Qualcomm RF360 Front End Solution

Truly global. Entirely integrated. Easily customizable.

The problem The solution
4G LTE band fragmentation

The advantage

Multiple versions of the same LTE device are required to accommodate the worldwide proliferation of cellular bands40 already and counting.

OEMs can design thinner, battery friendly devices that deliver higher performance using less power, and that are capable of supporting all modes and all bands, worldwide.

Integration at the system level

Delivering one global design

Optimized system solution for worldmode LTE

Performance Global LTE coverage Antenna Matching Tuner Envelope Power Tracker Power Amp & Antenna Switch RF POP Reduced power Improved throughput Design E iciency Reduced size Time to launch

With the Qualcomm RF360 solution, OEMs can create a single multimode design for worldwide LTE mobility.

Band Band

Band Band

Band Band

One solution designed for: All modes. All bands.

Processor Modem RFIC PMIC

Antenna Matching Tuner Power Amp & Antenna Switch

Envelope Power Tracker RF POP

Qualcomm RF360

Half the size*

*As compared to the previous Qualcomm RF solution.

Single SKU

Power

Performance

Size

Time to launch

QFE15xx Antenna Matching Tuner

Antenna matching made easy
Improves performance in ultra-thin smartphones while operating over 2G/3G/4G LTE radio frequency bands, from 700-2700 MHz.

QFE11xx Envelope Power Tracker

Unprecedented e iciency
Groundbreaking thermal reductions in heat and major improvements in power consumption for thinner form factors and more powerful devices.

QFE23xx Power Amp & Antenna Switch

Advantage: integration
Power Amp

QFE27xx RF POP
Customizable bands

Going vertical

Ant. Switch

More bars. More coverage.

Signal

Integrating the Power Amp and Antenna Switch using a CMOS process means a smaller PCB area, ease of routing and component count savings.

Fewer SKUs Customizable bands Integrated design Fast time-to-market

27xx

Dynamic antenna matching in the presence of physical impediments, like the users hand, allows for consistent signal strength and improved talk time.

APT mode - Average power tracker

30%

Up to

Wasted energy

RF POP

Innovative 3D-RF packaging allows OEMs to change the substrate conguration to support global or region specic band combinations. Enables a highly integrated multiband, multimode, single-package RF front-end solution thats truly global.

Worldmode
Signal

ET mode - Envelope power tracker

0%

Wasted energy

2G/3G/4G support on a single chip with an all mode, multiband solution an industry rst.

One simple design

To learn more visit qualcomm.com/rf-solutions

2013 Qualcomm Technologies, Inc. All rights reserved. Qualcomm is a trademark of Qualcomm Incorporated, registered in the United States and other countries. RF POP is a trademark of Qualcomm Incorporated. Qualcomm RF360 and RF POP are products of Qualcomm Technologies, Inc. All Qualcomm Incorporated marks are used with permission.