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The Base Material of PCB Board Today we mainly introduce Multilayer PCB board material: Resin copper-clad (RCC)

Resin copper-clad(RCC) Definition: RCC is electrolytic copper foil in very thin thickness (generally no more t han 18 um) precision of coarsening surface coated with a layer or two layers of specia l epoxy resin or other high performance resin (resin thickness generally 60-80 - um), the solvent was taken off by the oven drying, resin off half solid piece reach B order f orm. During the production process of HDI multilayer board, RCC replace the traditio nal coherence slice and the role of the copper foil, conductive as insulating medium la yer, not mechanical drilling technology can be used (usually a laser into a hole and ot her new technology) microporous formation, achieve electrical connection, so as to re alize the high density of PCB.
The constitute of RCC RCC: of RCC is coating a layer of high performance resin composite material which can meet spe cific performance requirements on Ultra-thin coarsening surface of copper foil, and then to be half cured in oven, 1 On the coarsening surface, it will form a layer of resin with uniformity thicknedd on copper f oil. Base material common performance indicators: TG temperature Glass transition temperature (Tg) 1 At present, the Tg value for FR-4 is usually 130-140 degrees, however in the PCB production process, there are a few process which will over this range, this will bring certain influence to the performance of final product. Therefore, Improving Tg degree is one of a main method for improving heat resisting property of FR4

One of the important means is improving the link density of curing system or increa sing the content of aromatic base in resin formula. In general FR - 4 resin formula, int roduced in part three functional groups and multi-function of epoxy resin and introduc tion of some phenolic type epoxy resin, increase the Tg value to around 160-200 degr ees. High-performance plank: CAF resistance plate CAF resistance plate With the rapid development of electronic industry, electronic products are light, thin, s hort, small, and the PCB hole spacing and line spacing becomes smaller and smaller, l ine is becoming more and more close, so that the ion migration resistance performanc e of the PCB is becoming more and more attention. Ion migration (Conductive Anodic Filament (CAF), was first discovered by researchers at bell LABS in 1955, it refers to metal ions under the action of electric field in non-metallic medium the electro-migrat

ion of chemical reaction, the circuit to form a Conductive path between the anode and cathode and cause short circuit. Wonderful PCB T +86-755-86229518-866 | Emial: | | Skype: wonderfulpcb11