4-1

4-2

4-3

l
R
A
resistivity

Copper

1.70

0.67

Copper (Plated)

6.0

2.36

Gold

2.2

0.87

Lead

22.0

8.66

Silver

1.5

0.59

Silver (Plated)

1.8

0.71

Tin -Lead

15

5.91

Tin (Plated)

11

4.33

Palladium

11

4.3

4-4

R
t

( )
t( )
t

1/2

0.02/0.7

1.0

1.3

0.04/1.4

0.5

0.65

0.07/2.8

0.2

0.26

4-5

l
A

l
(ro

ri )

2.36 10 6 0.06
(0.012 0.0092 )

2.4 m

4-6

4-7

Above Their Self-Resonant Frequency

10
10 F Ceramic

ZCAP - Impedance -

5 nH
0.1
1 nH

1000 F
OSCON

0.01
180 F
Solid
Polymer

0.001
0.1

470 F
Tantalum

10

100

1000

10000

f - Frequency - kHz

4-8

L 5
t

n
n

t w

1
nH (cm)
2

t w

1
nH (in)
2

0.25/0.01

0.07/0.0028

10/24

2.5/0.1

0.07/0.0028

6/14

12.5/0.5

0.07/0.0028

2/6

4-9

2hl
nH/cm
w

5hl
nH/in
w

0.25

2.5

0.2

0.01

0.1

0.5

1.5

2.5

1.2

0.06

0.1

3.0

4-10

4-11

10
5
36

0.01 pF

A
2

0.00025
0.00025

4-12

Ten 0.05 x 0.02 in2 pads in summing junction can

increase parasitic capacitance to 2 pF

4-13

100

Impedance - k

C = 23 pF
10
L = 28 mH

1k

10 k

100 k
Frequency - Hz

1M

4-14

4-15

4-16

4-17

4-18

4-19

Series

Parallel

4-20

4-21

4-22

4-23

Rjc:

Rcs:
Electrical Equivalent

Rsa:

4-24

Many Are PWB Mounted and Cooled

4-25

4-26

P
( Sa h)

P
( Sa 0.006)

P 0.8 Sa

0.7

166 P
Sa

RSA

166
Sa

(100 o C )
4-27

P
( Sa h)

P
( Sa 0.001)

P 0.8 Sa

0. 7

1000 P
Sa

RSA

1000
Sa

(650 C )
4-28

166 P
Sa

Sa

166 P
T

Sa

166 2
50

Sa

4-29

1000 P
Sa

Sa

1000 P
T

Sa

1000 2
50

Sa

40

4-30

Q
R
R

l
( l t)
1
(0.4 0.07)
40o C / W

l
1
(
l t) (
t)
1
(9 0.0028)

R
R

40o C / W

1
(0.00028 1.5)

1
(0.007 0.06)

2400o C / W

2400 o C / W

4-31

Air

0.0002

0.0007

Alumina

0.2

0.9

Aluminum

1.8

4.4

Beryllia

1.6

Copper (OFC)

3.6

Epoxy (PC board)

0.003

0.007

Ferrite

0.04

0.10

Steel

0.15

0.60

Tin-lead

0.4

1.00

4-32

Through board is much less than board-ambient

t
(

A)

1 .5
Metric
(0.0003 25.4 25.4)

0.06
English
(0.007 1)

8 C/W

4-33

l
(

A)

l
2
2
(ro ri )

R
R

100 C / W

4-34

2 W of dissipation on double-sided board calculates

30C rise
English

35

35

30

30

25

25

TJ - Temperature - C

TJ - Temperature - C

Metric

20
15
10

20
15
10

0.5

1.0

1.5

2.0

2.5

4-35

l
( wt )

0.25
Metric
(0.0003 25.4 1.5)

23o C / W

0.01
English
(0.007 1 0.06)

4-36

Vertical

650

100

Horizontal plane,
top surface

675

104

Horizontal,
bottom surface

1375

204

Pd

0.8

K'
A0.7
4-37

4-38

English

30

30

25

25

20

20

Temperature Rise - C

Temperature Rise - C

Metric

15

10

15
88 LFM = 1 mph
10

0
0

3
Air Flow - m/s

200

400

600

800

1000

1200

Air Flow - LFM

4-39

Heat flow due to radiation

A F

Fa

4
1

(T

4
2

T )

4-40

Bare aluminum

0.08

Polished copper/tin

0.04

Glass

0.9

Anodized aluminum

0.8

Lacquer

0.8

Water

0.95

White alumina

0.88

Machined copper

0.7

Dull nickel plate

0.11

4-41

Provides safety factor over convection calculations

Metric

English

0.045

0.30

0.040
0.25

0.030

Heat Flux - W/in2

Heat Flux - W/cm2

0.035

0.025
0.020
0.015

0.20
0.15
0.10

0.010
0.05
0.005
0.000

70
90
100
80
Board Temperature - C

110

120

0.00
70

80

90
100
110
Board Temperature - C

120

4-42

4-43

4-44

4-45

Good input capacitor placement and layout

4-46

4-47

4-48

4-49

4-50

4-51

Makes For A Successful Design

4-52

Copyright by Texas Instruments Incorporated

4-53