ECE 6360: Microwave Design Spring 2013 Design Project #2 Assigned 3/04/13 Layouts Due: 3/28/13 (5 pm) Reports

s Due: 4/21/2013
Discussion: As a newly hired microwave engineer with an up-and-coming wireless communication firm, you are assigned to a design group in the RF circuits division. One of your first tasks is to design several filters that will be part of a wireless communication system. More specifically, you are asked to design a band-pass and a low-pass filter. For both circuits you will meet with your design group to decide which design will be fabricated. The selected design will be fabricated at Georgia Tech and then be tested in the teaching microwave lab.

Design a prototype low-pass filter with the following specifications (25 pts): Microstrip line technology Cut-off frequency fc (see your team number) Fabricated on Duroid substrate with r=6.15, h(substrate thickness)= 50 mils, t(metalization thickness) = 1 mil, tan =0.002. Response type R (see your team number) More than 16 dB attenuation 1.5 GHz away from the cut-off frequency fc System impedance: 50 Return Loss: as low as possible Teams 1: Teams 2: Team 3: Team 4: Teams 5: Teams 6: Team 7: Team 8: Team 9: Team 10: Team 11: Team 12: fc= 1 GHz, R= max. flat fc= 1GHz, R=0.5 dB ripple fc= 1.1GHz, R=max. flat fc=1.1GHz, R=0.5 dB ripple fc= 1.2 GHz, R=max flat fc= 1.2 GHz, R=0.5 dB ripple fc= 1.3 GHz, R=max flat fc= 1.3 GHz, R=0.5 dB ripple fc= 1.4 GHz, R=max flat fc= 1.4 GHz, R=0.5 dB ripple fc= 1.35 GHz, R=max flat fc= 1.25 GHz, R=max flat

Design a prototype bandpass filter with the following specifications (25 pts): Microstrip line technology Center frequency fo (see your team number) Bandwidth D (see your team number) Fabricated on Duroid substrate with r=6.15 h(substrate thickness)= 50 mils, t(metalization thickness) = 1 mil, tan =0.002. Response type R (see your team number) System impedance: 50 Return Loss: as low as possible

Teams 1: Teams 2: Team 3: Team 4: Teams 5: Teams 6: Team 7: Team 8: Team 9: Team 10: Team 11: Team 12:

fo= 3.2 GHz, D=10%, R= max. flat fo= 3.2 GHz, D=20%, R=max. flat fo= 3.6 GHz, D=10%, R= 0.5 dB ripple fo=3.6 GHz, D=20%, R=0.5 dB ripple fo= 4 GHz, D=10%, R=max flat fo= 4 GHz, D=20%, R=0.5 dB ripple fo= 3.8 GHz, D=10%, R=max flat fo= 3.8 GHz, D=20%, R=0.5 dB ripple fo= 4.2 GHz, D=10%, R=max flat fo= 4.2 GHz, D=20%, R=0.5 dB ripple fo= 3.7 GHz, D=15%, R=0.5 dB ripple fo= 3.7 GHz, D=15%, R=max flat

Design Considerations: When generating circuit layouts, do not exceed the maximum circuit board size of 6 inches. Check to make sure that HP-ADS gives you practical circuit dimensions. For example, avoid using microstrip lines with w/h>10, and for resonant stubs keep w/l<0.4. The minimum trace width or gap is 10 mils, but the trace is fragile and can sometimes break. Make sure that you extend the input/output lines in a way that make sense for the measurements. At the input/output of the circuit you will attach/solder a coaxial SMA connector that you will use for measurements.

Creation of Gerber Files for Circuit Fabrication This document will guide you through the process of creating a final output file for circuit fabrication. The steps summarized here assume a completed layout done in ADS. My project is completed and ready for fabrication Whats next? From the schematic window (Menu bar) Click Layout Generate / Update Layout

A window will show the layout with labels and other parameters. In order to create the file for fabrication, we dont want any text in our Schematic. In the present window (Menu bar) Click File / Generate Artwork Rename the file

Renaming the file in the Generate Artwork window will create the layout without labels and text. (This is the picture of what the circuit will look like once it is fabricated.) From schematic without labels (Menu bar) Click File/Export Option => Gerber Click OK, until the window titled [M tools v 3.5 (Date)]. Click the TRANSLATE option Click OK

This should indicate that the Layout is being transfer to a Gerber file A summary will pop up with the name and location of the Output file. If you dont like the output file name rename it. Save the output file and give it to Chris. On your diskette write your group number and the name and e-mail of the contact person from your group.

Reports: For this project each team will submit one report in IEEE journal format not exceeding 15 pages (including the Appendix). It is expected that team members will divide the various tasks in a fair and reasonable way, and will contribute the same amount of effort/work. A group where only some students work on the project will automatically get a zero in the report grade. Include in your report a description of the hand calculations, as well as the results and the block diagrams of the Agilent-ADS simulations. Also include a copy of the filter layouts with all dimensions. You will need to give a gerber file of your filter layouts to Yuan Li by 4/1 the latest. Allow for extra microstrip length at the input and output ports of the filters.

Here are a few things your project report should include: 1) Introduction, where you will describe the goal of the project and the components (e.g. resistor type, substrate material etc.) to be used. 2) Design, where you will show the analytical or graphical (Smith chart) process to design the desired circuit. In this section, you should include the initial values for lengths and characteristic impedances of transmission lines that will be part of the lowpass and bandpass filters, prototype values for the filters etc. At the end of the section you should show the final design (all parameters included) that is the result of the method you used. 3) Simulation and Optimization, where you will describe the software tools you used to simulate the performance of the circuit and optimize it or fine-tune it. You should include specific information, such as the optimization method used, as well as hard copies of your schematics and test benches. You can also include some of the simulated results (all of the simulations will be compared with measurements at the next section). Describe the optimization process and any differences with your initial design (the one from part 2). 4) Fabrication, where you will outline the fabrication steps (if applicable). 5) Measurements, where you will describe all measurements performed (include block diagrams of set-ups, equipment used etc.) and compare the measured with the simulated results (e.g. in one graph you want to plot both the simulated and measured insertion loss of the filter). You should definitely explain any differences between the measurements and the simulations. You need to have a graph for each one of the measurements that you performed. 6) Conclusions, where you will summarize your achievements (also include a brief description of reasons that might have led to good or poor circuit performance) and provide recommendations for improving the performance of the circuit in future design iterations.