A MAJOR PROJECT REPORT ON AUTOMATIC DRUG DELIVERING SYSTEM

Submitted in Partial Fulfillment for the award of

Bachelor of Engineering in Electronics & Communication. (2009-2013)

Submitted to

RAJIV GANDHI PROUDYOGIKI VISHWAVIDYALAYA

BHOPAL (M.P.)

Submitted By: RUCHIKA AGRAWAL (0302EC091090)

Approved By

Under the Guidance of

Mr.A.P.Singh (HOD) (Electronics & Communication )

Mrs.Neha Verma (Electronics & Communication )

Department Of Electronics & Communication

VINDHIYA INSTITUTE OF TECHNOLOGY AND SCIENCE SATNA (M.P.)

Rajiv Gandhi Proudyogivi Vishwavidyalaya,Bhopal(M.P) Vindhya Institute of Technology & Science Satna (M.P)

CERTIFICATE
This is to certify that the project entitled as Automatic drug
delivery systemwhich has been completed & submitted by RUCHIKA AGRAWAL in partial fulfillment of the requirement

for the award of the

degree

of Bachelor of Engineering in

Information Technology for the session 2012-2013 is a bonafied work by them and has been completed under my guidance and supervision.It has not been submitted elsewhere for any other degree. Mr.A.P.SINGH (H.O.D)
Principal Mr.R.C.Srivastava Mrs.Neha Verma

(E & C)

Rajiv Gandhi Proudyogivi Vishwavidyalaya, Bhopal (M.P) Vindhya Institute of Technology & Science Santa (M.P)

CERTIFICATE
This is to certify that the project entitled as Automatic
drug delivery system which has been completed & submitted by

RUCHIKA AGRAWAL,SAPNA in partial fulfillment of the requirement for the award of the degree of Bachelor of Engineering in Electronics & Communication for the session 2012-2013. (External Examinor) (Internal Examinor)

ACKNOWLEDGEMENT

A project like this one involves many people and would be incomplete without the mention of all those people whose guidance and encouragement helped in the successful completion of this project. Our heartily thanks to all faculty members of Department of Electronics & Communication,Vindhya Institute of Technology & Science, Satna for their effort towards our project. We would like to thanks our H.O.D Mr. A.P.Singh who has been a great source of inspiration for us and without whose humble guidance of project was never to shape. We are also indebted to our guide Mrs.Neha Verma for his encouragement, guidance and support. We are also thankful to many people whose timely help but paucity of space is restricting us from mentioning their name. And finally we also thank to all my colleagues who were constant support during the whole project.

RUCHIKA AGRAWAL (0302EC091090)

DECLARATION

We here by declare that the work which is being presented in the project report entitled Automatic drug delivery system in partial fulfillment of the requirement of the degree of Bachelor of Engineering in Electronics

& Communication branch is an authentic record of our work carried out

under the able guidance of Mr. A.P. Singh.The work has been carried out at Vindhya Institute Of Technology & Science, Satna. (Font size-14)

Project Associate RUCHIKA AGRAWAL

ABSTRACT

ABSTRACT The use of these systems is recognized and accepted as standard practice in community, hospital and mail service pharmacies. There has also been innovation in systems that address hospital and long term care unit dose preparation, and in computer systems that electronically track and chart prescription medications. It also improves the process leading to the choice of drugs for a formulary or drafting of treatment guidelines for specific diseases. automated drugdelivery system is a device implanted under the skin and connected to a wireless control center, is being developed to remove the inconvenience associated with taking drugs manually

CONTENTS
1. INTRODUCTION 2. BLOCK DIAGRAM 3. WORKING 4. CIRCUIT DIAGRAM 5. CIRCUIT DESCRIPTION 6. PROGRAMMING 7. LIST OF COMPONENTS 8. COMPONENT DESCRIPTION 9. DESIGN PROCESS A)PCB IMPLEMENTION 10. APPLICATION 11. ADVANTAGES 12. DISADVANTAGES 13. PROBLAM FACED & RECOVERY 14. LIMITATIONS 15. CONCLUSION 16. BIBLIOGRAPHY

AUTOMATIC DRUG DELIVERING SYSTEM

INTRODUCTION

INTRODUCTION

Drug dosing is a technique that is done to cure the diseases through proper prescription and control of drugs that have been identified to the corresponding disease based on diagnosis. Drug dosing is a very critical and challenging step that needs to be correctly monitored and prescribed by the doctor. Patients who may otherwise be unable to take medication may benefit from new electronic implants capable of dispensing drugs automatically. However, researchers warn of security risks. automated drug-delivery system is a device implanted under the skin and connected to a wireless control center, is being developed to remove the inconvenience associated with taking drugs manually. Such devices will include built-in sensors that allow health care workers to monitor pulse rate, blood oxygen levels and other functions. Based on the information, they could adjust how frequently the medication is delivered or increase or decrease amounts as necessary. Researchers believe that automated drug-delivery systems will be especially beneficial for people with physical or mental disabilities, who would otherwise be unable to take medications on their own.

Block Diagram

Alarm with Display System Microcontr oller 89c51 Stepper Motor Controller Stepper Motor Syringe System

Sensor With Salt

Working
The automatic drug delivery system is monitor glucose level in the blood. Whenever it cross a set point user will get an alarm with a message to delivers the pre-programmed amount of drug to bring the glucose level back to normal. In this project Quad Operational amplifier is used. The probe is used to connect the salt level to IC LM324. It is act as an amplifier with comparator. When probe connected to the solution than it senses the variable resistance. It is compare the difference of the probe voltage. Output salt level detector is connected with the Light Emitting Diode. It shows three levels: 1. Normal 2. Critical and 3. Danger Here, Green LED indicate that the LEVEL IS NORMAL, Blue LED indicate that the LEVEL IS CRITICAL, Red LED indicate that the LEVEL IS DANGER. The Pre-programmed microcontroller gives signal to the stepper motor. When the level is critical, comparator generates (PIN 7) High signal and its connected to the PIN No. 1 of Microcontroller. Controller will send the high the voltage to the PIN NO. 17. PIN NO. 17 is connected to the buzzer after that display shows LEVEL IS CRITICAL. When the level is danger, comparator generates (PIN 14) High signal and its connected to the PIN No. 2 of Microcontroller. Controller will send the high the voltage to the PIN NO. 17. It generate buzzer, after that display shows LEVEL IS DANGER.

CIRCUIT DIAGRAM

Circuit diagram 5v DC regulated power supply system

CIRCUIT DESCRIPTION

The system is built around the Atmels (AT89c51) 8 bit microcontroller. In this system a unipolar stepper motor is used (which is used widely in all kinds of floppy drives and CD drives) with following specifications: Maximum voltage: 5V DC, Step angle: 18 degree, Steps per revolution: 20 Uni polar stepping motors with 5 or 6 wires are available and usually wired with a center tap at terminal 1 and 2 on each of the two windings. In use, the center taps of the windings are typically wired to the Positive supply an d the two ends of each winding are alternately grounded to reverse the direction of the field provided by that winding shows Microcontroller (AT89c51) based circuit which ca n control all the functions of step per motor Crystal oscillator of frequency 12. MHz is used to produce clock frequency for the microcontroller.

IC 7805 VOLTAGE REGULATORS

The IC used here in our project basically converts 9V supply to usable 5V. It is a positive voltage regulator.

89C51(MICROCONTR0LLER)
Features Compatible with MCS-51 Products 4K Bytes of In-System Reprogrammable Flash Memory Endurance: 1,000 Write/Erase Cycles Fully Static Operation: 0 Hz to 24 MHz Three-level Program Memory Lock 128 x 8-bit Internal RAM 32 Programmable I/O Lines Two 16-bit Timer/Counters Six Interrupt Sources Programmable Serial Channel Low-power Idle and Power-down Modes Description The AT89C51 is a low-power, high-performance CMOS 8-bit microcomputer with 4K bytes of Flash programmable and erasable read only memory (PEROM). The device is manufactured using Atmels high-density nonvolatile memory technology and is compatible with the industry-standard MCS-51 instruction set and pinout. The on-chip Flash allows the program memory to be reprogrammed in-system or by a conventional nonvolatile memory programmer. By combining a versatile 8-bit CPU with Flash on a monolithic chip, the Atmel AT89C51 is a powerful microcomputer which provides a highly-flexible and cost-effective solution to many embedded control applications. PDIP 8-bit Microcontroller with 4K Bytes AT89C51 The AT89C51 provides the following standard features: 4K bytes of Flash, 128 bytes of RAM, 32 I/O lines, two 16-bit timer/counters, a five vector two-level interrupt architecture, a full duplex serial port, on-chip oscillator and clock circuitry. In addition, the AT89C51 is designed with static logic for operation down to zero frequency and supports two software selectable power saving modes. The Idle Mode stops the CPU while allowing the RAM, timer/counters, serial port and interrupt system to continue functioning. The Power-down Mode saves the RAM contents but freezes the oscillator disabling all other chip functions until the next hardware reset. Pin Description VCC

Supply voltage. GND Ground. Port 0 Port 0 is an 8-bit open-drain bi-directional I/O port. As an output port, each pin can sink eight TTL inputs. When 1s are written to port 0 pins, the pins can be used as high impedance inputs. Port 0 may also be configured to be the multiplexed loworder address/data bus during accesses to external program and data memory. In this mode P0 has internal pullups. Port 0 also receives the code bytes during Flash programming, and outputs the code bytes during program verification. External pullups are required during program verification. Port 1 Port 1 is an 8-bit bi-directional I/O port with internal pullups. The Port 1 output buffers can sink/source four TTL inputs. When 1s are written to Port 1 pins they are pulled high by the internal pullups and can be used as inputs. As inputs, Port 1 pins that are externally being pulled low will source current (IIL) because of the internal pullups. Port 1 also receives the low-order address bytes during Flash programming and verification. Port 2 Port 2 is an 8-bit bi-directional I/O port with internal pullups. The Port 2 output buffers can sink/source four TTL inputs. When 1s are written to Port 2 pins they are pulled high by the internal pullups and can be used as inputs. As inputs, Port 2 pins that are externally being pulled low will source current (IIL) because of the internal pullups. Port 2 emits the high-order address byte during fetches from external program memory and during accesses to external data memory that use 16-bit addresses (MOVX @ DPTR). In this application, it uses strong internal pullups when emitting 1s. During accesses to external data memory that use 8-bit addresses (MOVX @ RI), Port 2 emits the contents of the P2 Special Function Register. Port 2 also receives the high-order address bits and some control signals during Flash programming and verification. Port 3 Port 3 is an 8-bit bi-directional I/O port with internal pullups. The Port 3 output buffers can sink/source four TTL inputs. When 1s are written to Port 3 pins they are pulled high by the internal pullups and can be used as inputs. As inputs, Port 3 pins that are externally being pulled low will source current (IIL) because of the pullups. Port 3 also serves the functions of various special features of the AT89C51 as listed below:

Port 3 also receives some control signals for Flash programming and verification. RST Reset input. A high on this pin for two machine cycles while the oscillator is running resets the device. ALE/PROG Address Latch Enable output pulse for latching the low byte of the address during accesses to external memory. This pin is also the program pulse input (PROG) during Flash programming. In normal operation ALE is emitted at a constant rate of 1/6 the oscillator frequency, and may be used for external timing or clocking purposes. Note, however, that one ALE Port Pin Alternate Functions P3.0 RXD (serial input port) P3.1 TXD (serial output port) P3.2 INT0 (external interrupt 0) P3.3 INT1 (external interrupt 1) P3.4 T0 (timer 0 extern al input) P3.5 T1 (timer 1 external input) P3.6 WR (external data memory write strobe) P3.7 RD (external data memory read strobe

PROGRAMMING
1. uf1 2. 3. 4. 5. 6. 7. 8. 9. 10. 11. 12. 13. 14. 15. 16. 17. 18. 19. 20. 21. 22. 23. 24. 25. 26. 27. 28. 29. 30. 31. 32. 33. 34. 35. 36. 37. 38. 39. equ 2fh uf2 equ 2eh org 0000h mov 2ah,#32h mov 2bh,#01h mov 2ch,#05h mov 2dh,#01h clr uf1 clr uf2 mov r0,#01h mov p1,#0ffh lop: mov a,p1 cjne a,#0ffh,jump ajmp lop jump: clr p0.0 loop: rrc a jnc num inc r0 sjmp loop num: acall dely setb p0.0 cjne r0,#01h,nxt acall clkwise sjmp over nxt: cjne r0,#02h,nxt2 acall aclkwise sjmp over nxt2: cjne r0,#03h,nxt3 jnb uf1,ledoff setb p0.3 ledoff: acall incrpm sjmp over nxt3: cjne r0,#04h,nxt4 jnb uf1,ledof setb p0.3 ledof: acall decrpm sjmp over

40. 41. 42. 43. 44. 45. 46. 47. 48. 49. 50. 51. 52. 53. 54. 55. 56. 57. 58. 59. 60. 61. 62. 63. 64. 65. 66. 67. 68. 69. 70. 71. 72. 73. 74. 75. 76. 77. 78. 79. 80. 81. 82. 83. 84. 85.

nxt4: of: nxt5: over:

cjne r0,#05h,nxt5 jnb uf2,of setb p0.4 acall incnum sjmp over cjne r0,#06h,over acall decnum mov p2,#0ffh mov p1,#0ffh mov r0,#01h sjmp lop

clkwise: mov r3,2ch rot: clr p0.1 mov p2,#33h acall delay mov p2,#3ch acall delay setb p0.1 mov p2,#0cch acall delay mov p2,#0c3h acall delay djnz r3,rot ret aclkwise: mov r3,2ch rott: clr p0.2 mov p2,#33h acall delay mov p2,#0c3h acall delay setb p0.2 mov p2,#0cch acall delay mov p2,#3ch acall delay djnz r3,rott ret incrpm: clr p0.3 mov r4,2bh

86. 87. 88. 89. 90. 91. 92. 93. 94. 95. 96. 97. 98. 99. 100. 101. 102. 103. 104. 105. 106. 107. 108. 109. 110. 111. 112. 113. 114. 115. 116. 117. 118. 119. 120. 121. 122. 123. 124. 125. 126. 127. 128. 129. 130. 131.

incr:

out:

cjne r4,#0ah,incr setb uf1 ajmp out inc 2bh mov b,2bh mov a,#32h div ab mov 2ah,a acall dely setb p0.3 ret

decrpm: clr p0.3 mov r4,2bh cjne r4,#01h,decr setb uf1 ajmp out1 decr: dec 2bh mov b,2bh mov a,#32h div ab mov 2ah,a acall dely setb p0.3 out1: ret incnum: clr p0.4 inc 2dh mov a,#05h mov b,2dh mul ab mov 2ch,a acall dely setb p0.4 ret decnum: clr p0.4 mov r4,2dh cjne r4,#01h,decn setb uf2 ajmp out2 decn: dec 2dh mov a,#05h mov b,2dh

132. 133. 134. 135. 136. 137. 138. 139. 140. 141. 142. 143. 144. 145. 146. 147. 148. 149. 150. 151. 152. 153. 154. 155. 156. 157. 158. 159.

mul ab mov 2ch,a acall dely setb p0.4 out2: ret delay: mov r1,2ah lp5: mov r2,#0c8h lp4: nop nop nop djnz r2,lp4 djnz r1,lp5 ret dely: mov r6,#0ffh lp2: mov r7,#0c8h lp1: nop nop nop djnz r7,lp1 nop nop djnz r6,lp2 ret end

LIST OF COMPONENTS

COMPONENT LIST
Semiconductors: IC1 IC2 T1, T3, T5, T7 T2, T4, T6, T8 D1-D8 LED1 - 7805 5V regulator - AT89C51 microcontroller - BC548 npn transistors - SL100 npn transistors - 1N4001 rectifier diodes - Red LED (5mm dia.)

Resistors (all -watt, 5% carbon): R1 R2 R3, R5, R7, R9 R4, R6, R8, R10 Capacitors: C1 C2 C3 C4, C5 C6 Miscellaneous: X1 - 230VAC primary to 0-7.5V, 1A secondary step-down transformer - 5V DC stepper motor - 220F, 25V electrolytic - 100F, 16V electrolytic - 10F, 16V electrolytic - 33pF ceramic disk - 100F, 16V electrolytic - 100-ohm - 10-kilo-ohm - 1-kilo-ohm - 470-ohm

COMPONENET DESCRIPTION

COMPONENT DETAIL:-

A.- RESISTOR:-

Resistor and resistive networks are extensively used in electronic circuits and measurement work. The foremost properties of material used in the construction of resistor meant for precision work are: stability or performance with time to resistance temperature co-efficient low thermoelectric emf. With copper high resistively resistance to oxidation corrosion and moisture case of manufacture and low cost.

COLOUR NUMBERS

Resistors, capacitors and other electronic components used in defense equipment, computers, space applications, etc. should be highly reliable and must be capable of stable operation under severe environmental conditions. These are called professional grade components, and they should be superior in characteristics regarding reliability, stability, and close tolerance, wider range of operating temperatures, superior electrical and electronic properties, and capacity to operate under severe environmental conditions.

The materials to achieve these superior characteristics should be chosen very carefully. Dielectric materials used in professional grade components should serve the dual purpose of providing electrical insulation and protection from adverse environmental conditions. We have already elaborated on the materials with superior insulation properties used in resistors and capacitors. The protection against atmospheric influences\ has to be almost perfect, and this is achieved by placing the capacitors in a nonferrous metal can and bringing out the leads through glass to metal seals. The next method in order of preference is encasing in metal cans and using ceramic to metal seals. Further down in priority would be to use metal can with ceramic bushings, or an epoxy free moulded can with epoxy end sealing, or a ceramic can with epoxy end sealing, etc.

B Capacitor:-

A capacitor is a passive electronic component consisting of a pair of conductors separated by a dielectric (insulator). When there is a potential difference (voltage) across the conductors, a static electric field develops in the dielectric that stores energy and produces a mechanical force between the conductors. An ideal capacitor is characterized by a single constant value, capacitance, measured in farads. This is the ratio of the electric charge on each conductor to the potential difference between them.

Capacitors are widely used in electronic circuits for blocking direct currentwhile allowing alternating current to pass, in filter networks, for smoothing the output of power supplies, in the resonant circuits that tune radios to particular frequencies and for many other purposes. The effect is greatest when there is a narrow separation between large areas of conductor, hence capacitor conductors are often called "plates", referring to an early means of construction. In practice the dielectric between the plates passes a small amount of leakage current and also has an electric field strength limit, resulting in a breakdown voltage, while the conductors and leads introduce an undesired inductance and resistance.

C. - LED:-

The LED is primarily a PN junction semiconductor device. The basics mechanism of Electro-magnetic radiation from the devices is injection luminescence (IL) The occurs in two steps i.e. (i) injection of minority carries across the junction and (ii) The radioactive recombination of minority carries when the diode has zero bias under thermal equilibrium condition the space charge of depletion layer potential prevents the cross over of large concentration of mobile conduction band electron & the valance band holes across et junction when a forward bias is applied to the device the magnitude of these potential barrier is reduced making it possible for diffusion of electron and helps across the junction. The minority carries concentrations on both sides to the junction are considerably increased which increased their rate of recombination. This is responsible for electromagnetic radiation.

Advantages:1. LEDs are miniature in size & they can be stacked together to form numeric & alpha numeric displays in high-density matrix. 2. The light output from an LED is a function of the current flowing through it therefore intensity of light emitted from LEDs can be smoothly controlled.

3. LEDs have a high efficiency as emitters of electromagnetic radiation they require moderate power for there operation. A typical voltage drop of 1.2 V and a current of 20mA us required for full brightness. 4. LEDs are available which emit light in different colors like red, green, yellow and amber.

5. The switching time (either on or off) is less than 1ns & therefore they are very useful where dynamic operation of large number of amays in involved. 6. LEDs are rugged and can therefore withstand shocks and vibrations they can be operate over a wide range of temperature says 0-70c.

Disadvantages:LEDs are not suited for large area displays primarily because of their high cost. For large displays devices using gas filled plasma are used.

D.- TRANSISTOR:-

A transistor is a semiconductor device used to amplify and switch electronic signals. It is made of a solid piece of semiconductor material, with at least three terminals for connection to an external circuit. A voltage or current applied to one pair of the transistor's terminals changes the current flowing through another pair of terminals. Because the controlled (output) power can

be much more than the controlling (input) power, the transistor provides amplification of a signal. Today, some transistors are packaged individually, but many more are found embedded in integrated circuits.

Crystal oscillator

A crystal oscillator is an electronic oscillator circuit that uses the mechanical resonance of a vibrating crystal of piezoelectric material to create an electrical signal with a very precise frequency. This frequency is commonly used to keep track of time (as in quartz wristwatches), to provide a stable clock signal for digital integrated circuits, and to stabilize frequencies for radio transmitters and receivers. The most common type of piezoelectric resonator used is the quartz crystal, so oscillator circuits designed around them became known as "crystal oscillators." Quartz crystals are manufactured for frequencies from a few tens of kilohertz to tens of megahertz. More than two billion (2109) crystals are manufactured annually. Most are used for consumer devices such as wristwatches, clocks, radios, computers, and cellphones. Quartz crystals are also found inside test and measurement equipment, such as counters, signal generators, and oscilloscopes.

Integrated Circuits:
An intagrated circuit (I.C.) is a group of components which may include resistors, low value capacitors and transistors printed on a silicon chip. The individual components of the I.C. make up a commonly used circuit. The circuits can range from simple voltage regulators to audio chips for a head unit to a microprocessor for a computer.

Baton switch :
This is a switch for the clockwise rotating, the counterclockwise rotating or making a motorstop, a tactile switch, comprising: a base body; a first stationary contact, provided on the base body; a second stationary contact, provided on the base body; a conductive click spring, disposed over the first stationary contact and the second stationary contact, so as to be always electrically connected to the first stationary contact and so as to be away from the second stationary contact in a neutral position thereof; a push button, including a head portion which is depressed by an operator, and an actuator which pushes the click spring so as to be abutted against the second stationary contact when the head portion is depressed, wherein the head portion and the actuator is integrally formed from rubber having elastic restorability. In this tactile switch, since the head portion and the actuator of the push button for pushing the click spring are formed from rubber having elasticity, an excessive impact caused by pushing operation can be absorbed by the push button itself. Therefore, the click spring is prevented from undergoing an excessive impact so that the lifetime of the click spring is increased. Moreover, deterioration in the quality thereof is prevented. Furthermore, because the head portion and the actuator are formed from rubber, the pushing stroke of the tactile switch is

increased. Thus, a switching operation of the tactile switch can reliably be performed.

IC socket
This is the socket to mount AT89C51.

Transformer
A TRANSFORMER is a device that transfers electrical energy from one circuit to another by electromagnetic induction (transformer action). The electrical energy is always transferred without a change in frequency, but may involve changes in magnitudes of voltage and current. Because a transformer works on the principle of electromagnetic induction, it must be used with an input source voltage that varies in amplitude. There are many types of power that fit this description; for ease of explanation and understanding, transformer action will be explained using an ac voltage as the input source. The alternating current has certain advantages over direct current. One important advantage is that when ac is used, the voltage and current levels can be increased or decreased by means of a transformer. As you know, the amount of power used by the load of an electrical circuit is equal to the current in the load times the voltage across the load, or P = EI. If, for example, the load in an electrical circuit requires an input of 2 amperes at 10 volts (20 watts) and the source is capable of delivering only 1 ampere at 20 volts, the circuit could not normally be used with this particular source. However, if a transformer is connected between the source and the load, the voltage can be decreased (stepped down) to 10 volts and the current increased (stepped up) to 2 amperes. Notice in the above case

that the power remains the same. That is, 20 volts times 1 ampere equals the same power as 10 volts times 2 amperes. In the transformer shown in the cutaway view in figure, the primary consists of many turns of relatively small wire. The wire is coated with varnish so that each turn of the winding is insulated from every other turn. In a transformer designed for highvoltage applications, sheets of insulating material, such as paper, are placed between the layers of windings to provide additional insulation. When the primary winding is completely wound, it is wrapped in insulating paper or cloth. The secondary winding is then wound on top of the primary winding. After the secondary winding is complete, it too is covered with insulating paper. Next, the E and I sections of the iron core are inserted into and around the windings as shown. The leads from the windings are normally brought out through a hole in the enclosure of the transformer. Sometimes, terminals may be provided on the enclosure for connections to the windings. The figure shows four leads, two from the primary and two from the secondary. These leads are to be connected to the source and load, respectively. Basic Operation of a Transformer In its most basic form a transformer consists of: A primary coil or winding. A secondary coil or winding. A core that supports the coils or windings. Refer to the transformer circuit in figure -1 as you read the following explanation: The primary winding is connected to a 60 hertz ac voltage source. The magnetic field (flux) builds up (expands) and collapses (contracts) about the primary winding. The expanding and contracting magnetic field around the primary winding cuts the secondary winding and induces an alternating voltage into the winding. This voltage causes alternating current to flow through the load. The voltage may be stepped up or down depending on the design of the primary and secondary windings.

Basic transformer action

The Components of a Transformer:

Two coils of wire (called windings) are wound on some type of core material. In some cases the coils of wire are wound on a cylindrical or rectangular cardboard form. In effect, the core material is air and the transformer is called an AIR-CORE TRANSFORMER. Transformers used at low frequencies, such as 60 hertz and 400 hertz, require a core of low-reluctance magnetic material, usually iron. This type of transformer is called an IRON-CORE TRANSFORMER. Most power transformers are of the iron-core type. The principle parts of a transformer and their functions are:

The CORE, which provides a path for the magnetic lines of flux. The PRIMARY WINDING, this receives energy from the ac source. The SECONDARY WINDING, which receives energy from the primary winding and delivers it to the load. Core Characteristics:

The composition of a transformer core depends on such factors as voltage, current, and frequency. Size limitations and construction costs are also factors to be considered. Commonly used core materials are air, soft iron, and steel. Each of these materials is suitable for particular applications and unsuitable for others. Generally, aircore transformers are used when the voltage source has a high frequency (above 20 kHz). Iron-core transformers are usually used when the source frequency is low (below 20 kHz). A soft-iron-core transformer is very useful where the transformer must be physically small, yet efficient. The iron-core transformer provides better power transfer than does the air-core transformer. A transformer whose core is constructed of laminated sheets of steel dissipates heat readily; thus it provides for the efficient transfer of power. The majority of transformers you will encounter in Navy equipment contain laminated-steel cores. These steel laminations are insulated with a nonconducting material, such as varnish, and then formed into a core. It takes about 50 such laminations to make a core an inch thick. The purpose of the laminations is to reduce certain losses which will be discussed later in this chapter. An important point to remember is that the most efficient transformer core is one that offers the best path for the most lines of flux with the least loss in magnetic and electrical energy.

LCD DISPLAY
A liquid crystal display (LCD) is a flat panel display, electronic visual display, or video display that uses the light modulating properties of liquid crystals. Liquid crystals do not emit light directly. LCDs are available to display arbitrary images (as in a general-purpose computer display) or fixed images which can be displayed or hidden, such as preset words, digits, and 7-segmentdisplays as in a digital clock. They use the same basic technology, except that arbitrary images are made up of a large number of small pixels, while other displays have larger elements. LCDs are used in a wide range of applications including computer monitors, televisions, instrument panels, aircraft cockpit displays, and signage. They are common in consumer devices such as video players, gaming devices, clocks, watches, calculators, and telephones, and have replaced cathode ray tube (CRT) displays in most applications. They are available in a wider range of screen sizes than CRT and plasma displays, and since they do not use phosphors, they do not suffer image burn-in. LCDs are, however, susceptible to image persistence.[1] The LCD is more energy efficient and can be disposed of more safely than a CRT. Its low electrical power consumption enables it to be used in batterypowered electronic equipment. It is an electronically modulated optical device made up of any number of segments filled with liquid crystals and arrayed in front of a light source (backlight) or reflector to produce images in color or monochrome. Liquid crystals were first developed in 1888

PCB IMPLEMENTION

P.C.B. MANUFACTURING PROCESS

It is an important process in the fabrication of electronic equipment. The design of PCBs (Printed Circuit Boards) depends on circuit requirements like noise immunity, working frequency and voltage levels etc. High power PCBs requires a special design strategy. The fabrication process to the printed circuit board will determine to a large extent the price and reliability to the equipment. A common target aimed is the fabrication of small series of highly reliable professional quality PCBs with low investment cost. The target becomes especially important for custom tailored equipment in the area of industrial electronics.
The layout of a PCB has to incorporate all the information of the board before one can go on the artwork preparation. This means that a concept, that clearly defined all the details of the circuit and partly also of the final equipment is prerequisite before the actual lay out can start. The detailed circuit diagram is very important for the layout designer but he must also be familiar with the design concept and with the philosophy behind the equipment.

BOARD TYPES:
The two most popular PCB types are: 1. Single Sided Boards The single sided PCBs are mostly used in entertainment electronics where manufacturing costs have to be kept at a minimum. However in industrial electronics cost factors cannot be neglected and single sided boards should be used wherever a particular circuit can be accommodated on such boards.

2. Double Sided Boards Double-sided PCBs can be made with or without plated through holes. The production of boards with plated through holes is fairly expensive. Therefore plated through holes boards are only chosen where the circuit complexities and density does not leave any other choice. DESIGN SPECIFICATION (I) STEP TAKEN WHILE PREPARING CIRCUIT (A) PCB DESIGNING
The main purpose of printed circuit is in the routing of electric currents and signal through a thin copper layer that is bounded firmly to and insulating base material some time called the substrate. This base is manufactured with an integral bounded layers of thin copper foil which has to be partly etched of other wise remove to arrive at a pre designed pattern to suite the circuit connections or whatever other application is noted.

The term printed circuit board is derived from the original method where by a printed pattern is used as the mask over wanted areas of copper. The PCB provides an ideal baseboard upon which to assemble and hold firmly most of the small components. From the constructors point of view, the main attraction of using PCB is its role as the mechanical support for small components. There is less need for complicate and time consuming metal work of chassis contraception except perhaps in providing the final enclosure. Most straight forward circuit designs can be easily covered in to printed wiring layer the thought required to carry out the inversion cab footed high light an possible error that would otherwise be missed in conventional point to point wiring .The finished project is usually neater and truly a work of art. Actual size PCB layout for the circuit shown is drawn on the copper board. The board is then immersed in FeCl3 solution for 12 hours.

In this process only the exposed copper portion that is etched out by the solution. Now the petrol washes out the paint. Now the copper layout on PCB is rubbed with a smooth sand paper slowly and lightly such that only the oxide layers over the Cu is removed. Now the holes are drilled at the respective places according to component layout as shown in figure. (B) LAYOUT DESIGN:
When designing the layout one should observe the minimum size (component body length and weight). Before starting to design the layout we need all the required components in hand so that an accurate assessment of space can be made. Other space consideration might also include from case of mounted components over the printed circuit board or to access path to present components.

It might be necessary to turn some components round to a different angular position so that terminals are closer to the connections of the components. The scale can be checked be positioning the components on the squared paper. If any connection crosses, then one can reroute to avoid such condition. All common or earth lines should ideally be connected to a common line routed around the perimeter of the layout. This will act as the ground plane. If possible try to route the outer supply line to the ground plane. If possible try to route the other supply lines around the opposite edge of the layout to through the center. The first set is tearing the circuit to eliminate the crossover without altering the circuit detail in any way. Plan the layout looking at the topside to this board. First this should be translated inverse later for the etching pattern large areas rate recommended to maintain good copper adhesive it is important to bear in mind always that copper track width must be according to the recommended minimum dimensions and allowance must be made for increased width where termination holes are needed. From this aspect, it can become little tricky to negotiate the route to connect small transistors. There are basically two ways of copper interconnections pattern in the under side to the board. The first is the removal of only the amount

of copper necessary to isolate the junction to the components to each other resulting in the large areas of copper. The second is to make the interconnection pattern looking more like conventional point wiring by routing uniform width of copper from component to component. (C) ETCHING PROCESS: Etching process requires the use of chemicals acid resistant dishes and running water supply. Ferric chloride is mostly used solution but other etching materials such as ammonium per sulphate can be used. Nitric acid can be used but in general it is not used due to poisonous fumes. The pattern prepared is glued to the copper surface of the board using a latex type of adhesive that can be cubed after use. The pattern is laid firmly on the copper using a very sharp knife to cut round the pattern carefully to remove the paper corresponding to the required copper pattern areas. Then apply the resist solution, which can be a kind of ink proportion for the purpose of maintaining smooth clean outlines as far as possible. While the board is drying, test all the components.
Before going to next stage, check the whole pattern and cross check against the circuit diagram. Check for any free metal on the copper. The etching bath should be in a glass or enamel disc. If using crystal of ferric- chloride these should be thoroughly dissolved in water to the proportional suggested. There should be 0.5 lt. of water for 125 gm of crystal.

Waste liquid should be thoroughly deflated and dried in water land. Never pour down the drain. To prevent particles of copper hindering further etching, agitate the solutions carefully by gently twisting or rocking the tray. The board should not be left in the bath a moment longer than is needed to remove just the right amount of copper. Inspite of there being a resistive coating there is no protection against etching away through exposed copper edges. This leads to over etching. Have running water ready so that etched board can be removed properly and rinsed. This will halt etching immediately.

Drilling is one of those operations that calls for great care. For most purposes a 1mm drill is used. Drill all holes with this size first those that need to be larger can be easily drilled again with the appropriate larger size. (D) COMPONENT ASSEMBLY: From the greatest variety of electronic components available, which runs into thousands of different types it is often a perplexing task to know which is right for a given job. There could be damage such as hairline crack on PCB. If there are, then they can be repaired by soldering a short link of bare copper wire over the affected part. The most popular method of holding all the items is to bring the wires far apart after they have been inserted in the appropriate holes. This will hold the component in position ready for soldering. Some components will be considerably larger .So it is best to start mounting the smallest first and progressing through to the largest. Before starting, be certain that no further drilling is likely to be necessary because access may be impossible later. Next will probably be the resistor, small signal diodes or other similar size components. Some capacitors are also very small but it would be best to fit these after wards. When fitting each group of componets mark off each one on the components as it is fitted and if we have to leave the job we know where to recommence.
Although transistors and integrated circuits are small items there are good reasons for leaving the soldering of these until the last step. The main point is that these components are very sensitive to heat and if subjected to prolonged application of the soldering iron, they could be internally damaged.

All the components before mounting are rubbed with sand paper so that oxide layer is removed from the tips. Now they are mounted according to the component layout.

(D)

SOLDERING: -

This is the operation of joining the components with PCB after this operation the circuit will be ready to use to avoid any damage or fault during this operation following care must be taken.

1. A longer duration contact between soldering iron bit & components lead can exceed the temperature rating of device & cause partial or total damage of the device. Hence before soldering we must carefully read the maximum soldering temperature & soldering time for device. 2. The wattage of soldering iron should be selected as minimum as permissible for that soldering place. 3. To protect the devices by leakage current of iron its bit should be earthed properly. 4. We should select the soldering wire with proper ratio of Pb & Tn to provide the suitable melting temperature. 5. Proper amount of good quality flux must be applied on the soldering point to avoid dry soldering

PCB Layout

Application
The use of these systems is recognized and accepted as standard practice in community, hospital and mail service pharmacies It reduce the stress and work imposed on physicians and nurses who are managing patients with unstable hemodynamic conditions. These personnel will be able to spend more time on other patient-related activities, thereby improving the quality of patient care Patients who may otherwise be unable to take medication may benefit from new electronic implants capable of dispensing drugs automatically. However, researchers warn of security risks.

ADVANTAGES

It reduce the stress and work imposed on physicians and nurses who are managing patients with unstable hemodynamic conditions. These personnel will be able to spend more time on other patientrelated activities, thereby improving the quality of patient care Such devices will include built-in sensors that allow health care workers to monitor pulse rate, blood oxygen levels and other functions
automated drug-delivery systems will be especially beneficial for people with physical or mental disabilities, who would otherwise be unable to take medications on their own.

The main advantage is that is not bulky.

DISADVANTAGES

Drug dosing is a very critical and challenging step that needs to be correctly monitored and prescribed by the doctor. The main demerits of this system is that needle condition must be checked before use and must be replaced if required. It has limited diease utility,it can be used only for diabetic

PROBLAM FACED & RECOVERY

As we know a disease that effect internal part of body & is causes by the inability to make insulin, an important Harmon are regulated glucose. The current electromechanical drug delivery which is available is not provide a continuous flow rate and extremely expensive. This pump injects insulin at time interval through a hypodermic needle around domen region. However our Clint dissatisfy with current pump. Thus it is required a device that can be disposable, small and efficient. To overcome this difficulty, we use AUTOMATIC DRUG DELIVERY SYSTEM which delivers solution at constant rates for a period 8 to 14 hours. The main advantage is that is not bulky. Thus it must be user friendly an average person must be able to use this pump with ease. Thats why; we will take this project because it is more convenient than current pumps.

Limitation
Each and every task done has some limitation & this project to have some but instead of taking them as failures and sitting back, it should be taken as a scope to improve and analyze in a better way. So some of them are: The main demerits of this system is that needle condition must be checked before use and must be replaced if required. It has limited diease utility,it can be used only for diabetic

CONCLUSION

At the fag end of the project we feel that the whole working period was a great learning experience due to a number of friendly & unfriendly encounters with various situations. We also came across a lot of new concepts making our learning a value addition. The project is only a demonstration of a system that can be developed into a full scale commercial utility for modern day scientific as well as corporate requirements.

THANK YOU

BIBLIOGRAPHY
ELECTRONICS & COMMUNICATIONS ENGINEERING:

ELECTRONIC DEVICES AND CIRCUIT THEORY BY:- ROBERT L. BOYLESTAD PRINCIPLES OF COMMUNICATION SYSTEMS BY:- TAUB SCHILLING PROGRAMING IN C BY:-ROBERT LAFORE

A TEXT BOOK OF ELECTRICAL ENGINEERING VOL:IV BY:-B L THERAJA UP TO DATE C-MOS DATA & COMPARISION TABLE

REFERENCE FOR ARTICLES & TECHNICAL INFORMATION ON LOCAL POSITIONING SYSTEM FROM FOLLOWING SITES:

http://www.yahoo.com (yahoo search engine) http://www.google.com (Google search engine) http://www.national.com/pf/CD/CD4066.html http://www.fairchildsemi.com/pf/1N/1N4007.html http://www.ascom.com http://www.dzu.inetg.bg/dzu/telecom.htm http://www.electricomconsulting.co.uk/overview.html http://www.electronicprojects.com REFERENCE FROM DOWNLOADED FILES OF FOLLOWING URL: FOR DIODE SPECIFICATIONS: http://www.fairchildsemi.com/ds/1N/1N4007.pd