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SPONSORED UNDER TEQIP-II PROJECT
Registration Form
rd
3 National Conference
on
Advanced Materials and Radiation Physics
(AMRP-2013)
(November 22-23, 2013)
1. Name: .................................
2. Designation:.................................
3. Field oI Specialization:.........................
4. Name oI Organization:..........................
5. Mailing Address:.............................
....................................
E-mail:.................................
Telephone No.:...........................
Fax:...................................
6. Accommodation required: Yes/No
I wish to participate in the conIerence: Yes/No
I wish to present a paper: Yes/No
Title oI the Paper:...................
-------------------------------------------------------
I am enclosing a demand draIt oI Rs....... in
Iavor oI the ~Convener AMRP-2013 payable at
Longowal as registration Iee.DD No.................
Or
Payment detail
Net Banking:
Net Banking ReI. No.
Pay amount & date:
Date:.. Signature..
Submission of puper & ubstruct
Importunt dutes
Pegistrution
Mode of puyment
Accommodution
Papers will be selected Ior presentation on the basis oI
reviewby subject expert. The accepted papers will be
published in the Iorm oI conIerence proceeding.
Participants are requested to submit their abstract in
MS-Word (New Times Roman). The title oI abstract
should be Iollowed by author(s) name, aIIiliation, and
abstract and supporting Iigure, tables' etc. The Iull
length paper should strictly in IEEE Iormat limited to
two pages only. (IEEE Iormat can be downloaded
Irom the site www.ieee.org).
Submission of abstract & full paper: 20.10.2013
Acceptance notification: 30.10.2013
Registration deadline: 30.10.2013
Conference dates: Nov. 22-23, 2013
The enclosed registration Iorm or its photocopy may be
Iilled andsent with registration Iee.
Faculty member/scientist: Rs. 1000/-
Research scholar/student: Rs. 500/-
Industrial participants: Rs. 2000/-
The payment Ior the registration Iees can be made in
the Iorm oI demand draIt drawn in Iavor oI 'Convener
AMRP-2013, or via Net Banking through detail
given below:
A/CNo.: 3260359947
Bank Name: Central Bank oI India
Branch Name: Longowal
IFSCcode: CBIN0283105
Branch code: 283105
All outstation participants will be provided
accommodation in the transit accommodation with
Iollowing charges;
1. Single occupancy Rs. 100 per day
2. Double occupancy- Rs. 60 per day
Lady participants will be accommodated at girl's
hostel with nominal charge.
Scope of conference
Topics covered in conference
TechnicuI sessions
Advanced aterials are materials that are either
designed or processed using newmethods or modiIied
concepts that lead to paradigm shiIts in understanding
and have vast potential Ior application in niche areas.
In a time when research competitiveness is an
increasingly dominant issue to a modern economy, the
development, evaluation, perIormance and marketing
oI advanced materials all become very important. On
the other hand the recent researches in the Iield oI
radiation and their interactions with matter have not
only helped the development in diIIerent Iields in
science and technology but also contributed towards
the improvement oI the quality oI human liIe to a great
extent. All this has become possible with the diIIerent
discoveries and inventions leading to the development
oI various radiation sources and detectors. The core
aim oI this conIerence is to provide an opportunity Ior
the delegates to meet, interact and exchange newideas
in the areas oI advanced materials and radiation
physics.
Nano Structured Materials
Electronic and Photonic Materials
Advanced Polymeric Materials
Materials Computational Methods
Advanced Biomaterials
Optical &Spectroscopy Properties oI Materials
Radiation Measurements & Instrumentation
Radiation Sources, Reactors and Accelerators
Basic Radiation Processes
Applications oI Radiations
Related areas
Technical sessions will consist oI invited talks Irom
leading experts in the Iield and contributory research
papers received Irom researchers, scientists and
technologists Ior oral and poster presentation in the
conIerence.