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Componente i circuite pasive

Facultatea Electronic, Telecomunicaii i Tehnologia informaiei Universitatea Politehnica din Bucureti

Capitole de curs:
1.Propieti generale ale componentelor electronice pasive 2.Rezistoare, 3.Condensatoare, 4.Inductoare, 5.Tehnologie

Componente i circuite pasive

Localul Polizu

D107 i D208

1. Componente electronice pasive Rezistoare, Proprieti, Construcie, Tehnologie, Aplicatii., P. Svasta, V. Golumbeanu, C. Ionescu, Al. Vasile, Ed. Cavallioti, Bucuresti 2011 2. Componente i circuite pasive Condensatoare, Proprieti, Construcie, Tehnologie, Aplicatii., P. Svasta, Al. Vasile, Ciprian Ionescu, V. Golumbeanu, Ed. Cavallioti, Bucureti 2010 3.Componente i circuite pasive Probleme, P. Svasta, Al. Vasile, Ed. Cavallioti, Bucuresti 2010 4. INTERNET:
(Centrul de Electronic Tehnologic i Tehnici de Interconectare)

5. Componente electronice pasive ntrebri i rspunsuri, P. Svasta, V. Golumbeanu, C. Ionescu, N.D. Codreanu, G. Popovici, A. Flechiu, D. Leonescu, litografia U.P.B., 1996 (*)


Notiuni introductive in ingineria modulelor si a microsistemelor electronice

Industria electronic este un motor al inovarii !

The global electronic industry acts as the engine for science, technology, advanced manufacturing, and the overall economy of the countries that participate in it.
Prof. Rao Tumala, Packaging Research Center, Georgia Institute of Technology, Atlanta, Georgia, Past President of IEEE-CPMT Society Fundamentals of Microsystems Packaging, McGraw-Hill, 2001

Locul i rolul componentelor pasive n actuala etap a dezvoltrii microelectronicii; Etapa actual de dezvoltare a electronicii este caracterizat de integrarea pe scar larg a funciilor electronice alturi de altele noi din domenii ca optoelectronica, mecanic, microfluidic, biologie, chimie. Numrul de tranzistoare echivalente a depit legea lui Moore, se vorbete de more than Moore i beyond Moore. n domeniile circuitelor integrate se trece la capsule tridimensionale la utilizarea TSV (Through Silicon Via). Evoluia n domeniul packaging-ului este caracterizat de conceptul SIP System in Package, Un nou domeniu este pe cale s se impun: electronica organica:

Scurta prezentare privind evoluia componentelor electronice pasive

Organic Electronics - Printed Electronics !!!!!!!!

n domeniul componentelor pasive evoluia este orientat spre:

Reducerea dimensiunilor, Creterea frecvenelor de lucru, Mrirea capacitii de dispare a puterii i a gamei de temperatur (cerine speciale pentru industria auto), mbuntirea stabilitii (cu temperatura i ali factori de mediu); creterea fiabilitii, Diversificarea produselor pentru a oferi componenta specific fiecrei aplicaii, Reducerea preului, Utilizarea componentelor pasive integrate, Dezvoltarea de noi componente LEC (Light Emmiting Capacitor), Supercondensatoare. !!!!!!! Componente pasive in electronica organic !!!!!

Evoluii n domeniul electronicii (sursa: J. C. Eloy, EMPC 2009, Rimini)

Electronics packaging has become recognized as a critical technology for the continued growth of the nations electronics industry. 1
Prof. James E. Morris Head of Department of Electrical Engineering, Portland State University, Oregon, USA ______________ 1 A Multidisciplinary Sophomore Course in Electronics Packaging, Proceedings ECTC, May 1998

Electronic Packaging
The engineering discipline that combines the engineering and manufacturing technologies required to convert an electrical circuit into a manufactured assembly. These include at least electrical, mechanical and material design and many functions such as engineering, manufacturing and quality control.
Editura: McGraw-Hill, Inc. New York & all, 1993, ISBN 0-07-026688-3

Electronic Package
The electromechanical assembly resulting from electronic packaging design and manufacture. The level of an electronic package may range from the integrated circuit package assembly to a printed wiring board assembly to a subsystem or system package assembly.


Medicin Comer Logistic Securitate Textile

ansamblul electromecanic rezultat al activitilor de proiectare i fabricaie specifice packagingului electronic de la

Modulul electronic =


Componentei electronice respectiv al circuitului integrat la placa cu circuite imprimate (PCB) asamblat la Subansamble sau produse electronice .

Industrie electronic n Romnia

Nivelul 2 - o ans pentru Romnia

A-E Electronics, Bacau Antrice, Bucuresti Armtech, Curtea de Arges Benchmark Electronics Romania, Ghimbav BKD, Petrosani Celestica, Oradea Connectronics Romania, Oradea Continental, Sibiu, Timisoara, Iasi, Brasov Dasteco, Iasi Delphi Automotive, Moldova Noua, Sannicolau Mare, Ineu Electromagnetica, Bucuresti Elettra Communications, Ploiesti EMS Electra, Iasi Flextronics, Timisoara GDM Electronics Romania, Curtea de Arges Hanil Electronics (Samsung), Biharia Hella Electronics Romania, Arad, Timisoara Honeywell Life Safety, Lugoj

Nivelul 2 - o ans pentru Romnia

Intrarom, Bucuresti IAE, Timisoara Kromberg & Schubert, Sibiu, Medias, Timisoara Kuhnke Automation, Sibiu Leoni Wiring Systems, Arad Marquardt, Sibiu Mibatron, Bucuresti Microsif, Bucuresti Plexus, Oradea Steinel, Curtea de Arges Sumida Romania, Jimbolia Systronics, Arad Topex, Bucuresti Trion Electronics, Curtea de Arges Yazaki Component Technology, Arad, Ploiesti, Timisoara,

Celulele fotovoltaice ale satelitului GOLIAT

Building block technology of the information age

Technology package trend 1970 2011

Source: F. Pasolini, EMPC 2009,

Semilogaritmic Moores plots of the Roadmap data

Porti / Chip

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The twenty-first century will be characterized by revolutionary changes in communication, computing, and consumer electronics. Today's product, from cellular phones to personal digital assistants to multimedia and networks computers, represent the top of the iceberg of a set of products that will dramatically change the way the World does business and communicates.
Prof. Rao Tumala, Packaging Research Center, Georgia Institute of Technology, Atlanta, Georgia, Past President of IEEE-CPMT Society
Universitatea Politehnica din Bucureti Centrul de Electronic Tehnologic i Tehnici de Interconectare

Electronics in automotive

Vehicle environmental zone

Despre module si micro module electronice

Structure of a Second level EP

Electro-mechanical parts, Mechanical parts, Electronic components

Subsystem Electronic module


Detail of an electronic module content:

standard components dedicated components (PCB)

electronic technologies

Standardized components
developed and manufactured by specialized producers. (examples: IC, Discrete active and passive components etc)

Dedicated components
developed by company itself according to the application requirements. (examples: PCB, integrated passives etc

Education and Training

Criterii de proiectare a cablajelor imprimate




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TIE Project

Interconnection Techniques in Electronics-TIE is a major project established to promote eSkills of students in electrical & electronics engineering education. The topics are focused on CAD

activities for electronic design of modules and micromodules. TIE was developed to cover the presence of all universities
involved in electrical & electronics engineering education in Romania. Because English is the TIE official language, the event is open towards all European universities. The Budapest University for Technology and Economics from Hungary has a constant participation in the last years. TIE is highly appreciated by the IEEE CPMT Society and is strongly supported by its IEEE CPMT Hu&Ro Joint Chapter. TIE, in fact, aims to raise awareness the growing demand of highly skilled ICT practitioners and users in industry in a domain with high added value products, like electronics industry is.

In this perspective, one of TIEs committees, the


Advisory Committee (IAC),

composed only by professionals coming from well known companies (Continental Automotive, Siemens, Microchip, etc), works closely with the Technical Program Committee for preparing the topics, the subjects, and the evaluation sheets of the competitors. At the end of the event, IAC establishes the level over which the participants are considered to have an accepted knowledge to be considered PCB designers, able to participate in industrial design teams and companies. The TIE project offers to students an extra-

curricular environment for gaining design skills in CAE-CAD-CAM for electronics. The acquired knowledge
and competence represent one of the main elements destined to promote the mandatory electronic industrial requirements in engineering education and training. Through this, the event provides by academia a concrete answer to the European Europe 2020 strategy.

Posterul evenimentul ui TIE 2012

Poster TIE

Componente electronice pasive

Componente pasive
scurt prezentare

Electronica 2008
Messe Mnchen - Germania



Activiti extracurriculare destinate cercetrii n domeniul ingineriei electronice cu accent pe problematica CCP

Programul Minerva

Programul Minerva reprezinta o activitate extra curriculara ce isi propune sprijinirea studentilor anului I ai facultatii ETTI interesati sa fie implicarea in proiecte de ce reprezinta o initiere intr-o activitate de cercetare orientata asupra problematicii componentelor electronice pasive. Programul este promovat cu ajutorul Chapterului studentesc al Societatii CPMT din cadrul IEEE ce a fost constituit in Universitatea Politehnica din Bucuresti in 2001. Se urmareste prin intermediul proiectelor programului, la cei ce participa si isi finalizeaza tema de proiect, dezvoltarea de abilitati privind cautarea si structurarea informatiei precum si capacitatea de a expune, intr-un mod cat mai profesional, rezultatele muncii depuse. Se doreste sa se dezvolte participantilor la program capacitatea studentilor de a lucra in echipe, pe care ei si le formeaza, de a conduce activitatea echipei etc. * !!!!!!!!!!!!!!!!!!!!!

SBCs Site



ECTC 2003 SBCs Awarding- Diploma


Slide 68 PS3
Paul Svasta, 24 February 07

Aprecierea cunotinelor dobndite


RN1 Nota finala a unei discipline rezulta prin nsumarea punctelor alocate fiecrei activitii din cadrul disciplinei (puncte ale cror suma este 100). Punctajul minim pentru promovarea unei discipline este de 50 puncte. RN3 Tipurile de activiti ale unei discipline care se puncteaz si modul de atribuire a celor 100 de puncte aferente tuturor activitilor disciplinei trebuie sa fie comunicate studenilor (prin ghidul studentului) la nceputul fiecrui an universitar, odat cu semnarea Contractului de studii si confirmate de fiecare titular de disciplina la nceputul semestrului. RN5 O disciplina are o singura nota finala. RN7 Pentru disciplinele prevzute cu verificare pe parcurs (fr examen) ultima evaluare va avea alocate cel mult 20 p.c. (din 100 puncte) si se va desfura n sptmnile 13 sau 14.

Activiti ce sunt notate in cadrul disciplinei CCP


Nr. puncte

1 Activiti legate de pregtirea si efectuarea lucrrilor de laborator

1.1. 1.2.

Pregtirea lucrrii de laborator ce urmeaz a fi efectuata in ziua respectiva(1pct/ref.) 5 ntocmirea si susinerea referatului de laborator (3 pct. / referat) 15


2 Rezolvare de probleme
2. 1. 2. 2.

Predarea unui set de 10 probleme din culegere de probleme CCP cap I+II Predarea unui set de 10 probleme din culegere de probleme CCP cap III+IV+V

2 3


3 Testarea cunotinelor teoretice si a nsuirii de a rezolva probleme

3.1. 3.2.

Test I cu noiuni teoretice si probleme asemntoare celor din cap I+II Test II cu noiuni teoretice si probleme asemntoare celor din cap III+IV+V

8 7

4 Tema de cas 5 Colocviu TOTAL I activitate in timpul semestrului 6 Verificare final in sptmna 13 si 14 Total II puncte = nota 10 1. Participarea la programul MINERVA se noteaz cu un bonus 0.......20 puncte 2. Bonusul se acorda numai in cazul obinerii a minim 65 puncte dintre care minim 10 puncte la verificarea finala

15 10 30 80 20 100

Industria electronic este de mare importan pentru dezvoltarea societii; Resursa uman este un factor esenial n succesul realizrii unei industrii electronice performante; Profesia de inginer n domeniul industriei electronice este att de actualitate ct i de perspectiv oriunde n lume; Exist n facultatea noastr bune premize, materiale i umane, pentru formarea unor inginere/ingineri cu o pregtire competitiv.