BurrBrown Products

from Texas Instruments

_
+
Interface
Logic
Shift
Register
DAC
Register
String
DAC
Power-Down
Logic
Power-On
Reset
V
DD
IOV
DD
V
REF
H
V
FB
V
OUT
V
REF
L GND CLR SDO
SDIN
SYNC
SCLK




















































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V
DD
V H
REF
V L
REF
V
FB
V
OUT
GND
IOV
DD
SDO
SDIN
SCLK
SYNC
CLR
1
2
3
4
5
6
12
11
10
9
8
7
DAC7751
Thermal
Pad
(1)

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SCLK
SYNC
SDIN D15 D14 D13 D12 D11 D1 D0 D15
t
8
t
4
t
3
t
2
t
1
t
7
t
6
t
5
D0
t
9
Input Word n Input Word n+1
Undefined
D15 D14 D0
Input Word n
t
10
SDO
CLR

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1.0
0.5
0
-0.5
-1.0
L
E

(
L
S
B
)
0 512 1024 1536 2048
DigitalInputCode
2560 3072 3584 4096
0.50
0.25
0
-0.25
-0.50
D
L
E

(
L
S
B
)
V =5V,
DD
V H=4.096V,V L=GND
REF REF
1.0
0.5
0
-0.5
-1.0
L
E

(
L
S
B
)
0 512 1024 1536 2048
DigitalInputCode
2560 3072 3584 4096
0.50
0.25
0
-0.25
-0.50
D
L
E

(
L
S
B
)
V =2.7V,
DD
V H=2.5V,V L=GND
REF REF
1.00
0.75
0.50
0.25
0
Z
e
r
o
-
S
c
a
l
e

E
r
r
o
r

(
m
V
)
Free-AirTemperature( C)
-40 -10 20 50 80 105
V =5V
DD
V H=4.096V
REF
V L=GND
REF
1.00
0.75
0.50
0.25
0
Z
e
r
o
-
S
c
a
l
e

E
r
r
o
r

(
m
V
)
Free-AirTemperature( C)
-40 -10 20 50 80 105
V =2.7V
DD
V H=2.5V
REF
V L=GND
REF
0
-0.25
-0.50
-0.75
-1.00
F
u
l
l
-
S
c
a
l
e

E
r
r
o
r

(
m
V
)
Free-AirTemperature( C)
-40 -10 20 50 80 105
V =5V
DD
V H=4.096V
REF
V L=GND
REF
0
-0.25
-0.50
-0.75
-1.00
F
u
l
l
-
S
c
a
l
e

E
r
r
o
r

(
m
V
)
Free-AirTemperature( C)
-40 -10 20 50 80 105
V =2.7V
DD
V H=2.5V
REF
V L=GND
REF

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V =5.5V
DD
V H=4.096V
REF
V L=GND
REF
V =2.7V
DD
V H=2.5V
REF
V L=GND
REF
DACLoadedwith0000h
Typical
0.20
0.15
0.10
0.05
0
O
u
t
p
u
t

V
o
l
t
a
g
e
,

V
(
V
)
O
0 5 10 15
I (mA)
SINK
V
DD
=V
REF
H=5.5V
V L=GND
REF
DACLoadedwithFFFFh
5.5
5.4
5.3
5.2
O
u
t
p
u
t

V
o
l
t
a
g
e
,

V
(
V
)
O
0 5 10 15
I (mA)
SOURCE
V =5.5V
DD
V H=4.096V
REF
V L=GND
REF
V =2.7V
DD
V H=2.5V
REF
V L=GND
REF
Powered,NoLoad
DigitalInputCode
0
250
200
150
100
50
0
I
D
D
(
m
A
)
512 1024 1536 2048 2560 3072 3584 4096
V
DD
=V
REF
H=2.7V
V
REF
L=GND
DACLoadedwithFFFFh
2.7
2.6
2.5
2.4
O
u
t
p
u
t

V
o
l
t
a
g
e
,

V
(
V
)
O
0 5 10 15
I (mA)
SOURCE
V =5.5V
DD
V H=4.096V
REF
V L=GND
REF
V =2.7V
DD
V H=2.5V
REF
V L=GND
REF
Powered,NoLoad
200
150
100
I
(
A
)
m
D
D
-40 -10 20 50 80 110
Free-AirTemperature( C)
175
125
DACPowered,NoLoad
V H=2.5V
REF
V L=GND
REF
V (V)
DD
2.7
110
105
100
95
90
I
D
D
(
m
A
)
3.5 3.1 3.9 4.3 4.7 5.1 5.5

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DigitalInputCode=2048
V =5.5V
DD
V H=4.096V
REF
V L=GND
REF
CurrentConsumption( A) m
128 136 144 152 160 168 176 184 192
2000
1500
1000
500
0
F
r
e
q
u
e
n
c
y

(
H
z
) V =5.5V
DD
V H=4.096V
REF
V L=GND
REF
V =2.7V
DD
V H=2.5V
REF
V L=GND
REF
T =+25 C
A
SCLKInput
AllOtherInput=GND
1600
1200
800
400
0
I
(
A
)
m
D
D
0 1 2 3 4 5
V (V)
LOGIC
DigitalInputCode=2048
V =2.7V
DD
V H=2.5V
REF
V L=GND
REF
CurrentConsumption( A) m
117 124 131 138 145 152 159 166 173
2000
1500
1000
500
0
F
r
e
q
u
e
n
c
y

(
H
z
)
V =5V
DD
V H=4.096V
REF
V L=GND
REF
T =+25 C
A
DigitalInputCode
0
4
2
0
-2
-4
T
o
t
a
l

E
r
r
o
r

(
m
V
)
512 1024 1536 2048 2560 3072 3584 4096
V =5V
DD
V H=4.096V
REF
V L=GND
REF
Power-UpCode=4000
5
4
3
2
1
0
O
u
t
p
u
t

V
o
l
t
a
g
e

(
V
)
Time(4 s/div) m
V =2.7V
DD
V H=2.5V
REF
V L=GND
REF
T =+25 C
A
DigitalInputCode
0
4
2
0
-2
-4
T
o
t
a
l

E
r
r
o
r

(
m
V
)
512 1024 1536 2048 2560 3072 3584 4096

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V =5V
DD
V H=4.096V
REF
V L=GND
REF
5
4
3
2
1
0
O
u
t
p
u
t

V
o
l
t
a
g
e
,

V
(
V
)
O
Time(5 s/div) m
OutputLoadedwith200pFtoGND
Code0041to4055
V =2.7V
DD
V H=2.5V
REF
V L=GND
REF
3
2
1
0
O
u
t
p
u
t

V
o
l
t
a
g
e
,

V
(
V
)
O
Time(5 s/div) m
OutputLoadedwith200pFtoGND
Code0041to4055
Time(400ns/div)
V
(
5
m
V
/
d
i
v
)
O
TriggerPulse
Time(400ns/div)
V
(
5
m
V
/
d
i
v
)
O
TriggerPulse
Time(400ns/div)
V
(
5
m
V
/
d
i
v
)
O
TriggerPulse
V =5.5V
DD
V H=4.096V
REF
V L=GND
REF
f =1MSPS
S
-1dBFSRDigitalInput
MeasurementBandwidth=20kHz
2ndHarmonic
THD
3rdHarmonic
OutputFrequency,Tone(kHz)
0
-40
-50
-60
-70
-80
-90
-100
T
H
D

(
d
B
)
1 2 3 4 5 6 7 8 9 10















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DAC
Register
REF(+)
ResistorString
REF( ) -
V H
REF
V
OUT
50kW
100kW 100kW
V
FB
V L
REF

V
REF
H
V
REF
L
R
R
R
R
V
REF
H V L -
REF
2
R
DIVIDER
ToOutputAmplifier
(2xGain)

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DAC7551
V
REF
H
DAC7551
_
+
V
dac
R2
R1
REF3140
V
REF
V
tail
V
OUT
OPA4130
V
OUT
+V
REF

R2
R1
)1

SDIN
4096
*V
tail

R2
R1

PACKAGING INFORMATION
Orderable Device Status
(1)
Package
Type
Package
Drawing
Pins Package
Qty
Eco Plan
(2)
Lead/Ball Finish MSL Peak Temp
(3)
DAC7551IDRNR ACTIVE USON DRN 12 3000 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
DAC7551IDRNRG4 ACTIVE USON DRN 12 3000 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
DAC7551IDRNT ACTIVE USON DRN 12 250 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
DAC7551IDRNTG4 ACTIVE USON DRN 12 250 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
PACKAGE OPTION ADDENDUM
www.ti.com 8-Dec-2009
Addendum-Page 1
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type
Package
Drawing
Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
(mm)
Pin1
Quadrant
DAC7551IDRNR USON DRN 12 3000 330.0 12.4 2.3 3.3 0.85 4.0 12.0 Q1
DAC7551IDRNT USON DRN 12 250 330.0 12.4 2.3 3.3 0.85 4.0 12.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 8-Dec-2009
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
DAC7551IDRNR USON DRN 12 3000 340.5 338.1 20.6
DAC7551IDRNT USON DRN 12 250 340.5 338.1 20.6
PACKAGE MATERIALS INFORMATION
www.ti.com 8-Dec-2009
Pack Materials-Page 2