Characterization of Cu Free Air Ball Constitutive Behavior using Microscale Compression Test

Sai Sudharsanan Paranjothy, 1Yuvraj Singh, 1Allen Tippman, 1Hung-Yun Lin, 1Ganesh Subbarayan, 2 Dae Young Jung, 2Bahgat Sammakia 1 School of Mechanical Engineering, Purdue University, West Lafayette, IN 47907 2 S3IP Center, Binghamton University, Binghamton, NY 13902 Email:!ganeshs@purdue.edu

Abstract- In recent years, there is increasing interest in copper wirebond technology as an alternative to gold wirebond in microelectronic devices due to its superior electrical performance and low cost. At present, validated constitutive models for the strain rate and temperature dependent behavior of Cu free air ball (FAB) appear to be largely missing in the literature. The lack of reliable constitutive models for the Cu FAB has hampered the modeling of the wirebonding process and the ability to assess risk of fracture in ultra low-k dielectric stacks. The challenge to FAB characterization is primarily due to the difficulty in performing mechanical tests on spherical FAB of micrometers in size. To address this challenge, we perform compression tests on FAB using custom-built microscale tester in the current study. Specifically, the tester has three closed-loop controlled linear stages with submicron resolutions, a manual tilt stage, a six-axis load cell with sub-Newton load resolution for eliminating misalignment, a milliNewton resolution load cell, a capacitance sensor to estimate sample deformation and to control the vertical stage in closed loop, a high working depth camera for viewing the sample deformation, and controllers for the stages implemented in the LabVIEW environment. We compress the FAB between tungsten carbide punches and develop a constitutive model for the copper of FAB through an inverse modeling procedure. In the inverse procedure, the assumed constitutive model parameter values are iterated until the load-displacement response matches the experimentally observed response. KEY WORDS: Copper FAB, Constitutive modeling, Experimental Characterization NOMENCLATURE A- Pre-exponential factor, s-1 a- Contact radius of the circular contact area a- Strain rate sensitivity of h0 C-Strength Index in power-law relationship E - Young's Modulus, 128 GPa E* - Effective Young's Modulus Es - Secant Modulus h0- Hardening or softening constant, MPa K-Dimensionless constant m- Strain hardening index in power-law relationship m- Strain rate sensitivity of stress n- Dimensionless constant n- Strain rate sensitivity of s P - Total load, N p0 - Maximum pressure at the centre of contact area
Py -Critical load at onset of plastic yielding

R- Radius of the copper free air ball R-Universal gas constant, KJ/(mole-K ) s0-Initial value of deformation resistance, MPa - coefficient of deformation resistance saturation value, MPa s V- Velocity of the Punch, mm/min Y- Yield strength of pure copper, 70 MPa GREEK SYMBOLS ! - Hertz approach/ displacement

! y -Critical displacement at onset of plastic yielding

! - Strain along the axis of compression
! p - Plastic strain rate ! ! - Absolute temperature ! - Poisson's ratio, 0.3 ! - Stress Multiplier ! - Stress along the axis of compression

INTRODUCTION Copper wirebond technology is of increasing interest due to its superior electrical properties and cost effectiveness. Though 87% of the connections in integrated microelectronic devices are realized by wire bonding [1], a constitutive model to describe the copper FAB behavior at different strain rates is largely missing in the literature at present. The constitutive behavior of Free Air Ball material is of critical importance in assessing the risk of cracking of the brittle dielectric stack on the chip. Although nano-indentation tests are common for micron scale objects such as the FAB, the hardness values are by themselves of relatively little use in modeling wirebonding process or in assessing the risk of fracture in chip dielectric stacks. The difficulty in characterizing the FAB is related to its spherical shape and micron scale diameter, which makes it difficult to obtain stress-strain behavior directly from standard compression tests. Free Air Balls are formed by the process of "electronic flame off", which results in a material of coarse grain structure [2]. Thus, the behavior of the unprocessed wire cannot be used to form constitutive models of the Cu FAB. In this paper, the experimental characterization of Cu FAB of diameter of 25 microns is presented at low and intermediate strain rates (0.001s -1-4 s -1). A custom microscale tester was constructed to enable the testing of the FAB under intermediate strain rate conditions. Elastic and Elasto-plastic contact theories are applied to understand the forcedisplacement behavior. Then, through finite element modeling (FEM), viscoplastic constitutive model (Anand's Model) parameters are iterated until the obtained P- ! response matches with the experimental response obtained at both low and intermediate strain rates.

Q- Activation Energy, KJ/mol

EXPERIMENTAL SETUP The microtester has three linear stages to effect movement along three axes. The X and the Y stages have a resolution of 0.1 !m, aiding in the precise placement of micron sized FAB under the punch. Mounted on these stages is a tilt stage of resolution 2 arcseconds to ensure parallelism between faces of tungsten carbide punches. There are two load cells, one of resolution 50mN attached to the tungsten carbide base to account for the extraneous forces due to misalignments and second of resolution 0.2 mN measuring the compressive force during the tests. The Z-stage has a resolution of 0.03 !m, to enable compressing the FAB of 25!m diameter with sufficient displacement increments to characterize the material. Attached to the Z-stage is a capacitance sensor with sub-micron resolution, which helps to measure displacements while discounting machine compliance. The apparatus is controlled in closed-loop based on the capacitive feedback via a LabVIEW program. The program controls the displacements through PID feedback loop to eliminate compliance. To eliminate tangential loading on the Cu FAB, the effects of friction had to be eliminated from the surfaces of the tungsten carbide punches. Thus, Surface finishing operations were performed on their surfaces with diamond paste, until a surface finish tolerance of about one micron was achieved. The compression tests were monitored through a high depth camera. The experimental set up is shown in Figure 1.

contact pressure, which is of parabolic form, is integrated to obtain a relation between force and the contact radius. Then, through assumptions of elastic half space and mutual approach of distant points, a relation between displacement and contact radius is established. The contact radius is then eliminated between both equations, establishing a relation between force and displacement [3]. The axisymmetric Hertz pressure is of the form [3]

,0 " r " a 2) a which results in the following normal displacement and contact force! !!
uz =
a

p ( r ) = p0 (1 ! r

1/2

(1)

! p0 (2a " r )
2 2

4aE

(2)
2

(3) 3 0 Through theory of mutual approach of distant points # 1 $ 2 (4) uz = ! " % &r ' 2R ( Equating the displacements and substituting for pressure, we arrive at the following load displacement relationship [3]. 4 * 1/ 2 3/ 2 E * (5) P = E R ! , where E = 2 3 1 #"

P = " p ( r )2! rdr =

p 0! a

Figure 2 Hertz Model for small displacements

The above relationships are valid only under the assumptions of elasticity and small strain. Predicted P- ! response by Hertz model is shown along with the experimentally observed values for different strain rates in Figure 3. The forces predicted by the elastic model are significantly higher than the experimentally observed values. Elasto-Plastic Deformation As the contact force increases, the stresses in the Cu FAB eventually reach the point of yielding. Thornton [4] suggested that the contact pressure distribution follows Hertz law until the critical limit, beyond which the onset of plastic yielding occurs and the pressure distribution follows a truncated pattern. Johnson [3] arrived at the critical load and displacement at which this occurs using Von Mises criteria. He calculated the critical pressure at which this happens as 1.6Y, where Y is the yield strength of the material. The corresponding critical displacement and force given by that value of pressure are 1 R 2 (6) !y = (" Y ) *2 4E

Figure 1 Experimental Setup.

CONTACT LAWS Elastic Deformation While compressing the comparatively softer Cu FAB with a stiff and flat surfaced punch, the contact area is assumed circular under elastic limits. In most contact theories, the procedure to arrive at the P- ! relations is similar. The normal

The values of critical force and displacement were calculated to be 1.4x10-8 N and 7.6x10-9 mm respectively. Thus, all the measurements made could be assumed to be in the plastic region. Thornton [5] gave the force displacement relationship after the onset of plastic yielding as (8) P = Py + ! YR (" # " y ) Though the magnitude of the predicted forces was comparable in value to the observed experimental values, Thornton model predicts a linear P- ! response, which does not match the observed response. Thus, new material parameters are analytically estimated to match the observed response and a comprehensive numerical model was built to capture the rate dependent behavior. CONSTITUTIVE LAWS Ramberg-Osgood Law A power law type relationship was first attempted between stress and strain [6].

# 3 Py = $ * % (! Y ) ! 6& E '

1" R

!!!!!!!!!"#$!

values of n are shown in Figure 3. Using Equating (11) and the above form of force, m for different punch velocities were calculated as
Table 1 Estimated parameter m of Ramberg-Osgood Model

V (mm/min) m

0.002 0.33

0.01 0.23

0.1 0.17

6 0.10

! = C"

(9) (10)

By replacing Young's modulus by Secant modulus and substituting the above relation in Equation (8)
1 R P= 6 C! m "1

$! & ("

% m #1 ' = C" = E s )

( )

1 R (# Y ) (1 " $ ) + # YR% " 4 C! m "1

3 2 2

( )

(# Y ) (1 " $ )
3 2

!!

& R ' 3 2 2 = ! YR" % ( m %1 ) (! Y ) (1 % # ) !! !!!!!!!!!!!!!!!!!!!!!"%%$! 12 * C$ +

1
Where " =

!
D

Viscoplasticitic Constitutive models The theories of viscoplasticity describe the rate dependent behavior of a material. Viscoplastic materials differ from rateindependent plasticity in one aspect, for same strain, the stress is higher for a higher strain rate. In both rate-independent plasticity and in viscoplasticity, the concept of yield surface plays a pivotal role [6]. For a material such as copper, the concept of yield limit is no longer strictly applicable even in the absence of rate effects and the stress-strain curves contain no discernible elastic limits. Thus, a 'unified' viscoplastic model was chosen to characterize the behavior of copper FAB. In unified theories, yielding is not a separate criterion, but a consequence of constitutive law. Though a sizable literature exists on viscsoplastic laws, the choice of the model depends on its ability to include tractable number of state variables as well as its ability to predict a range of experimentally observed strain rate and temperature dependent behavior. Here, Anand's model [7] was chosen both for its simplicity and for the ease in implementation in a finite element package. The theoretical basis for most models arise from Kocks' discussion of thermodynamics of slip [8,9]. The single internal variable 's' in Anand's model represents 'averaged isotropic resistance' [7] to plastic flow due to strengthening mechanisms such as dislocation density and grain size effects [10]. There are two governing equations in the model, one is the flow equation

, D being the diameter of the FAB

! p = A " exp ! Q !

$ #

( )
R!

%(! " + m '* & ) s,

(12)

and the second is the evolution equation for the internal variable
a " " s% s % p ! ! = h0 $ sign $ 1 ! ' . 1 ! s '! $ & ' s # s # &

(13)

Figure 3 The compressive load response obtaind using Hertz model as well as a finite strain model of contact proposed in (11) compared to experimental observation.

Assuming a relationship between force and displacement of the form P=K ! n, a non-linear regression analysis was done on the experimental data to find the best fit for K and n. The

Thus, there are nine material parameters to evaluate. , ! and s0. A FEM model was constructed A,Q/R,a,m,n,h0, s and the material parameters were iterated till the numerical P! response matched the experimental values. An axisymmetric FEM model was constructed in ANSYS 14.5 using PLANE182 elements (see Figure 4). The tungsten carbide punch was modeled using rigid TARGET169 elements. Contact was modeled along the circumference to using CONTA173 to simulate the evolving contact radius as the compression tests proceeded. Displacement conditions were applied on node N (Figure 4) and different time steps

!p !! = s # exp s "A

( )
Q R!

$ & %

(14)

were specified in individual simulations to account for rate effects. The material parameters for which the numerical and experimental P- ! matched are presented in Table 2.

Figure 4 Finite Element model of FAB. Table 2 Estimated Anand Model Parameters.

s0 7

A 3 E12

s
65

Q/R 8200

a 3.7

m 0.11

n 0.028

!
11

h0 78

The P- ! response predicted by the FEM model for the above material parameters are shown in comparison with one set of the experimental data in Figure 5.

Figure 5 The compressive load response obtained through FEM model compared against the experimentally observed values.

DISCUSSION The objective of the work is to estimate model parameters for Anand's viscoplastic model, which explain the behaviour of the copper FAB through low and intermediate strain rates. As a characteristic of viscoplastic material, the stresses of the FAB increase with the increase in strain rate, for the same amount of strain. The compressive tests reveal a strain hardening effect. Strain hardening is not so pronounced as the experimental strain rates are increased, which could be noted by the increments in the value of m in Table 2. This behavior can be due to transition from homogenous deformation by rate-dependent dislocations to rate-independent twin plasticity at higher rates [11]. CONCLUSION A custom-built microtester was devised to perform uniaxial compression tests on the micron sized Cu FAB at low and intermediate strain rates. Elastic contact model was used to analyse the force-displacement behaviour and predicted higher forces relative to the experiments. Ramberg-Osgood type relation was then substituted into plastic contact model to

analytically derive the strain hardening index. The results suggested that the strain rate sensitivity reduces as the strain rate increases, probably because of transition from ratedependent plasticity to twin plasticity. FEM models were used to perform inverse analysis to fit material parameters in Anand's model, constructing a comprehensive constitutive model for the Cu FAB. ACKNOWLEDGMENTS The authors are thankful to Semiconductor Research Corporation under SRC Task id 1292.075 for making this study possible. The authors are particularly thankful to Tu Anh Tran and Varughese Mathew of Freescale Semiconductor for their support of this project with samples. REFERENCES! [1] Beni Nachon," The Basics of Ball Bonding", Technical article, K&S Micro Swiss,2004. [2] Lorenz. G , Petzold. M., Mittag. M, Dresbach. C, Milke.E, "Mechanical Characterization of Gold and Copper Free Air Balls in Thermosonic Wire Bond Internconnections" [3]! ! ! ! ! Johnson, K.L., 1985. Contact Mechanics. Cambridge University Press, Cambridge. [4]! ! ! Li, L.-Y., Thornton, C., Wu, C.-Y., 2000. "Impact Behaviour of Elastoplastic Spheres with a Rigid Wall". Proceedings of the Institution of Mechanical Engineers, Part C: Journal of Mechanical Engineering Science 214, 11071114. [5] Thornton, C., 1997, "Coefficient of Restitution for Collinear Collisions of Elastic-Perfectly Plastic Spheres", ASME J. Appl. Mech. ,64, pp.383-386 [6] Lubliner, J., Plasticity Theory, MacMillan, 1st Edition, 1990. [7] Anand L., "Constitutive Equations for the RateDependent Deformation of Metals at Elevated Temperatures", J. Eng. Mater. Technol. 104(1), 12-17, Jan 01, 1982 [8] Kocks, U.F., Argon, A.S., and Ashby, M. F., "Thermodynamics and Kinetics of Slip," Progress in Materials Science, Vol. 19, eds., Chalmers, B., Christian, J. W., and Massalski, T. B., Pergamon Press, Oxford, 1975, pp. 231-234. [9] Kocks, U. F., "Constitutive Relations for Slip," Constitutive Equations in Plasticity, ed., Argon, A. S., The MIT Press, Cambridge, 1975, pp. 81-115. [10] Wang G. Z., Becker K., Wilde J. and Cheng Z. N., "Applying Anand Model to Represent the Viscoplastic Deformation Behavior of Solder Alloys" [11] Chan D., Xu Nie , Bhate D. , Subbarayan G. , Chen W.W., Dutta I., "Constitutive Models for Intermediateand High-Strain Rate Flow Behavior of Sn3.8Ag0.7Cu and Sn1.0Ag0.5Cu Solder Alloys"