COMSOL Multiphysics The MEMS Module

Jarmo Ritola COMSOL 3. June 2008

Contents
What is the MEMS Module? What is MEMS? Application areas of the the MEMS Module

FSI sensor

Physics and application modes covered by the MEMS Module What can you do, and how do you work with the MEMS Module application modes?

What is the MEMS Module?

The MEMS Module is an add-on to COMSOL Multiphysics Collection of additional tools for modeling MEMS devices, microfluidics systems, and physics phenomena common to MEMS Collection of MEMS-specific modeling examples The MEMS Module seamlessly integrates with all other COMSOL products
COMSOL Multiphysics and all other modules Material Library COMSOL Script (incl. Signals and Systems Lab, Optimization Lab) Reaction Engineering Lab CAD Import module

What is MEMS?
MEMS is short for
Micro: in the microscale Electro: electromagnetic phenomena Mechanical: moving or deforming parts Systems: all in the same device

MEMS in COMSOL Multiphysics

Modeling of microscale devices and physics that affect their operation Structural mechanics Piezoelectric effects Electrostatic fields Microfluidics with electrokinetic effects and reactions

Applications From Single Physics

Structural

Electrical Fluid flow

to Multiphysics Applications
Structural

Fluid flow

Electrical

Transport

Thermal

MEMS Module Application Fields

Structural mechanics, Electrical fields, Microfluidics Electro-mechanical
Electrostatic actuation Piezoelectric effect Piezoresistive effect Resistive heating Temperature dependent electric material properties Thermal expansion Thermo-elastic damping

Fluid-structure
Solid-fluid interaction Solid-pressure coupling Buoyancy, temperature dependent material properties Electroosmosis, electrophoresis, dielectrophoresis, Surface reactions

Fluid-thermal

Electro-thermal

Electrokinetic

Thermo-mechanical

Fluid-chemical

Electro-thermo-mechanical

Electro-thermo-mechano-fluidic

Work Flow
Model Navigator Geometry Physics settings Solve the model Post processing

Space dimension

Add several modes to the model

Application mode and analysis type

Geometry Modeling
Use the built-in CAD tool of the COMSOL Multiphysics Import your CAD-files into the model Use SolidWorks Live Interface Use COMSOL Script to automate geometry generation Details of the geometry form the basis for successful analysis

Subdomain Settings
Define material with application specific user interfaces

Material models Material library Coordinate systems

Boundary, Edge and Point Settings

Define settings on all domain levels with application specific user interfaces
Constraint condition Define groups

Boundary selection

Properties and Settings

Application mode properties
Tune application mode operation

Coupling variables
Integration, multigeometry couplings,

Global equations
ODEs, import Spice net list, control equations,

Solver settings
Tune solver operation for best operation in multiphysics applications

Postprocessing and Visualization

The Inkjet model

The MEMS Module Application Modes

Structural Mechanics Application Modes

Continuum Mechanics
No simplifying assumptions Stress strain relation applied directly to the material Plane Stress, Plane Strain, Axial symmetry and 3D formulations

Several Material models available

Isotropic, orthotropic, anisotropic, elastoplastic hyperelastic, nearly incompressible formulation

Coordinate systems define material orientation Thermal expansion, Loads Initial stress and strain effects Large deformation (geometrical nonlinearity), stress stiffening

Structural Mechanics Application Modes

Several analysis types available
Static, Frequency response, eigenfrequency, parametric, . You can run several tests on the model by simply changing the analysis type

Structural damping
time dependent, frequency response, damped eigenfrequency

Contact and friction analysis Follower loads Perfectly Matched Layers (PMLs)

Model: Prestressed Micromirror

Introduction
During the manufacturing process materials may gain either compressive or tensile residual stress, which will affect the operation of any MEMS Device Residual stress can also be an intended property Using a parametric analysis this model studies the deformation of a micromirror for different prestress levels

Model Definition
Tensile stress (blue) Fixed

Fixed

Compressive stress (red)

Physics Settings
Compressive stress

Solver Parameters

Sweep variable and the parameter list

Results

Film Damping Application Mode

The modified Reynolds equation models the damping effect of a thin gas film that surrounds a vibrating object. Formulation for slide film damping and squeezes film damping Special relative flow rate coefficients allow modeling of applications where continuum assumption does not hold Time dependent and Frequency response analysis Predefined coupling: Structural with film damping.

Model: MEMS Gyroscope

Introduction
This is a 3D model of a MEMS gyroscope. The quantity of interest is the Q factor, which is a measure of the ratio of stored energy to energy lost per cycle. To calculate the Q factor, the eigenfrequency solver is used. The Q factor can be calculated from the eigenvalue according to:

Model Definition
Applied load in x-direction

Fixed Fluid damping on underside of device

Physics Settings

Work with predefined groups

Results
A sharp resonance peak is observed at 4.338x105Hz.

Results
Plot of total displacement for the third eigenvalue.

Piezoelectric Application Modes

Fully coupled piezoelectric equations for linear piezoelectricity Direct and inverse effects Stress-Charge and Strain-charge formulations Several analysis types
Static, time dependent analysis, frequency response, eigenfrequency and damped eigenfrequency

Structural damping

Piezoelectric Application Modes

Piezo-component modeling
Piezoelectric material Decoupled isotropic and anisotropic structural and electrical material

Static and time-harmonic electric fields Floating potential boundary condition for floating electrodes Compatibility with Structural Mechanics and AC/DC Module application modes Applications: BAW and SAW resonators, ultrasonic transducers, piezoelectric actuators and sensors,

Model: Piezoelectric Effects

Introduction
This is a 3D model of a piezoelectric transducer. Piezoelectric materials have a strong two-way coupling between electrostatics and structural mechanics. The model allows us to determine the eigenfrequencies of the structure. Extruded meshes are used to keep the number of degrees of freedom to a minimum.

Model Definition
Adhesive (green) Aluminum (blue)

Piezoelectric material

0.5V

Ground

Physics Settings

Use Material model to define Piezoelectric or Decoupled material

Results
Plot of mechanical displacement at a frequency of 1.06e5Hz.

Results
Plot of the absolute value of the susceptance of the transducer. Peaks indicate the eigenfrequencies.

Electrostatics Application Mode

Solves the electric field and electric potential distribution in non-conducting media Three constitutive formulations Infinite elements allow approximation of infinite domains Electromagnetic force and torque calculations Several boundary conditions, with
Port boundary condition to compute the capacitance matrix Floating potential condition for floating conductors (electrodes)

Model: ALE Cantilever Beam

Introduction
This is a 3D model of a cantilever beam. The model uses electrostatics, structural mechanics and moving mesh application modes. A potential difference is applied between a ground plate and a beam. This creates an electrostatic force on the beam which leads to deformation of the structure. The moving mesh application mode is used to track the deformation.

Model Definition
Polysilicon beam (blue)

Air box (red)

Electrostatic force cause the deflection of the beam. 56V Ground

Physics Settings

Results
The arrows indicate the electric field, the boundary shows the total displacement of the beam. The beam deflection is approximately half its thickness for an applied voltage of 45V.

Conductive Media CD
Solves the electric current and electric potential distribution in conductive materials: solids or fluids Infinite elements allow approximation of infinite domains Resistive heating and temperature dependent conductivity Several boundary conditions with:
Port condition to compute the impedance matrix Floating potential for floating electrodes Circuit terminal for easier connection to Spice network Periodic condition

Model: Microresistor Beam

Model Geometry

Upper surfaces are free

Surface attached to the base of the device

Problem Definition, Electric Current

DC current balance for conductive media

Fixed potentials to generate a potential difference V

Physics Settings

Temperature dependent conductivity

Problem Definition, Thermal Analysis

Convection conditions flux out: h*(T-Tamb)

Inside the material: Thermal flux balance with the electric heating as source: Q = s|V|2

Fixed temperature T0

Physics Settings

Resistive heating

Problem Definition, Structural Analysis

Force balance with the thermally induced stress as volume load

Fixed to the base plate

Physics Settings

Thermal expansion

Results, Electric Potential Distribution

Potential profile [V]

Results, Temperature Field

Maximum temperature

Results, Deformation

Fluid Flow Modeling, Single Phase, Laminar

Several application modes for modeling of laminar flow Navier-Stokes and Stokes equations Incompressible and weakly compressible formulations Microscale effects
Electroosmotic flow Viscous slip (viscous non-continuum effect) Thermal creeping flow Laminar inflow/outflow

Artificial Diffusion methods improved convergence

Allows linear-element multigrid hierarchy for large models

Model: Electroosmotic Micropump

Model Definition
Gel anode (salt bridge) Inlet + + + Modeled geometry Outlet

One wide channel 800 m Stack of thin channels

Gel cathode (salt bridge)

Subdomain Settings

Boundary Settings

Results

Fluid Flow Modeling, Two-phase Flow

The Level Set method
Solves the interface between two fluids

Fully integrated with all laminar flow application modes

Level Set Two-Phase Flow, Laminar

Applications
capillary flow, droplets ink-jets, self assembly of microparts,

Model: Capillary Flow

Model Definition
This model investigates how the surface tension drives the fluid up into the vertical capillary

Air Wetting angle,

Water Axial symmetry, r = 0

Physics Settings
Define properties for the two fluids

Results

Transport Modeling
Transport of diluted species within fluid flow
Convection and Diffusion Flow with Species Transport, predefined coupling for easier flow and transport modeling

Transport of charged particles under applied electric field and fluid flow
Electrokinetic Flow

Connection to the Reaction Engineering Lab

Design the reaction equations in the Reaction Engineering Lab Export equations to COMSOL Multiphysics Solve the transport problem in the true geometry

Model: Separation in Micro H-cell

Model Definition
Coupled flow and mass transfer This model studies transport of species with different diffusivity
Separation of species Transport from inlet A to Outlet B Inlet B, c = 0 Outlet B

Outlet A Inlet A, c = c0

Physics Settings
Concentration dependent viscosity

Fluid velocity

Results

Predefined Couplings
Structural with Film damping Structural with Thermal expansion Fluid-Structure interaction Electroosmotic flow Flow with species transport Joule heating Each module provides additional predefined couplings You can couple any application modes with each other

MEMS Related Features

COMSOL: Deformed Mesh (ALE)
Geometry effects in electrostatic fields (capacitance, pull-in), fluid-structure interaction,

COMSOL: Heat transfer by conduction

Thermal effects in solids, thermoelastic damping, resistive heating effects,

COMSOL: Heat transfer by convection and conduction

Joule heating, thermo-electrokinetic effects,

AC/DC Module: Time harmonic electric currents

Time harmonic electric fields in electrolytes: AC-electoosmosis, dielectrophoresis,

COMSOL Script
Save your model as m-file and run parametric analyses of geometry, material parameters,

Thank You!