7370

VN820 / VN820SO / VN820SP / VN820-B5 / VN820PT
HIGH SIDE DRIVER
TYPE VN820 VN820SP VN820-B5 VN820SO VN820PT
RDS(on)
IOUT
VCC
10
40 m
9A
36 V
PowerSO-10
P2PAK
PPAK
CMOS COMPATIBLE INPUT ON STATE OPEN LOAD DETECTION I OFF STATE OPEN LOAD DETECTION I SHORTED LOAD PROTECTION I UNDERVOLTAGE AND OVERVOLTAGE SHUTDOWN I PROTECTION AGAINST LOSS OF GROUND I VERY LOW STAND-BY CURRENT
I I I
PENTAWATT
PACKAGE PENTAWATT TUBE
SO-16L
T&R
ORDER CODES VN820 PowerSO-10 VN820SP P2PAK VN820-B5 SO-16L VN820SO PPAK VN820PT VN820SP13TR VN820-B513TR VN820SO13TR VN820PT13TR
REVERSE BATTERY PROTECTION (*)
DESCRIPTION The VN820, VN820SP, VN820-B5, VN820SO, VN820PT are monolithic devices made by using STMicroelectronics VIPower M0-3 Technology, intended for driving any kind of load with one side connected to ground. Active VCC pin voltage clamp protects the device against low energy spikes (see ISO7637 transient BLOCK DIAGRAM
compatibility table). Active current limitation combined with thermal shutdown and automatic restart protect the device against overload. The device detects open load condition both is on and off state. Output shorted to VCC is detected in the off state. Device automatically turns off in case of ground pin disconnection.
VCC
VCC CLAMP
OVERVOLTAGE DETECTION UNDERVOLTAGE DETECTION
GND Power CLAMP
INPUT LOGIC
DRIVER OUTPUT CURRENT LIMITER
STATUS
ON STATE OPENLOAD DETECTION OVERTEMPERATURE DETECTION
OFF STATE OPENLOAD AND OUTPUT SHORTED TO VCC DETECTION
(*) See application schematic at page 9
June 2003
1/34

ABSOLUTE MAXIMUM RATING
Symbol VCC - VCC - IGND IOUT - IOUT IIN ISTAT Parameter DC Supply Voltage Reverse DC Supply Voltage DC Reverse Ground Pin Current DC Output Current Reverse DC Output Current DC Input Current DC Status Current Electrostatic Discharge (Human Body Model: R=1.5K; C=100pF) VESD - INPUT - STATUS - OUTPUT - VCC Maximum Switching Energy (L=4mH; RL=0; Vbat=13.5V; Tjstart=150C; IL=13A) Maximum Switching Energy (L=3.7mH; RL=0; Vbat=13.5V; Tjstart=150C; IL=13A) Maximum Switching Energy (L=4.48mH; RL=0; Vbat=13.5V; Tjstart=150C; IL=13A) Power Dissipation TC=25C Junction Operating Temperature Case Operating Temperature Storage Temperature 4000 4000 5000 5000 481 481 438 526 65.8 65.8 65.8 Internally Limited - 40 to 150 - 55 to 150 8.3 65.8 V V V V mJ mJ mJ W C C C Value Unit PowerSO-10 PENTAWATT P2PAK SO-16L PPAK 41 V - 0.3 V - 200 mA Internally Limited A -9 A +/- 10 mA +/- 10 mA
EMAX EMAX EMAX Ptot Tj Tc Tstg
CONNECTION DIAGRAM (TOP VIEW)

VCC N.C.
GROUND INPUT STATUS N.C. N.C.
6 7 8 9 10 11 5 4 3 2 1
16
VCC OUTPUT OUTPUT OUTPUT OUTPUT OUTPUT OUTPUT
OUTPUT OUTPUT N.C. OUTPUT OUTPUT
GND INPUT STATUS N.C.
VCC
PowerSO-10
PPAK / P2PAK / PENTAWATT
N.C. VCC
VCC
SO-16L
CURRENT AND VOLTAGE CONVENTIONS

IS
IIN INPUT ISTAT STATUS
VCC
IOUT OUTPUT GND V CC
V IN V STAT IGND
V OUT
2/34

THERMAL DATA
Symbol Rthj-case Rthj-lead Rthj-amb Value PowerSO-10 PENTAWATT P2PAK SO-16L PPAK Thermal Resistance Junction-case Max 1.9 1.9 1.9 1.9 Thermal Resistance Junction-lead Max 15 Thermal Resistance Junction-ambient Max 51.9 (*) 61.9 (*) 51.9 (*) 65 (**) 76.9 (*) Parameter Unit C/W C/W C/W
(*) When mounted on a standard single-sided FR-4 board with 0.5cm2 of Cu (at least 35m thick). (**) When mounted on FR4 printed circuit board with 0.5cm2 of Cu (at least 35 thick) connected to all VCC pins.
ELECTRICAL CHARACTERISTICS (8V<VCC<36V; -40C<Tj<150C unless otherwise specified) POWER

Symbol VCC VUSD VUSDhyst VOV RON Parameter Operating Supply Voltage Undervoltage Shut-down Undervoltage Shut-down hysteresis Overvoltage Shut-down On State Resistance Test Conditions Min 5.5 3 Typ 13 4 0.5 36 IOUT=3A; Tj=25C; VCC>8V IOUT=3A; VCC>8V Off State; VCC=13V; VIN=VOUT=0V IS Supply Current Off State; VCC=13V; VIN=VOUT=0V; Tj=25C On State; VCC=13V; VIN=5V; IOUT=0A IL(off1) IL(off2) IL(off3) IL(off4) Off State Output Current Off State Output Current Off State Output Current Off State Output Current VIN=VOUT=0V VIN=0V; VOUT=3.5V VIN=VOUT=0V; Vcc=13V; Tj =125C VIN=VOUT=0V; Vcc=13V; Tj =25C 0 -75 10 10 2 40 80 25 20 3.5 50 0 5 3 Max 36 5.5 Unit V V V V m m A A mA A A A A
SWITCHING (VCC=13V)
Symbol td(on) td(off) Parameter Turn-on Delay Time Turn-off Delay Time Test Conditions RL=4.3 from VIN rising edge to VOUT=1.3V RL=4.3 from VIN falling edge to VOUT=11.7V RL=4.3 from VOUT=1.3 to VOUT=10.4V RL=4.3 from VOUT=11.7 to VOUT=1.3V Min Typ 30 30 See relative diagram See relative diagram Max Unit s s V/s
dVOUT/dt(on) Turn-on Voltage Slope
dVOUT/dt(off) Turn-off Voltage Slope
V/s
INPUT PIN
Symbol VIL IIL VIH IIH VI(hyst) VICL Parameter Input Low Level Low Level Input Current Input High Level High Level Input Current Input Hysteresis Voltage Input Clamp Voltage Test Conditions VIN=1.25V VIN=3.25V IIN=1mA IIN=-1mA 0.5 6 6.8 -0.7 Min 1 3.25 10 8 Typ Max 1.25 Unit V A V A V V V
3/34

ELECTRICAL CHARACTERISTICS (continued) STATUS PIN
Symbol VSTAT ILSTAT CSTAT VSCL Parameter Test Conditions Status Low Output Voltage ISTAT=1.6mA Status Leakage Current Normal Operation VSTAT=5V Status Pin Input Normal Operation VSTAT=5V Capacitance ISTAT=1mA Status Clamp Voltage ISTAT=-1mA Min Typ Max 0.5 10 100 6 6.8 -0.7 8 Unit V A pF V V
PROTECTIONS
Symbol TTSD TR Thyst tSDL Ilim Vdemag Parameter Shut-down Temperature Reset Temperature Thermal Hysteresis Status delay in overload condition Current limitation Turn-off Output Clamp Voltage Test Conditions Min 150 135 7 Typ 175 15 20 9 5.5V<VCC<36V IOUT=3A; VIN=0V; L=6mH 13 20 20 VCC-41 VCC-48 VCC-55 Max 200 Unit C C C s A A V
Tj>TTSD
OPENLOAD DETECTION
Symbol IOL tDOL(on) Parameter Openload ON State Detection Threshold Openload ON State Detection Delay Openload OFF State Voltage Detection Threshold Openload Detection Delay at Turn Off Test Conditions VIN=5V IOUT=0A Min 70 Typ 150 Max 300 200 Unit mA s
VOL tDOL(off)
VIN=0V
1.5
2.5
3.5
V s
1000
OPEN LOAD STATUS TIMING (with external pull-up) IOUT< IOL VOUT > VOL VIN VIN
OVERTEMP STATUS TIMING Tj > TTSD
VSTAT
VSTAT
tDOL(off)
tDOL(on)
tSDL
tSDL
4/34
Switching time Waveforms

VOUT 90% 80%
dVOUT/dt(on)
dVOUT/dt(off)
10%
t
VIN td(on) td(off)
TRUTH TABLE
CONDITIONS Normal Operation Current Limitation Overtemperature Undervoltage Overvoltage Output Voltage > VOL Output Current < IOL INPUT L H L H H L H L H L H L H L H OUTPUT L H L X X L L L L L L H H L H STATUS H H H (Tj < TTSD) H (Tj > TTSD) L H L X X H H L H H L
5/34

OPEN LOAD DETECTION IN OFF STATE
Off state open load detection requires an external pull-up resistor (RPU) connected between OUTPUT pin and a positive supply voltage (VPU) like the +5V line used to supply the microprocessor. The external resistor has to be selected according to the following requirements: 1) no false open load indication when load is connected: in this case we have to avoid VOUT to be higher than VOlmin; this results in the following condition VOUT=(VPU/(RL+RPU))RL<VOlmin. 2) no misdetection when load is disconnected: in this case the VOUT has to be higher than VOLmax; this results in the following condition RPU<(VPUVOLmax)/ IL(off2). Because Is(OFF) may significantly increase if Vout is pulled high (up to several mA), the pull-up resistor RPU should be connected to a supply that is switched OFF when the module is in standby. The values of VOLmin, VOLmax and IL(off2) are available in the Electrical Characteristics section.
Open Load detection in off state
V batt.
VPU
VCC RPU INPUT DRIVER + LOGIC OUT + R STATUS VOL RL IL(off2)
GROUND
6/34

ELECTRICAL TRANSIENT REQUIREMENTS ON VCC PIN
ISO T/R 7637/1 Test Pulse 1 2 3a 3b 4 5 ISO T/R 7637/1 Test Pulse 1 2 3a 3b 4 5 CLASS C E TEST LEVELS III -75 V +75 V -100 V +75 V -6 V +66.5 V TEST LEVELS RESULTS II III C C C C C C C C C C E E
I -25 V +25 V -25 V +25 V -4 V +26.5 V
II -50 V +50 V -50 V +50 V -5 V +46.5 V
IV -100 V +100 V -150 V +100 V -7 V +86.5 V
Delays and Impedance 2 ms 10 0.2 ms 10 0.1 s 50 0.1 s 50 100 ms, 0.01 400 ms, 2
I C C C C C C
IV C C C C C E
CONTENTS All functions of the device are performed as designed after exposure to disturbance. One or more functions of the device is not performed as designed after exposure to disturbance and cannot be returned to proper operation without replacing the device.
7/34

Figure 1: Waveforms
NORMAL OPERATION INPUT LOAD VOLTAGE STATUS UNDERVOLTAGE VUSDhyst VUSD INPUT LOAD VOLTAGE STATUS undefined
VCC
OVERVOLTAGE VCC<VOV VCC INPUT LOAD VOLTAGE STATUS OPEN LOAD with external pull-up INPUT LOAD VOLTAGE STATUS VOUT>VOL VOL VCC>VOV
OPEN LOAD without external pull-up INPUT LOAD VOLTAGE STATUS
Tj INPUT LOAD CURRENT STATUS
TTSD TR
OVERTEMPERATURE
8/34

APPLICATION SCHEMATIC
+5V
+5V
Rprot STATUS
VCC
Dld C Rprot INPUT OUTPUT
GND
VGND
RGND
DGND
GND PROTECTION REVERSE BATTERY
NETWORK
AGAINST
Solution 1: Resistor in the ground line (RGND only). This can be used with any type of load. The following is an indication on how to dimension the RGND resistor. 1) RGND 600mV / (IS(on)max). 2) RGND (VCC) / (-IGND) where -IGND is the DC reverse ground pin current and can be found in the absolute maximum rating section of the of the devices datasheet. Power Dissipation in RGND (when VCC<0: during reverse battery situations) is: PD= (-VCC)2/RGND This resistor can be shared amongst several different HSD. Please note that the value of this resistor should be calculated with formula (1) where IS(on)max becomes the sum of the maximum on-state currents of the different devices. Please note that if the microprocessor ground is not common with the device ground then the RGND will produce a shift (IS(on)max * RGND) in the input thresholds and the status output values. This shift will vary depending on many devices are ON in the case of several high side drivers sharing the same RGND. If the calculated power dissipation leads to a large resistor or several devices have to share the same resistor then the ST suggest to utilize Solution 2 (see below). Solution 2: A diode (DGND) in the ground line. A resistor (RGND=1k) should be inserted in parallel to DGND if the device will be driving an inductive load.
This small signal diode can be safely shared amongst several different HSD. Also in this case, the presence of the ground network will produce a shift (j600mV) in the input threshold and the status output values if the microprocessor ground is not common with the device ground. This shift will not vary if more than one HSD shares the same diode/resistor network.
LOAD DUMP PROTECTION

Dld is necessary (Voltage Transient Suppressor) if the load dump peak voltage exceeds VCC max DC rating. The same applies if the device will be subject to transients on the VCC line that are greater than the ones shown in the ISO T/R 7637/1 table.
C I/Os PROTECTION:
If a ground protection network is used and negative transient are present on the VCC line, the control pins will be pulled negative. ST suggests to insert a resistor (Rprot ) in line to prevent the C I/Os pins to latch-up. The value of these resistors is a compromise between the leakage current of C and the current required by the HSD I/Os (Input levels compatibility) with the latch-up limit of C I/Os. -VCCpeak/Ilatchup Rprot (VOHC-VIH-VGND) / IIHmax Calculation example: For VCCpeak= - 100V and Ilatchup 20mA; VOHC 4.5V 5k Rprot 65k. Recommended Rprot value is 10k.
9/34

Off State Output Current
IL(off1) (A)
5 4.5 4 3.5 3 2.5 2 1.5 1 0.5 0 -50 -25 0 25 50 75 100 125 150 175
High Level Input Current

Iih (uA)
5
Off state Vcc=36V Vin=Vout=0V
4.5
Vin=3.25V
4 3.5 3 2.5 2 1.5 1 0.5 0 -50 -25 0 25 50 75 100 125 150 175
Tc (C)
Tc (C)
Input Clamp Voltage

Vicl (V)
8 7.8
Input High Level

Vih (V)
3.6 3.4 3.2
Iin=1mA
7.6 7.4 7.2 7 6.8 6.6
3 2.8 2.6 2.4
6.4 6.2 6 -50 -25 0 25 50 75 100 125 150 175 2.2 2 -50 -25 0 25 50 75 100 125 150 175
Tc (C)
Tc (C)
Input Low Level

Vil (V)
2.6 2.4 2.2
Input Hysteresis Voltage

Vhyst (V)
1.5 1.4 1.3 1.2
2 1.8 1.6 1.4
1.1 1 0.9 0.8 0.7
1.2 1 -50 -25 0 25 50 75 100 125 150 175
0.6 0.5 -50 -25 0 25 50 75 100 125 150 175
Tc (C)
Tc (C)
10/34

Overvoltage Shutdown
Vov (V)
50 48 46 44 42 40 38 36 34 32 30 -50 -25 0 25 50 75 100 125 150 175
ILIM Vs Tcase
Ilim (A)
25 22.5
Vcc=13V
20 17.5 15 12.5 10 7.5 5 2.5 0 -50 -25 0 25 50 75 100 125 150 175
Tc (C)
Tc (C)
Turn-on Voltage Slope

dVout/dt(on) (V/ms)
1000 900 800 700 600 500 400 300 200 100 0 -50 -25 0 25 50 75 100 125 150 175
Turn-off Voltage Slope

dVout/dt(off) (V/ms)
1000 900
Vcc=13V Rl=4.3Ohm
800 700 600 500 400 300 200 100 0 -50
Vcc=13V Rl=4.3Ohm
-25
25
50
75
100
125
150
175
Tc (C)
Tc (C)
On State Resistance Vs Tcase

Ron (mOhm)
100 90 80 70 60 50 40 30 20 10 0 -50 -25 0 25 50 75 100 125 150 175
On State Resistance Vs VCC

Ron (mOhm)
100 90
Iout=3A Vcc=8V; 13V; 36V
80
Tc= 150C
70 60 50 40 30 20 10 0 5 10 15 20 25 30 35 40
Tc= 25C
Tc= - 40C
Tc (C)
Vcc (V)
11/34

Status Clamp Voltage
Vscl (V)
8 7.8
Status Leakage Current

Ilstat (uA)
0.05
Istat=1mA
7.6 7.4 7.2 7 6.8 6.6 6.4 6.2 6 -50 -25 0 25 50 75 100 125 150 175 0 -50 -25 0 25 50 75 100 125 150 175 0.01 0.02 0.03 0.04
Vstat=5V
Tc (C)
Tc (C)
Status Low Output Voltage

Vstat (V)
0.8 0.7
Open Load Off State Voltage Detection Threshold

Vol (V)
5 4.5
Istat=1.6mA
0.6
Vin=0V
4 3.5
0.5 0.4 0.3 0.2
3 2.5 2 1.5 1
0.1 0 -50 -25 0 25 50 75 100 125 150 175
0.5 0 -50 -25 0 25 50 75 100 125 150 175
Tc (C)
Tc (C)
Open Load On State Detection Threshold

Iol (mA)
200 190 180 170 160 150 140 130 120 110 100 90 80 -50 -25 0 25 50 75 100 125 150 175
Vcc=13V Vin=5V
Tc (C)
12/34

PowerSO-10, P2PAK, PENTAWATT Maximum turn off current versus load inductance
ILMAX (A) 100
10
A B C
1 0.1 1 L(mH )
A = Single Pulse at TJstart=150C B= Repetitive pulse at TJstart=100C C= Repetitive Pulse at TJstart=125C Conditions: VCC=13.5V Values are generated with RL=0 In case of repetitive pulses, Tjstart (at beginning of each demagnetization) of every pulse must not exceed the temperature specified above for curves B and C. VIN, IL Demagnetization Demagnetization Demagnetization
10
100
13/34

PPAK Maximum turn off current versus load inductance
ILMAX (A) 100
10
B C
1 0.1 1 L(mH )
10
100
14/34

SO-16L Maximum turn off current versus load inductance
ILM AX (A) 100
A B
10
1 0.1 1 L(mH)
10
100
15/34
SO-16L THERMAL DATA

SO-16L PC Board
Layout condition of Rth and Zth measurements (PCB FR4 area= 41mm x 48mm, PCB thickness=2mm, Cu thickness=35m, Copper areas: 0.5cm2, 6cm2).
Rthj-amb Vs PCB copper area in open box free air condition
70 65 60 55 50 45 40
RTH j-amb (C/W)
PCB Cu heatsink area (cm^2)
16/34
P2PAK THERMAL DATA

P2PAK PC Board
RTHj_amb (C/W)
55
Tj-Tamb=50C
50 45 40 35 30
0 2 4 6 8 10
17/34
PPAK THERMAL DATA

PPAK PC Board
RTHj_amb
(C/W)
90 80 70 60 50 40 30 20 10 0 0 2 4 6 8 10
18/34
PowerSO-10 THERMAL DATA

PowerSO-10 PC Board
Layout condition of Rth and Zth measurements (PCB FR4 area= 58mm x 58mm, PCB thickness=2mm, Cu thickness=35m, Copper areas: from minimum pad lay-out to 8cm2).
RTHj_amb (C/W)
55
Tj-Tamb=50C
50 45 40 35 30
0 2 4 6 8 10
19/34

PowerSO-10 Thermal Impedance Junction Ambient Single Pulse
ZTH (C/W) 100

0.5 cm2 6 cm2
10
0.1
0.01 0.0001
0.001
0.01
0.1
10
100
1000
Time (s)
Thermal fitting model of a single channel HSD in PowerSO-10 Pulse calculation formula
Z TH = R TH + Z THtp ( 1 )
where
= tp T
0.5 0.04 0.25 0.25 0.8 12 37 0.0008 7.00E-03 0.015 0.3 0.75 3 6
Thermal Parameter
Area/island (cm2) R1 (C/W) R2 (C/W) R3( C/W) R4 (C/W) R5 (C/W) R6 (C/W) C1 (W.s/C) C2 (W.s/C) C3 (W.s/C) C4 (W.s/C) C5 (W.s/C) C6 (W.s/C)
Tj
C1
C2
C3
C4
C5
C6
R1
R2
R3
R4
R5
R6
Pd
22
T_amb
20/34

P2PAK Thermal Impedance Junction Ambient Single Pulse
ZTH (C/W) 1000
100
0.97 cm2 6 cm2
10
0.1
0.01 0.0001 0.001 0.01 0.1 1 T ime (s) 10 100 1000
Thermal fitting model of a single channel HSD in P2PAK
Pulse calculation formula
where
= tp T
0.97 0.04 0.25 0.3 4 9 37 0.0008 0.007 0.015 0.4 2 3 6
Thermal Parameter
Tj
C1
C2
C3
C4
C5
C6
R1
R2
R3
R4
R5
R6
Pd
22
T_amb
21/34

PPAK Thermal Impedance Junction Ambient Single Pulse
ZTH (C/W) 1000
100
0.44 cm2 6 cm2
10
0.1
0.01 0.0001 0.001 0.01 0.1 1 Time (s) 10 100 1000
Thermal fitting model of a single channel HSD in PPAK
where
= tp T
0.44 0.04 0.25 0.3 2 15 61 0.0008 0.007 0.02 0.3 0.45 0.8 6
Thermal Parameter
Tj
C1
C2
C3
C4
C5
C6
R1
R2
R3
R4
R5
R6
Pd
24
T_amb
22/34

SO-16L Thermal Impedance Junction Ambient Single Pulse
ZT H (C/W) 1000
100
0.5 cm2 6 cm2
10
0.1
0.01 0.0001 0.001 0.01 0.1 1 T ime (s) 10 100 1000
Thermal fitting model of a single channel HSD in SO-16L
where
= tp T
0.5 0.04 0.25 2.2 12 15 37 0.0008 7.00E-03 1.50E-02 0.14 1 3 6
Thermal Parameter
Tj
C1
C2
C3
C4
C5
C6
R1
R2
R3
R4
R5
R6
Pd
22
T_amb
23/34
PowerSO-10 MECHANICAL DATA

DIM. A A (*) A1 B B (*) C C (*) D D1 E E2 E2 (*) E4 E4 (*) e F F (*) H H (*) h L L (*) (*)
(*) Muar only POA P013P
mm. MIN. 3.35 3.4 0.00 0.40 0.37 0.35 0.23 9.40 7.40 9.30 7.20 7.30 5.90 5.90 1.27 1.25 1.20 13.80 13.85 0.50 1.20 0.80 0 2 1.80 1.10 8 8 0.047 0.031 0 2 1.35 1.40 14.40 14.35 0.049 0.047 0.543 0.545 TYP MAX. 3.65 3.6 0.10 0.60 0.53 0.55 0.32 9.60 7.60 9.50 7.60 7.50 6.10 6.30 MIN. 0.132 0.134 0.000 0.016 0.014 0.013 0.009 0.370 0.291 0.366 0.283 0.287 0.232 0.232
inch TYP. MAX. 0.144 0.142 0.004 0.024 0.021 0.022 0.0126 0.378 0.300 0.374 300 0.295 0.240 0.248 0.050 0.053 0.055 0.567 0.565 0.002 0.070 0.043 8 8
0.10 A B
10
E2
E4
SEATING PLANE e
0.25
DETAIL "A"
C D = D1 = = = SEATING PLANE
A F A1
A1
L DETAIL "A"
P095A
24/34
PENTAWATT (VERTICAL) MECHANICAL DATA

DIM. A C D D1 E F F1 G G1 H2 H3 L L1 L2 L3 L5 L6 L7 M M1 Diam. 3.65 2.6 15.1 6 4.5 4 3.85 0.144 10.05 17.85 15.75 21.4 22.5 3 15.8 6.6 0.102 0.594 0.236 0.177 0.157 0.152 2.4 1.2 0.35 0.8 1 3.2 6.6 3.4 6.8 mm. MIN. TYP MAX. 4.8 1.37 2.8 1.35 0.55 1.05 1.4 3.6 7 10.4 10.4 0.396 0.703 0.620 0.843 0.886 0.118 0.622 0.260 0.094 0.047 0.014 0.031 0.039 0.126 0.260 0.134 0.268 MIN. inch TYP. MAX. 0.189 0.054 0.110 0.053 0.022 0.041 0.055 0.142 0.276 0.409 0.409
25/34
P2PAK MECHANICAL DATA

DIM. A A1 A2 b c c2 D D2 E E1 e e1 L L2 L3 L5 R V2 Package Weight 0 1.40 Gr (typ) 3.20 6.60 13.70 1.25 0.90 1.55 0.40 8 10.00 8.50 3.60 7.00 14.50 1.40 1.70 2.40 mm. MIN. 4.30 2.40 0.03 0.80 0.45 1.17 8.95 8.00 10.40 TYP MAX. 4.80 2.80 0.23 1.05 0.60 1.37 9.35
P010R
26/34
SO-16L MECHANICAL DATA

DIM. A a1 a2 b b1 C c1 D E e e3 F L M S 7.4 0.5 10.1 10.0 1.27 8.89 7.6 1.27 0.75 8 (max.) 0.291 0.020 10.5 10.65 0.35 0.23 0.5 45 (typ.) 0.397 0.393 0.050 0.350 0.300 0.050 0.029 0.413 0.419 0.1 mm. MIN. TYP MAX. 2.65 0.2 2.45 0.49 0.32 0.014 0.009 0.020 0.004 MIN. inch TYP. MAX. 0.104 0.008 0.096 0.019 0.012
27/34
PPAK MECHANICAL DATA

DIM. A A1 A2 B B2 C C2 D1 D E E1 e G G1 H L2 L4 R V2 Package Weight 0 Gr. 0.3 0.60 0.2 8 4.90 2.38 9.35 0.8 6.00 6.40 4.7 1.27 5.25 2.70 10.10 1.00 1.00 MIN. 2.20 0.90 0.03 0.40 5.20 0.45 0.48 5.1 6.20 6.60 TYP MAX. 2.40 1.10 0.23 0.60 5.40 0.60 0.60
P032T1
28/34

PowerSO-10 SUGGESTED PAD LAYOUT
14.6 - 14.9
B
TUBE SHIPMENT (no suffix)

CASABLANCA MUAR
C
10.8- 11 6.30
A A
0.67 - 0.73 1 2 3 4 5 10 9 8 7 6 1.27 0.54 - 0.6
9.5
All dimensions are in mm. Base Q.ty Bulk Q.ty Tube length ( 0.5) Casablanca Muar 50 50 1000 1000 532 532 A B C ( 0.1) 0.8 0.8
10.4 16.4 4.9 17.2
TAPE AND REEL SHIPMENT (suffix 13TR)
REEL DIMENSIONS
Base Q.ty Bulk Q.ty A (max) B (min) C ( 0.2) F G (+ 2 / -0) N (min) T (max) 600 600 330 1.5 13 20.2 24.4 60 30.4
All dimensions are in mm.
TAPE DIMENSIONS
According to Electronic Industries Association (EIA) Standard 481 rev. A, Feb 1986 Tape width Tape Hole Spacing Component Spacing Hole Diameter Hole Diameter Hole Position Compartment Depth Hole Spacing W P0 ( 0.1) P D ( 0.1/-0) D1 (min) F ( 0.05) K (max) P1 ( 0.1) 24 4 24 1.5 1.5 11.5 6.5 2
End
Start Top cover tape 500mm min Empty components pockets saled with cover tape. User direction of feed 500mm min No components Components No components
29/34
PENTAWATT TUBE SHIPMENT (no suffix)
Base Q.ty Bulk Q.ty Tube length ( 0.5) A B C ( 0.1)

50 1000 532 18 33.1 1
30/34

P PAK TUBE SHIPMENT (no suffix)
2

50 1000 532 18 33.1 1
TAPE AND REEL SHIPMENT (suffix 13TR) REEL DIMENSIONS

TAPE DIMENSIONS
End
Start Top cover tape No components 500mm min Empty components pockets saled with cover tape. User direction of feed 500mm min Components No components
31/34

SO-16L TUBE SHIPMENT (no suffix) Base Q.ty Bulk Q.ty Tube length ( 0.5) A B C ( 0.1)
A
C B
50 1000 532 3.5 13.8 0.6

TAPE DIMENSIONS
End
Start Top cover tape 500mm min Empty components pockets saled with cover tape. User direction of feed 500mm min No components Components No components
32/34

PPAK TUBE SHIPMENT (no suffix)
A C

75 3000 532 6 21.3 0.6

TAPE DIMENSIONS
End
Start Top cover tape No components 500mm min Empty components pockets saled with cover tape. User direction of feed 500mm min Components No components
33/34
Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may results from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics. The ST logo is a trademark of STMicroelectronics 2003 STMicroelectronics - Printed in ITALY- All Rights Reserved. STMicroelectronics GROUP OF COMPANIES Australia - Brazil - Canada - China - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan - Malaysia Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - U.S.A. http://www.st.com
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VN820 / VN820SO / VN820SP / VN820-B5 / VN820PT

HIGH SIDE DRIVER

TYPE VN820 VN820SP VN820-B5 VN820SO VN820PT

REVERSE BATTERY PROTECTION (*)

OVERVOLTAGE DETECTION UNDERVOLTAGE DETECTION

GND Power CLAMP

DRIVER OUTPUT CURRENT LIMITER

ON STATE OPENLOAD DETECTION OVERTEMPERATURE DETECTION

OFF STATE OPENLOAD AND OUTPUT SHORTED TO VCC DETECTION

(*) See application schematic at page 9

VN820 / VN820SO / VN820SP / VN820-B5 / VN820PT

EMAX EMAX EMAX Ptot Tj Tc Tstg

CONNECTION DIAGRAM (TOP VIEW)

VCC OUTPUT OUTPUT OUTPUT OUTPUT OUTPUT OUTPUT

OUTPUT OUTPUT N.C. OUTPUT OUTPUT

GND INPUT STATUS N.C.

PPAK / P2PAK / PENTAWATT

CURRENT AND VOLTAGE CONVENTIONS

IIN INPUT ISTAT STATUS

VN820 / VN820SO / VN820SP / VN820-B5 / VN820PT

ELECTRICAL CHARACTERISTICS (8V<VCC<36V; -40C<Tj<150C unless otherwise specified) POWER

dVOUT/dt(on) Turn-on Voltage Slope

dVOUT/dt(off) Turn-off Voltage Slope

VN820 / VN820SO / VN820SP / VN820-B5 / VN820PT

OVERTEMP STATUS TIMING Tj > TTSD

VN820 / VN820SO / VN820SP / VN820-B5 / VN820PT

Switching time Waveforms

VN820 / VN820SO / VN820SP / VN820-B5 / VN820PT

Open Load detection in off state

VCC RPU INPUT DRIVER + LOGIC OUT + R STATUS VOL RL IL(off2)

VN820 / VN820SO / VN820SP / VN820-B5 / VN820PT

I -25 V +25 V -25 V +25 V -4 V +26.5 V

II -50 V +50 V -50 V +50 V -5 V +46.5 V

IV -100 V +100 V -150 V +100 V -7 V +86.5 V

VN820 / VN820SO / VN820SP / VN820-B5 / VN820PT

OPEN LOAD without external pull-up INPUT LOAD VOLTAGE STATUS

Tj INPUT LOAD CURRENT STATUS

VN820 / VN820SO / VN820SP / VN820-B5 / VN820PT

Dld C Rprot INPUT OUTPUT

GND PROTECTION REVERSE BATTERY

LOAD DUMP PROTECTION

VN820 / VN820SO / VN820SP / VN820-B5 / VN820PT

High Level Input Current

Off state Vcc=36V Vin=Vout=0V

Input Clamp Voltage

Input High Level

3 2.8 2.6 2.4

Input Low Level

Input Hysteresis Voltage

2 1.8 1.6 1.4

1.1 1 0.9 0.8 0.7

1.2 1 -50 -25 0 25 50 75 100 125 150 175

0.6 0.5 -50 -25 0 25 50 75 100 125 150 175

VN820 / VN820SO / VN820SP / VN820-B5 / VN820PT

Turn-on Voltage Slope

Turn-off Voltage Slope

800 700 600 500 400 300 200 100 0 -50

On State Resistance Vs Tcase

On State Resistance Vs VCC

Iout=3A Vcc=8V; 13V; 36V

VN820 / VN820SO / VN820SP / VN820-B5 / VN820PT

Status Leakage Current

Status Low Output Voltage

Open Load Off State Voltage Detection Threshold