PC357NT

PC357NT
s Features
1. Opaque type, mini-flat package PC357NT ( 1-channel ) 2. Subminiature type ( The volume is smaller than that of our conventional DIP type by as far as 30 %. ) 3. Current transfer ratio ( CTR: MIN. 50% at I F = 5mA, V CE = 5V ) 4. Isolation voltage between input and output PC357NT Viso : 3 750Vrms 5. Recognized by UL ( No. E64380 )

Mini-flat Package, General Purpose Photocoupler

s Outline Dimensions
PC357NT 2.54 0.25 4 357 1 Anode mark 2 0.4
0.1

( Unit : mm )

3 4.4 0.2

Internal connection diagram 4 3 1 2 3 4 1 C0.4 Input side 2 0.2 0.05

0.4 0.5 + - 0.2 0.2 7.0 + - 0.7

Anode Cathode Emitter Collector

s Applications
1. Hybrid substrates that require high density mounting 2. Programmable controllers

s Package Specifications
Model PC357NT Package specifications Taping reel diameter 178mm ( 750pcs.)

s Absolute Maximum Ratings

Parameter Forward current *1 Peak forward current Input Reverse voltage Power dissipation Collector-emitter voltage Emitter-collector voltage Output Collector current Collector power dissipation Total power dissipation *2 Isolation voltage Operating temperature Storage temperature *3 Soldering temperature
*1 Pulse width <=100 s, Duty ratio: 0.001 *2 40 to 60% RH, AC for 1 minute *3 For 10 senconds

( Ta = 25C )
Symbol IF I FM VR P V CEO V ECO IC PC P tot V iso T opr T stg T sol Rating 50 1 6 70 35 6 50 150 170 3 750 - 30 to + 100 - 40 to + 125 260 Unit mA A V mW V V mA mW mW V rms C C C

0.1 0.1 2.6 0.2

3.6 0.3

5.3 0.3

Soldering area 0.2mm or more

In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that occur in equipment using any of SHARP's devices, shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest version of the device specification sheets before using any SHARP's device.

PC357NT s Electro-optical Characteristics

Parameter Forward voltage Reverse current Terminal capacitance Collector dark current Collector-emitter breakdown voltage Emitter-collector breakdown voltage *4 Current transfer ratio Collector-emitter saturation voltage Isolation resistance Floating capacitance Rise time Response time Fall time Symbol VF IR Ct I CEO BVCEO BVECO CTR V CE(sat) R ISO Cf tr tf Conditions I F = 20mA V R = 4V V = 0, f = 1kHz V CE = 20V, I F = 0 I C = 0.1mA, I F = 0 I E = 10 A, I F = 0 I F = 5mA, V CE = 5V I F = 20mA, I C = 1mA DC500V, 40 to 60% RH V = 0, f = 1MHz V CE = 2V, I C = 2mA R L = 100 MIN. 35 6 50 5 x 1010 TYP. 1.2 30 1011 0.6 4 3

( Ta = 25C )
MAX. 1.4 10 250 10 - 7 600 0.2 1.0 18 18 Unit V A pF A V V % V pF s s

Input

Output

Transfercharacteristics

*4 Classification table of current transfer ratio is shown below.

s Current Transfer Ratio ( CTR ) Line-ups

Model No. PC357N1T PC357N2T PC357N3T PC357N4T PC357N5T PC357N6T PC357N7T PC357N8T PC357N9T PC357N0T PC357NT Rank mark A B C D A or B B or C C or D A, B or C B, C or D A, B, C or D A, B, C, D or No mark CTR ( % ) 80 to 160 130 to 260 200 to 400 300 to 600 80 to 260 130 to 400 200 to 600 80 to 400 130 to 600 80 to 600 50 to 600

PC357NT
Fig. 1 Forward Current vs. Ambient Temperature
70 60 Forward current I F ( mA ) 50 40 30 20 10 0 - 30

Fig. 2 Diode Power Dissipation vs. Ambient Temperature

Diode power dissipation P ( mW ) 0 25 50 75 100 125

100

80 70 60

40

20

0 - 30

50 55

100

Ambient temperature T a ( C )

Ambient temperature T a ( C )

Fig. 3 Collector Power Dissipation vs. Ambient Temperature

200 Collector power dissipation P C ( mW )

Fig. 4 Total Power Dissipation vs. Ambient Temperature

300

150

Total power dissipation P tot ( mW ) 0 25 50 75 100 125

250

200 170 150

100

100

50

50

0 - 30

0 - 30

25

50

100

Ambient temperature T a ( C )

Ambient temperature T a ( C )

Fig. 5 Peak Forward Current vs. Duty Ratio

10000 5000 Peak forward current I FM ( mA ) 2000 1000 500 200 100 50 20 10 5
5

Fig. 6 Forward Current vs. Forward Voltage

500 200 Forward current I F ( mA ) 100 50 20 10 5 2 1 T a = 75C 50C 25C 0C - 25C

Pulse width <=100 s T a = 25C

10

-3 2

10

-2 2

10

-1 2

0.5

1.0

1.5

2.0

2.5

3.0

3.5

Duty ratio

Forward voltage V F ( V)

PC357NT
Fig. 7 Current Transfer Ratio vs. Forward Current
500 VCE = 5V T a = 25C Current transfer ratio CTR ( % ) 400 Collector current I C ( mA ) 40 I F = 30mA P C ( MAX. )
mA

Fig. 8 Collector Current vs. Collector-emitter Voltage

50 T a = 25C

20
10

300

30

200

20

mA
2 4

5mA
10

100

0 0.1

1 Forward current I
F

10 ( mA )

100

6
CE

8 (V)

10

Collector-emitter voltage V

Fig. 9 Relative Current Transfer Ratio vs. Ambient Temperature

150 I F = 5mA VCE = 5V

Fig.10 Collector-emitter Saturation Voltage vs. Ambient Temperature

0.16 0.14 Collector-emitter saturation voltage V CE(sat) ( V ) 0.12 0.10 0.08 0.06 0.04 0.02 0 - 30 I F = 20mA I C = 1mA

Relative current transfer ratio ( % )

100

50

0 - 30

20

40

60

80

100

20

40

60

80

100

Ambient temperature T a ( C )

Ambient temperature T a ( C )

Fig.11 Collector Dark Current vs. Ambient Temperature

10
-5

Fig.12 Response Time vs. Load Resistance

500 VCE = 2V 200 I C = 2mA T a = 25C 100 Response time ( s ) 50 20 10 5 2 1 0.5 0.2 td ts tr tf

VCE = 20V

Collector dark current I CEO ( A )

10

-6

10

-7

10

-8

10

-9

10 10

- 10

5
- 11

- 30

20

40

60

80

100

0.1 0.01

0.1

10

50

Ambient temperature T a ( C )

Load resistance RL ( k )

PC357NT
Fig.13 Collector-emitter Saturation Voltage vs. Forward Current
8 T a = 25C 7 Collector-emitter saturation voltage V CE(sat) ( V ) VCC Input Input RD RL Output Output 10% 90% td tr ts tf 6 5 4 3 2 1 0 0 3 6 9
F

Test Circuit for Response Time

I C = 0.5mA 1mA 3mA 5mA 7mA

12 ( mA )

15

Forward current I

s Temperature Profile of Soldering Reflow

( 1 ) One time soldering reflow is recommended within the condition of temperature and time profile shown below.
30 seconds 230C

200C

180C

1 minute 25C 2 minutes 1.5 minutes 1 minute

( 2 ) When using another soldering method such as infrared ray lamp, the temperature may rise partially in the mold of the device. Keep the temperature on the package of the device within the condition of above ( 1 ) . ( 3 ) As for other general cautions, refer to the chapter Precautions for Use

Application Circuits

NOTICE
qThe circuit application examples in this publication are provided to explain representative applications of SHARP devices and are not intended to guarantee any circuit design or license any intellectual property rights. SHARP takes no responsibility for any problems related to any intellectual property right of a third party resulting from the use of SHARP's devices. qContact SHARP in order to obtain the latest device specification sheets before using any SHARP device. SHARP reserves the right to make changes in the specifications, characteristics, data, materials, structure, and other contents described herein at any time without notice in order to improve design or reliability. Manufacturing locations are also subject to change without notice. qObserve the following points when using any devices in this publication. SHARP takes no responsibility for damage caused by improper use of the devices which does not meet the conditions and absolute maximum ratings to be used specified in the relevant specification sheet nor meet the following conditions: (i) The devices in this publication are designed for use in general electronic equipment designs such as: --- Personal computers --- Office automation equipment --- Telecommunication equipment [terminal] --- Test and measurement equipment --- Industrial control --- Audio visual equipment --- Consumer electronics (ii)Measures such as fail-safe function and redundant design should be taken to ensure reliability and safety when SHARP devices are used for or in connection with equipment that requires higher reliability such as: --- Transportation control and safety equipment (i.e., aircraft, trains, automobiles, etc.) --- Traffic signals --- Gas leakage sensor breakers --- Alarm equipment --- Various safety devices, etc. (iii)SHARP devices shall not be used for or in connection with equipment that requires an extremely high level of reliability and safety such as: --- Space applications --- Telecommunication equipment [trunk lines] --- Nuclear power control equipment --- Medical and other life support equipment (e.g., scuba). qContact a SHARP representative in advance when intending to use SHARP devices for any "specific" applications other than those recommended by SHARP or when it is unclear which category mentioned above controls the intended use. qIf the SHARP devices listed in this publication fall within the scope of strategic products described in the Foreign Exchange and Foreign Trade Control Law of Japan, it is necessary to obtain approval to export such SHARP devices. qThis publication is the proprietary product of SHARP and is copyrighted, with all rights reserved. Under the copyright laws, no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, for any purpose, in whole or in part, without the express written permission of SHARP. Express written permission is also required before any use of this publication may be made by a third party. qContact and consult with a SHARP representative if there are any questions about the contents of this publication.

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