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CIRCUIT IN DUSTRIES

-Multilayer 8 LayerNow Available at CI (1) FIRST TIME IN THAILAND. FOR SMALL-MEDIUM VOLUME MULTILAYER 4-8 LAYER PCB ARE NOW AVAILABLE.

Improved Production Capabilities

As we had previously informed about our 2012 investment and Start up run of Multilayer PCB production. We had launched our Multilayer PCB 4-6 Layers boards into the market and the responses are very positive towards this technology improvement. Customers are interested and eager to start the development of their new products and technology to improve the Competency in the Electronics market both Local and Worldwide. Circuit Industries Co., Ltd. had set up a Technology Roadmap to Continuously improve in our Products Quality and Production&Technical Capabilities in order to support our High Technology demanding market. Our technology Road map & Improvement for 2013 is to increase our capabilities as Follows:
1)Test Run&Launch 8 Layer PCB

3) Change all White Solder Mask ink to a special White Solder Mask for LED Application (Better reection and less Discoloration) In April 2013, We had complete all of our 3 targets and all products are NOW AVAILABLE FOR MORE INFORMATION: SALES@CIPCB.COM HTTP://WWW.CIPCB.COM TEL: 02-8101406

2) Conrm 0.2mm. Drill hole (Aspect Ratio 1:8)

0.2 MM. DRILL

MULTILAYER 8 LAYER

WHITE SOLDERMASK FOR L.E.D.

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NEXT DEVEL OPMENT

HDI (HIGH DENSITY INTERCONNECT) PCB BLIND VIA, BURIED VIA

High Density Interconnect (HDI)

HDI PCB is becoming more and more important to the modern world of electronics products. As the signal transmission speed (Clock speed) has become a very important criteria to consider and also size restriction of the product with higher need of application are forcing the Electronics product manufacturer to turn to HDI and High Layer Count PCB for the solution. HDI PCB consist of Blind via and Buried via which helps transmit the signal from one layer to another without wasting the space with drilled hole of PTH on the other side of the PCB. Blind Via requires a very high accuracy CNC Drilling machine to drill the exact depth that given so the signal can transmit from Outer Layer to the desire Inner layer without drilling through the board. The drilled hole will be plated so the signal can now transmits from Layer to layer. If the Depth is not controlled properly, it could result a short circuit between layer. Buried Via can be easily described as a PTH board inside the Multilayer. As Mentioned, Buried via already has a interconnection between layer in their inner core. These PTH holes cannot be seen from outer layer. Only way to access these internal circuit is to drill PTH or Blind via to the internal PAD FOR MORE INFORMATION: SALES@CIPCB.COM HTTP://WWW.CIPCB.COM TEL: 02-8101406

CCD PINLESS BONDING

AUTOMATIC OPTICAL INSPECTION (AOI)

CCD EXPOSURE

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CAPABIL ITIES
website: http://www.cipcb.com Email: sales@cipcb.com

Circuit Industries Co., Ltd.

Production Capabilities
Small Volume Max. Layer Count Aspect Ratio Min. Drill size Min. board thickness Min. Prepreg thickness Min. copper thickness Max Copper thickness Min. line/spacing (inner layer) Min. line/spacing (Outer Layer) Min. Annular Ring Drill Accuracy (+/-) image registration (+/-) Soldermask Registration (+/-) Rout/Score Tolerance (+/-) Blind Via Buried via 8 Layer 1:8 0.2 mm. 0.8 mm. 0.075 mm. 1oz(35um) 2 oz(70um) 0.1mm. 0.1mm.
(4mil)

Mass Volume 8 Layer 1:8 0.3 mm. 0.8 mm. 0.075 mm. 1oz(35um) 2 oz (70um) 0.125mm 0.125mm 0.125mm 35 um 75 um 75 um 0.2 mm. no no
(5mil)

(4mil)

(5mil)

0.125mm 35 um 75 um 75 um

(5mil)

(5mil)

0.2 mm. yes yes

Production Lead time Single Sided Double Sided Multilayer 4 Layer Multilayer 6 Layer Multilayer 8 Layer

Small Volume 7-10 Days 9-11 days 16 days 16 days 17 days

Mass Volume 10-12 days 12-15 days 18 days 18 days 18 days