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MODELS FOR INTEGRATED-CIRCUIT ACTIVE DEVICES PN Junctions - Step Junction Barrier potential NAND NAND kT NAND o = q ln ni2 = Vt ln ni2 = UT ln ni2 Depletion region widthsW1 = W2 = 2si(o-vD)ND qNA(NA+ND) 2si(o-vD)NA qND(NA+ND)
1 N
Cj
1 o-vD =
Cj0 vD 1 - o
Fig. 010-01
Cj0 0
0 vD
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Above expressions become: Depletion region widths 2si(o-vD)ND m W1 = 1 m qND(NA+ND) W 2si(o-vD)NA N m W2 = qND(NA+ND) Depletion capacitance siqNAND 1 Cj0 m Cj = A2(NA+ND) -v m = vD o D m 1 o where 0.33 m 0.5.
ECE 6412 - Analog Integrated Circuits and Systems II
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Large Signal Model for the BJT in the Forward Active Region Large-signal model for a npn transistor:
iB B + FiB E v iB = Is exp BE F Vt Assumes vBE is a constant and iB is determined externally C vBE E + VBE(on) E B C FiB E
Fig.010-04
iB C VBE(on) + E
vBE E
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The Ebers-Moll Equations The reciprocity condition allows us to write, FIEF = RICR = IS Substituting into a previous form of the Ebers-Moll equations gives, IS vBE vBC iC = IS exp Vt + 1 -R exp Vt + 1 and IS vBE vBC iE =-F exp Vt + 1 +IS exp Vt + 1 These equations are valid for all four regions of operation of the BJT. Also: Dependence of F as a function of collector current The temperature coefficient of F is, 1 F TCF = F +7000ppm/C
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Simple Small Signal BJT Model Implementing the above relationships, ic = gmvi + govce, and vi = rib, into a schematic model gives,
C B B + vi E ib
r
ic gmvi
ro
C + vce E B
E Fig. 010-06
Note that the small signal model is the same for either a npn or a pnp BJT. Example: Find the small signal input resistance, Rin, the output resistance, Rout, and the voltage gain of the common emitter BJT if the BJT is unloaded (RL = ), vout/vin, the dc collector current is 1mA, the Early voltage is 100V, and = 100 at room temperature. IC 1mA o 1 gm = Vt = 26mV = 26 mhos or Siemans Rin = r = gm = 10026 = 2.6k VA 100V vout Rout = ro = IC = 1mA = 100k vin = -gm ro = - 26mS100k = -2600V/V
ECE 6412 - Analog Integrated Circuits and Systems II P.E. Allen - 2002
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rex E E
Fig. 010-07
The capacitance, C, consists of the sum of Cje and Cb. C = Cje +Cb
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Example 1 Derive the complete small signal equivalent circuit for a BJT at IC = 1mA, VCB = 3V, and VCS = 5V. The device parameters are Cje0 = 10fF, ne = 0.5, 0e = 0.9V, C0 = 10fF, nc = 0.3, 0c = 0.5V, Ccs0 = 20fF, ns = 0.3, 0s = 0.65V, o = 100, F = 10ps, VA = 20V, rb = 300, rc = 50, rex = 5, and r = 10oro. Solution Because Cje is difficult to determine and usually an insignificant part of C, let us approximate it as 2Cje0. Cje = 20fF C0 Ccs0 10fF 20fF C = V = and Ccs = V = 0.3 = 5.6fF 0.3 = 10.5fF 3 5 CB CS ne ns 1+ 1+ 1+ 1+ 0.5 0.65 0c 0s IC 1mA gm = Vt = 26mV = 38mA/V Cb = F gm = (10ps)(38mA/V) = 0.38pF C = Cb + Cje = 0.38pF + 0.02pF = 0.4pF o VA 20V r = gm = 10026 = 2.6k, ro = IC = 1mA = 20k and r = 10ro = 20M
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Transition Frequency, fT fT is the frequency where the magnitude of the short-circuit, common-emitter current =1. Circuit and model:
io rb ii ii C r + v1 C gmv1 ro Ccs rc io
Fig.010-08
Assume that rc 0. As a result, ro and Ccs have no effect. r gm r Io (j ) o V11+r(C+C)s Ii and IogmV1 Ii(j) = (C+C)s = (C+C)s 1+gmr gm 1+ o gm I o ( j ) o Now, ( j ) = I i ( j ) = (C+C)j 1+ o gm At high frequencies, gm gm 1 gm (j) j (C+C) When | (j)| =1 then T = C+C or fT = 2 C+C
ECE 6412 - Analog Integrated Circuits and Systems II P.E. Allen - 2002
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Fig. 010-09
Incorporating the channel modulation effect: vGS 2 iD = IDSS 1 - Vp vDS vGS-Vp (1+vDS) , Signs for the JFET variables: Type of JFET p-channel n-channel Vp Positive Negative IDSS Negative Positive vGS Normally positive Normally negative
P.E. Allen - 2002
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ro
Fig.010-10
Parameters: V GS diD | 2IDSS VGS gm = dvGS Q = - Vp 1- Vp = gm0 1- V p where 2IDSS gm0 = - V p V GS diD | 1 2 ro = dvDS Q = IDSS1- Vp ID Typical values of IDSS and Vp for a p-channel JFET are -1mA and 2V, respectively. With = 0.02V-1 and ID = 1mA we get gm = 1mA/V or 1mS and ro = 50k.
ECE 6412 - Analog Integrated Circuits and Systems II P.E. Allen - 2002
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Frequency Dependent JFET Small Signal Model Complete small signal model:
D G S G Cgss + vgs S
id vds
D + G
Fig.010-11
All capacitors are reverse biased depletion capacitors given as, Cgs0 Cgs = V (capacitance from source to top and bottom gates) GS1/3 1+ o Cgd0 Cgd = V (capacitance from drain to top and bottom gates) GD1/3 1+ o Cgss0 Cgss = V (capacitance from the gate (p-base) to substrate) GSS 1/2 1+ o gm 1 fT = 2 Cgs+Cgd+Cgss = 30MHz if gm = 1mA/V and Cgs+Cgd+Cgss = 5pF
ECE 6412 - Analog Integrated Circuits and Systems II P.E. Allen - 2002
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Simple Large Signal MOSFET Model D N-channel reference convention: + Non-saturationiD WoCox vDS2 G B vDS (vGS - VT)vDS (1 + vDS) , 0 < vDS < vGS - VT iD = L + + 2 vGS vBS Saturation- 2 S Fig. 010-12 WoCox vDS(sat) iD = L (v - VT)vDS(sat) 2 (1 + vDS) GS WoCox = 2L (vGS - VT) 2 (1 + vDS), 0 < vGS - VT < vDS where: o = zero field mobility (cm2/voltsec) Cox = gate oxide capacitance per unit area (F/cm2) = channel-length modulation parameter (volts-1) VT = VT0 + 2|f| 2|f| + |vBS| VT0 = zero bias threshold voltage = bulk threshold parameter (volts-0.5) 2|f| = strong inversion surface potential (volts) For p-channel MOSFETs, use n-channel equations with p-channel parameters and invert current.
ECE 6412 - Analog Integrated Circuits and Systems II P.E. Allen - 2002
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G S
G S
gmvgs
gmbsvbs
+D vds S
Fig. 010-13
where diD | diD | iD gm dvGS Q = (VGS-VT) = 2ID gds dvDS Q = 1 + vDS iD vGS i D vT D i gm D and gmbs = vBS Q = vGS vBS = - vTvBS = = gm Q Q 2 2|F| - VBS Simplified schematic model:
id D G S G S D G + vgs rds
gmvgs
gm 10gmbs 100gds
P.E. Allen - 2002
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MOSFET Depletion Capacitors - CBS and CBD Model: Polysilicon gate CJAS CJSWPS H G CBS = MJ + MJSW, vBS FCPB vBS vBS C 1 1 D PB PB Source Drain and F CJAS VBS E CBS = 1+MJ 1 - (1+MJ)FC + MJ PB B A 1- FC SiO2 Bulk CJSWPS VBS Fig. 010-14 + 1+MJSW 1 - (1+MJSW)FC + MJSW PB , Drain bottom = ABCD 1 FC Drain sidewall = ABFE + BCGF + DCGH + ADHE CBS vBS> FCPB where AS = area of the source vBS FCPB PS = perimeter of the source vBS FCPB PB CJSW = zero bias, bulk source sidewall capacitance vBS MJSW = bulk-source sidewall grading coefficient FCPB Fig 010-15 For the bulk-drain depletion capacitance replace "S" by "D" in the above equations.
ECE 6412 - Analog Integrated Circuits and Systems II P.E. Allen - 2002
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MOSFET Intrinsic Capacitors - CGD, CGS and CGB Cutoff Region: Cutoff CGB=C2+2C5=Cox(Weff)(Leff) +2CGBO(Leff) VB = 0 CGS = C1 Cox(LD)Weff) = CGSO(Weff) CGD = C3 Cox(LD)Weff) = CGDO(Weff) p+ Saturation Region: p- substrate CGB = 2C5 = CGBO(Leff) Saturated VB = 0 CGS = C1+(2/3)C2 = Cox(LD+0.67Leff)(Weff) = CGSO(Weff) + 0.67Cox(Weff)(Leff) p+ CGD = C3 Cox(LD)Weff) = CGDO(Weff) p- substrate Active Region: CGB = 2 C 5 = 2CGBO(Leff) Active VB = 0 CGS = C1 + 0.5C2 = Cox(LD+0.5Leff)(Weff) = (CGSO + 0.5CoxLeff)Weff p+ CGD = C3 + 0.5C2 = Cox(LD+0.5Leff)(Weff) p- substrate = (CGDO + 0.5CoxLeff)Weff
ECE 6412 - Analog Integrated Circuits and Systems II
CGS
VS = 0
n+
VS = 0 CGS
n+
VS = 0 CGS
n+
VD > 0 CGD n+
CGB
VG >VT
Polysilicon
Inverted Region
VG >VT
Polysilicon
Inverted Region
Fig 010-16
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Small-Signal Frequency Dependent Model The depletion capacitors are found by evaluating the large signal Cgd capacitors at the DC operating point. G + Cgs The charge storage capacitors are vgs gmvgs gmbsvbs constant for a specific region of Cgb S operation. vbs Cbs Gainbandwidth of the MOSFET: + Assume VSB = 0 and the MOSFET B is in saturation, gm 1 1 gm fT = 2 Cgs + Cgd 2 Cgs Recalling that 2 W Cgs 3 CoxWL and gm = oCox L (VGS-VT) gives 3 o fT = 4 L2 (VGS-VT)
id
rds
+ vds S
Cbd
Fig 010-17
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Subthreshold MOSFET Model Weak inversion operation occurs when the applied gate voltage is below VT and pertains to when the surface of the substrate beneath the gate is weakly inverted.
n+
Fig. 010-18
Regions of operation according to the surface potential, S. S < F : Substrate not inverted F < S < 2F : Channel is weakly inverted (diffusion current) 2F < S : Strong inversion (drift current) Drift current versus diffusion current in a MOSFET:
log iD Diffusion Current 10-6 Drift Current
10-12
VT
V Fig. 010-19 GS
P.E. Allen - 2002
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Large-Signal Model for Subthreshold Model: W v /nV iD = Kx L e GS t(1 - e-vDS/Vt)(1 + vDS) where Kx is dependent on process parameters and the bulk-source voltage n 1.5 - 3 and iD kT VGS=VT Vt = q 1A If vDS > 0, then W v /nV VGS<VT iD = Kx L e GS t (1 + vDS) Small-signal model: vDS 0 iD | qID 0 1V gm = vGS Q = nkT Fig 010-20 iD | ID gds = vDS Q VA
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SUMMARY Models - Large-signal - Small-signal Components - pn Junction - BJT - MOSFET Strong inversion Weak inversion - JFET Capacitors - Depletion - Parallel plate