Generally, the chip assembly line in Unisem is divided into 2 parts, which are Front of Line (FOL) and End of Line (EOL). Referring to Figure 2.4 FOL is in blue color and EOL is in yellow color.
Figure 1.4: The Process Flow
3.1 DESCRIPTION OF FRONT OF LINE (FOL)
The process of Front of Line department II is illustrated in Figure 1.5.
Figure 3.5: The FOL Process Flow
3.1.2Wafer Mount
Wafer mounting is a process of providing support to the wafer to facilitate the processing of the wafer from wafer saw through die attach. During wafer mounting, the wafer and a wafer frame are simultaneously attached on a wafer or dicing tape. The wafer frame may be made of plastic or metal, but it should be resistant to warping, bending, corrosion, and heat. The dicing tape is just a PVC sheet with synthetic adhesive on one side to hold both the wafer frame and the wafer.
Figure 3.6: The Wafer Mount Process
3.6.1Wafer Saw
Wafer saw is the step that actually cutting process to disintegrate the wafer into individual die for assembly in IC packages. The wafer saw process consists of the following steps. Firstly, the frame mounted wafer is automatically aligned into position for cutting. Then, the wafer is cut thru its thickness according to the programmed die dimensions using a resin-bonded diamond wheel rotating at a very high rpm. Finally, the wafer goes through a cleaning process using high pressure DI water sprayed on the rotating work piece and then dried by air-blowing.
Figure 3.7: The Wafer Saw Process
3.2.1.1 Second Optical Gate
The optical inspection process is to ensure that the wafers are sawed accordingly to specifications and the die is without sawing defect, glassivation, scratches on die, metallization voids, metallization corrosion, metallization adherence and other defects. Any damaged die will be rejected and disposed. A 100% screening will be performed.
Figure 1.8: Wafer view by microscope
3.2.2 Die Attach
Die Attach, also known as Die Mount or Die Bond, is the process of attaching the silicon chip to the die pad or die cavity of the support structure of the semiconductor package. The complete bonding process is repeated continuously and automatically. Only good dies are picking up from the wafer and accurately bonded onto the die pads using vacuum, form the Top Stack Loader to the Programmable Indexer. The Indexer transports the lead frame to the dispense position where it is accurately placed using a laser sensor. Epoxy (liked glue) is placed onto the die pad using the Syringe Dispenser. The lead frame is then moved to the bond position where it is positioned by a further laser sensor before a chip is placed onto the die pad. After bonding, the lead frames are placed in a magazine. The magazines are taken to the oven to cure the epoxy so that the epoxy is hardened and the dies are bonded tightly to the die pad. A die shear test monitor is performed to ensure the strength of the bonding conforms to the specifications of the customer.
Figure 1.9: Die Attach Process
3.2.3 Wire Bonding
Wire bonding is the process of providing electrical connection between the silicon chip and the external leads of the semiconductor device using very fine bonding wires. At Unisem, the wire used in wire bonding is gold (Au) wire. The bonding method used on the Wire Bonder 3006 (machine used in Unisem) is a thermo sonic ball bonding process, the predominant method in semiconductor assembly industry. The wire bonding process (ball and wedge bond) is a precisely controlled combination of heat, force, time and ultrasonic energy. It involves ultrafine gold wire with a typical diameter of approximately 1 mil and high purity of 99.99% gold. In the region where force is applied, diffusion and plastically deformation occurs between the gold wire and the metallization surface to produce a metallurgical bond. The device to be bonded is placed in contact with a heat source on the work holder to heat the lead frame to the required temperature of 150C to 200C.Three reliability tests, the wire pull test, the ball shear test and the wire peel test will be performed on samples from the magazines.
Figure 1.10: Wire Bond Process
3.2.4 Third Optical Gate
The high powered scope inspection is aimed to check for partial attached die, foreign matter, faint ink, die mask different from Build sheet, crack or chipped die, tilted die, lifted die, epoxy coverage (non-conformance to specifications), wrong bonding, metal scratches or smears, wrong die orientation, broken or extraneous wires, bonding on epoxy, cratering and other visual defects on die after bonding. The 3rd optical QA gate inspection is the last inspection in Front Of Line (FOL) assembly before units are sent for molding.