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  • A3000FC-Flip Clip Die Bonder PDF

    Încărcat de

    Kelvin Ng
    274 vizualizări8 pagini
    The document describes the A3000FC flip chip die bonder. It has high precision of +/- 25um for handling small dies down to 0.2mm x 0.2mm. It uses a PC-based control system with an interactive menu and 256-level vision system for die alignment. The machine has a large bonding area, handles thin substrates, and offers options like wafer mapping and epoxy stamping. It is a flexible and precise solution for flip chip applications.

    Descriere originală:

    Pistos Website Brochure

    Titlu original

    A3000FC-Flip Clip Die Bonder.pdf

    Drepturi de autor

    © Attribution Non-Commercial (BY-NC)

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    The document describes the A3000FC flip chip die bonder. It has high precision of +/- 25um for handling small dies down to 0.2mm x 0.2mm. It uses a PC-based control system with an interactive menu and 256-level vision system for die alignment. The machine has a large bonding area, handles thin substrates, and offers options like wafer mapping and epoxy stamping. It is a flexible and precise solution for flip chip applications.

    Drepturi de autor:

    Attribution Non-Commercial (BY-NC)
    Descărcați ca PDF, TXT sau citiți online pe Scribd
    Indicator pentru conținut neadecvat
    274 vizualizări8 pagini

    A3000FC-Flip Clip Die Bonder PDF

    Încărcat de

    Kelvin Ng
    The document describes the A3000FC flip chip die bonder. It has high precision of +/- 25um for handling small dies down to 0.2mm x 0.2mm. It uses a PC-based control system with an interactive menu and 256-level vision system for die alignment. The machine has a large bonding area, handles thin substrates, and offers options like wafer mapping and epoxy stamping. It is a flexible and precise solution for flip chip applications.

    Drepturi de autor:

    Attribution Non-Commercial (BY-NC)
    Descărcați ca PDF, TXT sau citiți online pe Scribd
    Indicator pentru conținut neadecvat
    din 8

    A3000FC

    FLIP CHIP DIE BONDER

    A High Precision and Flexible Solution for your Flip Chip Applications

    A3000FC

    Features

    Performance

    Control System

    High Precision +/- 25um Handle Small Die 0.2mm x 0.2mm Low Bonding Force 30g min Rotary Bonding tool Voice Coil bond force control Gentle Pickup Synchronize Ejector

    PC Based Control system Interactive menu driven control User customizable menu USB interface for data exchange

    Vision System

    Material Handling

    256 grey levels PR system Geometric Features recognition Die Alignment Ink dot detection

    Large Bonding Area Thin Substrate handling PCB/Ceramic substrate High Speed servo XY stage

    Bond Head

    Options

    Dual Servo Bond Head with linear encoder 2um resolution No stick Z pickup linear bearing Easy maintenance

    Wafer mapping Epoxy Stamping

    Die Handling

    Handling of 8 Flex Frame Motorized wafer Theta Adjustment Waffle Pak and Foton Ring Handling Capability Ejector system with multi stage programmable ejector height

    Product that requires certain degree of customization is available.

    Please consult ACCURATUS for such inquiries.

    Trusted Technology. Creative Engineering

    A3000FC
    Die Size Package Handling Substrate Size Length Width Thickness Cycle Time Wafer Stage Wafer size XY Table Travel Bond Head Bond force Resolution

    Specifications
    8 x 8mil 400 x 400mil 0.2 x 0.2mm 10 x 10mm PCB, Ceramic, Flex Circuit

    10 (250mm) 4 (100mm) 0.002 0.25 (0.050 6.35mm) 1.2 sec (Pick Flip and Place)

    Max 8 (200mm) 9.5 x 9.5 (240mm x 240mm)

    30 300g 2um

    Pattern Recognition System PRS 256 Grey Level Camera resolution 640pixel x 480pixel Positional accuracy +/- pixel System Accuracy XY Placement Angle Facilities Required Voltage Frequency Compressed air

    +/- 25 um +/- 1 deg

    110/220/230VAC (pre set at factory) 50/60Hz (pre-set at factory) 80 PSI (Min)

    Dimension & Weight LxBxH Weight

    1200mm x 1000mm x 1650mm 900kg (Depend on configurations)

    Pistos Solutions Pte Ltd Block 996 Bendemeer Road. #04-01 Kallang Basin Industrial Estate. Singapore 339944 EMAIL: enquiry@pistos-solutions.com

    A3000FC
    FLIP CHIP DIE BONDER

    Trusted Technology. Creative Engineering

    A3000FC
    FLIP CHIP DIE BONDER

    Efficient Machine Layout Wafer handling Assembly to go under the Workholder. This allow shorter working stroke and higher machine through put

    A3000FC
    FLIP CHIP DIE BONDER

    Pick Up Die from Wafer

    Die Flipping

    Kiss and Part

    Precision Bond Force control using Voice Coil

    A3000FC
    FLIP CHIP DIE BONDER

    Bottom Camera Assembly

    A3000FC
    FLIP CHIP DIE BONDER

    Flexible dispensing of flux or epoxy. Epoxy Stamping for critical control Syringe Holder

    Epoxy Pot

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