STTH3R02

Ultrafast recovery diode

Main product characteristics
IF(AV) VRRM Tj (max) VF (typ) trr (typ) 3A 200 V 175 C 0.7 V 16 ns

Features and benefits

A K
DO-201AD STTH3R02

A K
DO-15 STTH3R02Q

Very low conduction losses Negligible switching losses Low forward and reverse recovery times High junction temperature

Description
The STTH3R02 uses ST's new 200 V planar Pt doping technology, and it is specially suited for switching mode base drive and transistor circuits. Packaged in DO-201AD, DO-15, and SMC, this device is intended for use in low voltage, high frequency inverters, free wheeling and polarity protection.

K
SMC STTH3R02S

Order codes
Part Number STTH3R02 STTH3R02RL STTH3R02Q STTH3R02QRL STTH3R02S Marking STTH3R02 STTH3R02 STTH3R02 STTH3R02 3R2S

October 2006

Rev 2
www.st.com

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Characteristics

STTH3R02

1
Table 1.
Symbol VRRM IFRM IF(RMS)

Characteristics
Absolute ratings (limiting values at Tj = 25 C, unless otherwise specified)
Parameter Repetitive peak reverse voltage Repetitive peak forward RMS forward current SMC DO-15 Tlead = 50 C IF(AV) Average forward current, = 0.5 DO-201AD Tlead = 90 C SMC Tc = 110 C IFSM Tstg Tj TL Surge non repetitive forward current Storage temperature range Maximum operating junction temperature(1) Maximum lead temperature for soldering during 10 s at 4 mm from case tp = 10 ms Sinusoidal 75 -65 to + 175 175 230 A C C C 3 A 70 current(1) tp = 5 s, F = 5 kHz DO-201AD / DO-15 Value 200 110 70 A Unit V A

1. On infinite heatsink with 10 mm lead length

Table 2.
Symbol Rth(j-l) Rth(j-c)

Thermal parameters
Parameter DO-15 Junction to lead Junction to case Lead Length = 10 mm on infinite heatsink DO-201AD SMC 30 20 C/W Value 45 Unit

Table 3.
Symbol IR(1)

Static electrical characteristics

Parameter Reverse leakage current Test conditions Tj = 25 C Tj = 125 C Tj = 25 C VR = VRRM IF = 9 A 0.89 IF = 3 A 0.76 0.70 Min. Typ Max. 3 A 3 30 1.20 1.0 V 0.85 0.80 Unit

VF(2)

Forward voltage drop

Tj = 25 C Tj = 100 C Tj = 150 C

1. Pulse test: tp = 5 ms, < 2 % 2. Pulse test: tp = 380 s, < 2 %

To evaluate the conduction losses use the following equation: P = 0.68 x IF(AV) + 0.04 IF2(RMS)

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STTH3R02 Table 4.
Symbol

Characteristics Dynamic characteristics

Parameter Test conditions IF = 1 A, dIF/dt = -50 A/s, VR = 30 V, Tj = 25 C IF = 1 A, dIF/dt = -100 A/s, VR = 30 V, Tj = 25 C Min. Typ 24 16 3.5 40 1.9 Max. 30 ns 20 4.5 A ns V Unit

trr

Reverse recovery time

IRM tfr VFP

Reverse recovery current Forward recovery time Forward recovery voltage

IF = 3 A, dIF/dt = -200 A/s, VR = 160 V, Tj = 125 C IF = 3 A, dIF/dt = 100 A/s VFR = 1.1 x VFmax, Tj = 25 C IF = 3 A, dIF/dt = 100 A/s, Tj = 25 C

Figure 1.
IM(A)
100

peak current versus duty cycle

Figure 2.

Forward voltage drop versus forward current (typical values)

IFM(A)
T
IM

50

80

d=tp/T

tp

40

60
P = 10 W

30

40
P=5W P=3W

20

20

10

Tj=150C Tj=25C

0 0.0

0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0

VFM(V)

0 0.0 0.5 1.0 1.5 2.0

Figure 3.

Forward voltage drop versus forward current (maximum values)

Figure 4.

Relative variation of thermal impedance junction to ambient versus pulse duration - DO-201AD (Epoxy printed circuit board FR4, eCU = 35 m)

IFM(A)
50
1.0 0.9

Zth(j-a) /Rth(j-a)
DO-201AD Lleads=10mm

40

0.8 0.7

30

0.6 0.5

20
Tj=150C

0.4 0.3
Tj=25C

10

0.2

VFM(V) 0 0.0 0.5 1.0 1.5 2.0

0.1 0.0 1.E-01

Single pulse

tP(s) 1.E+00 1.E+01 1.E+02 1.E+03

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Characteristics

STTH3R02

Figure 5.

Relative variation of thermal impedance junction to ambient versus pulse duration - DO-15 (Epoxy printed circuit board FR4, eCU = 35 m)

Figure 6.

Relative variation of thermal impedance junction to ambient versus pulse duration - SMC (Epoxy printed circuit board FR4, eCU = 35 m)

Zth(j-a) /Rth(j-a)
1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0.0 1.E-01
Single pulse DO-15 Lleads=10mm

Zth(j-a) /Rth(j-a)
1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2
SMC Scu=1cm

tP(s) 1.E+00 1.E+01 1.E+02 1.E+03

0.1 0.0

Single pulse

tP(s) 1.E-01 1.E+00 1.E+01 1.E+02 1.E+03

1.E-03

1.E-02

Figure 7.

Junction capacitance versus reverse applied voltage (typical values)

F=1MHz Vosc=30mVRMS Tj=25C

Figure 8.

Reverse recovery charges versus dIF/dt (typical values)

C(pF)
100

QRR(nC)
80 70 60 50
IF=3A VR=160V

10

40 30 20 10
VR(V)

Tj=125C

Tj=25C

dIF/dt(A/s) 10 100 1000

1 1 10 100 1000

Figure 9.

Reverse recovery time versus dIF/dt Figure 10. Peak reverse recovery current (typical values) versus dIF/dt (typical values)
IRM(A)
8
IF=3A VR=160V
IF=3A VR=160V

tRR(ns)
60

50

7 6

40
5
Tj=125C

30
Tj=25C

4
Tj=125C

20

3 2

10
1

Tj=25C

dIF/dt(A/s) 0 10 100 1000

0 10 100

dIF/dt(A/s) 1000

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STTH3R02

Ordering information scheme

Figure 11. Dynamic parameters versus junction temperature

Figure 12. Thermal resistance junction to ambient versus copper surface under each lead for DO-15 and DO-201AD (Epoxy printed circuit board FR4, eCU = 35m)
Rth(j-a) (C/W)

QRR; IRM [T j] / Q RR; IRM [T j=125C]

1.4 1.2 1.0 0.8 0.6
QRR IRM IF=3A VR=160V

100 90 80 70 60 50
DO-201AD DO-15

40 30 20

0.4 0.2 Tj(C) 0.0 25 50 75 100 125 150

10 0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5

SCu(cm)

4.0

4.5

5.0

Figure 13. Thermal resistance versus copper surface under each lead for SMC (Epoxy printed circuit board FR4, eCU = 35m)
Rth(j-a) (C/W)
100
SMC

Figure 14. Thermal resistance versus lead length for DO-201AD package

Rth(C/W)
100 90 80 70
Rth(j-a) DO-201AD

80

60

60 50

40

40
Rth(j-l)

30
20 SCU(cm) 0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0

20 10 0 5 10 15 20 25 Lleads(mm)

Ordering information scheme

STTH
Ultrafast switching diode Average forward current
3=3A

3 R

02 XXX

Model R Repetitive peak reverse voltage 02 = 200 V Package Blank = DO-201 in Ammopack RL = DO-201 in Tape and reel Q = DO-15 in Ammopack QRL = DO-15 in Tape and reel S= SMC in Tape and reel

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Package information

STTH3R02

Package information

Epoxy meets UL94, V0 Cooling method: by conduction (C) DO-201AD Dimensions

Dimensions Ref. Millimeters Min.
B
Note 1

Table 5.

Inches Min. Max. 0.374 1.000

Max. 9.50

A E E
Note 1

A B 25.40

D
Note 2

C D E Notes

5.30 1.30 1.25

0.209 0.051 0.049

1 - The lead diameter D is not controlled over zone E 2 - The minimum length which must stay straight between the right angles after bending is 0.59"(15mm)

Table 6.

DO-15 dimensions
Dimensions
C A C

Ref.

Millimeters Min. Max. 6.75 3.53 31 0.88

Inches Min. 0.238 0.116 1.024 0.028 Max. 0.266 0.139 1.220 0.035

A
D B

6.05 2.95 26 0.71

B C D

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STTH3R02 Table 7. SMC dimensions

Package information

Dimensions Ref.
E1

Millimeters Min. Max. 2.45 0.20 3.2 0.41 8.15 7.15 4.70 6.25 1.60

Inches Min. 0.075 0.002 0.114 0.006 0.305 0.260 0.173 0.218 0.030 Max. 0.096 0.008 0.126 0.016 0.321 0.281 0.185 0.246 0.063

A1
D

1.90 0.05 2.90 0.15 7.75 6.60 4.40 5.55 0.75

A2 b

c E
A1

E1
b

C E2 L

A2

E2 D L

Figure 15. SMC footprint (dimensions in mm)

2.20 4.25 2.20

3.30

8.65

In order to meet environmental requirements, ST offers these devices in ECOPACK packages. These packages have a lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com.

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Ordering information

STTH3R02

Ordering information
Part Number STTH3R02 STTH3R02RL STTH3R02Q STTH3R02QRL STTH3R02S Marking STTH3R02 STTH3R02 STTH3R02 STTH3R02 3R2S Package DO-201AD DO-201AD DO-15 DO-15 SMC Weight 1.16 g 1.16 g 0.4 g 0.4 g 0.243 g Base qty 600 1900 1000 6000 2500 Delivery mode Ammopack Tape and reel Ammopack Tape and reel Tape and reel

Revision history
Date 03-May-2006 10-Oct-2006 Revision 1 2 First issue Added SMC package Description of Changes

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STTH3R02

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