Documente Academic
Documente Profesional
Documente Cultură
Pixel (sensor)
Improvement in Basic
Performance
Compact size
Faster speeds
Higher sensitivity
Higher pixel numbers
Circuit (logic)
Pixel (sensor)
Incompatibility of image
sensor specific processes
and standard logic
processes
Sensor process
constraints
Circuit (logic)
Inefficiencies caused
by unnecessary logic
processes
Constraints in process
line generation
Performance and cost
barriers to customization
Beauty
industry
Sensing
Learning
Data and
information
RGBW
Health care
Viewing
HDR
Funct
nctionality
Exceeding Human
Vi i
Vision
Image Quality
High Speed
A new
concept
Conventional
Back-illuminated
CMOS image sensor
Newlydeveloped
Pixel section
Pixel section
Circuit section
Supporting substrate
Supporting substrate
Stacked
CMOS image sensor
Circuit section
Layer
structure
Circuit section
Layer
structure
Final product
manufacturers
End user
Improved camera performance
New product value through timely
addition of new functions
The experience of a product that is
fun and easy to use
Sony
l Advantages to Final
Product Manufacturers
The stacked structure makes it possible to
place large circuits on small chips, which
further simplifies differentiation. Also, the
technology enables use of cutting-edge
processes with chips having formed circuits
to speed up signal processing speeds and
reduce power consumption. It also facilitates
design and improves design flexibility.
l Advantages to Sony
The new technology enables us to quickly
provide digital imaging IP, a Sony strength,
to increase productivity of the external
foundry cooperative manufacturers and to
quickly respond to customization requests.
Sony Proposal:
Conventional RGB
method
Normal movie
HDR movie
When a stacked CMOS image sensor supporting these two functions are integrated into a
smartphone or other device, there is no need to change the signal processing of the device.
Type 1/3.06 stacked CMOS image sensor with approx. 13.0M effective pixels
Sample shipments planned for June, 2012
Type 1/4 stacked CMOS image sensor with approx. 8.0M effective pixels
Sample shipments planned for August, 2012