Complete systems for the preparation of

Electro-optic Materials

Defect free face & edge polishing of electro-optic substrates Scratch-free surface finish on all materials Exacting and repeatable dimensional tolerances

Provided by: Adaptable machine systems Full technology transfer Total after sale support

The Logitech Package

Drawing on over 30 years of experience in the design and manufacture of high precision equipment for the sophisticated and diverse world of materials processing, Logitech has developed a fully integrated machine-technology package for the processing of Silicon, Lithium Niobate, Lithium Tantalate, Bismuth Silicon Oxide, Barium Titanate and similar electro-optic materials to precise tolerances with scratch-free surface finish. This flexible system will integrate into your total fabrication programme, offering a quick and reliable route to success in the final preparation of your electro-optic material samples. The system has the versatility to accommodate a wide range of electro-optic materials and specimens of varying size and geometry. A fabrication process for a typical device such as an optical phase modulator breaks down into 7 stages: Manufacturing and orientation of the crystal. Slicing the wafer from the crystal boule with an annular diamond saw. Smooth lapping of both wafer faces and polishing of one or both faces to defect-free quality (sub nm Ra). Cutting of substrates from the polished wafer. Forming of optical guide channel on the polished surface of the substrate, e.g. by diffusion of a Ti strip. Bonding of diffused plates to form a stack between end wasters, and polishing of ends flat and square to the main faces with minimal edge roll-off and edge chipping. Evaporation of further electrode strips, mounting of device plate onto header and connection of optical fibres and electrical leads.

Precision Processing Equipment

The Logitech package carries out parts 2, 3, 4 and 6 of this fabrication route and our custom-designed equipment assures the best possible results after each of these intermediary stages. The major advantages of a Logitech system are: adaptability to a range of different requirements; dependability; variable throughput capacity, tailored to suit all environments from the small research and development laboratory to larger production facilities. Add to this the ease of operation and the full technology transfer and customer support scheme offered by Logitech to every system purchaser, and a Logitech edge polishing system becomes a valuable package for integration into any electro-optic crystal fabrication process. The standard system also includes a full range of lapping and polishing plates with all the gauging accessories and consumable items necessary for the various stages of the process.

Results
The sketch below shows the consistently high quality of results obtainable using Logitech equipment: Typical Electro-Optic Device Substrate
General squareness and parallelism to about 3 minutes of arc Edge free of chips at the 1m level. Edge roll < 10 within 30m of edge. End faces flat overall to c. 10 with edge roll 10 within 30m of the edge. Scratch free generally as for the major faces. Major surface(s) scratch free under 1000x magnification. General long range flatness = 2 per cm. 0.5mm to 1mm nominal thickness.

Y axis square to main face within a few minutes of arc.

Z axis square to long dimension within 1 or better.

Typical Process Route for

Wafer Slicing
Boules of up to 55 or 78mm in diameter can be precisely sliced using an Annular Saw to a precise thickness. Using an automatic saw such as the APD1/APD2, cutting can continue unsupervised. These precision high speed annular saws, with single or multiple cut options, are ideal for cutting fine wafers of electro-optic materials with minimum kerf loss and surface damage. 200-300 micron slices can be cut with minimum material wastage.

APD1 saw cutting a lithium niobate boule

Wafer Mounting
This wafer is bonded to a glass support plate with wax or quartz cement and a gentle load is then applied by the bonding press to give the required uniformity of bond thickness.

Bonding press & wafer support plate

Sawing the Wafer into Substrates

The support plate is then held on the rotary table assembly of the APD1/APD2 and the wafer is cut into strips of the desired width and then into substrates of the desired length. The APD1 Saw is particularly suited to the sawing and dicing of wafers, as it can easily be changed from annular to peripheral sawing configuration. Both the APD1 and APD2 Peripheral Saws feature a rotary table with an indexing facility, to allow cuts to be made at a known angle to each other.

APD1 saw with rotary table

Smooth Lapping of the Wafer

The diced wafer substrates are then mounted on the Wafer Mounting Plate of the PP5 Precision Lapping & Polishing Jig, and lapped and polished using the PM5 machine with appropriate plates, abrasives and fluids. This advanced lapping and polishing machine with convenient touch panel control is efficient and reliable for both main face and edge lapping and polishing operations. The PM5 auto-lap/pol - not shown - can also be used to great effect for this operation as it offers automated plate flatness control. Subsequently, the substrates are de-mounted, turned over, and re-bonded to the Mounting Plate for preparation of the second face.
Lapping on a PM5 with accessories

Electro-Optic-Substrates
Inspecting the End Result
The substrates are now ready for inspection by microscope before passing on to the next stage of processing.

Substrate holder for microscopic examination

Dismantling the Stack

This is a critical stage which must be carried out very carefully to ensure that there is no chipping of the fine, square edges of the planks. To do this, the stack is placed in the Logitech Solvent/Vapour Cleaner assembly. The vapours dissolve the stack apart gently, whilst at the same time gently cleaning the planks in general and the edges in particular.
Solvent/vapour cleaner assembly

Polishing the Stack Ends

After cleaning excess wax from the bonded stack, it is mounted in a Stack Clamping Block on a purpose designed version of the PP5 Precision Polishing Jig. This precision holding fixture offers a high degree of control over parallelism and is ideal both for lapping and polishing electro-optic materials using a range of purpose designed accessories. Alternatively, for applications where the degree of precision offered by the PP5 jig is unnecessary, the polishing operations can be carried out using a retaining ring and adaptor weight.
PP5 jig and stack clamping block

Stack Cementing of Substrates between End Glass Wasters

The sawn substrates are then removed from the support plate, cleaned and "stacked", by bonding them together with a minimal thickness layer of hard cement. The stack is completed by end glass wasters which are prepared in a similar way to the substrates. Using the Alignment Jig and the Bonding Press, up to eight planks can be bonded into a stack, with controllable bond thickness.
Bonding press with alignment jig

Quantity
The quantity of finished samples produced per week depends on various factors such as the size of the system, the process route chosen and experience in using the equipment. A precise assessment of throughput rates can only really be made once the system has been finely tuned to the specific aim of the maximum output with optimum efficiency. The following table outlines realistic expectations for various sizes of system for producing electrooptic substrates based on either one or two PM5 (single work station) lapping and polishing machines:

SIZE 1 system

OUTPUT (substrates per week) 22 using off-saw wafers 66 using pre-polished wafers

SIZE 2 systems

OUTPUT (substrates per week) 60 using off-saw wafers 140 using pre-polished wafers

Greater outputs can be achieved by using the larger LP50 machine which can accommodate up to three work stations simultaneously.

Flexibility & Adaptability

Logitech systems are all individually matched to the needs of the individual organisation. However the basic machine components are designed to be used for many different applications. Using a range of plate types, abrasives, etc., a Logitech system is extremely versatile and can be converted quickly from one processing methodology to another. For example, the system described is for the production of electro-optic planks of a given standard size, but is easily modified to process various sizes of sample to different geometries It can also be quickly converted for processing of semiconductors, laser rods, optical mirrors and windows and other optical components, ceramics, polymers, plastics, composites, etc. Logitech recommends a system only after proper discussions have been carried out with our customers regarding their requirements for production quantity and general tolerances. Occasionally we may require a general outline of the proposed device fabrication route, but confidentiality of proprietary information is assured. This policy guarantees that our customers can achieve the best possible results through correct use of their equipment.

Technology Transfer & Support

A key part of any Logitech Machine-Technology System is the concept of technology transfer. Years of experience in supplying materials processing systems have shown us that instruction manuals alone, no matter how good, are not sufficient to impart all the necessary subtleties of sample preparation to the user of a Logitech system. It is for this reason that we provide each purchaser of a Logitech system with a free 3-day training course (inclusive of travel and accommodation) at our laboratories in Scotland. During this period we cover all aspects of system operation and maintenance and carry out various process trials to help resolve any problems peculiar to the individual customer's process route. Logitech places great emphasis on ensuring that the equipment we supply is successfully installed at our customers' premises. To achieve this, we have to make a high level of commitment to after sales support and respond quickly and efficiently whenever our help or advice is requested. The team of specialists in our Customer Services Section is fully skilled in solving all forms of technical or technological problems. This service, along with our policy of replacing defective components with the minimum inconvenience and delay, means that our response to any problem is immediate.

Logitech Limited Erskine Ferry Road, Old Kilpatrick Glasgow G60 5EU, Scotland, U.K. Tel: +44 (0) 1389 875444 Fax: +44 (0) 1389 890956 e-mail: info@logitech.uk.com www.logitech.uk.com

USA Struers Inc. Logitech Product Group 810 Sharon Drive Westlake, Ohio 44145 Telephone (440) 871 0071 Telefax (440) 871 8188
E-mail: info@logitech-us.com

Germany Struers GmbH Produktgruppe Logitech Linsellesstrasse 142 D-47877 Willich Telephone 02154 818-0 Telefax 02154 818-134
E-mail: infostru@struers.de

France Struers SAS Dpartement Logitech 370 rue de March Rollay 94507 Champigny-sur-Marne Cedex Telephone 01 55 09 14 30 / 31 Telefax 01 55 09 14 49
E-mail: struers@struers.fr

Japan Marumoto Struers K.K. Tsukiji MF 26th Building 2-12-10 Tsukiji Chuo-Ku Tokyo 104-0045 Telephone (03) 3546 8051 Telefax (03) 3546 7980