DIM600DCM17-A000

DIM600DCM17-A000
IGBT Chopper Module

DS5491-4.0 April 2003

FEATURES KEY PARAMETERS

■ 10µs Short Circuit Withstand
VCES 1700V
VCE(sat) (typ) 2.7V
■ High Thermal Cycling Capability IC (max) 600A
■ Non Punch Through Silicon IC(PK) (max) 1200A
■ Isolated MMC Base with AlN Substrates

APPLICATIONS
■ Choppers 1(E1) 2(C2)
5(E1)
■ Motor Controllers
■ Traction Drives 6(G1)

The Powerline range of modules includes half bridge,

7(C1)
chopper, dual and single switch configurations covering voltages
from 600V to 3300V and currents up to 2400A. 3(C1) 4(E2)
The DIM600DCM17-A000 is a 1700V, n channel
enhancement mode insulated gate bipolar transistor (IGBT)
chopper module. The IGBT has a wide reverse bias safe
operating area (RBSOA) plus full 10µs short circuit withstand. Fig. 1 Chopper circuit diagram
This module is optimised for traction drives and other
applications requiring high thermal cycling capability.
The module incorporates an electrically isolated base plate
and low inductance construction enabling circuit designers to
optimise circuit layouts and utilise grounded heat sinks for safety.

ORDERING INFORMATION
Order As:
DIM600DCM17-A000
Note: When ordering, please use the whole part number.

Outline type code: D

(See package details for further information)

Fig. 2 Electrical connections - (not to scale)

Caution: This device is sensitive to electrostatic discharge. Users should follow ESD handling procedures. 1/10
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DIM600DCM17-A000

ABSOLUTE MAXIMUM RATINGS - PER ARM

Stresses above those listed under 'Absolute Maximum Ratings' may cause permanent damage to the device. In extreme
conditions, as with all semiconductors, this may include potentially hazardous rupture of the package. Appropriate safety precautions
should always be followed. Exposure to Absolute Maximum Ratings may affect device reliability.
Tcase = 25˚C unless stated otherwise

Symbol Parameter Test Conditions Max. Units

VCES Collector-emitter voltage VGE = 0V 1700 V

VGES Gate-emitter voltage - ±20 V

IC Continuous collector current Tcase = 70˚C 600 A

IC(PK) Peak collector current 1ms, Tcase = 105˚C 1200 A

Pmax Max. transistor power dissipation Tcase = 25˚C, Tj = 150˚C 4630 W

I2t Diode I2t value (IGBT arm) VR = 0, tp = 10ms, Tvj = 125˚C 120 kA2s

Diode I2t value (Diode arm) 120 kA2s

Visol Isolation voltage - per module Commoned terminals to base plate. AC RMS, 1 min, 50Hz 4000 V

QPD Partial discharge - per module IEC1287. V1 = 1500V, V2 = 1100V, 50Hz RMS 10 pC

2/10 Caution: This device is sensitive to electrostatic discharge. Users should follow ESD handling procedures.
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 DIM600DCM17-A000

THERMAL AND MECHANICAL RATINGS

Internal insulation material: AlN
Baseplate material: AlSiC
Creepage distance: 20mm
Clearance: 10mm
CTI (Critical Tracking Index): 175

Symbol Parameter Test Conditions Min. Typ. Max. Units

Rth(j-c) Thermal resistance - transistor (per arm) Continuous dissipation - - - 27 ˚C/kW

junction to case

Rth(j-c) Thermal resistance - diode (IGBT arm) Continuous dissipation - - - 40 ˚C/kW

Thermal resistance - diode (Diode arm) junction to case - - 40 ˚C/kW

Rth(c-h) Thermal resistance - case to heatsink Mounting torque 5Nm - - 8 ˚C/kW

(per module) (with mounting grease)

Tj Junction temperature Transistor - - 150 ˚C

Diode - - 125 ˚C

Tstg Storage temperature range - –40 - 125 ˚C

- Screw torque Mounting - M6 - - 5 Nm

Electrical connections - M4 - - 2 Nm

Electrical connections - M8 - - 10 Nm

Caution: This device is sensitive to electrostatic discharge. Users should follow ESD handling procedures. 3/10
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DIM600DCM17-A000

ELECTRICAL CHARACTERISTICS
Tcase = 25˚C unless stated otherwise.

Symbol Parameter Test Conditions Min. Typ. Max. Units

ICES Collector cut-off current VGE = 0V, VCE = VCES - - 1 mA

VGE = 0V, VCE = VCES, Tcase = 125˚C - - 20 mA

IGES Gate leakage current VGE = ±20V, VCE = 0V - - 4 µA

VGE(TH) Gate threshold voltage IC = 30mA, VGE = VCE 4.5 5.5 6.5 V

VCE(sat) Collector-emitter saturation voltage VGE = 15V, IC = 600A - 2.7 3.2 V

VGE = 15V, IC = 600A, , Tcase = 125˚C - 3.4 4.0 V

IF Diode forward current DC - - 600 A

IFM Diode maximum forward current tp = 1ms - - 1200 A

VF Diode forward voltage (IGBT arm) IF = 600A - 2.0 2.3 V

Diode forward voltage (Diode arm) - 2.0 2.3 V

Diode forward voltage (IGBT arm) IF = 600A, Tcase = 125˚C - 2.1 2.4 V

Diode forward voltage (Diode arm) - 2.1 2.4 V

Cies Input capacitance VCE = 25V, VGE = 0V, f = 1MHz - 45 - nF

Cres Reverse transfer capacitance VCE = 25V, VGE = 0V, f = 1MHz - 3.8 - nF

LM Module inductance - per arm - - 20 - nH

RINT Internal transistor resistance - per arm - - 0.27 - mΩ

SCData Short circuit. ISC Tj = 125˚C, VCC = 1000V, I1 2780 - A

tp ≤ 10µs, VCE(max) = VCES – L*. di/dt I2 2400 - A

IEC 60747-9

Note:
L* is the circuit inductance + LM

4/10 Caution: This device is sensitive to electrostatic discharge. Users should follow ESD handling procedures.
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 DIM600DCM17-A000

ELECTRICAL CHARACTERISTICS
Tcase = 25˚C unless stated otherwise

Symbol Parameter Test Conditions Min. Typ. Max. Units

td(off) Turn-off delay time IC = 600A - 1200 - ns

tf Fall time VGE = ±15V - 140 - ns

EOFF Turn-off energy loss VCE = 900V - 190 - mJ

td(on) Turn-on delay time RG(ON) = RG(OFF) = 3.3Ω - 250 - ns

tr Rise time L ~ 100nH - 250 - ns

EON Turn-on energy loss - 220 - mJ

Qg Gate charge - 6.8 - µC

Qrr Diode reverse recovery charge Diode arm IF = 600A, - 370 - µC

IGBT arm VR = 50% VCES, - 150 - µC

Irr Diode reverse recovery current Diode arm dIF/dt = 3000A/µs - 800 - A

IGBT arm - 350 - A

Erec Diode reverse recovery energy Diode arm - 250 - mJ

IGBT arm - 100 - mJ

Caution: This device is sensitive to electrostatic discharge. Users should follow ESD handling procedures. 5/10
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DIM600DCM17-A000

ELECTRICAL CHARACTERISTICS
Tcase = 125˚C unless stated otherwise

Symbol Parameter Test Conditions Min. Typ. Max. Units

td(off) Turn-off delay time IC = 600A - 1500 - ns

tf Fall time VGE = ±15V - 170 - ns

EOFF Turn-off energy loss VCE = 900V - 270 - mJ

td(on) Turn-on delay time RG(ON) = RG(OFF) = 3.3Ω - 400 - ns

tr Rise time L ~ 100nH - 250 - ns

EON Turn-on energy loss - 350 - mJ

Qrr Diode reverse recovery charge Diode arm IF = 600A, - 650 - µC

IGBT arm VR = 50% VCES, - 250 - µC

Irr Diode reverse recovery current Diode arm dIF/dt = 3000A/µs - 900 - A

IGBT arm - 400 - A

Erec Diode reverse recovery energy Diode arm - 380 - mJ

IGBT arm - 150 - mJ

6/10 Caution: This device is sensitive to electrostatic discharge. Users should follow ESD handling procedures.
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 DIM600DCM17-A000

TYPICAL CHARACTERISTICS

1200 1200
Common emitter. Common emitter.
1100 Tcase = 25˚C 1100 Tcase = 125˚C
Vce is measured at power busbars Vce is measured at power busbars
1000 and not the auxiliary terminals 1000 and not the auxiliary terminals
900 900
Collector current, IC - (A)

Collector current, IC - (A)

800 800

700 700

600 600
500 500
400 400
300 300

200 VGE = 20V VGE = 20V

200
15V 15V
100 12V 100 12V
10V 10V
0 0
0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 5.5 6
Collector-emitter voltage, Vce - (V) Collector-emitter voltage, Vce - (V)

Fig. 3 Typical output characteristics Fig. 4 Typical output characteristics

450 1600
Conditions:
Vce = 900V
400 T = 125°C 1400
c
Rg = 3.3 Ohms Tj = 25˚C
350
1200
Switching energy - (mJ)

Foward current, IF - (A)

300
1000
Tj = 125˚C
250
800
200
600
150
400
100
Eon 200
50 Eoff
Erec
0 0
0 0.5 1.0 1.5 2.0 2.5 3.0 3.5
0 200 400 600 800 1000
Foward voltage, VF - (V)
Collector current, IC - (A)

Fig. 5 Typical switching energy vs collector current Fig. 6 Diode typical forward characteristics

Caution: This device is sensitive to electrostatic discharge. Users should follow ESD handling procedures. 7/10
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DIM600DCM17-A000

2000 800

1800 700

1600

Reverse recovery current, Irr - (A)

600
1400
Collector current, IC - (A)

500
1200
Chip
1000 400

800 300
Module
600
200
400
Tcase = 125˚C 100
200 Vge = ±15V
Rg(min) = 3.3Ω Tj = 125˚C
0 0
0 400 800 1200 1600 2000 0 400 800 1200 1600 2000
Collector-emitter voltage, Vce - (V) Reverse voltage, VR - (V)

Fig. 7 Reverse bias safe operating area Fig. 8 Diode reverse bias safe operating area

100
Freewheel and 1400
Antiparallel Diode
Transient thermal impedance, Zth (j-c) - (°C/kW )

1200
Transistor
DC collector current, IC - (A)

1000
10

800

600

1
400

1 2 3 4 200
IGBT Ri (˚C/KW) 0.74 5.34 7.52 10.42
τi (ms) 0.12 3.89 47.15 257.21
Freewheel and Ri (˚C/KW) 1.23 9.26 12.96 16.53
Antiparallel Diode τi (ms) 0
0.11 4.24 48.75 256.75 0 20 40 60 80 100 120 140 160
0.1
0.001 0.01 0.1 1 10 Case temperature, Tcase - (˚C)
Pulse width, tp - (s)

Fig. 10 Transient thermal impedance Fig. 11 DC current rating vs case temperature

8/10 Caution: This device is sensitive to electrostatic discharge. Users should follow ESD handling procedures.
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 DIM600DCM17-A000

PACKAGE DETAILS
For further package information, please visit our website or contact your nearest Customer Service Centre. All dimensions in mm, unless
stated otherwise. DO NOT SCALE.

Nominal weight: 1050g

Module outine type code: D

Caution: This device is sensitive to electrostatic discharge. Users should follow ESD handling procedures. 9/10
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POWER ASSEMBLY CAPABILITY
The Power Assembly group was set up to provide a support service for those customers requiring more than the basic
semiconductor, and has developed a flexible range of heatsink and clamping systems in line with advances in device voltages
and current capability of our semiconductors.
We offer an extensive range of air and liquid cooled assemblies covering the full range of circuit designs in general use today.
The Assembly group offers high quality engineering support dedicated to designing new units to satisfy the growing needs of
our customers.
Using the latest CAD methods our team of design and applications engineers aim to provide the Power Assembly Complete
Solution (PACs).

HEATSINKS
The Power Assembly group has its own proprietary range of extruded aluminium heatsinks which have been designed to
optimise the performance of Dynex semiconductors. Data with respect to air natural, forced air and liquid cooling (with flow
rates) is available on request.
For further information on device clamps, heatsinks and assemblies, please contact your nearest sales representative or
Customer Services.

http://www.dynexsemi.com
e-mail: power_solutions@dynexsemi.com

HEADQUARTERS OPERATIONS CUSTOMER SERVICE

DYNEX SEMICONDUCTOR LTD Tel: +44 (0)1522 502753 / 502901. Fax: +44 (0)1522 500020
Doddington Road, Lincoln.
Lincolnshire. LN6 3LF. United Kingdom. SALES OFFICES
Tel: +44-(0)1522-500500 Benelux, Italy & Switzerland: Tel: +33 (0)1 64 66 42 17. Fax: +33 (0)1 64 66 42 19.
Fax: +44-(0)1522-500550 France: Tel: +33 (0)2 47 55 75 52. Fax: +33 (0)2 47 55 75 59.
Germany, Northern Europe, Spain & Rest Of World: Tel: +44 (0)1522 502753 / 502901.
Fax: +44 (0)1522 500020
North America: Tel: (440) 259-2060. Fax: (440) 259-2059. Tel: (949) 733-3005. Fax: (949) 733-2986.

These offices are supported by Representatives and Distributors in many countries world-wide.
© Dynex Semiconductor 2003 TECHNICAL DOCUMENTATION – NOT FOR RESALE. PRODUCED IN
UNITED KINGDOM

Datasheet Annotations:
Dynex Semiconductor annotate datasheets in the top right hard corner of the front page, to indicate product status. The annotations are as follows:-
Target Information: This is the most tentative form of information and represents a very preliminary specification. No actual design work on the product has been started.
Preliminary Information: The product is in design and development. The datasheet represents the product as it is understood but details may change.
Advance Information: The product design is complete and final characterisation for volume production is well in hand.
No Annotation: The product parameters are fixed and the product is available to datasheet specification.

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