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See mechanical drawings for dimensions.

NC No internal connection
DBV PACKAGE
(TOP VIEW)
2
5
3 4 Y
1
B
GND
A V
CC
DCK PACKAGE
(TOP VIEW)
3 4 GND
2 B
Y
1 A 5 V
CC
DRL PACKAGE
(TOP VIEW)
2 B
1 A
3 4 GND Y
5 V
CC
YZP PACKAGE
(BOTTOM VIEW)
2
B
1
A
GND
4 3
Y
5
V
CC
DRY PACKAGE
(TOP VIEW)
B NC
A
6
5
4
2
3
GND
Y
V
CC
1

Y = A B or Y = + A B

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t
h
t
su
From Output
Under Test
C
(see Note A)
L
LOAD CIRCUIT
S1
V
LOAD
Open
GND
R
L
Data Input
Timing Input
0 V
0 V
0 V
t
W
Input
0 V
Input
Output
Waveform 1
S1 at V
(see Note B)
LOAD
Output
Waveform 2
S1 at GND
(see Note B)
V
OL
V
OH
0 V
0 V
Output
Output
t /t
PLH PHL
Open
TEST S1
Output
Control
V
M
V
M
V
M
V
M
V
M
1.8 V 0.15 V
2.5 V 0.2 V
3.3 V 0.3 V
5 V 0.5 V
1 MW
1 MW
1 MW
1 MW
V
CC
R
L
2 V
CC
2 V
CC
6 V
2 V
CC
V
LOAD
C
L
15 pF
15 pF
15 pF
15 pF
0.15 V
0.15 V
0.3 V
0.3 V
V
D
3 V
V
I
V
CC
/2
V
CC
/2
1.5 V
V
CC
/2
V
M
2 ns
2 ns
2.5 ns
2.5 ns
INPUTS
R
L
t /t
r f
V
CC
V
CC
V
CC
V
LOAD
t /t
PLZ PZL
GND t /t
PHZ PZH
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
LOW- AND HIGH-LEVEL ENABLING
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
INVERTING AND NONINVERTING OUTPUTS
NOTES: A. C includes probe and jig capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR 10 MHz, Z = 50 .
D. The outputs are measured one at a time, with one transition per measurement.
E. t and t are the same as t .
F. t and t are the same as t .
G. t and t are the same as t .
H. All parameters and waveforms are not applicable to all devices.
L
O
PLZ PHZ dis
PZL PZH en
PLH PHL pd
W
VOLTAGE WAVEFORMS
PULSE DURATION
VOLTAGE WAVEFORMS
SETUP AND HOLD TIMES
V
I
V
I
V
I
V
M
V
M
V /2
LOAD
t
PZL
t
PLZ
t
PHZ
t
PZH
V V
OH D
V + V
OL D
V
M
V
M V
M
V
M
V
OL
V
OH
V
I
V
I
V
OH
V
OL
V
M
V
M
V
M
V
M
t
PLH
t
PHL
t
PLH
t
PHL

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t
h
t
su
From Output
Under Test
C
(see Note A)
L
LOAD CIRCUIT
S1
V
LOAD
Open
GND
R
L
Data Input
Timing Input
0 V
0 V
0 V
t
W
Input
0 V
Input
Output
Waveform 1
S1 at V
(see Note B)
LOAD
Output
Waveform 2
S1 at GND
(see Note B)
V
OL
V
OH
0 V
0 V
Output
Output
TEST S1
t /t
PLH PHL
Open
Output
Control
V
M
V
M
V
M
V
M
V
M
1.8 V 0.15 V
2.5 V 0.2 V
3.3 V 0.3 V
5 V 0.5 V
1 kW
500 W
500 W
500 W
V
CC
R
L
2 V
CC
2 V
CC
6 V
2 V
CC
V
LOAD
C
L
30 pF
30 pF
50 pF
50 pF
0.15 V
0.15 V
0.3 V
0.3 V
V
D
3 V
V
I
V
CC
/2
V
CC
/2
1.5 V
V
CC
/2
V
M
2 ns
2 ns
2.5 ns
2.5 ns
INPUTS
R
L
t /t
r f
V
CC
V
CC
V
CC
V
LOAD
t /t
PLZ PZL
GND t /t
PHZ PZH
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
LOW- AND HIGH-LEVEL ENABLING
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
INVERTING AND NONINVERTING OUTPUTS
NOTES: A. C includes probe and jig capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR 10 MHz, Z = 50 .
D. The outputs are measured one at a time, with one transition per measurement.
E. t and t are the same as t .
F. t and t are the same as t .
G. t and t are the same as t .
H. All parameters and waveforms are not applicable to all devices.
L
O
PLZ PHZ dis
PZL PZH en
PLH PHL pd
W
VOLTAGE WAVEFORMS
PULSE DURATION
VOLTAGE WAVEFORMS
SETUP AND HOLD TIMES
V
I
V
I
V
I
V
M
V
M
V /2
LOAD
t
PZL
t
PLZ
t
PHZ
t
PZH
V V
OH D
V + V
OL D
V
M
V
M V
M
V
M
V
OL
V
OH
V
I
V
I
V
OH
V
OL
V
M
V
M
V
M
V
M
t
PLH
t
PHL
t
PLH
t
PHL

PACKAGING INFORMATION
Orderable Device Status
(1)
Package
Type
Package
Drawing
Pins Package
Qty
Eco Plan
(2)
Lead/Ball Finish MSL Peak Temp
(3)
SN74LVC1G08DBVR ACTIVE SOT-23 DBV 5 3000 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN74LVC1G08DBVRE4 ACTIVE SOT-23 DBV 5 3000 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN74LVC1G08DBVRG4 ACTIVE SOT-23 DBV 5 3000 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN74LVC1G08DBVT ACTIVE SOT-23 DBV 5 250 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN74LVC1G08DBVTE4 ACTIVE SOT-23 DBV 5 250 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN74LVC1G08DBVTG4 ACTIVE SOT-23 DBV 5 250 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN74LVC1G08DCKR ACTIVE SC70 DCK 5 3000 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN74LVC1G08DCKRE4 ACTIVE SC70 DCK 5 3000 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN74LVC1G08DCKRG4 ACTIVE SC70 DCK 5 3000 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN74LVC1G08DCKT ACTIVE SC70 DCK 5 250 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN74LVC1G08DCKTE4 ACTIVE SC70 DCK 5 250 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN74LVC1G08DCKTG4 ACTIVE SC70 DCK 5 250 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN74LVC1G08DRLR ACTIVE SOT DRL 5 4000 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN74LVC1G08DRLRG4 ACTIVE SOT DRL 5 4000 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN74LVC1G08DRYR ACTIVE SON DRY 6 5000 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN74LVC1G08DRYRG4 ACTIVE SON DRY 6 5000 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN74LVC1G08YZPR ACTIVE DSBGA YZP 5 3000 Green (RoHS &
no Sb/Br)
SNAGCU Level-1-260C-UNLIM
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
PACKAGE OPTION ADDENDUM
www.ti.com 1-Dec-2008
Addendum-Page 1
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF SN74LVC1G08 :

Automotive: SN74LVC1G08-Q1

Enhanced Product: SN74LVC1G08-EP

NOTE: Qualified Version Definitions:

Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects

Enhanced Product - Supports Defense, Aerospace and Medical Applications

PACKAGE OPTION ADDENDUM
www.ti.com 1-Dec-2008
Addendum-Page 2
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type
Package
Drawing
Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0 (mm) B0 (mm) K0 (mm) P1
(mm)
W
(mm)
Pin1
Quadrant
SN74LVC1G08DBVR SOT-23 DBV 5 3000 178.0 9.0 3.23 3.17 1.37 4.0 8.0 Q3
SN74LVC1G08DBVR SOT-23 DBV 5 3000 180.0 9.2 3.23 3.17 1.37 4.0 8.0 Q3
SN74LVC1G08DBVT SOT-23 DBV 5 250 180.0 9.2 3.23 3.17 1.37 4.0 8.0 Q3
SN74LVC1G08DCKR SC70 DCK 5 3000 180.0 9.2 2.24 2.34 1.22 4.0 8.0 Q3
SN74LVC1G08DCKR SC70 DCK 5 3000 178.0 9.0 2.4 2.5 1.2 4.0 8.0 Q3
SN74LVC1G08DCKT SC70 DCK 5 250 180.0 9.2 2.24 2.34 1.22 4.0 8.0 Q3
SN74LVC1G08DRLR SOT DRL 5 4000 180.0 9.2 1.78 1.78 0.69 4.0 8.0 Q3
SN74LVC1G08DRYR SON DRY 6 5000 179.0 8.4 1.2 1.65 0.7 4.0 8.0 Q1
SN74LVC1G08YZPR DSBGA YZP 5 3000 180.0 8.4 1.02 1.52 0.66 4.0 8.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 28-Nov-2008
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
SN74LVC1G08DBVR SOT-23 DBV 5 3000 565.0 140.0 75.0
SN74LVC1G08DBVR SOT-23 DBV 5 3000 205.0 200.0 33.0
SN74LVC1G08DBVT SOT-23 DBV 5 250 205.0 200.0 33.0
SN74LVC1G08DCKR SC70 DCK 5 3000 205.0 200.0 33.0
SN74LVC1G08DCKR SC70 DCK 5 3000 565.0 140.0 75.0
SN74LVC1G08DCKT SC70 DCK 5 250 205.0 200.0 33.0
SN74LVC1G08DRLR SOT DRL 5 4000 202.0 201.0 28.0
SN74LVC1G08DRYR SON DRY 6 5000 220.0 205.0 50.0
SN74LVC1G08YZPR DSBGA YZP 5 3000 220.0 220.0 34.0
PACKAGE MATERIALS INFORMATION
www.ti.com 28-Nov-2008
Pack Materials-Page 2