14,000/sec Digital Gyroscope Sensor

Data Sheet
ADIS16266


Rev. A Document Feedback
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FEATURES
Yaw rate gyroscope with range scaling
3500/sec, 7000/sec, and 14,000/sec settings
2429 SPS sample rate
Wide sensor bandwidth: 360 Hz
No external configuration required to start data collection
Start-up time: 170 ms
Sleep mode recovery time: 2.5 ms
Factory-calibrated sensitivity and bias
Calibration temperature range: 40C to +70C
SPI-compatible serial interface
Relative angle displacement output
Embedded temperature sensor
Programmable operation and control
Automatic and manual bias correction controls
Bartlett window FIR filter length, number of taps
Digital I/O: data ready, alarm indicator, general-purpose
Alarms for condition monitoring
Sleep mode for power management
DAC output voltage
Single-command self-test
Single-supply operation: 4.75 V to 5.25 V
3.3 V compatible digital lines
2000 g shock survivability
Operating temperature range: 40C to +105C
APPLICATIONS
Platform control and stabilization
Navigation
Medical instrumentation
Robotics
GENERAL DESCRIPTION
The ADIS16266 is a programmable digital gyroscope that combines
industry-leading MEMS and signal processing technology in a
single compact package. It provides accuracy performance that
would otherwise require full motion calibration with any other
MEMS gyroscope in this performance class. When power is
applied, the ADIS16266 automatically starts up and begins
sampling sensor data, without requiring configuration commands
from a system processor. An addressable register structure and a
common serial peripheral interface (SPI) provide simple access to
sensor data and configuration settings. Many digital processor
platforms support the SPI with simple firmware level instructions.
The ADIS16266 provides several programmable features for
in-system optimization. The Bartlett window FIR filter length and
sample rate settings provide users with controls that enable noise
vs. bandwidth optimization. The digital input/output lines offer
options for a data ready signal that helps the master processor
efficiently manage data coherency, an alarm indicator signal for
triggering master processor interrupts, and a general-purpose
function for setting and monitoring system level digital controls/
conditions.
The ADIS16266 is pin-compatible with the ADIS1625x and
ADIS1626x families and comes in an LGA package (11.2 mm
11.2 mm 5.5 mm) that meets Pb-free solder reflow profile
requirements, per JEDEC J-STD-020. It offers an extended
operating temperature range of 40C to +105C.
FUNCTIONAL BLOCK DIAGRAM
RST DIO2 VCC
SELF-TEST
ADIS16266
DIO1
SCLK
GND
DIN
DOUT
CS
TEMPERATURE
SENSOR
POWER
SUPPLY
AUX
ADC
AUX
DAC
VREF
FILT
RATE
CLOCK
CALIBRATION
CONTROLLER
ALARMS
FILTER
USER
CONTROL
REGISTERS
SPI
PORT
INPUT/
OUTPUT
OUTPUT
DATA
REGISTERS
MEMS
GYROSCOPE
SENSOR
POWER
MANAGEMENT
1
1
1
1
7
-
0
0
1

Figure 1.

ADIS16266 Data Sheet

Rev. A | Page 2 of 24
TABLE OF CONTENTS
Features .............................................................................................. 1
Applications ....................................................................................... 1
General Description ......................................................................... 1
Functional Block Diagram .............................................................. 1
Revision History ............................................................................... 2
Specifications ..................................................................................... 3
Timing Specifications .................................................................. 5
Absolute Maximum Ratings ............................................................ 6
ESD Caution .................................................................................. 6
Pin Configuration and Function Descriptions ............................. 7
Typical Performance Characteristics ............................................. 8
Theory of Operation ........................................................................ 9
Sensing Element ........................................................................... 9
Data Sampling and Processing ................................................... 9
User Interface ................................................................................ 9
Basic Operation............................................................................... 10
Reading Sensor Data .................................................................. 10
User Registers .................................................................................. 11
Output Data Registers................................................................ 12
Device Configuration ................................................................ 13
Digital Signal Processing ............................................................... 14
Decimation Filter (Update Rate) .............................................. 14
Frequency Response .................................................................. 14
Dynamic Range .......................................................................... 14
Calibration ....................................................................................... 15
System Tools .................................................................................... 16
Diagnostics .................................................................................. 17
Alarms .............................................................................................. 18
Product Identification ................................................................ 19
Applications Information .............................................................. 20
Assembly ...................................................................................... 20
Bias Optimization....................................................................... 20
Interface PCB .............................................................................. 21
Outline Dimensions ....................................................................... 22
Ordering Guide .......................................................................... 22


REVISION HISTORY
1/14Rev. 0 to Rev. A
Changes to General Description Section ...................................... 1
10/12Revision 0: Initial Version

Data Sheet ADIS16266

Rev. A | Page 3 of 24
SPECIFICATIONS
TA = 40C to +105C, VCC = 5.0 V, angular rate = 0/sec, 1 g, 14,000/sec range setting, unless otherwise noted.
Table 1.
Parameter Test Conditions/Comments Min Typ Max Unit
SENSITIVITY
1
Clockwise rotation is positive output
25C, dynamic range = 14,000/sec
2
4.17 /sec/LSB
25C, dynamic range = 7000/sec 2.08 /sec/LSB
25C, dynamic range = 3500/sec 1.04 /sec/LSB
Initial Tolerance 25C, dynamic range = 14000/sec, VDD = 5 V 0.5 2 %
Temperature Coefficient 4.75 V < VDD < 5.25 V 200 ppm/C
Nonlinearity Best fit straight line 0.1 % of FS
BIAS
Initial Error 15 /sec
In-Run Bias Stability 25C, 1 470 /hour
Angular Random Walk 25C, 1 21.5 /hour
Linear Acceleration Effect 25C, 1 0.1 /sec/g
Temperature Coefficient 0.35 /sec/C
Voltage Sensitivity VCC = 4.75 V to 5.25 V, 1 7.5 /sec/V
NOISE PERFORMANCE
Output Noise 25C, 14,000/sec range, no filtering 11.2 /sec rms
25C, 7000/sec range, 4-tap filter setting 7.2 /sec rms
25C, 3500/sec range, 16-tap filter setting 3.4 /sec rms

Rate Noise Density 25C, f = 25 Hz, 14,000/sec range, no filtering 0.44 /sec/Hz rms
FREQUENCY RESPONSE
3 dB Bandwidth 360 Hz
Sensor Resonant Frequency 16 18 20 kHz
SELF-TEST STATE
Change for Positive Stimulus 14,000/sec dynamic range setting 150 500 LSB
Change for Negative Stimulus 14,000/sec dynamic range setting 500 150 LSB
Internal Self-Test Cycle Time 30 ms
ADC INPUT
Resolution 12 Bits
Integral Nonlinearity 2 LSB
Differential Nonlinearity 1 LSB
Offset Error 4 LSB
Gain Error 2 LSB
Input Range 0 2.5 V
Input Capacitance During acquisition 20 pF
ON-CHIP VOLTAGE REFERENCE 2.5 V
Accuracy 25C 10 +10 mV
Temperature Coefficient 40 ppm/C
Output Impedance 70
DAC OUTPUT 5 k/100 pF to GND
Resolution 12 Bits
Relative Accuracy For Code 101 to Code 4095 4 LSB
Differential Nonlinearity 1 LSB
Offset Error 5 mV
Gain Error 0.5 %
Output Range 0 2.5 V
Output Impedance 2
Output Settling Time 10 s
ADIS16266 Data Sheet

Rev. A | Page 4 of 24
Parameter Test Conditions/Comments Min Typ Max Unit
LOGIC INPUTS Internal 3.3 V interface
Input High Voltage, VINH 2.0 V
Input Low Voltage, VINL 0.8 V
Logic 1 Input Current, IINH VIH = 3.3 V 0.2 10 A
Logic 0 Input Current, IINL VIL = 0 V
All Except RST 40 60 A
RST The RST pin has an internal pull-up. 1 mA
Input Capacitance, CIN 10 pF
DIGITAL OUTPUTS Internal 3.3 V interface
Output High Voltage, VOH ISOURCE = 1.6 mA 2.4 V
Output Low Voltage, VOL ISINK = 1.6 mA 0.4 V
SLEEP TIMER
Timeout Period
3
0.5 128 sec
START-UP TIME
Initial Start-Up Time 170 ms
Sleep Mode Recovery 2.5 ms
Reset Recovery 78 ms
Flash Memory Update Time 40 ms
Flash Memory Test Time 18 ms
Self-Test Time 30 ms
FLASH MEMORY
Endurance
4
20,000 Cycles
Data Retention
5
TJ = 55C 10 Years
CONVERSION RATE
Sample Rate 2429 SPS
Sample Rate Tolerance 3 %
POWER SUPPLY
Operating Voltage Range, VCC 4.75 5.0 5.25 V
Power Supply Current 41 mA
Sleep mode 400 A

1
Characterization data represents 4 to fall within the 1% limit.
2
The maximum guaranteed measurement range is 14,000/sec. The sensor outputs measure beyond this range, but performance is guaranteed.
3
Guaranteed by design.
4
Endurance is qualified as per JEDEC Standard 22, Method A117, and measured at 40C, +25C, +85C, and +125C.
5
Retention lifetime equivalent at a junction temperature (TJ) of 55C, as per JEDEC Standard 22, Method A117. Retention lifetime decreases with junction temperature.

Data Sheet ADIS16266

Rev. A | Page 5 of 24
TIMING SPECIFICATIONS
TA = 40C to +85C, VCC = 5.0 V, unless otherwise noted.
Table 2.
Parameter Description Min
1
Typ Max
1
Unit
fSCLK Serial clock (not shown in figures) 0.01 2.5 MHz
tDATARATE Data rate period 32 s
tSTALL Stall period between data 9 s
t
CS
Chip select to clock edge 48.8 ns
tDAV Data output valid after SCLK falling edge
2
100 ns
tDSU Data input setup time before SCLK rising edge 24.4 ns
tDHD Data input hold time after SCLK rising edge 48.8 ns
tDF Data output fall time (not shown in figures) 5 12.5 ns
tDR Data output rise time (not shown in figures) 5 12.5 ns
tSFS CShigh after SCLK edge
3
5 ns

1
Guaranteed by design; not production tested.
2
The MSB presents an exception to this parameter. The MSB clocks out on the falling edge of CS. The remaining DOUT bits are clocked after the falling edge of SCLK
and are governed by this specification.
3
This parameter may need to be expanded to allow for proper capture of the LSB. After CSgoes high, the DOUT line enters a high impedance state.

Timing Diagrams
CS
SCLK
t
DATARATE
t
STALL
1
1
1
1
7
-
0
0
2

Figure 2. SPI Chip Select Timing

CS
SCLK
DOUT
DIN
1 2 3 4 5 6 15 16
R/W A5 A4 A3 A2 D2
MSB DB14
D1 LSB
DB13 DB12 DB10 DB11 DB2 LSB DB1
t
CS
t
SFS
t
DAV
t
DHD
t
DSU
*
*NOT DEFINED
1
1
1
1
7
-
0
0
3

Figure 3. SPI Timing (Using SPI Settings Typically Identified as CPOL = 1, CPHA = 1)

ADIS16266 Data Sheet

Rev. A | Page 6 of 24
ABSOLUTE MAXIMUM RATINGS
Table 3.
Parameter Rating
Acceleration
Any Axis, Unpowered, 0.5 ms 2000 g
Any Axis, Powered, 0.5 ms 2000 g
VCC to GND 0.3 V to +6.0 V
Digital Input/Output Voltage to GND 0.3 V to +5.3 V
Analog Inputs to GND 0.3 V to +3.5 V
Operating Temperature Range
1
40C to +105C
Storage Temperature Range
1
65C to +150C


1
Extended exposure to temperatures outside the temperature range of 40C
to +85C can adversely affect the accuracy of the factory calibration. For best
accuracy, store the part within the temperature range of 40C to +85C.



Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.

ESD CAUTION