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2SJ76, 2SJ77, 2SJ78, 2SJ79

Silicon P-Channel MOS FET

ADE-208-1179 (Z) 1st. Edition Mar. 2001 Application


High frequency and low frequency power amplifier, high speed power switching Complementary pair with 2SK213, 2SK214, 2SK215, 2SK216

Features
Suitable for direct mounting High forward transfer admittance Excellent frequency response Enhancement-mode

Outline

TO-220AB

D G

3 1. Gate 2. Source (Flange) 3. Drain

2SJ76, 2SJ77, 2SJ78, 2SJ79


Absolute Maximum Ratings (Ta = 25C)
Item Drain to source voltage 2SJ76 2SJ77 2SJ78 2SJ79 Gate to source voltage Drain current Body to drain diode reverse drain current Channel dissipation VGSS ID I DR Pch Pch* Channel temperature Storage temperature Note: 1. Value at TC = 25C Tch Tstg
1

Symbol VDSX

Ratings 140 160 180 200 15 500 500 1.75 30 150 45 to +150

Unit V

V mA mA W W C C

Electrical Characteristics (Ta = 25C)


Item Drain to source breakdown voltage 2SJ76 2SJ77 2SJ78 2SJ79 Gate to source breakdown voltage Gate to source voltage Drain to source saturation voltage Forward transfer admittance Input capacitance Reverse transfer capacitance Note: 1. Pulse test V(BR)GSS VGS(on) VDS(sat) |yfs| Ciss Crss Symbol Min V(BR)DSX 140 160 180 200 15 0.2 20 Typ 35 120 4.8 Max 1.5 2.0 Unit V V V V V V V mS pF pF I G = 10 A, VDS = 0 I D = 10 mA, VDS = 10 V*1 I D = 10 mA, VGD = 0 *1 I D = 10 mA, VDS = 20 V*1 VDS = 10 V, ID = 10 mA, f = 1 MHz Test conditions VGS = 2 V, ID = 1 mA

2SJ76, 2SJ77, 2SJ78, 2SJ79


Power vs. Temperature Derating 60 Channel Dissipation Pch (W) Typical Output Characteristics 500 TC = 25C Drain Current ID (mA) 400 4.5 4.0 3.5 300 3.0 2.5 2.0 100 1.5 1.0
VGS = 0.5 V

40

200

20

50 100 Case Temperature TC (C)

150

8 20 4 12 16 Drain to Source Voltage VDS (V)

Typical Output Characteristics 50 TC = 25C Drain Current ID (mA) 40 0.8 30 0.7 0.6 0.5 10 0.4 0.3
0.2
VGS = 0.1 V

Typical Transfer Characteristics 500 VDS = 20 V

1.0 0.9 Drain Current ID (mA)

400
25 25 C 75 = T
C

300

20

200

100

40 100 20 60 80 Drain to Source Voltage VDS (V)

1 3 4 2 5 Gate to Source Voltage VGS (V)

2SJ76, 2SJ77, 2SJ78, 2SJ79


Typical Transfer Characteristics Forward Transfer Admittance yfs (mS) 100 VDS = 20 V 200 100 50 Forward Transfer Admittance vs. Drain Current

Drain Current ID (mA)

80
= 25 25 C T
C

60

75

20 10 5 2 2 TC = 25C VDS = 20 V

40

20

0.8 0.4 1.2 1.6 2.0 Gate to Source Voltage VGS (V)

50 100 200 5 10 20 Drain Current ID (mA)

Forward Transfer Admittance vs. Frequency Forward Transfer Admittance yfs (mS) 500 100

10

TC = 25C VDS = 20 V ID = 10 mA

1.0

0.1 0.05 5 k10 k

100 k 1M 10 M Frequency f (Hz)

50 M

2SJ76, 2SJ77, 2SJ78, 2SJ79


Package Dimensions As of January, 2001
Unit: mm

11.5 MAX 2.79 0.2 10.16 0.2 9.5 8.0 3.6 -0.08
+0.1

4.44 0.2 1.26 0.15

6.4

+0.2 0.1

18.5 0.5

15.0 0.3

1.27

2.7 MAX 14.0 0.5 1.5 MAX

7.8 0.5

0.76 0.1

2.54 0.5

2.54 0.5

0.5 0.1

Hitachi Code JEDEC EIAJ Mass (reference value)

TO-220AB Conforms Conforms 1.8 g

2SJ76, 2SJ77, 2SJ78, 2SJ79


Cautions
1. Hitachi neither warrants nor grants licenses of any rights of Hitachis or any third partys patent, copyright, trademark, or other intellectual property rights for information contained in this document. Hitachi bears no responsibility for problems that may arise with third partys rights, including intellectual property rights, in connection with use of the information contained in this document. 2. Products and product specifications may be subject to change without notice. Confirm that you have received the latest product standards or specifications before final design, purchase or use. 3. Hitachi makes every attempt to ensure that its products are of high quality and reliability. However, contact Hitachis sales office before using the product in an application that demands especially high quality and reliability or where its failure or malfunction may directly threaten human life or cause risk of bodily injury, such as aerospace, aeronautics, nuclear power, combustion control, transportation, traffic, safety equipment or medical equipment for life support. 4. Design your application so that the product is used within the ranges guaranteed by Hitachi particularly for maximum rating, operating supply voltage range, heat radiation characteristics, installation conditions and other characteristics. Hitachi bears no responsibility for failure or damage when used beyond the guaranteed ranges. Even within the guaranteed ranges, consider normally foreseeable failure rates or failure modes in semiconductor devices and employ systemic measures such as failsafes, so that the equipment incorporating Hitachi product does not cause bodily injury, fire or other consequential damage due to operation of the Hitachi product. 5. This product is not designed to be radiation resistant. 6. No one is permitted to reproduce or duplicate, in any form, the whole or part of this document without written approval from Hitachi. 7. Contact Hitachis sales office for any questions regarding this document or Hitachi semiconductor products.

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For further information write to:


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Copyright Hitachi, Ltd., 2000. All rights reserved. Printed in Japan.


Colophon 2.0

This datasheet has been download from: www.datasheetcatalog.com Datasheets for electronics components.

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