION
During my Training I learnt a lot, due to the result of hard working of my guides & co-operation of my parents. It was an interesting experience to know the spirit of, human relationship, punctuality & hard work. The period of 30 days training was really a great experience in industries field. I also learnt how to co-ordinate with the colleagues & also increased my personal skill it will be helpful a lot in my future. It has given a lot of my knowledge & is an essential part of technical education programme.. we were PCB designing My training section mainly included knowing about the basics of pcb designing through the use of orcad software. It was great pleasure learning and we were given a lot of knowledge & this training was an essential part of technical education programme. On completion of this 30 days training I am very well aware about substation, its working and importance.
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REFERENCE
[1] [2] [3] [4] [6] [7] Manual provided by the institute. S.M.Sze,VLSI TECH.,second edition,chapter:2,9,7. WALTER C BOSSHART, PCB design and techenology, second edition chapter no.1,2,9,11 Carrow, R.A., Soft Logic; A Guide to Using a Printed ckt Board, McGraw Hill, 1997.chapter no.3,5. Batten, G.L., Applications of Printed Ckt Board, Second Edition, McGrawHill, 1994.ch no.10 PCB software library.
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