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Structural ceramics
Mechanical properties!
Flexural strength!
alumina
liquid phase sintering (SiO2) (purity 80-99%) solid state sintering (purity 99-100%) hot-pressing
f =
KIC c
KIC $ G
flexural strength
silicon nitride
liquid phase sintering (SiO2, Y2O3, Al2O3 ) (purity 90-99%) - SSN hot-pressing (purity 99-100%) - HPSN reaction bonding (Si + NH3) - RBSN
400
800
T (C)
1200
1600
liquid phase sintering (SiO2, Al2O3 ) (purity 90-99%) - SSC hot-pressing (purity 99-100%) - HPSC reaction bonding (Si + CO / C +Si) - RBSC
SiC
silicon carbide
Al2O3
Ceramics and Glasses, Engineered Materials Handbook, vol. 4, ASM international, USA, 2000!
Reaction bonding!
preform (Si powder)
preform (C powder)
liquid Si
Toughening mechanisms
E (10 GPa) 10 Ceramic materials:! E mechanical strength << (100 MPa) 10 absence of plastic deformations at the crack tip KC o GC limited!
theoretical strength
defects (c)
mechanical strength K f = IC c
microstructure (KIC)
KC constant!
f2
KC increasing with c !
f1
f
KC (c)
KC2 KC1
stable growth!
f1
c00.5 c0.5 c00.5 c0.5
f depending on c
f independent from c
R- or T-curve effect
Thoughening mechanisms
(a) process zone (frontal wake)
weakening of the material in front of the crack tip
s volume fraction of toughening agent dislocations grain interlocking
(a)
(b)
sC
G C 2 C T h
eT e microcracks
fibres
G C 2 t(u)du
0 surface fraction of the bridges ductile particles ductile particles
u*
martensitic trasformation (MS 1200C - 600C) V 4%, ij 1-7% MS decreases with: presence of stabilizing oxides (MgO, CaO, Y2O3, CeO2) (grain size)-1 compression stresses (matrix)
Thoughening mechanism
E KC = 0.22 T h 1
**
fraction of grains t
Typical systems (Kc 20 MPa m0.5):! partially stabilized zirconia (PSZ)! zirconia toughened alumina (ZTA)!
Bridging mechanisms
1. Bridging with ductile particles!
' 2 GC = d ) f E T ) (E
( )
2 * 4 i , 2 hp + R R 1 , +
pull-out length
fibre radius
Sistems:! alumina with SiC whiskers (Kc 9 MPa m0.5)! silicon nitride with SiC whiskers (Kc 11 MPa m0.5)! SiC-SiCf or C-SiCf composites (Kc 30 MPa m0.5)!
3. Bridging grains!
Sistems:! alumina (Kc 8 MPa m0.5)! silicon nitride (Kc 10 MPa m0.5)! silicon carbide (Kc 8 MPa m0.5)!
E 2 w ar2 6(1 2 )