Documente Academic
Documente Profesional
Documente Cultură
Registered
UL Label (15)
LINE VOLTAGE FREQUENCY FUSES
90 260 V~ 50/60 Hz T 6a
0129-4842
LASER APERTURE
LASERSTRAHLFFNUNG
OUVERTURE LASER
CE Aperture Label (4)
part # 0129-4843
CAUTION: Visible and/or invisible laser radiation when open.
Avoid eye or skin exposure to direct or scattered radiation.
VORSICHT: Beim Offnen Austritt von sichtbarer und/oder
unsichtbarer Laserstrahlung. Bestrahlung von Auge oder Haut
durch direkte oder Streustrahlung vermeiden.
ATTENTION: Rayonnement laser visible et/ou invisible en cas d'ouverture.
Exposition dangereuse de l'oeil ou de la peau au rayonnement direct ou diffus.
CE Caution Label for Fiber Cable (8)
CE Warning Label
Electrical Hazzard (2)
OEM/Export Label (12)
This laser product is intended to be
sold to a manufacturer of electronic
products for use as a component (or
replacement thereof) in such elec-
tronic products. As such, this product
is exempt from DHHS performance
standard for laser products in accord-
ance with paragraph 1040.10(a)(1) or
(2).
OEM
EXPORT
or
This product is otherwise intended
for
421-067
THISPRODUCTISMANUFACTUREDUNDERONE
OR MORE OF THE FOLLOWING PATENTS:
U. S. PATENT NUMBERS
RE:34,192
4,653,056
4,656,635
4,665,529
4,701,929
4,723,257
4,739,507
4,756,003
4,761,786
4,785,459
4,829,529
4,837,771
4,872,177
4,894,839
4,908,832
4,913,533
4,942,582
5,018,152
5,080,706
5,127,068
5,155,631
5,351,121
5,410,559
5,412,683
5,436,990
5,446,749
5,504,762
5,550,852
5,561,547
5,577,060
5,579,422
5,608,742
5,638,388
5,638,397
5,651,020
5,745,519
5,801,403
5,812,583
5,835,513
5,907,570
Warning Label
Disconnect Service (5)
DISCONNECT FROM POWER
SOURCE BEFORE OPENING
VOR DEM FFNEN
NETZSTECKER ZIEHEN
RETIRER LA PRISE DU
SECTEUR AVANT OUVERTURE
0129-5261
System Ground
Label (17)
TUV Certified
Label (16)
RWTUV
Certified
EN 61010-1
EN 60825-1
EN 6095
Integra MP Industrial Semiconductor Laser System
2-10
CE Declaration of Conformity
Figure 2-10: CE Declaration of Conformity
Declaration of Conformity
Application of Council Directive 89/336/EEC and 73/23/EEC
Standards to which Conformity is Declared:
EN50081-2, EN50082-2, EN61010-1,
EN60825-1, EN60950
Manufacturer's Name:
Spectra Physics Lasers, Inc.
Manufacturer's Address:
1305 Terra Bella Avenue, P.O. Box 7013
Mountain View, CA 94043-7013
Equipment Tested: Lasers
Model(s):
Integra MP Laser System
I, the undersigned, hereby declare
that the equipment specified above conforms to
Directives and Standards listed.
For: Spectra Physics Lasers, Inc.
Name: Philippe Brak
Title: Vice President and G.M. OEM
Signature:
Date: September 1, 2001
Laser Safety
2-11
Sources for Additional Information
The following are some sources for additional information on laser safety
standards, safety equipment, and training.
Laser Safety Standards
Safe Use of Lasers (Z136.1:2000)
American National Standards Institute (ANSI)
11 West 42
nd
Street
New York, NY 10036
Tel: (212) 642-4900
Occupational Safety and Health Administration (Publication 8.1-7)
U. S. Department of Labor
200 Constitution Avenue N. W., Room N3647
Washington, DC 20210
Tel: (202) 693-1999
Internet: www.osha.gov
A Guide for Control of Laser Hazards, 4th Edition, Publication #0165
American Conference of Governmental and
Industrial Hygienists (ACGIH)
1330 Kemper Meadow Drive
Cincinnati, OH 45240
Tel: (513) 742-2020
Internet: www.acgih.org
Laser Institute of America
13501 Ingenuity Drive, Suite 128
Orlando, FL 32826
Tel: (800) 345-2737
Internet: www.laserinstitute.org
Compliance Engineering
Canon Communications, LLC
11444 W. Olympic Boulevard
Los Angeles, CA 90064
Tel: (310) 445-4200
International Electrotechnical Commission
Journal of the European Communities
IEC 60825-1 Safety of Laser ProductsPart 1: Equipment classification,
requirements and users guide
Tel: +41 22-919-0211 Fax: +41 22-919-0300
Internet: www.iec.ch
Cenelec
35, Rue de Stassartstraat
B-1050 Brussels, Belgium
Tel: +32 2 519 68 71
Internet: www.cenelec.org
Document Center, Inc.
111 Industrial Road, Suite 9
Belmont, CA 94002
Tel: (650) 591-7600
Internet: www.document-center.com
Integra MP Industrial Semiconductor Laser System
2-12
Equipment and Training
Laser Safety Guide
Laser Institute of America
13501 Ingenuity Drive, Suite 128
Orlando, FL 32826
Tel: (800) 34LASER
Internet: www.laserinstitute.org
Laser Focus World Buyer's Guide
Laser Focus World
Penwell Publishing
98 Spit Rock Road
Nashua, NH 03062
Tel: (603) 891-0123
Internet: lfw.pennet.com/home.cfm
Photonics Spectra Buyer's Guide
Photonics Spectra
Laurin Publications
Berkshire Common
PO Box 4949
Pittsfield, MA 01202-4949
Tel: (413) 499-0514
Internet: www.photonics.com
3-1
Chapter 3 Laser Description
A Brief Review of Laser Theory
Emission and Absorption of Light
*
Laser is an acronym derived from Light Amplification by Stimulated Emis-
sion of Radiation. Thermal radiators, such as the sun, emit light in all direc-
tions, the individual photons having no definite relationship with one
another. But because the laser is an oscillating amplifier of light, and
because its output comprises photons that are identical in phase and direc-
tion, it is unique among light sources. Its output beam is singularly direc-
tional, monochromatic, and coherent.
Radiant emission and absorption take place within the atomic or molecular
structure of materials. The contemporary model of atomic structure
describes an electrically neutral system composed of a nucleus with one or
more electrons bound to it. Each electron occupies a distinct orbital that
represents the probability of finding the electron at a given position relative
to the nucleus. Each orbital has a characteristic shape that is defined by the
radial and angular dependence of that probability, e.g., all s orbitals are
spherically symmetrical, and all p orbitals surround the x, y, and z axes of
the nucleus in a double-lobed configuration (Figure 3-1). The energy of an
electron is determined by the orbital that it occupies, and the over-all
energy of an atomits energy leveldepends on the distribution of its
electrons throughout the available orbitals. Each atom has an array of
energy levels: the level with the lowest possible energy is called the ground
state, and higher energy levels are called excited states. If an atom is in its
ground state, it will stay there until it is excited by external forces.
Movement from one energy level to anothera transitionhappens when
the atom either absorbs or emits energy. Upward transitions can be caused
by collision with a free electron or an excited atom, and transitions in both
directions can occur as a result of interaction with a photon of light. Con-
sider a transition from a lower level whose energy content is E
1
to a higher
one with energy E
2
. It will only occur if the energy of the incident photon
matches the energy difference between levels, i.e.,
h = E
2
E
1
[1]
where h is Plancks constant, and is the frequency of the photon.
*
Light will be used to describe the portion of the electromagnetic spectrum from far
infrared to ultraviolet.
Integra MP Industrial Semiconductor Laser System
3-2
Figure 3-1: Electrons occupy distinct orbitals that are defined by the
probability of finding an electron at a given position, the shape of the
orbital being determined by the radial and angular dependence of the
probability.
Likewise, when an atom excited to E
2
decays to E
1
, it loses energy equal to
E
2
E
1
. The atom may decay spontaneously, emitting a photon with energy
h and frequency
[2]
Spontaneous decay can also occur without emission of a photon, the lost
energy taking another form, e.g., transfer of kinetic energy by collision
with another atom. An atom excited to E
2
can also be stimulated to decay to
E
1
by interacting with a photon of frequency , emitting energy in the form
of a pair of photons that are identical to the incident one in phase, fre-
quency, and direction. This is known as stimulated emission. By contrast,
spontaneous emission produces photons that have no directional or phase
relationship with one another.
A laser is designed to take advantage of absorption, and both spontaneous
and stimulated emission phenomena, using them to create conditions favor-
able to light amplification. The following paragraphs describe these condi-
tions.
Population Inversion
The net absorption at a given frequency is the difference between the rates
of emission and absorption at that frequency. It can be shown that the rate
of excitation from E
1
to E
2
is proportional to both the number of atoms in
the lower level (N
1
) and the transition probability. Similarly, the rate of
stimulated emission is proportional to the population of the upper level (N
2
)
and the transition probability. Moreover, the transition probability depends
on the flux of the incident wave and a characteristic of the transition called
its cross section. The absorption coefficient depends only on the differ-
ence between the populations involved, N
1
and N
2
, and the flux of the inci-
dent wave.
E
2
E
1
h
------------------ =
Laser Description
3-3
When a material is at thermal equilibrium, there exists a Boltzmann distri-
bution of its atoms over the array of available energy levels with most
atoms in the ground state. Since the rate of absorption of all frequencies
exceeds that of emission, the absorption coefficient at any frequency is pos-
itive.
If enough light of frequency is supplied, the populations can be shifted
until N
1
= N
2
. Under these conditions the rates of absorption and stimulated
emission are equal, and the absorption coefficient at frequency is zero. If
the transition scheme is limited to two energy levels, it is impossible to drive
the populations involved beyond equality; that is, N
2
can never exceed N
1
because every upward transition is matched by one in the opposite direc-
tion.
However, if three or more energy levels are employed, and if their relation-
ship satisfies certain requirements described below, additional excitation
can create a population inversion where N
2
> N
1
.
A model four-level laser transition scheme is depicted in Figure 3-2. A
photon of frequency
1
excitesor pumpsan atom from E
1
to E
4
. If the
E
4
to E
3
transition probability is greater than that of E
4
to E
1
, and if the life-
time of an atom at E
4
is short, the atom will decay almost immediately to E
3
.
If E
3
is metastable, i.e., atoms that occupy it have a relatively long lifetime,
the population will grow rapidly as excited atoms cascade from above. The
E
3
atom will eventually decay to E
2
, emitting a photon of frequency
2
.
Finally, if E
2
is unstable, its atoms will rapidly return to the ground state, E
1
,
keeping the population of E
2
small and reducing the rate of absorption of
2
.
In this way the population of E
3
is kept large and that of E
2
remains low,
thus establishing a population inversion between E
3
and E
2
. Under these
conditions, the absorption coefficient at
2
becomes negative. Light is
amplified as it passes through the material, which is now called an active
medium. The greater the population inversion, the greater the gain.
Figure 3-2: A Typical Four-level Transition Scheme
A four-level scheme has a distinct advantage over three-level systems,
where E
1
is both the origin of the pumping transition and the terminus of
the lasing transition. Also, the first atom that is pumped contributes to the
population inversion in the four-level arrangement, while over half of the
E
4
E
3
E
2
E
1
2
Integra MP Industrial Semiconductor Laser System
3-4
atoms must be pumped from E
1
before an inversion is established in the
three-level system.
Generating Light Energy in a Laser Diode
In the diode laser, the amplifying element is a forward-biased PN junction
formed in a direct-bandgap semiconductor. Optical gain is provided by the
recombination of electrons and holes in the PN junction. When forward
biased, electrons are injected from the N side while holes are injected from
the P side; both electrons and holes are confined within a lower-bandgap
region where they can recombine either spontaneously or via stimulated
emission when excited by an existing photon.
*
Resonant Optical Cavity
To sustain lasing action, the gain medium must be placed in a resonant
optical cavity. The latter is defined by two mirrors (or a grating) that pro-
vide optical feedback to the active medium, i.e., photons emitted parallel to
the cavity axis are reflected back into the cavity to interact with other
excited states. Mirrors are formed in solid-state lasers by cleaving facets at
each end of a waveguide that is formed in the semiconductor material.
Once the electrons and holes interact to generate the light, the waveguide
confines the light in two dimensions, causing it to travel back and forth
between the mirrors along a predominantly linear path. This type of resona-
tor is called a Fabry-Perot resonator.
Stimulated emission produces two photons of equal energy, phase, and
direction from each interaction. The two photons become four, four
become eight, and the numbers continue to increase geometrically until an
equilibrium between excitation and emission is reached.
The cavity mirror facets are coated to increase or decrease reflectivity and
to improve resistance to damage from the extremely high power densities,
which are as high as 10 MW/cm
2
. The wider the waveguide, the higher the
output power of the diode, but with less coherence. The end mirror is typi-
cally 99% reflective while the output mirror is only 1 to 10% reflective.
The latter transmits much of the energy stored within the cavity as radiation
which becomes the output beam of the laser diode.
The laser oscillates within a narrow range of frequencies around the transi-
tion frequency. The width of the frequency distribution, or linewidth, and
its amplitude depend on the gain medium, its temperature and the magni-
tude of the population inversion.
Linewidth is determined by plotting gain as a function of frequency and
measuring the width of the curve where the gain has fallen to one half max-
imum (full width at half maximum, or FWHM, Figure 3-3).
*
Robert J. Lang, An Introduction to Semiconductor Lasers, The Photonics Design and
Applications Handbook, H-232 H-235 (1999).
Laser Description
3-5
Figure 3-3: Frequency Distribution of Longitudinal Modes for a Single
Line
The output of the laser is discontinuous within this line profile. A standing
wave propagates within the optical cavity, and any frequency that satisfies
the resonance condition
[3]
will oscillate, where
m
is the frequency, c is the speed of light, L is the opti-
cal cavity length, and m is an integer. Thus, the output of a given line is a set
of discrete frequencies, called longitudinal modes, that are spaced such
that
[4]
These wide waveguide, high-power diode lasers generate multiple longitu-
dinal modes and are called multimode lasers.
Longitudinal
Modes
Gain
Envelope
6-10 GHz
Frequency ()
C
2 L
~
~ G
a
i
n
FWHM Point
m
mc
2L
------- =
c
2L
------- =
Integra MP Industrial Semiconductor Laser System
3-6
The Integra MP Laser System
The Laser
The Integra MP laser system is a stand-alone, solid-state laser system
designed to provide efficient, high power laser output. The mechanical con-
trol functions are fully described in Chapter 4, Controls, Indicators and
Connectors, and system operation and the remote interface is described in
Chapter 7, Operation.
Figure 3-4: The Integra MP Laser System
The Integra MP delivers output powers of 15, 30 and 60 Watts and can be
purchased in 810 10 nm and 91510 nm configurations. Output power is
coupled via armored optical fiber bundles to the target device.
The diode modules mate with the fiber delivery bundle through a precision
splice made at the factory and becomes a permanent part of the laser mod-
ule. The delivery fiber is terminated with an industry standard fiber-optic
SMA 905 connector. This provides a precise and repeatable attachment of
the delivery fiber to the target device. And, if necessary, it allows the diode
module to be replaced in the field without requiring an alignment of the
system to the target device.
To stabilize the output wavelength of the diode, the module is mounted
directly onto a temperature-regulated cold plate. Cooling for the cold plate
is provided either by a thermo-electric (TE) cooler.
Specifications
The Integra MP is rack-mountable and requires 90 to 260 Vac, 50/60 Hz,
30 A single phase line power. Secondary systems provide diode cooling
and laser output control.
Rear panel connections receive power and control signals. The Integra MP
is air-cooled. Fans bring cooling air in from the front panel and exhausts
heated air from the rear.
Laser Description
3-7
Note: All Specifications are to be considered confidential and subject to change.
Table 3-1: Optical Parameters
Parameter I20 I40 I80
Diode Output Power (at fiber output) 15 W 30 W 60 W
Wavelength 810 10 nm
915 10 nm
Numerical Aperture 0.20 0.20 0.20
Fiber Diameter 0.850 mm 0.850 mm 1.200 mm
Terminal type SMA 905 SMA 905 SMA 905
Table 3-2: Utilities
AC power input (both systems) 90 to 260 Vac, 50/60 Hz (autoranging)
single phase
Power consumption <1000 W (500 W typical)
Heat dissipation into room
at maximum output power
at average, mid-life power
4500 W or 15 kBTU
3000 W or 10 kBTU
Table 3-3: Mechanical Specifications
Size (L x W x H) 60 x 48 x 17.8 cm
(23.6 x 19.0 x 7.0 in.)
Weight
I20
I40
I80
21.9 kg (48.2 lbs)
21.9 kg (48.2 lbs)
25.5 kg (56.2 lbs)
Cooling
Forced Air: 2.8 m
3
/min (100 cfm)
Power cable length 3 m (10 ft)
Optical fiber length 5 m (16 ft)
Table 3-4: Operating Conditions
Warm-up time 2 minutes
Temperature range 18C to 30C
Altitude 03000 m
Humidity 885%, non-condensing
Table 3-5: Non-operating Conditions
Temperature range 20C to 50C
Altitude 012000 m
Humidity 895%, non-condensing
Table 3-6: Fuse Ratings for F1, F2
Supply Voltage Rating Type
100240 Vac 10 A T 10A 250 V
Integra MP Industrial Semiconductor Laser System
3-8
Outline Drawing
Figure 3-5: Outline Drawing
19.00
484,6
Integra MP Control Panel
Integra MP Side View
inches
mm
All dimensions in
1.60
40,6
6.80
172,7
17.91
454,9
6.80
172,7
1.03
26,2
0.50
12,7
4.30
109,2
6.63
168,4
6.94
176,3
Laser Enable
Power
Laser Emission
Remote
Off / O
On / I
I
O
4-1
Chapter 4 Handling Fiber Optics
This chapter contains important information pertaining to the safe use and
handling of the fiber optic cable. Please read this section carefully before
installing or operating this power supply/laser system.
The fiber optic bundle incorporated in the Integra MP laser system is, by
definition, an optical component and must be handled with care. The stain-
less steel jacket surrounding the optical fiber is intended to prevent light
leakage in the unlikely event of fiber breakage. It provides only limited pro-
tection of the optical fiber.
Excessive stress on an optical fiber can alter the characteristics of beam
delivery and can possibly lead to breakage of the optical fibers. Stress
comes in three forms:
tensile stress, occurs when the fibers are axially strained,
torsional stress, occurs when the fibers are twisted,
bending stress, occurs when the fibers are subjected to a bending
radius.
The following guidelines for handling, cleaning, and coiling should be fol-
lowed for all fiber bundles used in systems from Spectra-Physics. These
guidelines are recommended to maximize the long-term performance of
the fiber bundles.
Unpacking and Uncoiling
The Integra MP was shipped with the fiber bundle rolled and secured. Sup-
port the cable when unpacking and uncoiling it. Do not allow the cable to
spring out.
Do not remove the fiber bundle protective end cap until you are ready to
connect the fiber cable to the target device.
General Handling
The minimum recommended bend radius is 6 in. (15 cm). Avoid twisting
the bundle as well (see Coiling Procedure below).
A strain relief may be used to support the fiber bundle, provided that the
strain relief itself does not violate these guidelines. Do not allow the strain
relief to crimp the stainless steel jacket.
Never pull on the fiber cable. Excessive pulling forces can stretch the steel
jacket and may lead to fiber and/or connector damage. Avoid walking on or
rolling equipment over the cable. Keep it out of water, oils and other con-
taminants.
Integra MP Industrial Semiconductor Laser System
4-2
Coiling Procedure
This procedure is recommended when coiling the fiber bundle for use or
when storing it. By following this procedure, twists are avoided that can
damage optical fibers.
Figure 4-1: Fiber bundle rolling technique.
1. Do not pull on the cable; allow the fiber to relax. Try to keep the stain-
less steel jacket clean as you proceed, and make sure the protective end
cap is on the fiber connector.
2. Make one gentle loop with a diameter no less than 12 in. (30 cm). Tie-
wrap this loop to make rolling easier.
3. While walking toward the power supply, gently roll the bundle in a
hand-over-hand motion until you are near the power supply interface,
then tie-wrap the bundle. Allow several inches of unwrapped cable to
avoid stress at the power supply interface.
Avoid pulling on the Integra MP with the fiber cable and avoid tight
bends near the connector.
Warning!
12 in. dia. loop
1
2
3
This procedure should only be performed by personnel who understand
standard laser safety practices and are trained in the handling of delicate
optical components.
Caution!
Handling Fiber Optics
4-3
Cleaning and Inspection
As with most optical components used in lasers, contamination of the opti-
cal surfaces can lead to performance degradation and possible catastrophic
failure. Contaminants on the end of the fiber bundle can cause localized
heating and damage to the anti-reflective coating. Contaminants can come
from handling the fiber or from mounting the fiber output too close to a
power meter or beam dump. In severe cases, charring may occur at the out-
put end, which requires replacement of the fiber cable.
To prevent costly damage of the fiber bundle, always be extremely careful
when handling the output end. Before use or anytime the presence of con-
taminants is suspected, it is recommended that the output end of the bundle
be inspected and, if necessary, cleaned.
If you have any questions regarding these procedures, contact your Spectra-
Physics service representative.
Materials Required
Powder-free finger cots or gloves
Lint-free lens tissue
Clean forceps or hemostats
Water-free, spectroscopic grade methanol (methyl alcohol) or propanol
(2-propanol or isopropyl alcohol)
Clean dropper or droplet dispensing unit for the alcohol
Fiber holding fixture for inspection (optional, but very helpful)
Inspection video microscope, 4080 x magnification, for indirect
viewing of the fiber bundle. Example: Optispec ME2500 Fiber Optic
Illuminated Inspection Video Microscope, available from Micro Enter-
prises, Norcross, Georgia, U.S.A.
Prior to cleaning fibers, it is advisable to briefly inspect the fiber end coat-
ings for damage or burn areas. For safety, we recommend indirect viewing
of the fiber bundle using a microscope and CCD camera, such as the one
listed above. Never turn on the Integra MP during inspection. Avoid
tight fiber bends of less than 6 in. (15 cm) radius. Inspection of the coatings
should reveal a uniform, bluish, smooth and shiny surface with few
scratches, inclusions, or dust particles.
The following terms define some of the types of damage you may see.
Blemishesminor blemishes are unavoidable and will not adversely
affect system performance.
Scratchesa minor scratch should have a width of less than 5 m.
All versions of the Spectra-Physics Integra MP laser system include a
Class IVHigh Power Laser. The output beam from the fiber bundle is,
by definition, a safety hazard. Turn off and unplug the Integra MP
before inspecting the fiber bundle.
Danger!
Laser Radiation
Integra MP Industrial Semiconductor Laser System
4-4
Digsa minor dig should have a maximum diameter of less than 30 m
and no cracks propagating from the dig.
Burnsa minor burn should have a maximum diameter of less than
30 m. Debris should be cleaned away with methanol to prevent further
damage.
Figure 4-2: Examples of an acceptable and unacceptable fiber output
surface.
If a fiber bundle has 6 or fewer minor blemishes, it may be used to pump a
laser system with no compromise of performance. If the fiber bundle blem-
ishes exceed this acceptable level, please contact Spectra-Physics for assis-
tance.
Cleaning Method
If contaminants are visible, the fiber ends should be cleaned by one or both
of two following methods, as required, to achieve appropriate results.
First, the drop and drag method should be used to remove contaminants
not tightly bound to the coated surfaces.
1. Place a single drop of the cleaning solvent near the center of a small
piece of lens tissue.
2. Contact the fiber end and draw slowly and steadily, moving the tissue
or the fiber across the surface until no more liquid remains at the point
of contact between the fibers and tissue.
This may be repeated as necessary using clean tissue.
An alternate method is to:
1. fold the lens tissue to form a small wiper, approximately 3-4 mm wide,
and held in forceps.
2. Apply 23 drops of cleaning solvent on the end of this wiper and gen-
tly draw it across the fiber end surfaces.
This method can be used to remove more tightly bound contaminants,
but be careful. If done too roughly or too often, it can damage the coat-
ings.
When finished, it is advisable to inspect the progress of the fiber cleaning
process using the method described previously.
Acceptable Unacceptable
Burn
Scratches
Chips
Handling Fiber Optics
4-5
Connections and General Operation
Never operate the system with the protective cap on the fiber bundle. As a
general rule, make all optical and interface connections prior to connecting
the ac power cable.
The fiber cable uses a SMA 905 standard connector designed for precision
alignment. Avoid damaging the barrel and optical surface when mating the
fiber cable to the laser head. It may be helpful to tip the barrel upward at a
slight angle to make the insertion. Do not scrape it around hunting for
insertion. A tab is present on the fiber connector which mates to a slot on the
laser connector. Align the tab and slot to achieve full and proper seating.
Measuring Fiber Output Power
When it becomes necessary to measure the fiber output power, follow these
precautions to insure safety for both personnel and equipment.
Turn off the Integra MP.
Disconnect the fiber cable from the target device.
Carefully secure the output end near an optical power meter capable of
reading 60 W. Maintain a distance of approximately 2 cm from the
fiber tip to the detector surface. Never allow the optical surface to
touch the detector surface.
Prevent vapors and contaminants from foreign surfaces from being
deposited on the tip of the fiber. This can cause rapid and permanent
damage to the optical surface.
Never attempt to move the fiber output connector when the laser diode
is energized.
Integra MP Industrial Semiconductor Laser System
4-6
5-1
Chapter 5 Controls, Indicators and Connections
Introduction
This section defines the user controls, indicators and connections of the
Integra MP laser system. The Integra MP is air-cooled and has a single
fiber output. Controlling the system via the SERIAL port and/or ANALOG
port is described in Chapter 7, Operation.
The Integra MP System
All controls and indicators are on the front panel of the system. All connec-
tions are made via the rear panel. Each panel is described below from left
to right, top to bottom, starting with the front panel.
Front Panel
Figure 5-1: The Integra MP Front Panel
Provide at least 3 in. of room on the front and back of the Integra MP
power supply to allow cool air to enter the front and for the exhaust air
to leave the rear panel. Inadequate cooling will cause the unit to over-
heat and shut down. Damage to components caused by insufficient cool-
ing is not covered by your warranty.
Caution!
LCD Screen
Emission Indicator
On/Off Indicator On/Off AC Power Switch
Interlock Keyswitch
Laser Enable
Power
Laser Emission
Remote
Off / O
On / I
I
O
Integra MP Industrial Semiconductor Laser System
5-2
LCD displaydisplays the status of the power supply during normal oper-
ation, such as diode currents and temperature. It also displays any status
codes that are generated by the power supply. During start up, this panel
displays the status of the self-diagnostics. If you ever experience problems,
it can be useful to monitor this panel to see if the power supply is having
trouble starting up. However, all warnings, including errors generated by
the system and indicators that are germane to proper system operation, are
displayed on the control device.
Air exhaustallows the heated air to be removed from the system.
Heated air is vented from the two grids on the front panel and the one or
two grids on the back panel.
LASER ENABLE interlock keyswitchprovides interlock safety to pre-
vent unauthorized personnel from using the Integra MP system when the
key is turned to the off position and the key is removed. Turning the key
to the on position allows the laser diodes to be energized if the AC
POWER switch is also on.
POWER indicator (Green)when on, indicates that ac power is applied to
the system.
LASER EMISSION indicator (Red)shows that power is supplied to the
laser diodes and that diode emission is present or imminent.
AC power on/off switchprovides ac power to the Integra MP if the
LASER ENABLE interlock keyswitch is also on.
REMOTE connector (15-pin D-sub)is used for factory diagnostics only.
A shorting jumping connector is provided that must always be inserted in
order for the system to operate properly.
Rear Panel
Fiber-optic cableis permanently attached to the diode module inside the
power supply and must be replaced along with the diode module. The fiber
cable provides either 810 10 nm or 915 10 nm output power.
ANALOG connectoris jumpered as it comes from the factory. If this con-
nection is to be used, refer to the pin descriptions in Table 5-1 at the end of
this chapter and to the section on Using the Analog Interface in Chapter
7, Operation.
SERIAL COM connector (9-pin, D-sub)is used as the control port. Con-
nect your control device (computer) to this connector. Refer to the pin
descriptions in Table 5-2 at the end of this chapter and to the section on
Using the Serial Interface in Chapter 7, Operation.
Provide at least 3 in. of room on the front and back of the Integra MP to
allow cool air to enter the front and for the exhaust air to leave the rear
panel. Inadequate cooling will cause the unit to overheat and shut down.
Damage to components caused by insufficient cooling is not covered by
your warranty.
Caution!
Controls, Indicators and Connections
5-3
Figure 5-2: Integra MP Rear Panel
EMISSION connector (3-pin)provides connection to a relay that can be
used to turn on and off a user-supplied emission indicator (Figure 5-3).
When the laser is off (i.e., there is no emission), there is closure between
pins 3 and 1 and an open between pins 3 and 2. The opposite is true when
the laser is on, i.e., there is emission or emission is imminent. There is no
power supplied by these terminals. This circuit is rated for 30 Vac at 1 A.
Figure 5-3: EMISSION connector, rear panel
INTERLOCK connector (2-pin)provides attachment for a safety switch.
These two contacts must be shorted together before the laser will operate.
A defeating jumper plug is installed at the factory to permit operation with-
out a safety switch. This plug can be replaced with a similar, non-shorting
plug that is wired to auxiliary safety equipment (such as a door switch) to
shut off the laser when actuated (opened). Such a switch must be designed
for a low-voltage, low-current digital signal.
LASER HEAD connector (27-pin, D-sub)is not used on this system.
AC POWER connectorprovides connection for an IEC power cable to
provide ac power to the Integra MP laser system.
Spectra-Physics
Spectra-Physics Lasers, Inc.
1330 Terra Bella Avenue, Mountain View, CA. 94043
MANUFACTURED
IN USA
MODEL S/N S240-827-NS1 521
AC Power
Input
Fuses Emission Safety Interlock
Analog Control Serial Interface
Laser
Diode Fiber
Fuse Chart
AC Power
LINE VOLTAGE FREQUENCY
CAUTION: Double pole/neutral fusing
FUSES
F
U
S
E
S
100 240 V~ 50/60 Hz T 10A
SERIAL COM AUXILIARY ANALOG
LASER HEAD INTERLOCK EMISSION
3 2 1
Integra MP Industrial Semiconductor Laser System
5-4
Connector Interface Descriptions
Figure 5-4: The 26-Socket ANALOG Connector
Table 5-1: Integra MP Analog Port Connector
Pin Type Description Function
1 Output Laser average power monitor 0 4 V full scale, 32 W full scale.
82 internal resistance. Maximum 10 mA load.
2 Input Diode #1 external drive 0 4 V full scale, 80 A full scale: limited by the diode cur-
rent limit value (DCL). Pin 18 must be pulled low to acti-
vate this function.
3 Output Diode #1 current monitor 0 4 V full scale, 80 A full scale.
200 internal resistance. Maximum 10 mA load.
4 Input First pulse suppression (FPS)
disable
TTL. 10 K internally pulled-up +5 Vdc.
Active low disables FPS.
5 Output Diode #2 current monitor 0 4 V full scale, 80 A full scale.
200 internal resistance. Maximum 10 mA load.
6 Input Diode #2 external drive 0 4 V full scale, 80 A full scale, limited by the diode cur-
rent limit value (DCL). Pin 18 must be pulled low to acti-
vate this function.
7 Input User interlock return current User must connect to pin 8 through a device that provides
less than 0.3 V and can handle 100 mA. 0 V open circuit.
100 mA maximum load closed circuit
8 Output User interlock line User must connect to pin 7 to enable operation. +24 Vdc
open circuit, 100 mA maximum load closed circuit
9 Output Emission indicator
An active low open collector pulls a 50 impedance to
ground when emission is active. 24 V max.
10 Input External diode TTL. Active low. Pull low to turn diodes on. Pulled up to +5
Vdc via internal 10 k. Input low current is 1 mA max.
Level sensitive.
11 Output Laser status OK flag TTL. Active high. A high signal indicates a system fault.
82.5 output resistance.
12 N/A Reserved Must be open.
13 Output Interlock fault TTL. Active low. A low signal indicates an interlock is open.
Pulled up to +5 Vdc via internal 10 k.
14 N/A Reserved Must be open.
15 Input Standby current TTL. Active low. Pull low to force diode current to standby
setting. Pulled up to +5 Vdc via internal 10 k. Input low
current 1 mA max. Level sensitive.
16 Input CW TTL. Active low. Pulled up to +5 Vdc via internal 10 k. Pull
low to force the laser system into CW mode. Input low
current 1 mA max. Level sensitive.
1
19 26
9
Controls, Indicators and Connections
5-5
Figure 5-5: The 9-Pin SERIAL COM Port
17 Input Ext. Q-switch gate Not used on this system.
18 Input External diode drive enable TTL. Active low. Pull low to activate external diode current
control at pins 2 and 6. Pulled up to +5 Vdc via internal
10 k. Input low current 1 mA max.
19 Output RF sync out Not used on this system.
20 Output 12 Vdc output 250 mA max.
21 Input External Q-switch trigger Not used on this system.
22 Input Analog reference ground Reference ground for pins 1, 2, 3,5, 6.
23 Output +12 Vdc supply 250 mA max.
24 Input Digital reference Gnd Reference ground for pins 4, 10, 11, 12, 13, 14, 15, 16, 17,
18, 19, 21
25 Output +5 Vdc supply Power supplied for accessories. 250 mA max.
26 Input Earth Gnd Chassis ground.
Table 5-2: IBM-PC/AT Serial Port Pinout
Computer or Terminal Integra MP
RS-232-C
Signal Name
Signal Pin No.
(25-Pin)
Pin No.
(9-Pin)
Pin No. Signal
Transmit Data TXD 2 3 3 RXD
Receive Data RXD 3 2 2 TXD
No Connection RTS 4 7 CTS
No Connection CTS 5 8 RTS
No Connection DSR 6 6 DTR
No Connection DCD 8 1 DCD
No Connection DTR 20 4 DSR
Signal Ground 7 5 5
Protective Ground 1 SHELL SHELL
Table 5-1: Integra MP Analog Port Connector
1 5
6 9
Integra MP Industrial Semiconductor Laser System
5-6
6-1
Chapter 6 Installation
This section provides detailed instructions and notes for the initial planning
and set-up of the Integra MP laser system. If you have not set up the system
before or if you are moving the it to a new location, please review this sec-
tion in detail.
System Mounting Considerations
If the system is to be mounted in a 19 in. rack, make sure it is appropriately
ventilated. Allow 15 cm (6 in.) of clearance to the front and back panels
and 8 cm (3 in.) on each side of each unit for proper air flow. Take mea-
sures to prevent heated air exhausted from the back panels from returning
to the cooling air intakes of the other three sides. Failure to do so will cause
over-heating.
The Integra MP can also be placed on a stable and secure table.
Ensure that there is room for the electrical cables to be safely routed to and
from the rear of the power supply and that they are not under any strain.
Avoid conditions in which the cables can be stepped on by personnel.
System Installation
Installing the Integra MP in a Rack
The following installation procedures assume you are installing the power
into a standard 48.3 cm (19 in.) rack mount unit. Although this system does
not have to be rack-mounted, we feel this is the most compact and space-
saving approach to installing it, especially if any of the other system com-
ponents are rack-mountable. When using a rack unit, provide positive fil-
tered ventilation air that flows into the bottom of the unit, past the mounted
units without obstruction, and exhausts from the top. Do not add shelves
between units or heated exhaust air will be returned to the intake vents and
cause over-heating. Provide enough room cooling capacity to counter the
heat produced by the system and to prevent room overheating (refer to sys-
tem specifications at the end of Chapter 3).
Allow only personnel qualified and authorized by Spectra-Physics to
install and set up your system. You will be charged for repair of any
damage caused by untrained personnel, and such action might also void
your warranty.
Note
Integra MP Industrial Semiconductor Laser System
6-2
Connecting the System
Refer to interconnect drawing Figure 6-1.
Figure 6-1: Integra MP Interconnect Drawing.
1. Move the rack to within 3 m of the target device (the length of the
shortest cable).
Front Panel
2. Verify the jumper plug is in place on the REMOTE connector (Figure 6-
2). This plug should never be removed.
Figure 6-2: The REMOTE Connector
Back Panel
3. If the ANALOG connector is not used for control, verify the jumper
plug is in place. If control from this port is required, remove the
jumper and attach a 26-pin control cable from this connector to your
I/O control device. Refer to Table 5-1 at the end of Chapter 4 for pin
descriptions. Also refer to Controlling the System Using the ANALOG
Interface in Chapter 7, Operation.
90 240 Vac
50/60 Hz
Integra MP Diode Laser
Computer or
Integrated Interface
RS-232
"Serial Com"
Power
Cord
Fiber Cable
End-effector
Focussing Device
Laser Enable
Power
Laser Emission
Remote
Off / O
On / I
I
O
Remote Connector
Installation
6-3
Figure 6-3: Integra MP Rear Panel
4. Connect the 9-pin SERIAL COM connector to the RS-232 serial port on
your personal computer and note which Com Port (1 or 2) on the com-
puter you are using. Refer to Table 5-2 at the end of Chapter 4 for pin
descriptions.
5. If an emission indicator lamp other than the front panel LED on the
Integra MP is required, use the EMISSION relay connector on the rear
panel as a switch to turn a lamp on and off (Figure 6-4) (or use pins 9
and 22 on the ANALOG port (Figure 6-5)). To use the relay, attach a
wire to pin 2 and pin 3 of the connector. When the laser is off (i.e.,
there is no emission), there is closure between pins 1 and 3 and an
open between pins 2 and 3. The opposite is true when the there is emis-
sion or emission is imminent. There is no power supplied by these ter-
minals. This circuit is rated for 30 Vac at 1 A.
Figure 6-4: The EMISSION Connector Schematic
To use the EMISSION signal provided by the analog port, reference
your lamp drive circuitry to pin 22 and use pin 9 to sink up to 50 mA at
24 V to drive a relay. Remember to shunt the relay with a back-biased
diode to protect the circuits in the Integra MP.
Spectra-Physics
Spectra-Physics Lasers, Inc.
1330 Terra Bella Avenue, Mountain View, CA. 94043
MANUFACTURED
IN USA
MODEL S/N S240-827-NS1 521
AC Power
Input
Fuses Emission Safety Interlock
Analog Control Serial Interface
Laser
Diode Fiber
Fuse Chart
AC Power
LINE VOLTAGE FREQUENCY
CAUTION: Double pole/neutral fusing
FUSES
F
U
S
E
S
100 240 V~ 50/60 Hz T 10A
SERIAL COM AUXILIARY ANALOG
LASER HEAD INTERLOCK EMISSION
EMISSION
49.9 K
R
98
J
3
EMISSION
K
2
+ 24 V
Q
8
3 Wiper
2 N.O.
1 N.C.
4
3
2
5
1
3 2 1
Integra MP Industrial Semiconductor Laser System
6-4
Figure 6-5: The 26-Socket ANALOG Connector
6. Verify the two fuses on the rear panel are appropriate for your line
voltage (refer to the fuse table in Chapter 3).
7. Attach the provided IEC power cord to the power connector and fasten
it properly to the receptacle retaining screws so that it does not pull
out. Plug the other end into a facility power outlet. The outlet must
supply 90 to 260 Vac, 30 A single phase power.
This completes the wiring connection and rack preparation.
Fiber Connections
The fiber cable is terminated with a safety cap that comes off by unscrew-
ing the collar and removing the cap (see Figure 6-6).
To attach the fiber delivery cable(s) to the laser focussing or re-imaging
unit:
1. Remove the safety cap.
2. Carefully insert the SMA 905 terminal into the focussing unit.
3. Hand tighten the threaded jacket.
To remove the fiber cable from the target device, reverse this procedure.
Figure 6-6: Integra fiber cable shown with the cap on and off.
1
19 26
9
Installation
6-5
Software Installation
System Requirements
Windows