XDM SPEC A01 8.2.3-8.2.4 en PDF

XDM
Version 8.2.3/8.2.4
System Specifications
417006-2009-013-A01
XDM System Specifications

V8.2.3/8.2.4
Catalog No: X38696
May 2011
2 nd Edition
Copyright by ECI, 2008-2011. All rights reserved worldwide.

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Contents
Overview................................................................................... 1-1
XDM Intelligent and Scalable Optical Networking Platforms ...................... 1-1
Unparalleled Capabilities .................................................................................. 1-2
XDM Platforms ................................................................................................. 1-4
Physical Description ............................................................... 2-1

XDM Shelf Configurations ................................................................................ 2-2
XDM-50 Card and Module Layout .................................................................. 2-32
MXC50 and ECU50 Cards ............................................................................. 2-33
XDM-100 Card and Module Layout ................................................................ 2-35
MXC and ECU Cards ..................................................................................... 2-37
MXC300 and ECU300 Cards ......................................................................... 2-41
MXC900 and ECU900 Cards ......................................................................... 2-46
XDM-40 Card Layout ...................................................................................... 2-48
XDM-400 Card Layout .................................................................................... 2-49
XDM-450 Card Layout .................................................................................... 2-50
XDM-500 Card Layout .................................................................................... 2-51
XDM-1000 Card Layout .................................................................................. 2-52
XDM-2000 Card Layout .................................................................................. 2-54
XDM-3000 Card Layout .................................................................................. 2-55
Control, Matrix, and I/O Cards for Large XDM Shelves ................................. 2-57
XDM-50 Specifications ............................................................ 3-1

Cross-Connect Specifications .......................................................................... 3-2
Traffic Protection .............................................................................................. 3-2
Redundancy ..................................................................................................... 3-2
Synchronization ................................................................................................ 3-2
Jitter and Wander ............................................................................................. 3-2
I/O Interfaces .................................................................................................... 3-3
Management .................................................................................................... 3-4
SDH Interfaces ................................................................................................. 3-5
Data Modules ................................................................................................... 3-8
Physical Specifications ................................................................................... 3-11
Environmental Conditions .............................................................................. 3-12
EMC ............................................................................................................... 3-13
Safety ............................................................................................................. 3-13
Reliability ........................................................................................................ 3-13
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ECI Telecom Ltd. Proprietary
Contents
XDM-100 Specifications .......................................................... 4-1

Redundancy ..................................................................................................... 4-3
I/O Interfaces .................................................................................................... 4-4
Management .................................................................................................... 4-5
SDH/SONET Interfaces.................................................................................... 4-6
Data Modules ................................................................................................. 4-13
Optical Amplifier Modules for TPU/OCU ........................................................ 4-19
GbE/FC/2 Gbps FC/FICON Optical SFP Transceivers for
Transponders/Combiners ............................................................................... 4-20
STM-1 SFP Optical supervisory channel transceivers for OSC1_2 ............... 4-21
CWDM Modules ............................................................................................. 4-21
EMC ............................................................................................................... 4-27
Safety ............................................................................................................. 4-27
Reliability ........................................................................................................ 4-28
XDM-300/900 Specifications ................................................... 5-1

Redundancy ..................................................................................................... 5-2
I/O Interfaces .................................................................................................... 5-3
Management .................................................................................................... 5-5
SDH/SONET Interfaces.................................................................................... 5-6
Data Modules ................................................................................................. 5-14
Optical Amplifier Modules for TPU/OCU ........................................................ 5-19
CWDM Modules ............................................................................................. 5-20
EMC ............................................................................................................... 5-26
Safety ............................................................................................................. 5-26
Reliability ........................................................................................................ 5-26
XDM-40, 400, 450, 500, 1000, 2000, and 3000

Specifications .......................................................................... 6-1
Electrical, Optical, and Mixed Basecard Information ........................................ 6-2
XDM Shelf Capacities ...................................................................................... 6-5
PDH/Async and SDH/SONET Interface Specifications .................................... 6-8
SDH/SONET Interfaces.................................................................................. 6-10
XDM MPLS/Ethernet Card Summary ............................................................. 6-22
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Contents
Data Cards ..................................................................................................... 6-22

Optical Components ....................................................................................... 6-32
C Band Channel Frequencies and Wavelengths (ITU-T Rec. G.694.1 for
DWDM)........................................................................................................... 6-62
CWDM Frequencies and Wavelengths (ITU-T Rec. G.694.2 for CWDM) ...... 6-65
EMC ............................................................................................................... 6-73
Safety ............................................................................................................. 6-73
Reliability ........................................................................................................ 6-74
Management Specifications ........................................................................... 6-74
Other Specifications ....................................................................................... 6-75
Standards and References .................................................... A-1
Overview .......................................................................................................... A-1

Broadband Forum ............................................................................................ A-1
Environmental Standards ................................................................................. A-2
ETSI: European Telecommunications Standards Institute ............................... A-2
IEC: International Electrotechnical Commission .............................................. A-3
IEEE: Institute of Electrical and Electronic Engineers ...................................... A-4
IETF: Internet Engineering Task Force ............................................................ A-5
ISO: International Organization for Standardization ......................................... A-7
ITU-T: International Telecommunication Union ................................................ A-7
MEF: Metro Ethernet Forum ........................................................................... A-11
NIST: National Institute of Standards and Technology .................................. A-12
North American Standards ............................................................................. A-12
OMG: Object Management Group ................................................................. A-13
TMF: TeleManagement Forum ....................................................................... A-13
Web Protocol Standards ................................................................................ A-13
Index .......................................................................................... I-1
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Contents
iv
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List of Figures
Figure 1-1: Multiservice metropolitan optical network .................................................... 1-3
Figure 1-2: XDM shelves................................................................................................ 1-6
Figure 2-1: Basic XDM-50 shelf ..................................................................................... 2-2
Figure 2-2: XDM-50 with TPU (I/O protection) ............................................................... 2-3
Figure 2-3: Basic XDM-100 shelf ................................................................................... 2-4
Figure 2-4: XDM-100 with TPU (I/O protection) ............................................................. 2-5
Figure 2-5: XDM-100 nonredundant configuration ........................................................ 2-5
Figure 2-6: XDM-100H with one TPU/OCU shelf........................................................... 2-6
Figure 2-7: Basic XDM-300 shelf, horizontal installation ............................................... 2-7
Figure 2-8: Basic XDM-300 shelf, vertical Installation ................................................... 2-7
Figure 2-9: XDM-300 with TPU on top ........................................................................... 2-8
Figure 2-10: XDM-300 with TPUs on top and at the bottom of the shelf ....................... 2-8
Figure 2-11: XDM-300 with two TPUs and an OCU ...................................................... 2-9
Figure 2-12: Basic XDM-900 shelf, horizontal installation ........................................... 2-10
Figure 2-13: Basic XDM-900 shelf, vertical Installation ............................................... 2-11
Figure 2-14: XDM-900 with TPU on top ....................................................................... 2-12
Figure 2-15: XDM-900 with TPUs on top and at the bottom ........................................ 2-13
Figure 2-16: XDM-900 with two TPUs and an OCU .................................................... 2-14
Figure 2-17: XDM-40 shelf layout ................................................................................ 2-15
Figure 2-18: XDM-400 shelf open view........................................................................ 2-15
Figure 2-19: XDM-450 platform.................................................................................... 2-16
Figure 2-20: XDM-500 shelf open view........................................................................ 2-17
Figure 2-21: XDM-1000 standard shelf open view ...................................................... 2-18
Figure 2-22: XDM-2000 open view .............................................................................. 2-19
Figure 2-23: XDM-3000 front view ............................................................................... 2-20
Figure 2-24: Three XDM-50 shelves in a 2600 mm ECI recommended
ETSI rack...................................................................................................................... 2-22
Figure 2-25: Three XDM-100 or XDM-200 shelves in a 2600 mm ECI
recommended ETSI rack ............................................................................................. 2-23
Figure 2-26: Two XDM-300 shelves in a 2600 mm ECI recommended
ETSI rack...................................................................................................................... 2-24
Figure 2-27: XDM-1000 and XDM-500 shelves in a 2600 mm ECI recommended
ETSI rack...................................................................................................................... 2-25
Figure 2-28: Two XDM-500 shelves installed in a 2200 mm ETSI rack ...................... 2-26
Figure 2-29: Two XDM-40 shelves installed in a 2200 mm ETSI rack ........................ 2-27
Figure 2-30: Two XDM-2000 shelves installed in a 2200 mm ECI recommended
ETSI rack...................................................................................................................... 2-28
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List of Figures
Figure 2-31: Two XDM-1000 shelves installed in a 2600 mm ECI

Figure 2-32: XDM-1000 and XDM-100H shelves installed in a 2200 mm ECI
Figure 2-34: XDM-50 slot allocation ............................................................................. 2-32
Figure 2-35: XDM-100 slot allocation ........................................................................... 2-35
Figure 2-38: XDM-40 card layout ................................................................................. 2-49
Figure 2-39: XDM-400 typical card layout.................................................................... 2-49
Figure 2-40: XDM-450 slot layout ................................................................................ 2-50
Figure 2-41: XDM-500 standard card layout ................................................................ 2-51
Figure 2-42: XDM-1000 standard card layout .............................................................. 2-53
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List of Tables
Table 3-1:
STM-1 bidirectional transceivers ........................................................... 3-6
Table 3-2:
Table 4-1:
Table 4-2:
Table 4-3:
STM-16 bidirectional transceivers ....................................................... 4-11
Table 5-1:
Table 5-2:
Table 5-3:
Table 5-4:
GbE bidirectional transceivers ............................................................. 5-18
Table 6-1:
STM-1 transceivers ............................................................................. 6-12
Table 6-2:
STM-1 bidirectional transceivers ......................................................... 6-13
Table 6-3:
STM-4 transceivers ............................................................................. 6-14
Table 6-4:
STM-4 bidirectional transceivers ......................................................... 6-15
Table 6-5:
STM-16 transceivers ........................................................................... 6-17
Table 6-6:
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List of Tables
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1
Overview
In this chapter:
XDM Intelligent and Scalable Optical Networking Platforms .................. 1-1
Unparalleled Capabilities ................................................................................ 1-2
XDM Platforms ............................................................................................... 1-4
XDM Intelligent and Scalable

Optical Networking Platforms
The telecommunications landscape is becoming more and more competitive.
Carriers and operators are demanding networking equipment that can do more
for less money. Today's networking equipment must be flexible, upgradeable,
and highly intelligent. It must be able to successfully integrate with equipment
produced by other manufacturers according to accepted industry standards.
Above all, today's networking equipment must be scalable, easy to operate and
maintain, and cost effective.
At ECI, we specifically addressed these issues when we designed the XDM
platforms. The XDM offers carriers unprecedented capacity, cost-savings, and
ease of integration, placing it at the forefront of the optical networking
revolution.
The XDM offers a series of outstanding advantages, including:
Data-services the XDM facilitates migration from voice-oriented to

data-oriented networks, combining the cost-effectiveness and universality
of Ethernet with the Quality of Service (QoS), scalability, and resilience of
SDH/SONET.
Optical DWDM capabilities the XDM implements low-cost all-optical
networks by offering sublambda grooming of multiple low-rate services
(including SDH/SONET, IP, ATM, and GbE) onto a single wavelength.
417006-2009-013-A01
1-1
Overview
Versatility and interoperability the XDM coexists in perfect harmony

with equipment from other vendors by enabling the free flow of
management information between network elements. Its management
software facilitates smooth integration with other high-level management
systems.
Readiness for future architectures thanks to its inherently modular
build-as-you-grow architecture, the XDM gives carriers the ability to
meet all of tomorrow's networking environments, be they ring, star, or
mesh.
The innovative design of the XDM meets all the requirements of modern
transmission networks in a single shelf, consolidating key networking
technologies in a modular infrastructure to create the world's most
accommodating and scalable single-shelf platform. XDM operators can choose
to use only the features required based on current demands, and add functions
and services as requirements grow. This results in flexible and scalable
platforms that provide dynamic multiservice provisioning while reducing both
capital expenditures (CAPEX) and operating expenses (OPEX).
Unparalleled Capabilities
Typical metro networks span distances anywhere from 10 km to 300 km,
serving large bandwidth-hungry areas. Equipment serving these networks must
therefore be able to interconnect a wide range of protocols, from business
customers in the access layer to service providers in the backbone.
As a true MultiService Provisioning Platform (MSPP), the XDM seamlessly
integrates multiple network types, traffic types and technologies, including:
SDH/SONET
Bitrates ranging from E1 all the way up to STM-64/OC-192
Large nonblocking matrix for full connectivity
1-2
Variety of port densities that can fit into any network layer from the
network termination unit all the way up to the central office
Optical
High density of lambdas (40 to 80) in the C band
Ability to add/drop any lambda at any site
Ability to provide metro solutions without amplification
Long-haul solutions up to 1500 km
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Data
Overview
Usable bandwidth to customers, including Layer 1 and Layer 2 Ethernet

services, from 10BaseT all the way up to GbE
Ability to route data over SDH/SONET or DWDM
Additional cards can be added as needed, to reduce cost and protect
against over-expansion
Cellular
Aggregates ATM traffic to optimize bandwidth utilization
Unifies 2G and 3G networks
As a digital cross connect, the XDM offers VC-12 granularity (STS-1 for
SONET) within a 60 Gbps fabric. Several cross connect types are available,
including broadband, wideband, and integrated broadband/wideband, all of
which comply with applicable standards.
The XDM does all of this while maintaining high levels of performance and
reliability. Moreover, the inherent DWDM capabilities of the XDM provide
operators with an intelligent infrastructure offering virtually unlimited
expansion paths.
The multilayer multiservice functionality of the XDM enables you to:
Migrate from today's ring topologies to mesh architectures, segment by

segment
Add and activate bandwidth as requirements change
Provide on-demand services across multiple network layers
Figure 1-1: Multiservice metropolitan optical network
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1-3
Overview
XDM Platforms
The XDM family of integrated optical platforms consolidates key networking
technologies in a modular infrastructure that integrates all the transport
functions of a complete Point of Presence (POP) in a single shelf-sized
element. Cards can be interchanged between the various platforms, ensuring a
flexible build-as-you-grow architecture for transporting all types of traffic,
including voice, ATM, IP, and data.
These technical specifications address the following XDM shelf configurations:
XDM-50 The Do-It-All MSPP for Up-and-Coming Networks ultra

compact platform, designed to provide a swift response to evolving
network requirements. It brings greater levels of flexibility to metropolitan
and cellular networks, and is emerging as a solid solution for these focused
and highly cost-sensitive markets.
XDM-100 Miniature MSPP for Metro-Access and Cellular
Networks an intelligent integrated system that offers operators a
cost-effective flexible approach to maximizing bandwidth utilization, while
delivering both enhanced data services and traditional voice services.
XDM-300 Flexible MSPP for Metro Aggregation Applications
designed for metro aggregation applications and cellular Radio Access
Network (RAN) infrastructure. The platform is optimized for cost- and
physical size-effective implementation of MADM-64 and MADM-16
network elements.
XDM-900 MSPP for High-Capacity Central Exchange Applications
designed for high-capacity central exchange applications, the XDM-900
is optimized for the metro-core and features unprecedented port densities.
As a digital cross connect, the XDM-900 forms a fully protected mesh core.
As a multi-ADM, it simultaneously closes STM-64/OC-192 core
MS-SPRing/BLSR and multiple edge 1+1/UPSR rings. As a DWDM, it
enables migration from SDH/SONET to DWDM networks, providing high
capacity and sublambda grooming and reliability.
The XDM-900 provides connectivity between central office legacy
switches over E1, E3/DS-3, and STM-1/OC-3 trunks, and between POPs
over native Fast Ethernet, Gigabit Ethernet, or POS, while efficiently
grooming traffic from edge rings.
1-4
XDM-40 Modular C/DWDM and OTN Platform for Metro-Access

and CPE Applications enables service providers to build end-to-end
flexible standards-based OTN solutions that address the growing demand
for business data transport. It gives service providers the flexibility to take
full advantage of their existing networks, while providing a smooth and
fully supported migration to IP over optics.
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Overview
XDM-400 Aggregator for Metro-Edge Networks an innovative

product optimized for optical metro-access and cellular applications. When
equipped with high-power long-haul optical devices, it provides an
excellent solution for regional applications spanning distances of up to
1500 km.
XDM-450 Standalone Computer Control Panel (CCP) shelf for
optics overlay provides an efficient cost-effective way to add optical
capacity to your network configuration and serves as an add-on to host
additional OMs such as amplifiers and ROADMs. The XDM-450 is
especially valuable for use with the XDM-300, XDM-1000, XDM-2000,
XDM-3000, and ECI's CESR 9000 platforms, enabling a smooth DWDM
upgrade path and supporting alien lambda extensions.
XDM-500 Data-Aware Access Gateway designed for medium
interface capacities and street-cabinet installations, the XDM-500 is a
compact optical platform optimized for the metro-edge. It provides
traditional broadband services and highly advanced data services like
adaptive-rate Gigabit Ethernet, sophisticated Layer 2 Ethernet, POS, and
lambda. It can be used either as a simple ADM or as an edge
multi-ADM/TM shared between several rings, providing distributed cross
connectivity and concentration of low-rate services.
XDM-1000 MSPP for High-Capacity Central Exchange
Applications designed for high-capacity central exchange applications,
the XDM-1000 is optimized for the metro-core and features unprecedented
port densities.
As a digital cross connect, the XDM-1000 forms a fully protected mesh
core. As a multi-ADM, it simultaneously closes STM-64/OC-192 core
MS-SPRing/BLSR and multiple edge 1+1/UPSR rings. As a DWDM, it
enables migration from SDH/SONET to DWDM networks, providing high
capacity and sublambda grooming and reliability.
The XDM-1000 provides connectivity between central office legacy
switches over E1, E3/DS-3, and STM-1/OC-3 trunks, and between POPs
over native Fast Ethernet, Gigabit Ethernet, or POS, while efficiently
grooming traffic from edge rings.
XDM-2000 Multifunctional Intelligent Optical Switch designed for

the metro and metro-regional core, the XDM-2000 is optimized for pure
DWDM and hybrid optical applications. This is a highly dense DWDM
platform that provides intelligent sublambda grooming and optimum
wavelength utilization.
As the most flexible optical switch on the market today, the XDM-2000
transports up to 400 Gbps (upgradeable to 1.6 Tbps and above), and
integrates the most advanced optical units with a variety of interfaces and a
sophisticated high-capacity matrix in one small low-cost package.
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1-5
Overview
XDM-3000 High Capacity Metro-Core MSPP the 240 Gbps

capacity is ideal for regional metro-core networks. The XDM-3000 is
designed for ever-expanding optical transport traffic demands, with
network migration to n x 10G interfaces increasing the bulk bandwidth
requirements for core platforms. The high capacity of the XDM-3000
relieves metro-core network bottlenecks while enabling network expansion
and improved BW efficiency through the use of 10 Gbps cards to maximize
utilization of available slots.
As a multi-ADM, the XDM-3000 provides multi-ring closure,
simultaneously closing STM-16/STM-64 core MSSPRing and multiple
edge SNCP rings, and providing improved protection and restoration
capabilities. The XDM-3000 can also be used as a cost-effective DXC for
heavy traffic sites, forming a fully protected mesh core. The large amount
of low-order traffic handled by this platform enables full connectivity for
TDM networks.
Figure 1-2: XDM shelves
1-6
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2
Physical Description
In this chapter:
XDM Shelf Configurations ............................................................................. 2-2
XDM-50 Card and Module Layout ............................................................... 2-32
MXC50 and ECU50 Cards ............................................................................ 2-33
XDM-100 Card and Module Layout ............................................................. 2-35
MXC and ECU Cards .................................................................................... 2-37
MXC300 and ECU300 Cards ........................................................................ 2-41
MXC900 and ECU900 Cards ........................................................................ 2-46
XDM-40 Card Layout ................................................................................... 2-48
XDM-400 Card Layout ................................................................................. 2-49
XDM-450 Card Layout ................................................................................. 2-50
XDM-500 Card Layout ................................................................................. 2-51
XDM-1000 Card Layout ............................................................................... 2-52
XDM-2000 Card Layout ............................................................................... 2-54
XDM-3000 Card Layout ............................................................................... 2-55
Control, Matrix, and I/O Cards for Large XDM Shelves .............................. 2-57
417006-2009-013-A01
2-1
XDM Shelf Configurations

This section describes the XDM shelf configurations and slot assignments.
XDM-50 Shelf Layout

The XDM-50 is available in two configurations:
Basic XDM-50 shelf with 21 protected E1 interfaces
XDM-50 with I/O protection
Basic XDM-50 shelf

The basic XDM-50 shelf is housed in a 231 mm deep, 443 mm wide, and 129
mm high equipment cage. The lower part of the shelf consists of the card cage
and accommodates the MXC50 (Main Cross connect and Control) cards (main
and protection), the ECU50 (External Connection Unit), the CCP50_2
(Common Connection Panel), and the INF50 (Input Filter) cards. The upper
part of the shelf consists of the module cage that houses up to four I/O
modules. Various types of interface modules supporting PDH, SDH, and data
services are available.
The FCU50 fan control unit at the right side of the shelf provides cooling air to
the system.
Electrical connections are located directly in the tributary modules, except for
the CCP50_2, which provides electrical connection to the PDB_21 (PDH
Daughter Board) residing in the MXC50.
To support system redundancy, the XDM-50 contains two INF50 units with
connectors for two input power sources.
Figure 2-1: Basic XDM-50 shelf
2-2
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A Tributary Protection Unit (TPU) is mounted on top of the basic XDM-50
shelf to provide I/O protection to the I/O modules. The TPU adds only 75 mm
to the basic shelf height, allowing it to remain ultra compact in size. It has five
slots, four allocated for Tributary Protection Modules (TPMs) and one for a
Tributary Control (TC) or Tributary Control and Fan (TCF) module.
Each TPM is connected to both operating and protection I/O modules in the
shelf, in a 1:1 or 1:3 configuration. If a failure is detected in one of the
operating I/O modules, the TC (or TCF) switches the traffic from the active to
the protection I/O module.
Figure 2-2: XDM-50 with TPU (I/O protection)
XDM-100 Shelf Layout

The XDM-100 is available in four configurations:
Basic XDM-100 shelf
Nonredundant XDM-100
Hybrid XDM-100H
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2-3
Basic XDM-100 shelf

mm high equipment cage. The lower part of the shelf consists of the card cage
and accommodates the MXC-100 cards (main and protection) and the ECU.
The upper part of the shelf consists of the module cage that houses up to eight
I/O modules. Various types of interface modules supporting PDH, SDH, and
data services are available. The FCU fan control unit at the right side of the
shelf provides cooling air to the system.
All electrical connections are located directly in the tributary modules;
therefore, the XDM-100 does not need additional electrical interface
connections.
To support system redundancy, each MXC card contains an integrated xINF
(XDM Input Filter) unit with connectors for two input power sources.
Figure 2-3: Basic XDM-100 shelf
2-4
417006-2009-013-A01

A TPU is mounted on top of the basic XDM-100 shelf to provide I/O
protection to the I/O modules. The TPU adds only 75 mm to the basic shelf
height, allowing the XDM-100 to remain compact in size. It has five slots, four
allocated for TPMs and one for a TC module.
shelf in a 1:1, 1:2, or 1:3 configuration. If a failure is detected in one of the
operating I/O modules, the TC switches the traffic from the active to the
protection I/O module.
Figure 2-4: XDM-100 with TPU (I/O protection)
Nonredundant XDM-100
NOTE: The nonredundant XDM-100 configuration is not
recommended for data applications.
The nonredundant XDM-100 has the same physical dimensions as the basic
shelf. It differs only by the single MXC-100 card that it has in slot MXC A,
compared with two cards in the basic shelf. Slot MXC B of the nonredundant
configuration accommodates a bridging unit, MXC-BR. No redundancy is
provided for the MXC-100 functions.
Figure 2-5: XDM-100 nonredundant configuration
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2-5
XDM-100H
The XDM-100H combines the SDH/SONET and data capabilities of the
XDM-100 with the optical CWDM capabilities. This is provided by the
software cost option incorporated within the NVM card in each of the
MXC-100 cards.
The XDM-100H consists of the basic XDM-100 shelf, and if required, one or
two TPU/OCU shelves. The I/O module cage can accept any mix of the
XDM-100 I/O modules and CWDM I/O modules.
The TPU/OCU shelf is identical in its physical dimensions and number of slots
(five) to the TPU. Four of the slots can house any mix of TPMs and CWDM
optical networking modules (mux/demux, OADM, and splitter/coupler); the
fifth slot always accommodates a TC module.
Figure 2-6: XDM-100H with one TPU/OCU shelf

The XDM-300 is available in following configurations:
Basic XDM-300 shelf
Expanded XDM-300 with I/O protection as follows:
A TPU mounted on top of the basic shelf.
A TPU mounted at the bottom of the basic shelf.
2-6
Two TPUs mounted, one on top and one at the bottom of the basic
shelf.
Expanded XDM-300 with enhanced CWDM networking capabilities. An

OCU is mounted on top of the basic shelf, or on the expanded shelf (with a
TPU).
417006-2009-013-A01
Basic XDM-300 shelf

mm high equipment cage. The upper part of the shelf consists of a module cage
(upper module cage) and houses up to eight I/O modules. In the middle of the
shelf is a card cage that accommodate the MXC300 cards (main and
protection), the External Connection Unit (ECU300), and up to two I/O cards.
The lower part of the shelf consists of an additional module cage (lower
module cage) that can be equipped with up to eight I/O modules.
I/O protection is not supported in this option.
The XDM-300 shelf can be installed in a horizontal or vertical position.
Figure 2-7: Basic XDM-300 shelf, horizontal installation
Figure 2-8: Basic XDM-300 shelf, vertical Installation
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2-7
Expanded XDM-300 with I/O Protection

TPUs can be attached to the XDM-300 shelf to protect installed I/O modules.
operating I/O modules, the active MXC300 via the TC module in the TPU
switches the traffic from the active I/O module to the protection module.
Several protection configurations are possible:
A TPU mounted on top of the basic shelf, protects I/O modules residing in
the upper module cage.
A TPU mounted at the bottom of the basic shelf, protects I/O modules
installed in the lower module cage.
Two TPUs mounted one on top and one at the bottom of the basic shelf;
provide protection to I/O modules in both the upper and lower module
cages.
Figure 2-9: XDM-300 with TPU on top
Figure 2-10: XDM-300 with TPUs on top and at the bottom of the shelf
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Expanded XDM-300 with CWDM Networking

Capabilities
An OCU can be mounted on top of a basic XDM-300 shelf or on top of an
expanded shelf to add enhanced CWDM networking capabilities to the
platform.
NOTE: An OCU is not supported at the bottom of the
XDM-300 shelf.
Figure 2-11: XDM-300 with two TPUs and an OCU
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2-9

The XDM-300 is available in following configurations:
Basic XDM-900 shelf
Expanded XDM-900 with I/O protection as follows:
A TPU mounted on top of the basic shelf.
A TPU mounted at the bottom of the basic shelf.
Two TPUs mounted, one on top and one at the bottom of the basic
shelf.
Expanded XDM-900 with enhanced CWDM networking capabilities. An
OCU is mounted on top of the basic shelf, or on the expanded shelf (with a
TPU).
Basic XDM-900 shelf

mm high equipment cage. The upper part of the shelf consists of a module cage
(upper module cage) and houses up to eight I/O modules. In the middle of the
shelf is a card cage that accommodate the MXC900 cards (main and
protection), the External Connection Unit (ECU900), and up to two I/O cards.
The lower part of the shelf consists of an additional module cage (lower
module cage) that can be equipped with up to eight I/O modules.
I/O protection is not supported in this option.
The XDM-900 shelf can be installed in a horizontal or vertical position.
Figure 2-12: Basic XDM-900 shelf, horizontal installation
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Figure 2-13: Basic XDM-900 shelf, vertical Installation
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2-11

TPUs can be attached to the XDM-900 shelf to protect installed I/O modules.
operating I/O modules, the active MXC900 via the TC module in the TPU
switches the traffic from the active I/O module to the protection module.
Several protection configurations are possible:
A TPU mounted on top of the basic shelf, protects I/O modules residing in
the upper module cage.
A TPU mounted at the bottom of the basic shelf, protects I/O modules
installed in the lower module cage.
Two TPUs mounted one on top and one at the bottom of the basic shelf;
provide protection to I/O modules in both the upper and lower module
cages.
Figure 2-14: XDM-900 with TPU on top
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Figure 2-15: XDM-900 with TPUs on top and at the bottom
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Expanded XDM-900 with CWDM Networking

Capabilities
An OCU can be mounted on top of a basic XDM-900 shelf or on top of an
expanded shelf to add enhanced CWDM networking capabilities to the
platform.
NOTE: An OCU is not supported at the bottom of the
XDM-900 shelf.
Figure 2-16: XDM-900 with two TPUs and an OCU
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XDM-40 Shelf Layout

The compact XDM-40 shelf is located in a 285 mm deep, 447 mm wide, and
256 mm high equipment cage. The cards cage houses two I/O slots for optical
cards (transponders, combiners, and/or optical amplifiers). The upper cage
houses two slots for the DWDM/amplifier modules. The shelf also includes an
xMCP_B, MECP, two xINF40s, and an xFCU40 that includes three separate
fans to support system redundancy.
Figure 2-17: XDM-40 shelf layout

The compact XDM-400 shelf is located in a 285 mm deep, 450 mm wide, and
500 mm high equipment cage. It consists of a single-row cage housing I/O,
matrix, processor, and common cards in the middle and right side of the shelf.
The electrical interface connection modules are housed in two slots on the left
side of the shelf. The shelf also contains two xINF4 (XDM-400 Input Filter)
units and an xFCU4 (XDM-400 Fan Control Unit) that consists of five separate
fans that provide system redundancy.
Figure 2-18: XDM-400 shelf open view
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2-15

The standard XDM-450 is located in a 275 mm deep, 492 mm wide, and
374 mm high shelf with a single cards cage section. The shelf consists of a
single-row cage housing the DWDM, processor, and common cards. The shelf
also has two xINF and an xFCU unit.
Figure 2-19: XDM-450 platform
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The XDM-500 compact shelf is located in a 285 mm deep, 450 mm wide, and
725 mm high equipment cage. The shelf consists of a single-row cage housing
the I/O, matrix, processor, and common cards in two slot areas on either side of
the shelf. The electrical interface connection modules and DWDM/OADM
modules are housed in the central slot area. The shelf also has two xINF and
three xFCU units.
Figure 2-20: XDM-500 shelf open view
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2-17

The standard XDM-1000 is located in a 285 mm deep, 450 mm wide, and 1100
mm high shelf with a modules cage and a cards cage section. The cards cage
houses the I/O, matrix, processor, and common cards. The modules cage
houses the electrical interface connection modules and DWDM/OADM
modules. The shelf also has two xINFs and three xFCUs.
Figure 2-21: XDM-1000 standard shelf open view
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The XDM-2000 shelf is located in a 285 mm deep, 450 mm wide, and 775 mm
high equipment cage. The shelf consists of a single-row cage that houses
optical cards (transponders, mux/demux, optical amplifiers), and
xMCP/xMCP_B and MECP cards.
XDM-500 and XDM-2000 shelves may be used in conjunction with the regular
XDM-1000 shelf in the same rack.
Figure 2-22: XDM-2000 open view
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2-19

The XDM-3000 is located in a 350 mm deep, 492 mm wide, and 1550 mm
high shelf. The XDM-3000 consists of an I/O card cage arranged in four
sections, together with additional power, communication, and control units.
Figure 2-23: XDM-3000 front view
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Rack Layouts and Expansion Shelves

XDM shelves can be installed in both standard and ECI recommended ETSI
racks, as well as in 19" and 23" racks. They can also be installed in 19" 7' and
23" 7' bay racks, except for the XDM-50, XDM-100, and XDM-300 that
cannot be installed in 19" 7'bay racks.
The recommended ETSI rack offered by ECI is specially designed for
installation of telecommunication equipment and a wide range of equipment
accessories. To facilitate cable routing, the rack has removable rear and side
panels which enable tidy leading and efficient maintenance of all rack cables.
Two plastic conduits on the rack's front rails support routing of up to 200
optical fibers. It also has open top and bottom frames to facilitate easy routing
of cables from suspension floors and/or ceiling ladders. The front door can be
mounted for right or left opening.
The XDM-50, XDM-100, or XDM-300 can be installed in either 2200 mm or
2600 mm standard or ECI recommended ETSI racks.
NOTE: Installations of XDM-50, XDM-100, or XDM-300 in
19" racks must be approved by ECI's Transport Networks
Division Mechanical Department.
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Figure 2-24: Three XDM-50 shelves in a 2600 mm ECI recommended ETSI rack
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Figure 2-25: Three XDM-100 or XDM-200 shelves in a 2600 mm ECI recommended

ETSI rack
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Figure 2-26: Two XDM-300 shelves in a 2600 mm ECI recommended ETSI rack
The XDM-1000 can be installed in either a 2200 mm or 2600 mm ETSI rack.

Two XDM-1000 shelves can be installed in a 2600 mm rack, whereas a
2200 mm rack can accommodate only a single XDM-1000 shelf.
Alternatively, two XDM-500 and/or XDM-2000 shelves can be installed in a
2200 mm rack. One XDM-1000 shelf and one XDM-500 or XDM-2000 shelf
can be installed in a 2600 mm rack.
The installation of XDM-500, XDM-1000, and XDM-2000 in 19" or 23" racks
is supported as well.
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In addition, a 600 mm deep rack can house XDM shelves in a back-to-back

configuration, thus doubling the capacity of the rack.
Figure 2-27: XDM-1000 and XDM-500 shelves in a 2600 mm ECI recommended

ETSI rack
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Figure 2-28: Two XDM-500 shelves installed in a 2200 mm ETSI rack
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Figure 2-29: Two XDM-40 shelves installed in a 2200 mm ETSI rack
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2-27

ETSI rack
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ETSI rack
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2-29

recommended ETSI rack
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recommended ETSI rack
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2-31
XDM-50 Card and Module Layout

Basic XDM-50 Shelf
The basic XDM-50 cage contains slots for I/O interface modules and dedicated
slots for the MXC50, CCP50, INF50, and ECU50. The cage's design and
mechanical practice conform to international mechanical standards and
specifications.
The modules and cards are distributed as follows:
Four (4) slots, I1 to I4, optimally allocated for I/O interface modules.
Two (2) slots, A and B respectively, allocated for the MXC50s (main and
protection). Each MXC50 has three slots (A1, A2, A3 and B1, B2, B3) to
accommodate SDH aggregate SFP transceivers.
One (1) slot allocated for the CCP50_2.
Two (2) slots allocated for INF50 cards.
One (1) slot allocated for the ECU50.
The CCP50_2 provides the physical connection to 21 E1 interfaces in the

PDB2_21 residing in the MXC50.
Two INF50 filter cards, with inputs for two sources, support system DC
redundancy.
The ECU50 is located beneath the MXC50s. Its front panel features several
interface connectors for management, external timing, alarms, orderwire and
overhead (future release). It also includes colored alarm severity LED
indicators.
Figure 2-34: XDM-50 slot allocation
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Expanded XDM-50 Shelf with I/O Protection

A TPU can be mounted on top of the basic XDM-50 shelf to add protection of
electrical I/O modules. The modules are distributed as follows:
Four (4) slots flexibly allocated for TPMs (single-slot, double-slot, or

triple-slot modules are supported)
One (1) slot allocated for the TC or TCF
Each TPM is connected to the operating and protection modules of the

XDM-50 shelf respectively. If a failure is detected in one of the operating I/O
modules, the XDM-50 control system sends control signals to the appropriate
TPM relays to switch traffic from the operating I/O module to the protection
module. Several types of TPMs for 1:1 or 1:3 protection schemes are
supported.
The TC or TCF is connected to the DC and control buses of the MXC50 cards
via the TPU backplane. It controls the switching of traffic from the main to
protection I/O module by relays in the corresponding TPM. In addition, the
TCF has three fans that provide cooling air to the modules installed in the TPU
(optional).
MXC50 and ECU50 Cards

The MXC50 and ECU50 were designed to facilitate simple installation and
maintenance. They feature:
Easy routing of external management interfaces
Hot insertion of cards and modules to support quick and

non-traffic-affecting maintenance and repair
MXC50
The MXC50 performs the shelf's cross-connect, timing, and multiplexing
functions, including:
Multiplexer control and traffic processing.
SDH traffic cross-connect. The switch handles aggregate and tributary

interface traffic with a capacity of 128 x STM-1 (64 x STM-1 in use)
equivalents.
Timing and synchronization.
Routing and handling of 16 DCC channels.
The XDM-50 supports several types of cross connects in compliance with

applicable ITU-T and Telcordia standards. These include broadband,
wideband, and integrated broadband/wideband cross connects.
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ECU50 and ECU50R

The ECU50 is the alarms and maintenance card. It is available in two versions:
ECU50 and ECU50R. The functions of both cards are similar; the main
difference is that the ECU50R does not support OW. The ECU50 provides a
variety of interfaces and indicators, as follows:
2-34
RS-232 serial interface for a craft terminal
Ethernet RJ45 interface for Lightsoft and EMS-XDM
Alarm severity outputs (Critical, Major, Minor, Warning) and external

alarm outputs and inputs (D-type SCSI connector)
External synchronization inputs/outputs (T3/T4)
Alarms and status display
Analog orderwire (OW) circuit, providing point-to-point or conference

engineering orderwire voice connection for technical staff use (future
release)
Pushbuttons for LED tests, forced laser activation during ALS, alarms
cutoff (ACO), and OW circuit (future release)
NET SEL switch (A/B)
Optional USB interface (future use, for craft terminal)
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XDM-100 Card and Module

Layout
Basic XDM-100 Shelf
The basic XDM-100 cage contains slots for I/O interface modules, and
dedicated slots for the MXC cards and the ECU. The cage's design and
mechanical practice conform to international mechanical standards and
specifications.
The modules and cards are distributed as follows:
Eight (8) slots, I1 to I8, optimally allocated for I/O interface modules.
Two (2) slots, A and B respectively, allocated for the MXC cards (main and
protection). Each MXC has two slots (A1 and A2 and B1 and B2) to
accommodate SDH/SONET aggregate modules.
One (1) slot allocated for the ECU.
The ECU is located beneath the MXC cards. Its front panel features several
interface connectors for management, external timing, alarms, orderwire, and
overhead (future release). It also includes colored alarm severity LED
indicators and selectors, and a display for selecting specific modules and ports
for monitoring purposes.
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Expanded XDM-100 Shelf with I/O

Protection
A TPU can be mounted on top of the basic XDM-100 shelf to add protection of
electrical I/O modules. The modules are distributed as follows:
Four (4) slots flexibly allocated for TPMs (single-slot or double-slot

modules are supported)
One (1) slot allocated for the TC or TCF module

module. Several types of TPMs for 1:1, 1:2, or 1:3 protection schemes are
supported.
The TC or TCF is connected to the DC and control buses of the MXC cards via
the TPU backplane. It controls the switching of traffic from the main to
TCF has four fans that provide cooling air to the modules installed in the TPU
(optional).
Nonredundant XDM-100 Shelf

The XDM-100 is also available in a nonredundant configuration. This shelf is
equipped with only one MXC. The second position of the MXC houses an
MXC-BG card that bridges the buses of the second slot to the I/O modules.
Redundancy for power supply, timing and synchronization, cross-connect, and
all other MXC functions is not supported in this configuration. However, since
the MXC has two aggregate modules, SNCP, MSP, and MS-SPRing traffic
protection mechanisms are supported.
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XDM-100H Shelf
The XDM-100H platform is based on the basic XDM-100 shelf, with a
software cost option that supports installation of any mix of the XDM-100 I/O
modules with optical I/O modules in the module cage. In addition, one or two
TPU/OCU shelves can be mounted on top of the basic shelf to support any mix
of TPM and CWDM optical networking modules.
The XDM-100H consists of the following units:
Basic XDM-100 shelf that includes the ECU or ECU-F, two MXC-100
cards, the I/O module cage with eight slots, and the FCU. Each MXC-100
card houses an NVM module which contains the licensed option software.
The eight slots of the I/O module cage support installation of XDM-100 I/O
modules, as well as CWDM I/O modules (transponders and combiners).
TPU/OCU shelf (optional), mounted on top of the XDM-100 basic shelf. It

contains five (5) slots: four (4) for supporting any mix of mux/demux,
OADM, splitter/coupler, and TPM modules, and one (1) for a TC module.
One or two TPU/OCUs can be mounted on the basic XDM-100 shelf.
MXC and ECU Cards

The MXC and ECU were designed to facilitate simple installation and
Electrical interface connectors that are integrated into the I/O modules,
saving the need for separate electrical interface modules
Monitoring system for acceptance test purposes

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2-37
MXC
Two types of MXC cards are available:
MXC-100 used in XDM-100. It has two slots for housing aggregate

modules in XDM-100. Two MXC-100 cards are usually installed in the
XDM-100, providing 1+1 protection.
MXC-100B supported only for XDM-100. Features enhanced

cross-connect and timing functionality, and also supports OW.
The basic and expanded versions of the XDM-100 shelf accommodate two
identical MXC cards. By default, the MXC-A is the main card and MXC-B is
the protection card.
Both cards perform the following functions simultaneously in a 1+1 protection
configuration:
Communication and control
Alarm and maintenance
Cross-connect
Timing and synchronization
Distribution of power supply to all modules
Routing and handling of 32 DCC channels
Support for OW in conjunction with ECU100B (only MXC-100B)
In addition, the MXC accommodates the NVM compact flash memory card and
houses SDH/SONET aggregate modules (SAMs).
The additional MXC card provides 1+1 protection to the cross-connect matrix
and full 1:1 protection to all other functions, since the standby MXC has an
identical database to the active MXC.
In case of a hardware failure in the active MXC or in its traffic
interconnections, the I/O interface modules switch to the protection MXC
within 50 ms. Similarly, in case of a hardware failure in the TiMing Unit
(TMU) of the operational MXC card, the backup TMU takes over the timing
control with no disruption in traffic. The operational MXC card is configured
by LightSoft, ECI's Optical Network Division's multidimensional network
manager.
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ECU
The ECU connects management, alarms, overhead access, and orderwire
interfaces to the active MXC card. This card also provides the physical
connections for these interfaces.
Two types of ECU cards are available:
ECU-F supports full functionality, is usually used in the XDM-100
ECU supports reduced functionality and can also be used in XDM-100

installations
The ECU-F supports the following management and alarm interfaces and
functions:
Ethernet interface to LightSoft and EMS-XDM
Ethernet hub for multiple NE connections
Serial RS-232 interface for craft terminal
USB interface
Synchronization inputs and outputs (T3/T4)
Alarm severity outputs (Critical, Major, Minor, Warning)
External alarm outputs and inputs
Alarm Cut Off (ACO)
Operation and alarm LEDs
Selection and display of traffic interfaces for monitoring purposes
Monitor interface for STM-1/OC-3 ports
Laser activation during ALS, for maintenance purposes
Multiplexer reset
Holdup capacitors
Lamp test activation
The ECU supports all functions provided by the ECU-F except for Ethernet
expansion to hub, monitoring points, holdup capacitors, and alarms in/out.
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2-39

Layout
Basic XDM-300 Shelf
The basic XDM-300 shelf is 443 mm wide, 246 mm deep and 350 mm high.
When the optional TPUs or OCU are attached to the shelf, each of these
expansion shelves adds 75 mm to the height of the basic shelf.
The rightmost slot of the shelf houses the FCU300. The middle part of the shelf
consists of the cards cage with five horizontal slots which accommodate:
ECU300 or ECU300-F
Two MXC300 cards (main and protect)
Up to two quad I/O cards

NOTE: The slots of the quad I/O cards can be adapted to
accommodate one SIM16_1 I/O module each instead of the

I/O cards by using a mechanical adapter.
The upper and lower parts of the shelf consist of a module cage with eight
horizontal slots. Each module cage can house up to eight I/O (PDH, SDH, or
data) single slot modules, totaling a maximum of 16 modules.
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Protection
In an expanded XDM-300 shelf with I/O protection, one or two TPUs are
mounted on the top and/or at the bottom of the basic shelf, including a TC or
TCF module and TPMs. An OCU with CWDM networking modules can be
mounted on top of a basic or expanded shelf.
The TPU modules are distributed as follows:


supported.
The TC or TCF is connected to the DC and control buses of the MXC300 cards
(optional).


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2-41
MXC300
The XDM-300 is a redundant platform, and two MXC300 cards must always
be installed in slots MXC-A and MXC-B of the XDM-300 shelf.
The MXC300 performs the following functions:
Communications and control (by CPU):
Control of all shelf cards and modules
Management interface
Alarms and maintenance
Control of TPU/OCU shelves
2.5 Gbps capacity for all I/O module slots, and 10 Gbps for I/O card
slots
SDH-related functions:
SDH timing and synchronization
SDH cross connect 4/3/1
60 Gbps HO/LO nonblocking matrix
Support for CWDM I/O modules (transponders and combiners) in all I/O
module slots
DC voltage supply:
2-42
Support of the 256 Mb NonVolatile compact flash Memory (NVM)

card
One 48 V DC power input that supplies voltages for all cards and
modules
Input Filtering (INF) function for the entire shelf
Voltage and control for Fan Control Unit (VFCU)
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ECU300
Two types of ECU300 cards are available:
ECU300-F supports full functionality
ECU300 supports reduced functionality
ECU300F
The ECU300-F supports:
Management interfaces:
Management (LightSoft and EMS-XDM) interface (Ethernet)
Ethernet hub for the connection of multiple NEs
Serial (RS-232) interface for craft terminal
Alarm interfaces and indications, including:
External alarm outputs and inputs to client or xRAP-B/xRAP-100
ACO
LEDs for display of operation and alarms
Traffic monitoring, including:
Selection and display of the traffic interface channel currently being

monitored for all I/O module (I1 to I16) slots, as well as, quad I/O card
(I17 and I18) slots
Monitor interface for STM-1 ports
Activations, including:
Laser activation during ALS for maintenance purposes
LEDs test for the entire shelf
Hold-up capacitors
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ECU300
The ECU300 card is suitable for sites that do not require alarms dry-contacts,
output system monitoring, and Ethernet hub for management. It supports:
Management interfaces, including:
External alarm outputs and inputs to client or xRAP-B/xRAP-100
ACO
LEDs for the display of operation and alarms

Layout
Basic XDM-900 Shelf
The basic XDM-900 shelf is 443 mm wide, 246 mm deep and 350 mm high.
When the optional TPUs or OCU are attached to the shelf, each of these
expansion shelves adds 75 mm to the height of the basic shelf.
The rightmost slot of the shelf houses the FCU900. The middle part of the shelf
consists of the cards cage with five horizontal slots which accommodate:
ECU900 or ECU900-F
Two MXC900 cards (main and protect)
Two ACP900 modules each in an MXC900
Up to two quad I/O cards

NOTE: The slots of the quad I/O cards can be adapted to
accommodate one SIM16_1 I/O module each instead of the

I/O cards by using a mechanical adapter.
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The upper and lower parts of the shelf consist of a module cage with eight
horizontal slots. Each module cage can house up to eight I/O (PDH, SDH, or
data) single slot modules, totaling a maximum of 16 modules.

Protection
In an expanded XDM-900 shelf with I/O protection, one or two TPUs are
mounted on the top and/or at the bottom of the basic shelf, including a TC or
TCF module and TPMs. An OCU with CWDM networking modules can be
mounted on top of a basic or expanded shelf.
The TPU modules are distributed as follows:


supported.
The TC or TCF is connected to the DC and control buses of the MX900 cards
(optional).
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2-45


MXC900
The XDM-900 is a redundant platform, and two MXC900 cards must always
be installed in slots MXC-A and MXC-B of the XDM-40 shelf.
The MXC900 performs the following functions:
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Communications and control (by CPU):
Control of all shelf cards and modules
Management interface
Support of the 256 Mb NonVolatile compact flash Memory (NVM)

card
Alarms and maintenance
Control of TPU/OCU shelves
5 Gbps capacity for all I/O module slots, and 20 Gbps for quad I/O card
slots
SDH/SONET-related functions:
SDH/SONET timing and synchronization
SDH/SONET cross connect 4/3/1
120 Gbps HO/LO nonblocking matrix
Accommodates the ACP-900 module and provides power supply,

communication, and control
Support for CWDM I/O modules (transponders and combiners) in all I/O
module slots
DC voltage supply:
One 48 VDC power input that supplies voltages for all cards and
modules
Input Filtering (INF) function for the entire shelf
Voltage and control for Fan Control Unit (VFCU)
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ECU900
Two types of ECU900 cards are available:
ECU900-F supports full functionality
ECU900 supports reduced functionality
ECU900F
The ECU900F supports:
Management interfaces:
External alarm outputs and inputs to client or xRAP-100
ACO
LEDs for display of operation and alarms
Traffic monitoring, including:
Selection and display of the traffic interface channel currently being

monitored for all I/O module (I1 to I16) slots, as well as, quad I/O card
(I17 and I18) slots
Monitor interface for STM-1 ports
Hold-up capacitors
417006-2009-013-A01
2-47
ECU900
The ECU900 card is suitable for sites that do not require alarms dry-contacts,
output system monitoring, and Ethernet hub for management. It supports:
Management interfaces, including:
External alarm outputs and inputs to client or xRAP-100
ACO
LEDs for the display of operation and alarms
XDM-40 Card Layout

The XDM-40 standard shelf consists of a modules cage housing DWDM and
amplification modules, a cards cage housing the I/O cards and common cards,
the xFCU40, and the power supply for the fan unit (PSFU).
Modules cage
Two (2) slots (M1 and M2) allocated to DWDM/OADM, optical booster,
and accessories modules
Two (2) xINF40s designed for power supply redundancy
One (1) ECM to facilitate routing of external management interfaces,

connecting the management, OHA, and OW interfaces to the active
xMCP_B
Cards cage
2-48
Two (2) slots (I1 and I2) flexibly allocated to I/O optical transponders,
combiners, and/or amplifiers
One (1) slot (C1) allocated to the xMCP_B card
One (1) slot (C3) allocated to the MECP card, for user and management
interfaces
PSFU and xFCU40 that consists of three separate fans to support cooling
system redundancy
417006-2009-013-A01
Hot insertion of cards and modules is allowed to supports quick maintenance

and repair activities without affecting traffic.
Figure 2-38: XDM-40 card layout
XDM-400 Card Layout

The XDM-400 shelf consists of a single cage containing slots for five I/O
cards, and dedicated slots for the XIO (cross-connect and I/O matrix),
processor and common cards in the middle and right side of the shelf. The
electrical interface connection modules are housed in two slots on the left side
of the shelf. The XDM-400 cage design and mechanical practice conform to
international mechanical standards and specifications. The cards are distributed
as follows:
Five (5) slots, IS1 to IS5, optimally allocated for I/O cards
Two (2) slots, MS1 and MS2, allocated for electrical interface connection
modules
Two (2) slots, X1 and X2, allocated for XIO-192 cards
Two (2) slots, C1 and C2, allocated for xMCP cards
An external connection module, the MECP, is located above the xMCP. It

connects the management, overhead access (OHA), and orderwire interfaces to
the active xMCP.
Figure 2-39: XDM-400 typical card layout
417006-2009-013-A01
2-49
XDM-450 Card Layout

The XDM-450 shelf consists of a single cage containing slots for nine DWDM
modules and dedicated slots for the processor, management and other common
cards. The XDM-450 standard shelf is arranged as follows.
Nine CCP slots (M1 to M9) flexibly allocated to DWDM modules such as
ROADMs, Mux/DeMuxes, and amplifiers.
One slot (C0) allocated to the xECM-450 card, for user and management
interfaces.
One slot (C1) allocated to the xMCP-B2G card.
One slot for optional OSC Mux/DeMux module with integrated C/T filter
(ACC4OSC5).
Two xINF-450 modules designed for power supply redundancy.
xFCU-450 fan unit to support cooling system redundancy.
The XDM-450 standard card layout is illustrated in the following figure.
Figure 2-40: XDM-450 slot layout
2-50
417006-2009-013-A01
XDM-500 Card Layout

The XDM-500 shelf consists of a single cage containing slots for six I/O cards,
four connection modules, and dedicated slots for the matrix, processor, and
common cards. The XDM-500 cage design and mechanical practice conform to
international mechanical standards and specifications. The cards are distributed
as follows:
Six (6) slots, IC1 to IC6, flexibly allocated for I/O cards and/or
transponders (depending on the configuration)
Four (4) slots, MC1 to MC4, allocated for electric interface connection
modules or DWDM/OADM modules
Two (2) slots, X1 and X2, allocated for the HLXC or XIO matrix cards
Two (2) slots, C1 and C2, allocated for the xMCP cards
An external connection module, the MECP, is located above the

xMCP/xMCP_B cards for connecting the management, overhead access, and
orderwire interfaces to the active xMCP/xMCP_B.
Figure 2-41: XDM-500 standard card layout
417006-2009-013-A01
2-51
XDM-1000 Card Layout

The standard XDM-1000 consists of a modules cage housing the connection
modules, a cards cage housing the I/O and common cards, input filters, and fan
control units. The XDM-1000 standard card layout is illustrated in XDM-1000
standard card layout (page 2-53) and is allocated as described in the following
paragraphs.
Modules Cage
Eleven (11) slots, M1 to M11, allocated for electric interface connection

modules or DWDM/OADM, optical booster, optical preamp modules
Two xINFs
Cards Cage
Twelve (12) slots, I1 to I12, flexibly allocated for I/O cards and/or
transponders (depending on the configuration)
Two (2) slots, X1 and X2, allocated for the HLXC or XIO matrix cards
Two (2) slots, C1 and C2, allocated for the xMCP/xMCP_B cards
An external connection module, the MECP, is located in the cards cage of the
XDM-1000 above the xMCP/xMCP_B cards. It is used to connect the
management, overhead access, and orderwire interfaces to the active
xMCP/xMCP_B card.
The modules cage contains 11 double-slot connection modules. Electrical I/O
cards installed in the cards cage interface with the XDM-1000 via connection
modules installed in the modules cage. The modules are extractable, thus
allowing a flexible assignment of physical I/O ports.
2-52
417006-2009-013-A01
Optical I/O cards utilize internal slide-in I/O modules for signal interfacing and
do not require connection modules in the modules cage. The free modules cage
slots in optical systems can therefore be allocated to DWDM or OADM
multiplexing and amplification modules.
417006-2009-013-A01
2-53

The XDM-2000 consists of a single cage whose slots can be allocated as
follows:
Twelve (12) slots, I1 to I12, allocated for transponders and other optical
modules
Two (2) slots, X1 and X2, allocated for mux/demux or matrix cards
(depending on the system configuration)
Two (2) slots, C1 and C2, allocated for the xMCP/xMCP_B cards
The external connection module, the MECP, is located in the upper section of
the cage.
The cage design and mechanical practice of the XDM-2000 conform to
international mechanical standards and specifications.
2-54
417006-2009-013-A01

The XDM-3000 consists of an I/O card cage arranged in four sections, together
with additional power, communication, and control units, as follows:
24 slots (I1 to I24) flexibly allocated to I/O cards and/or amplifiers,

depending on the configuration. I/O card options include combinations of
up to 24 SIO1&4B, SIO164, DIOB, and/or MCS5/10 cards. Single channel
OFA2 or OFA_M amplifiers can be used for long distance applications.
Two slots (X1 and X2) allocated to HLXC1536 matrix cards.
Two slots (A1 and A2) allocated to ACP3000 ASON cards.
Two slots (C1 and C2) allocated to the xMCP-B2G cards.
One slot (C0) allocated to the MECP card, for user and management
interfaces.
One ECB3000 that provides external connections for the MECP card.
Two INF3000s designed for power supply redundancy.
Two FCU3000 fan units with ten fans each.
417006-2009-013-A01
2-55
The XDM-3000 card layout is illustrated in the following figure.
2-56
417006-2009-013-A01
Control, Matrix, and I/O Cards

for Large XDM Shelves
NOTE: HLXC and XIO matrix cards are offered in several
versions for large XDM shelves. The generic names HLXC
and XIO are used in the following sections to describe the
cards functionality when the information applies to all
versions.
XDM shelves have been designed to facilitate simple installation and easy
maintenance. They incorporate the following layout features:
The connection modules in the modules cage (XDM-400, XDM-500, and

XDM-1000) are located as close as possible to the I/O cards in the cards
cage
The HLXC-L, HLXC-R, or XIO matrix cards are located near the sidewall
of the shelf to facilitate the routing of traffic buses to the I/O cards
The xMCP/xMCP_B control cards are located such that they simplify the
identification of any control problem issues
The MECP is located above the xMCP/xMCP_B to facilitate the routing of

the external management interfaces
HLXC192/384/768/1536
Three versions of HLXC matrix cards are offered for XDM large shelves. They
differ in their switching capacity as follows:
HLXC192 supports 192 x 192 STM-1 streams
HLXC1536 - supports 1536 x 1536 STM-1 streams

NOTE: HLXC384 and HLXC768 are not supported in
XDM-500.
NOTE: HLX1536 is supported in XDM-3000 only.
417006-2009-013-A01
2-57
The XDM-500, XDM-1000, XDM-2000, and XDM-3000 contain two identical

HLXC cards. Both cards perform the cross-connect and node synchronization
functions simultaneously in a 1+1 protection configuration. In case of a
hardware failure in the operational HLXC or in its traffic interconnections, the
I/O interface cards switch to the backup HLXC within 50 ms. Similarly, in case
of a hardware failure in the TMU of the operational HLXC, the backup TMU
takes over the timing control with no traffic disruption. The operational HLXC
is determined by the LightSoft network manager.
XIO192/384F
XIO cards combine the functionality of an HLXC card with that of SDH I/O
cards.
Two versions of XIO cards are offered for XDM large shelves. They differ in
their switching capacity and SDH supported ports:
XIO192 switching of 192 x 192 STM-1 streams. Supports 1 x

STM-16/OCU-48 interface, 4 x STM-1/OC-3 interfaces, or 1 x
STM-4/OCU-12 interface.
XIO384F switching of 384 x 384 STM-1 streams. Supports 1 x

STM-64/OC-192 interface or 4 x STM-16/OC-48 interfaces.
NOTE: XIO384F is not supported in XDM-400.
NOTE: XIO cards are not supported in XDM-3000.
The XDM can optionally contain two identical XIO cards (in the XDM-400,
the XIO is the only dedicated matrix card). XIO cards consist of a matrix unit
and SDH/SONET interfaces on the same basecard. Like the HLXC, XIO cards
perform the cross-connect and node synchronization functions simultaneously
in a 1+1 protection configuration. Upon detection of a hardware failure in the
XIO or in its traffic interconnections, I/O cards switch to the backup XIO card
within 50 ms. If required, the backup TMU takes over timing control from the
operational XIO with no traffic disruption.
2-58
417006-2009-013-A01
xMCP/xMCP_B
The xMCP/xMCP_B performs the communications, control, alarm, and
maintenance functions for the XDM. An additional xMCP/xMCP_B may
optionally provide full capability 1:1 protection since the standby
xMCP/xMCP_B has an identical database to the active xMCP/xMCP_B. Upon
a failure of the active xMCP/xMCP_B, the standby xMCP/xMCP_B becomes
the active control unit.
The xMCP/xMCP_B is also responsible for communicating with external
network elements and management stations. It communicates with other
SDH/SONET NEs via the DCC channel embedded in each SIO link. In
addition, the xMCP/xMCP_B provides multiple access to all overhead bytes in
all incoming SDH/SONET lines. It provides 64 kbps and N x 64 kbps trail
capability for transporting management data, external DCC channels or for
external DCN purposes.
MECP
The MECP connects the management, overhead access, and orderwire
interfaces to the active xMCP/xMCP_B. The physical management
connections are provided by the ECB located above the MECP.
The MECP supports standard OW as well as a special voice channel over the
DCC when using VoIP and a special router. This feature enables external calls
from outside the network to a particular site. In addition, the MECP generates
system alarms and activates indicators, for example, software downloads,
restarts, configurations, and so on.
In pure optical networks and inline amplifier sites, one of two special MECP
versions is supplied to support the optical supervisory channel operating at
1510 nm or 1310 nm.
ECB, xECB4, or ECB3000

The ECB provides the physical interface between the XDM and external
management and clock devices. This card is also available in special two
versions, xECB4 for the XDM-400, and ECB3000 for the XDM-3000.
ECM40
The ECM40 provides the physical connections to the XDM-40 alarms,
provisioning (LCT), and OW interfaces. This unit is a dedicated module, used
only in the XDM-40.
417006-2009-013-A01
2-59
2-60
417006-2009-013-A01
3
XDM-50 Specifications
In this chapter:
Traffic Protection............................................................................................. 3-2
Redundancy ..................................................................................................... 3-2
Synchronization ............................................................................................... 3-2
I/O Interfaces ................................................................................................... 3-3
Management .................................................................................................... 3-4
SDH Interfaces ................................................................................................ 3-5
Data Modules................................................................................................... 3-8
Physical Specifications .................................................................................. 3-11
Environmental Conditions ............................................................................. 3-12
EMC .............................................................................................................. 3-13
Safety ............................................................................................................. 3-13
Reliability ...................................................................................................... 3-13
417006-2009-013-A01
3-1
Cross-Connect Specifications
Cross-Connect Levels
SDH cross-connect levels ........................................................... VC-4nc, VC-4, VC-3, VC-12
Cross-Connect Capacity
SDH switch core options ...................... 128 x STM-1 (64 x STM-1 in use) with cross-connect
....................................................................................................................... capability of 4/3/1
Traffic Protection
Applicable specifications ................. ITU-T G.841, G.842, GR-1230-CORE, GR-1400-CORE
SNCP I/N LO, HO ................................................................................................. within 30 ms
MSP 1+1 ................................................................................................................ within 50 ms
Redundancy
Control and synchronization systems.................................................................. 1+1 duplicated
Switching matrix, power system, internal buses, external buses ........................1+1 duplicated
I/O electrical modules protection .................................................................... 1:1, 1:2, and 1:3
Synchronization
There are four timing references available from multiple SDH/PDH timing sources:
From any 2 MHz/2 Mbps tributary interface
From any SDH line
External SDH 2 MHz/2 Mbps timing outputs (two per shelf)
G.813 internal clock

Synchronization Status Marker (SSM) support is also provided.
Jitter and Wander

Applicable specifications .......................................................................... ITU-T G.823, G.825
3-2
417006-2009-013-A01
I/O Interfaces
2 Mbps (E1)
Physical level .............................................................................................. G.703, Paragraph 6
Frame ......................................................................................................................... Unframed
Line code .......................................................................................................................... HDB3
Line impedance ................................................................... 120 balanced/75 1 unbalanced
Bitrate ........................................................................................................ 2048 Kbps 50 ppm
34 Mbps (E3)
Frame ................................................................................................................................ G.751
Line code .......................................................................................................................... HDB3
Line impedance ............................................................................................... 75 unbalanced
45 Mbps (DS-3)
Frame .................................................................................................. Unframed, ANSI T1.107
Line code ........................................................................................................................... B3ZS
STM-1 Electrical
Physical level ............................................................................................ G.703, Paragraph 12
Bitrate ..................................................................................................... 155.52 Mbps 20 ppm
Frame ................................................................................................................................ G.707
Line code ............................................................................................................................. CMI
STM-1 Optical
Physical level ..................................................................................................... G.957, Table 2
Wavelength .................................................................................................. 1310 nm, 1550 nm
Bitrate .................................................................................................... 155.52 Mbps 4.6 ppm
Transmission range ................................................................................................... S3, L3, L5
Through external DDF.
417006-2009-013-A01
3-3
STM-4 Optical
Wavelength .................................................................................................. 1310 nm, 1550 nm
Bitrate ......................................................................................................... 622 Mbps 4.6 ppm
Management
Applicable specifications ......................................................... G.784, G.774, M.3010, M.3100
LightSoft (network manager) server and client for managing all ECI
.............................................................................................. equipment on SUN workstation(s)
EMS-XDM (XDM element manager) ...................................................... on SUN workstation
LCT-XDM local craft terminal ........................................................................................ on PC
EMS-XDM and LightSoft can work on the same SUN workstation.
Management and Alarm Interfaces

CMIP-like over TCP/IP to EMS-XDM; MTNM from EMS-XDM to LightSoft or other
TMN; RS-232 to LCT-XDM; OverHead Access (OHA); orderwire; RAP (Rack Alarm
Panel).
Alarms and Performance

Performance concept ............................................................................................. G.821, G.826
Alarm concept ................................................................................................................... G.783
Alarm types .................... LED indicators, dry contacts, audible alarms (per subrack), external
............................................................................................................. alarm inputs and outputs
Alarm classes ......................................................................... Critical, Major, Minor, Warning
3-4
417006-2009-013-A01
SDH Interfaces
STM-1 (155.52 Mbps 4.6 ppm) I/O Module
SFP TRANSCEIVER NAME
OTR1_S3
OTR1_L3
OTR1_L5
APPLICATION CODE 2
S-1.1
L-1.1
L-1.2
Operating wavelength (nm)
1261-1360
1263-1360
1480-1580
Source type
MLM 3
SLM
SLM
Max. RMS width (nm)
7.7
Min. side mode suppression ratio (dB)
30
30
Min. mean launched power (dBm)
-15
-5
-5
Max. mean launched power (dBm)
-8
Min. extinction ratio (dB)
8.2
10
10
Min. sensitivity (BER of 1*10-12) EOL dBm)
-28
-34
-34
Min. overload (dBm)
-8
-10
-10
Max. receiver reflectance (dB)
-25
Max. dispersion [ps/nm]
96
Min. optical return loss of cable (dB)
-20
Max. discrete reflectance (dB)
-25
Max. optical path penalty (dB)
NOTE: When selecting bidirectional transceivers, pay

attention that they must operate in complementary pairs. For
example: OTR1-S3BD can work only vis-a-vis OTR1-S5BD;
OTR4-L3BD can work only vis-a-vis OTR4-L5BD, and so
on. The transceivers in the following table are arranged in
complementary pairs.
Application code is in reference to ITU-T Recommendation G.691.

MultiLongitudinal Mode (MLM) source type laser can also operate with single mode fibers for S-1.1 interfaces in
reference to ITU-T Recommendation G.957.
417006-2009-013-A01
3-5
Table 3-1:
STM-1 bidirectional transceivers
SFP transceiver name
OTR1-S3BD
OTR1-S5BD
OTR1-L3BD
OTR1-L5BD
Application code 4
BD 3 5
BD 5 6
L3BD
L5BD
1260-1360
1480-1580
1280-1360
1480-1580
Source type
MLM
MLM
MLM
SLM
Max. RMS width (nm)
30
-14
-14
-5
-5
-8
-8
10
10
10
10
Min. sensitivity (BER of 1 * 10-12)

EOL (dBm)
-32
-32
-32
-32
Min. overload (dBm)
-8
-8
Max. dispersion (ps/nm)
-20
-20
TRANSMITTER
RECEIVER 7
OPTICAL PATH BETWEEN S & R
STM-4 (622 Mbps 4.6 ppm) I/O Module

OTR4_S3
OTR4_L3
OTR4_L5
APPLICATION CODE 8
S-4.1
L-4.1
L-4.2
1274-1356
1280-1335
1480-1580
Source type
MLM 9
SLM
SLM
Max. RMS width (nm)
4/2.5
Max. -20 dB width (nm)
<1
30
30
-15
-3
-3
-8
+2
+2
8.2
10
10
Min. sensitivity (BER of 1*10-12) EOL (dBm)
-28
-28
-28
Min. overload (dBm)
-8
-8
-8
TRANSMITTER
RECEIVER

BD 3: STM-1 single-fiber bidirectional SFP module with a 1310 nm TX wavelength.
6
7
Receiver units of SFPs (excluding bidirectional SFPs) are a wide-band type.
8
9
5
3-6
417006-2009-013-A01
OTR4_S3
OTR4_L3
OTR4_L5
-14
-27
74
20
24
-25
-27

Table 3-2:
OTR4_S3BD
OTR4_S5BD
OTR4_L3BD
OTR4_L5BD
S3BD
S5BD
L3BD
L5BD
1260-1360
1480-1580
1260-1360
1480-1580
Source type
MLM
SLM
MLM
SLM
Max. RMS width (nm)
30
30
-15
-15
-3
-3
-8
-8
+2
+2
8.2
8.2
10
10

EOL (dBm)
-28
-28
-28
-28
Min. overload (dBm)
-8
-8
-8
-8
Application code
10

TRANSMITTER
RECEIVER 11
10
11

417006-2009-013-A01
3-7
Data Modules
DIOM Specifications
Module
DIOM_04
DIOM_08
DIOM_40
Service interfaces
4 x 10/100/
1000BaseT
8 x 10/100BaseT
4 x optical FE/GbE
with SFP
Size
1 slot
1 slot
1 slot
Data handling
Layer 1
Layer 1
Layer 1
Network interfaces
4 x EoS
8 x EoS
4 x EoS
Total EoS bandwidth Up to 16 x VC-4

per module in slots I1 Up to 48 x VC-3
to I4 (2.5Gbps)
Up to 252 x VC-12
Up to 8 x VC-4
Up to 24 x VC-3
Up to 252 x VC-12
Up to 16 x VC-4
Up to 48 x VC-3
Up to 252 x VC-12
Total bandwidth per 1 to 16 x VC-4

EoS port in slots I1 to 1 to 48 x VC-3
I4
1 to 63 x VC-12
1 to 8 x VC-4
1 to 24 x VC-3
1 to 63 x VC-12
1 to 16 x VC-4
1 to 48 x VC-3
1 to 63 x VC-12
Encapsulation mode
GFP-F
GFP-F
GFP-F
Differential delay
compensation
256 ms for VC-3/4

128 ms for VC-12
256 ms for VC-3/4

128 ms for VC-12
256 ms for VC-3/4

128 ms for VC-12
Maximum frame
length
10240 bytes
10240 bytes
10240 bytes
Interfaces ........................ 10/100/1000BaseT, 100BaseFX (single mode and multimode fiber),

...................................................... 1000BaseSX, 1000BaseLX, 1000BaseZX, 1000BaseT SFP
Protection ..................................................... IOP 1:1 for both EoS ports and optical user ports
Standards compliance............................................IEEE 802.3z, G.707, G.783, G.7041 (GFP),
........................................................................................................................... G.7042 (LCAS)
LCAS ............................................. Enabled or Disabled (VCAT mode), configurable per port
Flow control ................................................................................. hitless following IEEE 802.3
Failure forwarding...................................................................................................... CSF, TSF
3-8
417006-2009-013-A01
EISMB Specifications
Module
EISMB_04 12
EISMB_40 13
Service interfaces
2 x 10/100/1000BaseT +
2 x 10/100BaseT
2 x optical FE/GbE +
2 x optical FE with SFP
Size
1 slot
1 slot
Data handling
Layer 2
Layer 2
Network interfaces
2 x GE EoS +
6 x FE EoS
2 x GE EoS +
6 x FE EoS
Total EoS bandwidth per module in

slots I3, I4
Up to 16 x VC-4
Up to 48 x VC-3
Up to 252 x VC-12
Up to 16 x VC-4
Up to 48 x VC-3
Up to 252 x VC-12
Total bandwidth per EoS port in

slots I3, I4
1 to 16 x VC-4
1 to 48 x VC-3
1 to 63 x VC-12
1 to 16 x VC-4
1 to 48 x VC-3
1 to 63 x VC-12
Encapsulation mode
GFP-F
GFP-F
Differential delay compensation
256 ms for VC-3/4

128 ms for VC-12
256 ms for VC-3/4

128 ms for VC-12
Maximum frame length
9600 bytes
9600 bytes
Interfaces .............................................................................. 10/100/1000BaseT, 10/100BaseT,

.......................... 100BaseFX (single mode and multimode fiber), 1000BaseSX, 1000BaseLX,
.................................................................................................... 1000BaseZX, 1000BaseT SFP
Switch capacity ............................................................................................................ 6.4 Gbps
MAC address memory ....................................................................................................... 3500
Standards compliance........................ IEEE 802.1D, IEEE 802.1p, IEEE 802.1Q, IEEE 802.3,
................................... IEEE 802.1ad, IEEE 802.3x, IEEE 802.3u, IEEE 802.3z, IEEE 802.1w
.......................................................................... G.707, G.783, G.7041 (GFP), G.7042 (LCAS)
Slot support ...................................................................... up to 4 modules in slots I1, I2, I5, I6
Untagged frame handling ........................................ block, forward, attach CTAG and forward
12
13
The EISMB can be installed only in slots I3, I4.

The EISMB can be installed only in slots I3, I4.
417006-2009-013-A01
3-9
EISM Specifications
Module
EISM_226 14
Service interfaces
6 x 10/100BaseT +
2 x FE/GbE
Size
2 slots
Data handling
Layer 2
Network interfaces
2 x EoS
Total bandwidth per EoS port
1 to 7 x VC-4
1 to 21 x VC-3
Encapsulation mode
GFP-F
LCAS mode
LCAS and non-LCAS
3.8 ms
9600 bytes
Interfaces .......... 10/100BaseT, 100BaseFX (single mode and multimode fiber), 1000BaseSX,
........................................................................................................ 1000BaseLX, 1000BaseZX
MAC address memory ...................................................................................................... 3,500
Protection ............................. IOP 1:1 for both Ethernet over SDH ports and optical user ports
.......................................................................... G.707, G.783, G.7041 (GFP), G.7042 (LCAS)
Untagged frame handling .................................................................................... block, forward
Client Transceivers for EISM Cards

OTGBE_SX 15
OTGBE_LX
OTGBE_ZX
OTFE_MM
OTFE_SM
Transmitter type
GbE/FC/
FICON 16
short-reach laser,
850 nm, multimode
GbE/FC/
FICON 17 long-reach
laser, 1310 nm, single
mode
GbE/FC/
FICON 18 very
long-reach laser,
1550 nm, single
mode
FE, short-reach
laser, 1310
multimode
FE, short-reach
laser, 1310 nm,
single mode
Data rate (nominal)

(Gbps)
1.250
1.250
1.250
0.125
0.125
Average
Max.
launch
Min.
power (dBm)
-3
-3
-8
-9.5
-11
-15
Min. transmitter
extinction ratio (dB)
10
10
14
The EISM occupies two slots and can be installed in slot pairs I1-I2, I3-I4.
The EISM occupies two slots and may be installed in slot pairs I1-I2 or I3-I4.
16
For EISM applications, GbE interfaces only.
17
18
15
3-10
417006-2009-013-A01
OTGBE_SX 15
Data format
OTGBE_LX
OTGBE_ZX
OTFE_MM
OTFE_SM
8 B/10 B
8 B/10 B
8 B/10 B
N/A
N/A
Min.
-20
-22
-22
-28
-22
Typical
-21
-25.5
--
-30
--
Max. receiver overload

(dBm)
-14
-8
Typical Rx LOS level

(dBm)
-24
-29
-25
< -29
< -28
Connector
LC
LC
LC
LC
LC
Fiber lengths
550 m
(50/62.5 m MMF)
10 km
(9 m SMF)
80 km
(9 m SMF)
550 m
(50/62.5 m
MMF)
10 km
(9 m SMF)
Average
receiver
sensitivity
(dBm)
Electrical GbE SFP (ETGbE)

ETGBE
Notes
Data rate
1000 Mbps
IEEE 802.3 compatible
Connector
RJ-45
Cable type
CAT 5
Cable length
100m
STP (Shielded Twisted Pair)
Physical Specifications
Dimensions (H x W x D)
XDM-50 .............................................................. 129 x 443 x 231 mm (5.08 x 17.44 x 9.09 in)
SIM-1/4, PIM-2/345.................................................. 35 x 97 x 213 mm (1.38 x 3.82 x 8.38 in)
EISMB, DIOM .......................................................... 32 x 97 x 213 mm (1.26 x 3.82 x 8.38 in)
EISM, PIM2_63 ...................................................... 32 x 195 x 213 mm (1.26 x 7.68 x 8.38 in)
CCP50_2 ............................................................................. 58.5 x 79 x 251 (2.3 x 3.11 x 9.88)
INF50 ................................................................................... 41 x 79 x 252 (1.61 x 3.11 x 9.92)
TPM-xx_1/TPM-xx_3 .............................................. 72 x 97 x 211 mm (2.83 x 3.82 x 8.31 in)
TC, TCF .................................................................... 84 x 45 x 210 mm (2.91 x 1.77 x 8.27 in)
MXC50.................................................................. 29 x 300 x 250 mm (1.14 x 11.81 x 9.84 in)
ECU50 ................................................................................ 28 x 230 x 255 (1.1 x 9.05 x 10.04)
TPU ...................................................................... 75 x 443 x 231 mm (2.95 x 17.44 x 9.09 in)
xRAP (optional) ................................................ 100 x 450 x 285 mm (3.94 x 17.72 x 11.22 in)
xRAP-100 (optional) ........................................... 133 x 445 x 185 mm (5.24 x 17.53 x 7.29 in)
miniRAP (optional) ................................................. 90 x 445 x 150 mm (3.54 x 17.53 x 5.9 in)
Racks ........................................2200/2600 x 600 x 300 mm (86.61/102.36 x 23.62 x 11.81 in)
417006-2009-013-A01
3-11
...................................................................................... 2134 x 584 x 305 mm (82 x 23 x 12 in)
Weight
Basic XDM-50 shelf ........................................................................................... 4 kg (8.82 lbs)
Basic XDM-50 fully populated ....................................................................... 12 kg (26.46 lbs)
Power
Applicable specifications ........................................................ ETSI 300 132-2; FTZ 19 PFL 1
Input voltage ............................................................................................ -40 V dc to -75 V dc
Nominal power source ....................................................................................... -48 V or -60 V
Power consumption .............................................................. Typical 150 W, maximum 250 W
Main Equipment Power Consumption

For the XDM-50 main equipment power consumption refer to XDM-100 Product Line Main
Equipment Power Consumption (page 4-24) in section XDM-100 Specifications (page 4-1).
Power Dissipation
Power dissipation .................................................... Typical 515 Btu/hr, maximum 855 Btu/hr
Environmental Conditions
Operation
Applicable specification .................................................................. ETS 300 019-1-3 Class 3.2
Temperature range ............................................................................................. -5 C to +55 C
Relative humidity ..................................................................................................... 5% to 90%
NOTE: Extended temperature range of -5 C to +65 C is
supported for specific outdoor configurations.
Storage (packed)
Applicable specification ................................................................. ETS 300 019-1-1 Class 1.2
Temperature range ........................................................................................... -25 C to +55 C
Relative humidity ................................................................................................. 10% to 100%
3-12
417006-2009-013-A01
Handling and Transportation

Temperature range .......................................................................................... -40 C to +70 C
Relative humidity ...................................................................................................... up to 95%
EMC
Applicable specifications ............................................................................... EN 300 386/2000
Applicable directive ....................................................................... EMC directive 89/336 EEC
Safety
Applicable specifications .................................................................................. EN 60950/2000
Applicable CE directive .................................................................... LVD directive 73/23/EEC
Laser Safety
Applicable specification ....................................................... EN 60825-1&2 (AS/NZS 2211.2)
CE Compliance
The XDM-50 complies with CE standards.
Reliability
Life
Expected lifetime of the XDM platforms ...................................................................... 15 years
Availability
Availability of service for an end-to-end service trail passing through a protected
SDH/SONET network ................................................................................ better than 99.999%
417006-2009-013-A01
3-13
3-14
417006-2009-013-A01
4
In this chapter:
Redundancy ..................................................................................................... 4-3
I/O Interfaces ................................................................................................... 4-4
Management .................................................................................................... 4-5
SDH/SONET Interfaces .................................................................................. 4-6
Data Modules................................................................................................. 4-13
Optical Amplifier Modules for TPU/OCU .................................................... 4-19
GbE/FC/2 Gbps FC/FICON Optical SFP Transceivers for
Transponders/Combiners ............................................................................... 4-20
STM-1 SFP Optical supervisory channel transceivers for OSC1_2 .............. 4-21
CWDM Modules ........................................................................................... 4-21
EMC .............................................................................................................. 4-27
Safety ............................................................................................................. 4-27
Reliability ...................................................................................................... 4-28
417006-2009-013-A01
4-1
SONET cross-connect levels.............................................................................. STS-nc, STS-1
SDH switch core options .......................... 192 x STM-1 with cross-connect capability of 4/3/1
SONET switch core options ..................................................................................... 192 x OC-3
XDM-100 Shelf Capacity

XDM-100 shelf slot capacities differ as a function of the type of matrix cards
(MXC-100, MXC-100B, or combination of MXC-100, and MXC-BR) used.
Although the MXC-100 and the MXC-100B have identical cross-connect
capabilities, the bandwidth allocation capacity per I/O slot for the MXC-100 is
different than that of the MXC-100B, or MXC-100 and a MXC-BR.
NOTE: The following is applicable:
Mix of MXC-100 and MXC-100B on the same shelf is not

supported
The MXC-BR is supported only for SDH applications
The following table describes the MXC-100, MXC-100B, and MXC-BR

bandwidth allocation capacity per slot for the XDM-100.
MXC type
19
MXC-100 (x 2)
Slot #
Capacity per slot
Total XDM-100 capacity
I1, I2, I5, I6
2.5 Gbps
25 Gbps
I3, I4, I7, I8
1.25 Gbps
A1, A2, B1, B2
2.5 Gbps
20
MXC-100B (x 2) I1 to I8
21
MXC-100 (x 1)
MXC-BR 22 (x 1)
2.5 Gbps
A1, A2, B1, B2
2.5 Gbps
I1 to I8
1.25 Gbps
A1, A2
2.5 Gbps
30 Gbps
15 Gbps
19
Mix of MXC-100 and MXC-100B on the same shelf is not supported.

Mix of MXC-100 and MXC-100B on the same shelf is not supported.
21
This configuration is supported only for SDH applications.
22
This configuration is supported only for SDH applications.
20
4-2
417006-2009-013-A01
Traffic Protection
MSP/APS 1+1 ........................................................................................................ within 50 ms
MS-SPRing/BLSR ................................................................................................. within 50 ms
OCH 1+1 optical protection ..................................................................................... within 5 ms
Redundancy
Synchronization
There are several timing references available from multiple SDH/SONET
and/or PDH/Async timing sources:
From any 1.5 Mbps tributary interface
From any SDH/SONET line
External SONET 1.5 Mbps timing outputs (two per shelf)
417006-2009-013-A01
4-3
Jitter and Wander

I/O Interfaces
2 Mbps (E1)
Frame ......................................................................................................................... Unframed
Line code .......................................................................................................................... HDB3
Line impedance .................................................................. 120 balanced/75 23 unbalanced
Bitrate ........................................................................................................ 2048 Kbps 50 ppm
34 Mbps (E3)
Frame ................................................................................................................................ G.751
Line code .......................................................................................................................... HDB3
45 Mbps (DS-3)
Line code ........................................................................................................................... B3ZS
52 Mbps (STS-1)
Physical level ..................................................................................................... GR-253-CORE
Frame ................................................................................................................................ G.253
Line code ............................................................................................................................. CMI
23
Through an external DDF.
4-4
417006-2009-013-A01
STM-1 Electrical
Bitrate ..................................................................................................... 155.52 Mbps 20 ppm
Frame ................................................................................................................................ G.707
Line code ............................................................................................................................. CMI
STM-1/OC-3 Optical
Wavelength .................................................................................................. 1310 nm, 1550 nm
Bitrate .................................................................................................... 155.52 Mbps 4.6 ppm
STM-4/OC-12 Optical
Wavelength .................................................................................................. 1310 nm, 1550 nm
Bitrate ......................................................................................................... 622 Mbps 4.6 ppm
Transmission range ............................................................................................ S3, L3, L5, V5
STM-16/OC-48 Optical
Wavelength ................................................................................................. 1310 nm, 1550 nm
Bitrate .................................................................................................. 2488.32 Mbps 4.6 ppm
Transmission range ......................................... I3, S3, L3, L5, C/DWDM (G.694.2 and G.695)
Management
LightSoft (network manager) server and client for managing all ECI equipment
............................................................................................................... on SUN workstation(s)
417006-2009-013-A01
4-5

TMN; RS-232 to LCT-XDM; OverHead Access (OHA); orderwire; RAP.

Alarm concept ................................................................................................................... G.783
SDH/SONET Interfaces
STM-1/OC-3 (155.52 Mbps 4.6 ppm) I/O
Modules
OTR1_S3
OTR1_L3
APPLICATION CODE 24
S-1.1
L-1.1
L-1.2
1261-1360
1263-1360
1480-1580
Source type
MLM 25
SLM
SLM
Max. RMS width (nm)
7.7
30
30
-15
-5
-5
-8
8.2
10
10
Min. sensitivity (BER of 1*10 ) EOL dBm)
-28
-34
-34
Min. overload (dBm)
-8
-10
-10
-25
96
-20
-25
-12
OTR1_L5
24

25
4-6
417006-2009-013-A01

Table 4-1:

Application code
26
OTR1-S3BD
OTR1-S5BD
27
28
BD 3
OTR1-L5BD
L3BD
L5BD
1260-1360
1480-1580
1280-1360
1480-1580
Source type
MLM
MLM
MLM
SLM
Max. RMS width (nm)
30
-14
-14
-5
-5
-8
-8
10
10
10
10
Min. sensitivity (BER of 1 * 10-12) EOL

(dBm)
-32
-32
-32
-32
Min. overload (dBm)
-8
-8
-20
-20
BD 5
OTR1-L3BD
TRANSMITTER
RECEIVER 29
26

28
29
27
417006-2009-013-A01
4-7
STM-4/OC-12 (622 Mbps 4.6 ppm) I/O

Modules
OTR4_S3
OTR4_L3
OTR4_L5
OTR4_V5
APPLICATION CODE 30
S-4.1
L-4.1
L-4.2
V5
1274-1356
1280-1335
1480-1580
1550
TRANSMITTER
Source type
MLM 31
SLM
SLM
SLM
Max. RMS width (nm)
4/2.5
<1
30
30
30
-15
-3
-3
-8
+2
+2
8.2
10
10
10
RECEIVER
-28
-28
-28
-34
Min. overload (dBm)
-8
-8
-8
-8
-14
-27
-27
74
20
24
-25
-27

30

31
4-8
417006-2009-013-A01
Table 4-2:
OTR4_S3BD
OTR4_S5BD
OTR4_L3BD
OTR4_L5BD
Application code 32
S3BD
S5BD
L3BD
L5BD
1260-1360
1480-1580
1260-1360
1480-1580
Source type
MLM
SLM
MLM
SLM
Max. RMS width (nm)
Min. side mode suppression ratio

(dB)
30
30
-15
-15
-3
-3
-8
-8
+2
+2
8.2
8.2
10
10

EOL (dBm)
-28
-28
-28
-28
Min. overload (dBm)
-8
-8
-8
-8
TRANSMITTER
RECEIVER 33
32
33
Min. optical return loss of cable

(dB)

417006-2009-013-A01
4-9
STM-16/OC-48 (2488.32 Mbps 4.6 ppm)

I/O Modules
OTR16_I3
OTR16_S3
OTR16_L3
OTR16_L5
OTR25_AVxx 34
OTR25_ABxx 35
I-16
S-16.1
L-16.1
L-16.2
DW100S1D2/5(C)
DW100S1A2/5(C)
DW100L-1D2/5(C)F
DW100C-1A2/5(C)F
G.698.1/.2
1260-1360
1260-1360
1280-1335
1500-1580
1530-1565
1530-1565
Source type
SLM
SLM
SLM
SLM
SLM
SLM
<1
0.4
0.4
Max. RMS width (nm)
Min. side mode suppression

(dB)
30
30
30
30
30
Min. mean launched power

(dBm)
-10
-5
-2
-2
Max. mean launched power

(dBm)
-3
+3
+3
8.2
8.2
8.2
8.2
8.2
8.2
Min. sensitivity (BER of

1*10-12) EOL (dBm)
-16
-18
-27
-28
-28
-28
Min. overload (dBm)
-9
-9
-9
-9
Max. receiver reflectance

(dB)
-27
-27
-27
-27
-27
-27

APPLICATION CODE
36

TRANSMITTER
RECEIVER
1600
2400
(120km G.652
3600
(180 km G.652)
Min. optical return loss of

cable (dB)
-24
-24
-24
-24
-24
-24
Max. discrete reflectance

(dB)
-27
-27
-27
-27
-27
-27
Max. optical path penalty

dB)
<1
<3
<2

34
35
36
xx designates the transceiver's wavelength in nm.

4-10
417006-2009-013-A01
Table 4-3:

Application code
37
OTR16_S3BD
OTR16_S5BD OTR16_L3BD OTR16_L5BD
S3BD
S5BD
L3BD
L5BD
1260-1360
1480-1580
1260-1360
1480-1580
Source type
SLM
SLM
SLM
SLM
Max. RMS width (nm)

(dB)
30
30
30
30

(dBm)
-5
-5
-2
-2

(dBm)
+2
+2
+5
+5
8.2
8.2
8.2
8.2
Min. sensitivity (BER of 1 *

10-12) EOL (dBm)
-18
-18
-27
-27
Min. overload (dBm)
-9
-9

TRANSMITTER
RECEIVER
38
37
38

(dB)

417006-2009-013-A01
4-11
2.5 Gbps Optical CWDM SFP Transceivers

CWDM
OTC25_1PSxx
39
DWDM
OTC25_1ALxx
40
APPLICATION CODE 43
OTR25_AVxx 41
OTR25_ABxx 42
DW100S1D2/5(C)
DW100S1A2/5(C)
DW100L-1D2/5(C)F
DW100C-1A2/5(C)F
G.698.1/.2
1464-1618
1464-1618
1530-1565
1530-1565
Source type
SLM
SLM
SLM
SLM
0.4
0.4
TRANSMITTER
Max. RMS width (nm)
Min. side mode suppression (dB)
30
30
30
30
+5
+5
8.2
8.2
8.2
8.2
Min. sensitivity (BER of 1*10-12)

EOL (dBm)
-21.5
(-23 GbE)
-28
(-32 GbE)
-28
-28
Min. overload (dBm)
-7
-9
-9
-27
-27
-27
-27
800
(40 km G.652)
1600
(80 km G.652)
2400
(120 km G.652)
3600
(180 km G.652)
Min. optical return loss of cable (dB) 24
24
-24
-24
-27
-27
-27
-27
1.5
2.5
<3
<2
RECEIVER
39

41
42
43
40
4-12
417006-2009-013-A01
Data Modules
DIOM Specifications
Module
DIOM_04
DIOM_08
DIOM_40
Service interfaces
4 x 10/100/1000BaseT
8 x 10/100BaseT
4 x optical FX/GbE
with SFP
Size
1 slot
1 slot
1 slot
Data handling
Layer 1
Layer 1
Layer 1
Network interfaces
4 x EoS
8 x EoS
4 x EoS
Total EoS bandwidth

per module in slots 1,
2, 5, 6 (2.5Gbps)
Up to 16 x VC-4
Up to 48 x VC-3
Up to 252 x VC-12
Up to 8 x VC-4
Up to 24 x VC-3
Up to 252 x VC-12
Up to 16 x VC-4
Up to 48 x VC-3
Up to 252 x VC-12
Total EoS bandwidth

4, 7, 8 (1.25Gbps)
Up to 8 x VC-4
Up to 24 x VC-3
Up to 252 x VC-12
Up to 8 x VC-4
Up to 24 x VC-3
Up to 252 x VC-12
Up to 8 x VC-4
Up to 24 x VC-3
Up to 252 x VC-12
Total bandwidth per

EoS port in slots 1, 2,
5, 6
1 to 16 x VC-4
1 to 48 x VC-3
1 to 63 x VC-12
1 to 8 x VC-4
1 to 24 x VC-3
1 to 63 x VC-12
1 to 16 x VC-4
1 to 48 x VC-3
1 to 63 x VC-12
Total bandwidth per

7, 8
1 to 8 x VC-4
1 to 24 x VC-3
1 to 63 x VC-12
1 to 8 x VC-4
1 to 24 x VC-3
1 to 63 x VC-12
1 to 8 x VC-4
1 to 24 x VC-3
1 to 63 x VC-12
Encapsulation mode
GFP-F
GFP-F
GFP-F
Differential delay
compensation
256 ms for VC-3/4

128 ms for VC-12
256 ms for VC-3/4

128 ms for VC-12
256 ms for VC-3/4

128 ms for VC-12
Maximum frame
length
10240 bytes
10240 bytes
10240 bytes

........................................................................................................................... G.7042 (LCAS)
417006-2009-013-A01
4-13
Module
EISMB_04
EISMB_40
Service interfaces
2 x 10/100/1000BaseT +
2 x 10/100BaseT
2 x optical FX/GbE +
2 x optical FX with SFP
Size
1 slot
1 slot
Data handling
Layer 2
Layer 2
Network interfaces
2 x GE EoS +
6 x FX EoS
2 x GE EoS +
6 x FX EoS
Total EoS bandwidth per module
Up to 16 x VC-4
Up to 48 x VC-3
Up to 252 x VC-12
Up to 16 x VC-4
Up to 48 x VC-3
Up to 252 x VC-12
1 to 16 x VC-4
1 to 48 x VC-3
1 to 63 x VC-12
1 to 16 x VC-4
1 to 48 x VC-3
1 to 63 x VC-12
Encapsulation mode
GFP-F
GFP-F
256 ms for VC-3/4

128 ms for VC-12
256 ms for VC-3/4

128 ms for VC-12
9600 bytes
9600 bytes

.................................................................................................... 1000BaseZX, 1000BaseT SFP
.......................................................................... G.707, G.783, G.7041 (GFP), G.7042 (LCAS)
Slot support ..................................................... up to 4 modules in any slots (with MXC-100B)
4-14
417006-2009-013-A01
MCSM Specifications
Module
MCSM
Service interfaces
8 x 10/100BaseT +
8 x optical FX/GbE with SFP
Size
2 slots
Maximum modules per shelf
Up to 2 with MXC-100B
One only with MXC-100
Data handling
Layer 2 (Ethernet/MPLS)
Network interfaces
16 x EoS/MoT
Up to 32 x VC-4
Up to 96 x VC-3
Up to 252 x VC-12
1 to 16 x VC-4
1 to 48 x VC-3
1 to 63 x VC-12
NG-SDH standards
GFP-F, VCAT, LCAS
256 ms for VC-3/4

128 ms for VC-12
9600 bytes
Interfaces ................................. 10/100BaseT, 100BaseFX (single mode and multimode fiber),

.................................................................................. 1000BaseSX, 1000BaseLX, 1000BaseZX
Total EoS/MoT capacity ................................................................................................. 5 Gbps
Switch capacity ............................................................................................................. 20 Gbps
MAC address memory ....................................................................................... 128,000 entries
Protection ........................................ <50ms FRR link and node, <50ms Dual homed/attached,
..................................................................................... Ethernet UNI/NNI LAG and EoS LAG,
.............................................................................................................................. G.8032 (ERP)
................................................................... Fast IOP MCSM 1+1 hot standby card protection
MPLS-based services ... VPWS (Martini encapsulation), VPLS (Full mesh and star), H-VPLS
.......................................................................................... P2MP (Multicast drop and continue)
IGMP snooping and static MAC ................................................................................................
417006-2009-013-A01
4-15
Hard QoS: ........................... 8000 policed flows per card supporting CIR, CBS and EIR, EBS
.............................................. Classification based on port, CVLAN, CVLAN-P bits, SVLAN,
................................................. SVLAN-Pbits (802.1p priority bits), Untagged Frame, BPDU,
......................................................... and Wildcard (all VLANs that are not explicitly defined).
.............................................. Untagged frame handling with port-based VLAN (attach/detach
............................................................................ CVLAN and/or SVLAN to untagged frames)
..........................................Eight Classes of Service (CoS), Classification rules, CoS mapping,
.................................................... 2 rate policing, 3 colors marking, Admission Control (CAC)
....................................... WRED, Shaping, Scheduling (WFQ/WRR Weighted Fair Queuing
........................................................................................................... / Weighted Round Robin)
MAC and VLANs:4093 x 4093 VLANs with 16k VLAN mapping rules, SVLAN translation,
..................................... S-VLAN configurable Ether-type, FDB (Forwarding Data Base) with
.......................................................................................................... 128k MAC address entries
E2E OAM: ...........................Tunnel OAM with Connectivity Verification per ITU-T Y.1711,
.................................................................................................................. Link OAM (802.3ah)
.................................................................................................... Service OAM 802.1ag (CFM)
Security: ............................. VSI (Virtual Switch Instance) VPN segregation, VLAN filtering,
............................................................................... FIB quota, BSC (Broadcast Storm Control)
Management: ....................... Point-and-click fast service creation, Management layers/Planes:
....................................................... Data, TDM, optic, Supporting CAC for MPLS Tunnel and
................................................... Service provisioning, Enhanced protection by SRLG (Shared
.......................................................................................................... Risk Link Group) schemes
Services:
Triple Play............................................ DTV/IPTV, HDTV, Gaming, VoD, VoIP, and HSI
Business connectivity............................................................... VPWS, VPLS, and H-VPLS
Mobile aggregation ......................... 3G Ethernet-based services, including VoIP, HSDPA,
..................................... IPTV and video streaming, MP3 streaming, VoD, video and voice
........................................................................................................................... conferences
Wholesale/CoC ............................................................ Ethernet bandwidth and leased lines
Standards compliance:
IEEE ................................................. 802.1ad, 802.3ah (Link OAM), 802.1D/P/Q, 802.1w,
................................................................................. 802.3-2005, 802.3ad, 802.3x, 802.1ag
MEF .......................... MEF 4, MEF 6, MEF 7, MEF9, MEF 10, MEF 11, MEF 12 MEF14
ITU-T ........................................ G.707, G.7041, G.7042, G.8010/Y.1306, G.8011/Y.1307,
.............................................................................. G.8011.1/Y.1307.1, G.8011.2/Y.1307.2,
.................................................................. G.8012/Y.1308, Y.1710, Y.171, G.783, G.8032
IETF ........................................... RFC 3031, RFC 3032, RFC 3270, RFC 3443, RFC 4448,
..................................................................... RFC 4379, RFC 3812, RFC 3813, RFC 2702,
...................................................... RFC 4090, RFC 3916, RFC 3985, RFC 4125, RFC 412
4-16
417006-2009-013-A01
EISM Specifications
Module 44
EISM_208
EISM_244
EISM_226
Service interfaces
8 x 10/100BaseT
4 x 10/100BaseT +
2 x FX/GbE +
2 x FX
6 x 10/100BaseT +
2 x FX/GbE
Size
2 slots
2 slots
2 slots
Data handling
Layer 2
Layer 2
Layer 2
Network interfaces
2 x EoS
2 x EoS
2 x EoS
Total bandwidth per

EoS port
1 to 7 x VC-4
1 to 21 x VC-3
1 to 7 x VC-4
1 to 21 x VC-3
1 to 7 x VC-4
1 to 21 x VC-3
Encapsulation mode
GFP-F
GFP-F
GFP-F
LCAS mode
LCAS and non-LCAS
LCAS and non-LCAS
LCAS and non-LCAS
Differential delay
compensation
3.8 ms
3.8 ms
3.8 ms
Maximum frame
length
9600 bytes
9600 bytes
9600 bytes
Interfaces .......... 10/100BaseT, 100BaseFX (single mode and multimode fiber), 1000BaseSX,
........................................................................................................ 1000BaseLX, 1000BaseZX
MAC address memory ...................................................................................................... 3,500
Protection ............................. IOP 1:1 for both Ethernet over SDH ports and optical user ports
.......................................................................... G.707, G.783, G.7041 (GFP), G.7042 (LCAS)
Untagged frame handling .................................................................................... block, forward
44
The EISM occupies two slots and can be installed in slot pairs I1-I2, I3-I4, I5-I6, I7-I8.
417006-2009-013-A01
4-17
Client Transceivers for MCSM, EISM Cards

Card 45
OTGBE_SX
OTGBE_LX
Transmitter type
GbE
short-reach
laser, 850 nm,
multimode
FX, short-reach FX, short-reach

GbE long-reach GbE very
laser, 1310 nm,
laser, 1310
laser, 1310 nm, long-reach
single mode
laser, 1550 nm, multimode
single mode
single mode
Data rate (nominal)

(Gbps)
1.250
1.250
1.250
0.125
0.125
Average
launch
power
(dBm)
Max.
-3
-3
-8
Min.
-9.5
-11
-15
Min. transmitter
10
10
Data format
8B/10B
8B/10B
8B/10B
N/A
N/A
Min.
-20
-22
-22
-28
-22
Typical
-21
-25.5
--
-30
--
Max. receiver overload 0

(dBm)
-14
-8

(dBm)
-24
-29
-25
< -29
< -28
Connector
LC
LC
LC
LC
LC
Fiber lengths
550 m
(50/62.5 m
MMF)
10 km
(9 m SMF)
80 km
(9 m SMF)
550 m
(50/62.5 m
MMF)
10 km
(9 m SMF)
Average
receiver
sensitivity
(dBm)
OTGBE_ZX
OTFE_MM
OTFE_SM

ETGBE
Notes
Data rate
1000 Mbps
Connector
RJ-45
Cable type
CAT 5
Cable length
100m
45
STP (Shielded Twisted Pair)
The EISM occupies two slots and may be installed in slot pairs I1-I2, I5-I6.
4-18
417006-2009-013-A01
Optical Amplifier Modules for

TPU/OCU
The MO_DC0_BAS is an optical booster for the C band. MO_PAS_DCM80 is
a single channel preamplifier (Channel 35 in the C band).
MO_DC0_BAS
MO_PAS_DCM80
Input power (dBm)
-12+4
-38 -18
Output power (dBm)
14.5-16
-16 -14
Spectrum (nm)
46
47
48
Channel 35
Gain tilt (Ch. 21-36) (dB)
<3
46
N/A
< 7 47
N/A
Passband width, < 0.5 dB loss (GHz) N/A
N/A
Passband width, < 1.0 dB loss (GHz) N/A
N/A
Noise figure (dB)
<7
<6
Polarization-dependent gain (dB)
< 0.5
< 0.5
Polarization mode dispersion (ps)
< 0.1
< 0.3
Return loss (dB)
< 40
< 40
Power consumption (Watt)
<7
<7
48
Monitor port tap fraction (%)
4-6
Automatic Laser Shutdown (ALS)
100 ms
0.5 2
Measured peak-to-peak.
Over the entire C band.
417006-2009-013-A01
4-19
GbE/FC/2 Gbps FC/FICON

Optical SFP Transceivers for
Transponders/Combiners
OTGBE_SX
OTGBE_LX
OTGBE_ZX
Transmitter type
GbE/FC/2 Gbps
FC/FICON short
reach laser, 850 nm,
multimode
GbE/FC/2 Gbps
FC/FICON long
reach laser, 1310
nm, single mode
GbE/FC/2 Gbps
FC/FICON very long
reach laser, 1550 nm,
single mode
Bitrate (Gbps)
1.250
1.250
1.250
Max.
-3
-3
Min.
-9.5
-11
Min. transmitter extinction ratio

(dB)
Data format
8 B/10 B
8 B/10 B
8 B/10 B
Min.
-20
-22
-22
Typical
-21
-25.5
--
Max. receiver overload (dBm)
Typical Rx LOS level (dBm)
-24
-29
-25
Connector
LC
LC
LC
Fiber lengths
550 m (50/62.5 m
MMF)
10 km (9 m SMF)
80 km (9 m SMF)
4-20
Mean launch power

(dBm)
Average receiver
sensitivity (dBm)
417006-2009-013-A01
STM-1 SFP Optical supervisory

channel transceivers for OSC1_2
Optical Supervisory Channel
OTR1_L3
OTR1_X3
Source type
SLM
SLM
Operating output wavelength (nm)
1263-1360
1270-1360
Spacing (nm)
NA
NA
Minimum side mode suppression ratio (dB)
30
30
Mean launched power (min.) (dBm)
-5
Mean launched power (max.) (dBm)
+5
10
10
Sensitivity (BER of 1*10-10) (dBm)
-34
-37
Min. overload (dBm)
-9
-8
CWDM Modules
Mux/Demux Modules
Module 49
MO-CMD4C
MO_CMD8
MO_CMD4C-E
MO_CMD4SL
Insertion loss mux +

demux (dB) 50
< 4.2
< 5.5
< 4.9
< 7.3
Return loss (dB)
< 40
< 40
< 40
< 40
Directivity (dB)
< 45
< 45
< 45
< 45
OADM Modules
Module type 51
Insertion loss 52
Through
Drop
Add
MO_COADM1AB_xx
53
< 3.9 dB
< 2.6 dB
< 2.2 dB
MO_COADM2AB_xx
54
< 4.4 dB
< 3.2 dB
< 3.2 dB
49
Module specifications are also applicable to XDM-100H.

Including built-in 1310 nm OSC filter. The insertion loss for 1310 nm filter is 1.2dB.
52
53
xx designates the channel dropped by the OADM.
54
xx designates the group of two channels dropped by the OADM.
50
51
417006-2009-013-A01
4-21
Splitter/Coupler Modules
Module type 55
Insertion loss
MO_4CP4SPMM50
4 dB
MO_4CP4SPMM62
4 dB
MO_4CP4SPSM
4 dB
CWDM Frequencies and Wavelengths (ITU-T

Rec. G.694.2 for CWDM)
Nominal central wavelengths (nm) for
spacing of 20 nm
55
4-channel
system
8-channel
system
1471
1491
1511
1531
1551
1571
1591
1611
4-22
417006-2009-013-A01
XDM-100 ............................................................ 200 x 443 x 231 mm (7.87 x 17.44 x 9.09 in)
SIM-1/4/16, PIM-2/345............................................. 35 x 97 x 213 mm (1.38 x 3.82 x 8.38 in)
SAM-4/16.................................................................. 32 x 97 x 213 mm (1.26 x 3.82 x 8.38 in)
EISM, PIM2_63 ...................................................... 32 x 195 x 213 mm (1.26 x 7.68 x 8.38 in)
TCF/TC ..................................................................... 84 x 45 x 210 mm (2.91 x 1.77 x 8.27 in)
MXC-100/MXC-100B .......................................... 52 x 385 x 279 mm (2.05 x 15.16 x 10.1 in)
TPU ....................................................................... 75 x 443 x 231 mm (2.95 x 17.44 x 9.09 in)
Racks ........................................2200/2600 x 600 x 300 mm (86.61/102.36 x 23.62 x 11.81 in)
...................................................................................... 2134 x 584 x 305 mm (82 x 23 x 12 in)
Weight
Basic XDM-100 shelf .................................................................................... 7.6 kg (16.76 lbs)
Basic XDM-100 fully populated .................................................................. 20.2 kg (44.53 lbs)
Power
Power consumption .............................................................. Typical 300 W, maximum 420 W
Power Dissipation
Power dissipation .......................................... Typical 1024.5 Btu/hr, maximum 1434.4 Btu/hr
417006-2009-013-A01
4-23
XDM-100 Product Line Main Equipment

Power Consumption
The following table lists the power requirements of the main equipment
components. Determine the expected power requirement of the equipment
installed in the shelf, and compare it with the shelf capabilities.
Type
Component
Power requirements
Common cards
MXC-100
47 W
MXC-100B
47 W
MXC-BR
0W
MXC50
42 W
MXC-300
88.5 W
MXC-900
210 W
ECU
6.7 W
ECU-F
18.3 W
ECU50
68 W
ECU50_R
10 W
ECU300
6.7 W
ECU300_F
18 W
ECU900
6.7 W
ECU900_F
18 W
INF50
14 W
OHU
5W
TPU
0W
TC
2.5 W
TCF
7W
FCU-100-9F
21.6 W
FCU50
52 W
FCU300
79.2 W
FCU900
79.2 W
PIM2_21
11 W
PIM2_42
14.3 W
PIM2_63
16 W
PIM2_63B
16 W
PIM2_63S
16 W
PIM345_3
11 W
CCP50_2
2W
PDH modules
4-24
417006-2009-013-A01
Type
Component
Power requirements
SDH modules
SAM1_4E
10 W
SAM1_4O
10 W
SAM1_4OB
10 W
SAM4_2
17 W
SAM16_1
19.7 W
SAM16_1B
30 W
SIM1_4E
12 W
SIM1_4O
12 W
SIM1_4OB
12 W
SIM1_8
12.8 W
SIM4_2
17 W
SIM4_4
30 W
SIM4_8
47 W
SIM16_1
26 W
SIM16_2
37 W
SIM16_4
63.3 W
SIM16_8
110 W
SIM64_XFP
73.6 W
SIM64_1
60 W
SIM64_2
137 W
TPM2_1
5W
TPM2_3
5W
TPM2_42_2
5W
TPM2_63_2
5W
TPMH_1
5W
EISMB_804
32 W
EISMB_840
35 W
DIOM_04
22 W
DIOM_08
24 W
DIOM_40
31.2 W
MCSM
75 W
ACP100
12 W
ACP900
12 W
Protection modules
Data modules
Control module
417006-2009-013-A01
4-25
Type
Component
Power requirements
Optical modules
MO_CMD4C
1.8 W
MO_CMD8
4.8 W
MO_CMD4C_E
4.8 W
MO_CMD4SL
4.8 W
MO_COADM1AB-Gxx
4.8 W
MO_COADM2AB-xx
4.2 W
MO_4CP4SPSM
4.2 W
MO_4CP4SPMM50
4.2 W
MO_4CP4SPMM62U5
4.8 W
CCMB25_2D
34 W
CRPT25_2C
4.5 W
CTRP25_2C
10 W
OSC1_2
12 W
MO_DC0_BAS
7W
MO_PAS_DCM80
4.9 W
OTR1_YY
1W
OTR4_YY
1W
OTR25_YY
1W
OTC25_PSxx
1.5 W
OTC25_ALxx
1.5 W
OTFE_SM
1W
OTFE_MM
1W
OTGBE_LX
1W
OTGBE_SX
1W
OTGBE_ZX
1W
ETGBE
1W
OMS16-4T
8W
MO_DW16MDB-AVAV
4.8 W
MO_DW16MDB-ST
4.8 W
MO_DW16MDR-ST
10 W
MO_DW16MDRE-ST
10 W
MO_DW40MC-S
10 W
MO_DW40MC-A
10 W
MO_DW40MC-G
10 W
MO_DW40DC-A
10 W
MO_DW40DC-G
10 W
Optical amplifiers
Optical transceivers
Data transceivers
4-26
417006-2009-013-A01
Operation
Temperature range .............................................................................................. -5 C to +55 C
NOTE: Extended temperature range of -5 C to +65 C is
supported for specific outdoor configurations.
Storage (packed)
Temperature range ............................................................................................ -25 C to +55 C

EMC
Safety
Laser Safety
417006-2009-013-A01
4-27
NEBS Compliance
The XDM platforms are designed in accordance with NEBS regulations for EMC and
Safety, including GR-1089-CORE Issue 1, October 1995 and GR-63-CORE Issue 2,
December 1997 Revision 1, February 1999 (Level 3).
Reliability
Life
Availability
4-28
417006-2009-013-A01
5
XDM-300/900 Specifications
In this chapter:
Redundancy ..................................................................................................... 5-2
I/O Interfaces ................................................................................................... 5-3
Management .................................................................................................... 5-5
SDH/SONET Interfaces .................................................................................. 5-6
Data Modules................................................................................................. 5-14
Optical Amplifier Modules for TPU/OCU .................................................... 5-19
CWDM Modules ........................................................................................... 5-20
EMC .............................................................................................................. 5-26
Safety ............................................................................................................. 5-26
Reliability ...................................................................................................... 5-26
417006-2009-013-A01
5-1
MXC300 Cross-Connect Capacity

SONET switch core options ......................................................................... 384 x OC-3/STS-1
MXC900 Cross-Connect Capacity

SONET switch core options ......................................................................... 768 x OC-3/STS-1
Traffic Protection
MSP/APS 1+1 ........................................................................................................ within 50 ms
MS-SPRing/BLSR ................................................................................................. within 50 ms
Redundancy
5-2
417006-2009-013-A01
Synchronization
There are several timing references available from multiple SDH/SONET
and/or PDH/Async timing sources:
From any 1.5 Mbps tributary interface
From any SDH/SONET line
External SONET 1.5 Mbps timing outputs (two per shelf)
Jitter and Wander

I/O Interfaces
2 Mbps (E1)
Frame ......................................................................................................................... Unframed
Line code .......................................................................................................................... HDB3
Line impedance .................................................................. 120 balanced/75 56 unbalanced
Bitrate ........................................................................................................ 2048 Kbps 50 ppm
34 Mbps (E3)
Frame ................................................................................................................................ G.751
Line code .......................................................................................................................... HDB3
56
Through an external DDF.
417006-2009-013-A01
5-3
45 Mbps (DS-3)
Line code ........................................................................................................................... B3ZS
52 Mbps (STS-1)
Frame ................................................................................................................................ G.253
Line code ............................................................................................................................. CMI
STM-1 Electrical
Bitrate ..................................................................................................... 155.52 Mbps 20 ppm
Frame ................................................................................................................................ G.707
Line code ............................................................................................................................. CMI
STM-1/OC-3 Optical
Wavelength .................................................................................................. 1310 nm, 1550 nm
Bitrate .................................................................................................... 155.52 Mbps 4.6 ppm
STM-4/OC-12 Optical
Wavelength .................................................................................................. 1310 nm, 1550 nm
Bitrate ......................................................................................................... 622 Mbps 4.6 ppm
Transmission range ............................................................................................ S3, L3, L5, V5
Wavelength ................................................................................................. 1310 nm, 1550 nm
Bitrate .................................................................................................. 2488.32 Mbps 4.6 ppm
Transmission range ............................................. I3, S3, L3, L5, CDWM (G.694.2 and G.695)
5-4
417006-2009-013-A01
Physical level .......................................................................................... G.691, G.957, Table 5
Wavelength ................................................................................................. 1310 nm, 1550 nm
Short-haul, long-haul, very long-haul, C/DWDM (G.694.1) bitrate ... 9953.28 Mbps 4.6 ppm
Management
LightSoft (network manager) server and client for managing all ECI equipment ....................

TMN; RS-232 to LCT-XDM; OverHead Access (OHA); orderwire; RAP.

Alarm concept ................................................................................................................... G.783
417006-2009-013-A01
5-5
STM-1/OC-3 (155.52 Mbps 4.6 ppm) I/O
Modules
OTR1_S3
OTR1_L3
OTR1_L5
APPLICATION CODE 57
S-1.1
L-1.1
L-1.2
1261-1360
1263-1360
1480-1580
Source type
MLM 58
SLM
SLM
Max. RMS width (nm)
7.7
30
30
-15
-5
-5
-8
8.2
10
10
Min. sensitivity (BER of 1*10-12) EOL dBm)
-28
-34
-34
Min. overload (dBm)
-8
-10
-10
-25
96
-20
-25

57

58
5-6
417006-2009-013-A01
Table 5-1:
OTR1-S3BD
OTR1-S5BD
OTR1-L3BD
OTR1-L5BD
Application code 59
BD 3 60
BD 5 61
L3BD
L5BD
1260-1360
1480-1580
1280-1360
1480-1580
Source type
MLM
MLM
MLM
SLM
Max. RMS width (nm)
30
-14
-14
-5
-5
-8
-8
10
10
10
10

EOL (dBm)
-32
-32
-32
-32
Min. overload (dBm)
-8
-8
-20
-20
TRANSMITTER
RECEIVER 62
59

61
62
60
417006-2009-013-A01
5-7

Modules
OTR4_S3
OTR4_L3
OTR4_L5
OTR_V5
APPLICATION CODE 63
S-4.1
L-4.1
L-4.2
V5
1274-1356
1280-1335
1480-1580
1550
TRANSMITTER
Source type
MLM 64
SLM
SLM
SLM
Max. RMS width (nm)
4/2.5
<1
30
30
30
-15
-3
-3
-8
+2
+2
8.2
10
10
10
-28
-28
-28
-34
Min. overload (dBm)
-8
-8
-8
-8
-14
-27
-27
74
RECEIVER

20
24
-25
-27

63

64
5-8
417006-2009-013-A01
Table 5-2:
OTR4_S3BD
OTR4_S5BD
OTR4_L3BD
OTR4_L5BD
Application code 65
S3BD
S5BD
L3BD
L5BD
1260-1360
1480-1580
1260-1360
1480-1580
Source type
MLM
SLM
MLM
SLM
Max. RMS width (nm)

ratio (dB)
30
30

(dBm)
-15
-15
-3
-3

(dBm)
-8
-8
+2
+2
8.2
8.2
10
10

10-12) EOL (dBm)
-28
-28
-28
-28
Min. overload (dBm)
-8
-8
-8
-8
TRANSMITTER
RECEIVER
66
65
66

cable (dB)

417006-2009-013-A01
5-9
STM-16/OC-48 (2488.32 Mbps 4.6 ppm)

I/O Modules
OTR16_I3
OTR16_S3
OTR16_L3
OTR16_L5
APPLICATION CODE 67
I-16
S-16.1
L-16.1
L-16.2
1260-1360
1260-1360
1280-1335
1500-1580
SLM
SLM
SLM
SLM
TRANSMITTER
Source type
<1
Max. RMS width (nm)

(dB)
30
30
30

(dBm)
-10
-5
-2
-2

(dBm)
-3
+3
+3
8.2
8.2
8.2
8.2

1*10-12) EOL (dBm)
-16
-18
-27
-28
Min. overload (dBm)
-9
-9
-27
-27
-27
-27
RECEIVER
1600

cable (dB)
-24
-24
-24
-24
-27
-27
-27
-27
Max. optical path penalty dB)
<1

67
5-10
417006-2009-013-A01
Table 5-3:

Application code
68
OTR16_S3BD
OTR16_S5BD OTR16_L3BD OTR16_L5BD
S3BD
S5BD
L3BD
L5BD
1260-1360
1480-1580
1260-1360
1480-1580
Source type
SLM
SLM
SLM
SLM
Max. RMS width (nm)

ratio (dB)
30
30
30
30

(dBm)
-5
-5
-2
-2

(dBm)
+2
+2
+5
+5
8.2
8.2
8.2
8.2

10-12) EOL (dBm)
-18
-18
-27
-27
Min. overload (dBm)
-9
-9

TRANSMITTER
RECEIVER
69
68
69

417006-2009-013-A01
5-11
2.5 Gbps Optical C/DWDM SFP Transceivers

CWDM
APPLICATION CODE
OTC25_1PSxx 70
DWDM
OTC25_1ALxx 71
74
OTR25_AVxx 72
OTR25_ABxx 73
DW100S1D2/5(C)
DW100S1A2/5(C)
DW100L-1D2/5(C)F
DW100C-1A2/5(C)F
G.698.1/.2
1464-1618
1464-1618
1530-1565
1530-1565
Source type
SLM
SLM
SLM
SLM
0.4
0.4
Max. RMS width (nm)
30
30
30
30
TRANSMITTER
+5
+5
8.2
8.2
8.2
8.2
Min. sensitivity (BER of 1*10-12)

EOL (dBm)
-21.5 (-23 GbE)
-28(-32 GbE)
-28
-28
Min. overload (dBm)
-7
-9
-9
-27
-27
-27
-27
800
(40 km G.652)
1600
(80 km G.652)
2400
(120 km G.652)
3600
(180 km G.652)
24
24
-24
-24
-27
-27
-27
-27
1.5
2.5
<3
<2
RECEIVER
70

72
73
74
71
5-12
417006-2009-013-A01
10 Gbps Optical XFP Transceivers

OTR10_ASx
x
OTX10_AT
SLM
SLM
SLM
1530-1565
1529-1560
1529-1560
1528.38-1564.
68
--
--
192.1 + 0.1m
m=0 to 40
192.1 + 0.1m 191.7+0.05m

m=0 to 40
m=0 to 88
--
--
--
12.5
12.5
Spacing (GHz)
--
--
--
Direct max. -20 dB

width (nm)
<1
<1
<1
<1
<1
< 0.5
Min. side mode

suppression ratio (dB)
30
30
30
30
30
35
Min. mean launched

power (dBm)
-6
-1
Max. mean launched

power (dBm)
-1
+2
+4
Min. extinction ratio

(dB)
8.2
Maximum attenuation
(dB)
11
22
NA
--
Minimum attenuation
(dB)
11
NA
--
Max. dispersion (ps/nm) 6.6
800
1600
1600
1440
Minimum optical return

loss (dB)
24
24
24
--
--
Maximum discrete
reflectance
-27
-27
-27
-27
-27
Maximum DGD (ps)
30
30
30
Sensitivity (BER of
1*10-12) (dBm)
-11
-14
-24
-24
-24
Min. overload (dBm)
-1
-1
-7
-8
-7
Maximum optical path

penalty
2.5
OCH switching time

(ms)
<3
<3
<3
NA
NA
Transceiver
OTR64_I3
OTR64_S5
OTR64_L5
OTR10_ALxx
Application code
I-64.1
P1I1_2D1
VSR2000_2R1
S-64.2b
P1S1_2D2b
L-64.2a
P1L1-2D2
1L1-2D2F
Source type
SLM
SLM
SLM
Modulation
External
External
External
Operating output
wavelength (nm)
1290-1330
1529-1560
Central frequency
(THz)
--
Maximum central
frequency deviation
(GHz)
417006-2009-013-A01
2.5
50
-1
-1
+3
+3
--
5-13
Data Modules
DIOM Specifications
Module
DIOM_04
DIOM_08
DIOM_40
Service interfaces
4 x 10/100/1000BaseT
8 x 10/100BaseT
4 x optical FX/GbE
with SFP
Size
1 slot
1 slot
1 slot
Data handling
Layer 1
Layer 1
Layer 1
Network interfaces
4 x EoS
8 x EoS
4 x EoS
Total EoS bandwidth

2, 5, 6 (2.5Gbps)
Up to 16 x VC-4
Up to 48 x VC-3
Up to 252 x VC-12
Up to 8 x VC-4
Up to 24 x VC-3
Up to 252 x VC-12
Up to 16 x VC-4
Up to 48 x VC-3
Up to 252 x VC-12
Total EoS bandwidth

4, 7, 8 (1.25Gbps)
Up to 8 x VC-4
Up to 24 x VC-3
Up to 252 x VC-12
Up to 8 x VC-4
Up to 24 x VC-3
Up to 252 x VC-12
Up to 8 x VC-4
Up to 24 x VC-3
Up to 252 x VC-12
Total bandwidth per

5, 6
1 to 16 x VC-4
1 to 48 x VC-3
1 to 63 x VC-12
1 to 8 x VC-4
1 to 24 x VC-3
1 to 63 x VC-12
1 to 16 x VC-4
1 to 48 x VC-3
1 to 63 x VC-12
Total bandwidth per

7, 8
1 to 8 x VC-4
1 to 24 x VC-3
1 to 63 x VC-12
1 to 8 x VC-4
1 to 24 x VC-3
1 to 63 x VC-12
1 to 8 x VC-4
1 to 24 x VC-3
1 to 63 x VC-12
Encapsulation mode
GFP-F
GFP-F
GFP-F
Differential delay
compensation
256 ms for VC-3/4

128 ms for VC-12
256 ms for VC-3/4

128 ms for VC-12
256 ms for VC-3/4

128 ms for VC-12
Maximum frame
length
10240 bytes
10240 bytes
10240 bytes

........................................................................................................................... G.7042 (LCAS)
5-14
417006-2009-013-A01
Module
EISMB_04
EISMB_40
Service interfaces
2 x 10/100/1000BaseT +
2 x 10/100BaseT
2 x optical FX/GbE +
2 x optical FX with SFP
Size
1 slot
1 slot
Data handling
Layer 2
Layer 2
Network interfaces
2 x GE EoS +
6 x FX EoS
2 x GE EoS +
6 x FX EoS
Up to 16 x VC-4
Up to 48 x VC-3
Up to 252 x VC-12
Up to 16 x VC-4
Up to 48 x VC-3
Up to 252 x VC-12
1 to 16 x VC-4
1 to 48 x VC-3
1 to 63 x VC-12
1 to 16 x VC-4
1 to 48 x VC-3
1 to 63 x VC-12
Encapsulation mode
GFP-F
GFP-F
256 ms for VC-3/4

128 ms for VC-12
256 ms for VC-3/4

128 ms for VC-12
9600 bytes
9600 bytes

.................................................................................................... 1000BaseZX, 1000BaseT SFP
.......................................................................... G.707, G.783, G.7041 (GFP), G.7042 (LCAS)
Slot support ...................................... up to 8 modules in the right-most slots only I3, I4, I7, I8,
..................................................................
I11, I12, I15, I16
417006-2009-013-A01
5-15
MCSM Specifications
Module
MCSM
Service interfaces
8 x 10/100BaseT +
8 x optical FX/GbE with SFP
Size
2 slots
Data handling
Layer 2 (Ethernet/MPLS)
Network interfaces
16 x EoS/MoT
Up to 32 x VC-4
Up to 96 x VC-3
Up to 252 x VC-12
1 to 16 x VC-4
1 to 48 x VC-3
1 to 63 x VC-12
NG-SDH standards
GFP-F, VCAT, LCAS
256 ms for VC-3/4

128 ms for VC-12
9600 bytes
Interfaces ................................. 10/100BaseT, 100BaseFX (single mode and multimode fiber),

Protection ........................................ <50ms FRR link and node, <50ms Dual homed/attached,
.............................................................................................................................. G.8032 (ERP)
................................................................... Fast IOP MCSM 1+1 hot standby card protection
MPLS-based services ... VPWS (Martini encapsulation), VPLS (Full mesh and star), H-VPLS
IGMP snooping and static MAC
Hard QoS:
....................................... 8000 policed flows per card supporting CIR, CBS and EIR, EBS
......................................... Classification based on port, CVLAN, CVLAN-Pbits, SVLAN,
........................................... SVLAN-Pbits (802.1p priority bits), Untagged Frame, BPDU,
................................................... and Wildcard (all VLANs that are not explicitly defined).
........................................ Untagged frame handling with port-based VLAN (attach/detach
...................................................................... CVLAN and/or SVLAN to untagged frames)
Eight Classes of Service (CoS), Classification rules, CoS mapping,
.............................................. 2 rate policing, 3 colors marking, Admission Control (CAC)
................................. WRED, Shaping, Scheduling (WFQ/WRR Weighted Fair Queuing
..................................................................................................... / Weighted Round Robin)
5-16
417006-2009-013-A01
MAC and VLANs:

........................ 4093 x 4093 VLANs with 16k VLAN mapping rules, SVLAN translation,
............................... S-VLAN configurable Ether-type, FDB (Forwarding Data Base) with
.................................................................................................... 128k MAC address entries
E2E OAM:
........................................Tunnel OAM with Connectivity Verification per ITU-T Y.1711,
............................................................................................................ Link OAM (802.3ah)
.............................................................................................. Service OAM 802.1ag (CFM)
Security:
...................................... VSI (Virtual Switch Instance) VPN segregation, VLAN filtering,
......................................................................... FIB quota, BSC (Broadcast Storm Control)
Management:
....................................... Point-and-click fast service creation, Management layers/Planes:
................................................. Data, TDM, optic, Supporting CAC for MPLS Tunnel and
............................................. Service provisioning, Enhanced protection by SRLG (Shared
.................................................................................................... Risk Link Group) schemes
Services:
........................................................................................................................... conferences
IEEE ............................................................... 802.1ad, 802.3ah (Link OAM), 802.1D/P/Q,
.................................................................... 802.1w, 802.3-2005, 802.3ad, 802.3x, 802.1ag
ITU-T ........................................ G.707, G.7041, G.7042, G.8010/Y.1306, G.8011/Y.1307,
.............................................................................. G.8011.1/Y.1307.1, G.8011.2/Y.1307.2,
.................................................................. G.8012/Y.1308, Y.1710, Y.171, G.783, G.8032
..................................................................... RFC 4379, RFC 3812, RFC 3813, RFC 2702,
...................................................... RFC 4090, RFC 3916, RFC 3985, RFC 4125, RFC 412
417006-2009-013-A01
5-17
Client Transceivers for MCSM, EISMB_840

Cards
OTGBE_SX
OTGBE_LX
Transmitter type
GbE
short-reach
laser, 850 nm,
multimode
GbE long-reach GbE very

FX, short-reach FX, short-reach
laser, 1310 nm, long-reach
laser, 1310
laser, 1310 nm,
single mode
laser, 1550 nm, multimode
single mode
single mode
Data rate (nominal)

(Gbps)
1.25
1.25
1.25
0.125
0.125
Average
launch
power
(dBm)
Max.
-3
-3
-8
Min.
-9.5
-11
-15
Min. transmitter
10
10
Data format
8B/10B
8B/10B
8B/10B
N/A
N/A
Min.
-20
-22
-22
-28
-22
Typical
-21
-25.5
--
-30
--
Max. receiver overload 0

(dBm)
-14
-8

(dBm)
-24
-29
-25
< -29
< -28
Connector
LC
LC
LC
LC
LC
Fiber lengths
550 m
(50/62.5 m
MMF)
10 km
(9 m SMF)
80 km
(9 m SMF)
550 m
(50/62.5 m
MMF)
10 km
(9 m SMF)
Average
receiver
sensitivity
(dBm)
Table 5-4:
OTGBE_ZX
OTFE_MM
OTFE_SM
GbE bidirectional transceivers

OTGBE_S3BD
OTGBE_S5BD
OTGBE_L3BD
OTGBE_L5BD
Transmitter type
Bidirectional SFP,
1310 nm
Bidirectional SFP,
1490 nm
Bidirectional SFP,
1310 nm e
Bidirectional SFP,
1490 nm
Data rate (nominal) (MBaud)
1250
1250
1250
1250
Average launch power (dBm)
-3 Max.
-3
+2
+2
-10 Min.
-10
-5
-5
Min. transmitter extinction ratio

(dB)
>9
>9
>9
>9
Data format
8B/10B
8B/10B
8B/10B
8B/10B
Average receiver sensitivity

(dBm)
< -21
< -21
< -23
< -23
Typical Rx LOS level (dBm)
< -22
< -22
< -24
< -24
Connector
LC
LC
LC
LC
Fiber lengths
10 km
(9 m SMF)
10 km
(9 m SMF)
40 km
(9 m SMF)
40 km
(9 m SMF)
5-18
417006-2009-013-A01

ETGBE
Notes
Data rate
1000 Mbps
Connector
RJ-45
Cable type
CAT 5
Cable length
100m
Optical Amplifier Modules for

TPU/OCU
The MO_DC0_BAS is an optical booster for the C band. MO_PAS_DCM80 is a single
channel preamplifier (Channel 35 in the C band).
Input power (dBm)
Output power (dBm)
MO_DC0_BAS (Booster)
MO_PAS_DCM80
-12 +4
-38 -18
14.5-16
75
Spectrum (nm)
-16 -14
Channel 35
< 3 76
N/A
<7
77
N/A
Passband width, < 0.5 dB loss

(GHz)
N/A
N/A
Passband width, < 1.0 dB loss

(GHz)
N/A
N/A
Noise figure (dB)
<7
<6
Polarization-dependent gain (dB)
< 0.5
< 0.5
Polarization mode dispersion (ps)
< 0.1
< 0.3
Return loss (dB)
< 40
< 40
<7
<7
78
Monitor port tap fraction (%)
4-6
Automatic Laser Shutdown (ALS)
100 ms
0.5 - 2
--
75
For 10 G links, add a 3 dB attenuator to the output ports.

77
78
Over the entire C band.
76
417006-2009-013-A01
5-19
CWDM Modules
Mux/Demux Modules for XDM-300/900
See Section Mux/Demux Modules (page 4-21) for detailed specifications.
OADM Modules for XDM-300/900

See Section OADM Modules (page 4-21) for detailed specifications.
Splitter/Coupler Modules for XDM-300/900

See Section Splitter/Coupler Modules (page 4-22) for detailed specifications.
CWDM Frequencies and Wavelengths (ITU-T

Rec. G.694.2 for CWDM)
spacing of 20 nm
5-20
4-channel
system
8-channel
system
1471
1491
1511
1531
1551
1571
1591
1611
417006-2009-013-A01
XDM-300/XDM-900 .......................................... 350 x 443 x 246 mm (13.8 x 17.44 x 9.68 in)
SIM-1/4/8/16, PIM-2/345 ......................................... 35 x 97 x 213 mm (1.38 x 3.82 x 8.38 in)
PIM2_63/B, MCSM ................................................ 32 x 195 x 213 mm (1.26 x 7.68 x 8.38 in)
SIM16_4/SIM64_XFP/SIM64_2 ........................................ 34 x 381 x 203 mm (1.34 x 15 x 8)
TCF/TC ..................................................................... 84 x 45 x 210 mm (2.91 x 1.77 x 8.27 in)
MXC-300 .............................................................. 52 x 385 x 279 mm (2.05 x 15.16 x 10.1 in)
MXC900................................................................ 52 x 385 x 279 mm (2.05 x 15.16 x 10.1 in)
ECU300 ...................................................................................... 27 x 381 x 203 (1.06 x 15 x 8)
ECU900 ...................................................................................... 27 x 381 x 203 (1.06 x 15 x 8)
TPU/OCU.............................................................. 75 x 443 x 246 mm (2.95 x 17.44 x 9.68 in)
xRAP-D (optional) .............................................. 133 x 445 x 285 mm (5.24 x 17.53 x 7.29 in)
Racks ........................................2200/2600 x 600 x 300 mm (86.61/102.36 x 23.62 x 11.81 in)
...................................................................................... 2134 x 584 x 305 mm (82 x 23 x 12 in)
Weight
Basic XDM-300 fully populated ..................................................................... 30 kg (66.08 lbs)
Basic XDM-900 fully populated ..................................................................... 30 kg (66.08 lbs)
Power
XDM-300 power consumption .......................................... Typical 800 W, maximum 1100 W
XDM-900 power consumption ........................................ Typical 1000 W, maximum 1400 W
417006-2009-013-A01
5-21
Power Dissipation
XDM-300 power dissipation ............................... Typical 2732 Btu/hr, maximum 3757 Btu/hr
XDM-900 power dissipation ............................... Typical 3414 Btu/hr, maximum 4780 Btu/hr

Power Consumption
5-22
Type
Component
Power requirements
Common cards
MXC-100
47 W
MXC-100B
47 W
MXC-BR
0W
MXC50
42 W
MXC-300
88.5 W
MXC-900
210 W
ECU
6.7 W
ECU-F
18.3 W
ECU50
68 W
ECU50_R
10 W
ECU300
6.7 W
ECU300_F
18 W
ECU900
6.7 W
ECU900_F
18 W
INF50
14 W
OHU
5W
TPU
0W
TC
2.5 W
TCF
7W
FCU-100-9F
21.6 W
FCU50
52 W
FCU300
79.2 W
FCU900
79.2 W
417006-2009-013-A01
Type
Component
Power requirements
PDH modules
PIM2_21
11 W
PIM2_42
14.3 W
PIM2_63
16 W
PIM2_63B
16 W
PIM2_63S
16 W
PIM345_3
11 W
CCP50_2
2W
SAM1_4E
10 W
SAM1_4O
10 W
SAM1_4OB
10 W
SAM4_2
17 W
SAM16_1
19.7 W
SAM16_1B
30 W
SIM1_4E
12 W
SIM1_4O
12 W
SIM1_4OB
12 W
SIM1_8
12.8 W
SIM4_2
17 W
SIM4_4
30 W
SIM4_8
47 W
SIM16_1
26 W
SIM16_2
37 W
SIM16_4
63.3 W
SIM16_8
110 W
SIM64_XFP
73.6 W
SIM64_1
60 W
SIM64_2
137 W
TPM2_1
5W
TPM2_3
5W
TPM2_42_2
5W
TPM2_63_2
5W
TPMH_1
5W
SDH modules
Protection modules
417006-2009-013-A01
5-23
Type
Component
Power requirements
Data modules
EISMB_804
32 W
EISMB_840
35 W
DIOM_04
22 W
DIOM_08
24 W
DIOM_40
31.2 W
MCSM
75 W
ACP100
12 W
ACP900
12 W
MO_CMD4C
1.8 W
MO_CMD8
4.8 W
MO_CMD4C_E
4.8 W
MO_CMD4SL
4.8 W
MO_COADM1AB-Gxx
4.8 W
MO_COADM2AB-xx
4.2 W
MO_4CP4SPSM
4.2 W
MO_4CP4SPMM50
4.2 W
MO_4CP4SPMM62U5
4.8 W
CCMB25_2D
34 W
CRPT25_2C
4.5 W
CTRP25_2C
10 W
OSC1_2
12 W
MO_DC0_BAS
7W
MO_PAS_DCM80
4.9 W
OTR1_YY
1W
OTR4_YY
1W
OTR25_YY
1W
OTC25_PSxx
1.5 W
OTC25_ALxx
1.5 W
Control module
Optical modules
Optical amplifiers
Optical transceivers
5-24
417006-2009-013-A01
Type
Component
Power requirements
Data transceivers
OTFE_SM
1W
OTFE_MM
1W
OTGBE_LX
1W
OTGBE_SX
1W
OTGBE_ZX
1W
ETGBE
1W
OMS16-4T
8W
MO_DW16MDB-AVAV
4.8 W
MO_DW16MDB-ST
4.8 W
MO_DW16MDR-ST
10 W
MO_DW16MDRE-ST
10 W
MO_DW40MC-S
10 W
MO_DW40MC-A
10 W
MO_DW40MC-G
10 W
MO_DW40DC-A
10 W
MO_DW40DC-G
10 W
Operation
Temperature range .............................................................................................. -5 C to +55 C
Storage (packed)
Temperature range ............................................................................................ -25 C to +55 C

417006-2009-013-A01
5-25
EMC
Safety
Laser Safety
NEBS Compliance
The XDM platforms are designed in accordance with NEBS regulations for EMC and
Safety, including GR-1089-CORE Issue 1, October 1995 and GR-63-CORE Issue 2,
December 1997 Revision 1, February 1999 (Level 3).
Reliability
Life
Availability
5-26
417006-2009-013-A01
6
XDM-40, 400, 450, 500, 1000,
2000, and 3000 Specifications
In this chapter:
Electrical, Optical, and Mixed Basecard Information ..................................... 6-2
XDM Shelf Capacities ..................................................................................... 6-5
PDH/Async and SDH/SONET Interface Specifications ................................. 6-8
SDH/SONET Interfaces ................................................................................ 6-10
XDM MPLS/Ethernet Card Summary........................................................... 6-22
Data Cards ..................................................................................................... 6-22
Optical Components ...................................................................................... 6-32
C Band Channel Frequencies and Wavelengths (ITU-T Rec. G.694.1 for
DWDM) ......................................................................................................... 6-62
CWDM Frequencies and Wavelengths (ITU-T Rec. G.694.2 for CWDM) .. 6-65
EMC .............................................................................................................. 6-73
Safety ............................................................................................................. 6-73
Reliability ...................................................................................................... 6-74
Management Specifications ........................................................................... 6-74
Other Specifications ...................................................................................... 6-75
417006-2009-013-A01
6-1
XDM-40, 400, 450, 500, 1000, 2000,

and 3000 Specifications
Electrical, Optical, and Mixed

Basecard Information
Card
Ports/Bitrate
Electrical
PIO2_84
84 x E1 (2 Mbps) PDH/Async basecard for balanced and unbalanced

interfaces
PIO2_21
21 x E1 (2 Mbps) PDH/Async basecard for balanced and unbalanced

interfaces
PIO345/PIO345M 79
16 x E3/DS-3/STS-1 (34/45/51 Mbps) interfaces
Optical
SIO16/SIO16M 80
SIO64/SIO64M/MF
SIO164
2 x STM-16/OC-48 (2.488 Gbps) interfaces

81
82
1 x STM-64/OC-192 (10 Gbps) interface

1 x STM-64/OC-192 (10 Gbps) interface or
XIO192
1 x STM-16/OC-48 (2.488 Gbps) + 1 x STM-4/OC-12 or

4 x STM-1/OC-3 interfaces
XIO348F 83
1 x STM-64/OC-192 (10 Gbps) interface or

Mixed
SIO1&4/SIO1&4M 84
SIO1&4B
Supports various electrical (e) and/or optical (o) interfaces as follows:

16 x STM-1o/OC-3/OC-3c
16 x STM-1e/STS-3e
4 x STM-4/OC-12
NOTE: For full interface support per card and shelf, please
contact ECI's Product Management or your local ECI
representative.
79
The suffix M denotes SONET support; it also denotes MS-SPRing/BLSR support for SDH/SONET. The MF suffix
denotes FEC 7% support according to ITU-T Recommendation G.709.
80
81
denotes FEC 7% support according to ITU-T Recommendation G.709. Cards are not supported in XDM-400.
Optical STM-16 transceivers MSA for 2 and 20 km are not supported for SIO64MF.
82
Cards are not supported in XDM-400.
83
84
6-2
417006-2009-013-A01
XDM-40, 400, 450, 500, 1000, 2000,

Electrical Interface Connection Modules

Electrical I/O cards are assigned an interface connection module. This module
serves as the I/O card electrical line transceiver and is connected to the I/O
cards via the XDM backplane. For example, when eleven PIO2_84 I/O cards
are installed in the XDM-1000 cards cage, eleven M2_84xx connection
modules should be installed in the modules cage. In this case, if hardware
protection is required, one PIO2_84 I/O card can be configured as the
protection card, and the corresponding protection connection module M2_84P
I/O is installed in the appropriate slot of the XDM-1000 modules cage.
I/O slot 12 is always configured as a pure optical slot without a modules cage
module.
Connection Module Data for Electrical I/O

Cards
I/O card
Bitrate
(Mbps)
I/O ports
Module
Interface type
Function/Description
SIO1&4
155
16
M1_16BT
SDH/SONET
electrical
Connection module
M1_16DIN
SDH/SONET
electrical
Connection module
M1_16P 85
Connection module with

protection
M1_8BT
SDH/SONET
electrical
Connection module
M1_8DIN
SDH/SONET
electrical
Connection module
M345_16BT
PDH/Async
Connection module
M345_16DI
PDH/Async
Connection module
M345_16P 86
PDH/Async

protection
PIO345
34/45/52
16
85
86
M345_8BT
PDH/Async
Connection module
M345_8DI
PDH/Async
Connection module
M345_8BN
PDH/Async
Connection module
Protection modules are not supported in XDM-400.

Protection modules are not supported in XDM-400.
417006-2009-013-A01
6-3
XDM-40, 400, 450, 500, 1000, 2000,

I/O card
Bitrate
(Mbps)
I/O ports
Module
Interface type
PIO2_84
2.048
84
M2_84B
PDH
Balanced (120 ) connection

module
M2_84BR
PDH
Low-cost, balanced (120 )

connection module, without
protection
M2_84U
PDH
Unbalanced (75 )
connection module
M2_84UR
PDH
Low-cost, unbalanced (75 )

connection module, without
protection
M2_84P 87
PDH

protection
M2_21B
PDH
Balanced (120 ) connection

module
M2_21U
PDH
Unbalanced (75 )
connection module
M2_84P 88
PDH

protection
PIO2_21
2.048
21
Optical transceivers for I/O cards

Optical I/O cards use a slide-in optical transceiver, which is directly plugged
into the card for signal interfacing.
I/O card
Optical module
Connector
type
I/O ports
per optical
module
Modules per
I/O card
Ports per I/O card
SIO1&4
OM01_4
LC
16 x STM-1/OC-3
OM04_1
SC/LC
4 x STM-4/OC-12
OM16_1
SC/LC
2 x STM-16/OC-48
OM64_1
LC
1 x STM-64/OC-192/OTU2
OMSC16_4
LC
OMTX10_EF
LC
OMTX10
LC
OMTX10_S
LC
OM01_4
LC
4 x STM-1/OC-3
OM04_1
SC/LC
1 x STM-4/OC-12
OM16_1
SC/LC
1 x STM-16/OC-48
OMSC16_4
LC
OMTX10_EF
LC
OMTX10
LC
OMTX10_S
LC
SIO16
SIO64
89
SIO164 90
XIO192
XIO384F 91
87
Protection module M2_84P can be used to protect PIO2_84. Protection modules are not supported in XDM-400.
Protection module M2_84P can be used to protect PIO2_84. Protection modules are not supported in XDM-400.
89
90
91
88
6-4
417006-2009-013-A01
XDM-40, 400, 450, 500, 1000, 2000,

Optical SFP transceivers for I/O cards

New optical I/O cards use a high flexibility concept, consisting of slide-in
optical modules. Each module has slots for up to four SFP transceivers.
Connector
type
I/O ports per

optical
module
Modules per
I/O card
Ports per I/O card
OMS01_4 92
LC
1 to 4
16 x STM-1/OC-3
93
I/O card
Optical
module
SIO1&4
LC
4 x STM-4/OC-12
SIO16
OMS04_1
OM16_1SFP 94 LC
SIO164
OMSC16_4
LC
XDM Shelf Capacities

XDM shelf slot capacities differ as a function of the type of matrix cards
(HLXC or XIO) used. Although the XIO and the HLXC have identical
cross-connect capabilities, the bandwidth allocation capacity per I/O slot for
the XIO is different than that of the HLXC. The HLXC has uniform capacity
distribution per slot, regardless of the XDM shelf in which it is installed. In
contrast, XIO capacity varies, depending on the XDM shelf type in use.
XDM Shelf Capacities with HLXC

The following table describes the HLXC bandwidth allocation capacity (in VC-4s) per slot
for each XDM shelf type.
XDM-500 slot #
XDM-1000/
2000 slot #
XDM-500
slot capacity
(HLXC192)
XDM-1000
slot capacity
(HLXC192)
XDM-1000/2000
slot capacity
(HLXC384)
XDM-1000/2000
slot capacity
(HLXC768)
I/C2
I/O1
32
(5 Gbps)
16
(2.5 Gbps)
32
(5 Gbps)
64
(10 Gbps)
I/C3
I/O2
32
(5 Gbps)
16
(2.5 Gbps)
32
(5 Gbps)
64
(10 Gbps)
I/C4
I/O3
32
(5 Gbps)
16
(2.5 Gbps)
32
(5 Gbps)
64
(10 Gbps)
I/C5
I/O4
32
(5 Gbps)
16
(2.5 Gbps)
32
(5 Gbps)
64
(10 Gbps)
I/C1
I/O5
32
(5 Gbps)
16
(2.5 Gbps)
32
(5 Gbps)
64
(10 Gbps)
I/C6
I/O6
32
(5 Gbps)
16
(2.5 Gbps)
32
(5 Gbps)
64
(10 Gbps)
I/O7
16
(2.5 Gbps)
32
(5 Gbps)
64
(10 Gbps)
I/O8
16
(2.5 Gbps)
32
(5 Gbps)
64
(10 Gbps)
92
93
94
SFP SDH/SONET transceivers starting system version V 5.0, DWDM SFPs release V6.2.
417006-2009-013-A01
6-5
XDM-40, 400, 450, 500, 1000, 2000,

XDM-500 slot #
XDM-1000/
2000 slot #
XDM-1000
slot capacity
(HLXC192)
XDM-1000/2000
slot capacity
(HLXC384)
XDM-1000/2000
slot capacity
(HLXC768)
I/O9
16
(2.5 Gbps)
32
(5 Gbps)
64
(10 Gbps)
I/O10
16
(2.5 Gbps)
32
(5 Gbps)
64
(10 Gbps)
I/O11
16
(2.5 Gbps)
32
(5 Gbps)
64
(10 Gbps)
I/012
16
(2.5 Gbps)
32
(5 Gbps)
64
(10 Gbps)
192
384
768
Total capacity
XDM-500
slot capacity
(HLXC192)
192
XDM Shelf Capacities with XIO

The following table describes the XIO bandwidth allocation capacity (in VC-4s) per slot for
each XDM shelf type.
95
XDM-500
slot
capacity
(XIO384F)
XDM-1000
slot
capacity
(XIO192)
XDM-1000/
2000 slot
capacity
(XIO384F
97
ConfigA)
XDM-400
slot #
XDM-500
slot #
XDM-1000/
2000 slot #
XDM-400 slot XDM-500

capacity
slot
(XIO192)
capacity
(XIO192)
IS2
IC2
I/O1
32 (5 Gbps)
32 (5 Gbps) 32 (5 Gbps) 32 (5 Gbps) 32 (5 Gbps) 0
IS3
IC3
I/O2
32 (5 Gbps)
32 (5 Gbps) 64 (10
Gbps)
IC4
I/O3
16 (2.5 Gbps) 32 (5 Gbps) 64 (10

Gbps)
16
(2.5 Gbps)
32 (5 Gbps) 64 (10
Gbps)
IS4
IC5
I/O4
16 (2.5 Gbps) 32 (5 Gbps) 32 (5 Gbps) 16

(2.5 Gbps)
32 (5 Gbps) 64 (10
Gbps)
IS1
IC1
I/O5
32 (5 Gbps) 16
16 (2.5 Gbps) 8
(2.5 Gbps)
(1.25 Gbps)
16
(2.5 Gbps)
16
(2.5 Gbps)
IS5
IC6
I/O6
8
32 (5 Gbps) 16
(2.5 Gbps)
(1.25 Gbps)
16
(2.5 Gbps)
16
(2.5 Gbps)
I/O7
4
16
(622 Mbps) (2.5 Gbps)
16
(2.5 Gbps)
I/O8
4
16
(622 Mbps) (2.5 Gbps)
16
(2.5 Gbps)
I/O9
4 (622
Mbps)
16
(2.5 Gbps)
96
XDM-1000/
2000 slot
capacity
(XIO384F
98
ConfigB)
32 (5 Gbps) 32 (5 Gbps) 0
16
(2.5 Gbps)
95
The bandwidth capacities in the XDM-500 are suitable for cost-effective ADM-64s. Using the XIO384F with an
STM-64 interface frees six slots in the XDM-500 for PIO and SIO cards.
The bandwidth capacities in the XDM-1000 are suitable for cost-effective ADM-64s as well as an ADM-16 with
many PIO interfaces. This is an excellent option for systems with a large number of E1 interfaces.
97
The bandwidth capacities in this configuration of the XDM-1000/2000 are suitable for a multi-ADM-16 with eight
drop slots available for SDH/SONET, PDH, and Ethernet services.
98
The bandwidth capacities in this configuration of the XDM-1000/2000 are a good solution for a double ADM64
with eight drop slots available for SDH/SONET, PDH, and Ethernet services. Two slots are available for optical
transponders and/or combiners for hybrid applications.
96
6-6
417006-2009-013-A01
XDM-400
slot #
XDM-500
slot #
XDM-40, 400, 450, 500, 1000, 2000,

95
XDM-1000/
2000 slot
capacity
(XIO384F
97
ConfigA)
XDM-1000/
2000 slot
capacity
(XIO384F
98
ConfigB)
I/O10
4
16
(622 Mbps) (2.5 Gbps)
16
(2.5 Gbps)
I/O11
16
(2.5 Gbps)
16
(2.5 Gbps)
I/012
16
(2.5 Gbps)
16
(2.5 Gbps)
XDM-1000/
2000 slot #
XDM-400 slot XDM-500

capacity
slot
(XIO192)
capacity
(XIO192)
XDM-500
slot
capacity
(XIO384F)
XDM-1000
slot
capacity
(XIO192)
96
XIO-L
XIO-L
XIO-L
20
20
64
20
64
64
(10 Gbps)
XIO-R
XIO-R
XIO-R
20
20
64
20
64
64
(10 Gbps)
OHA
OHA
OHA
--
--
--
192
192
384
192
384
384
Total capacity
The bandwidth capacities in the XDM-500 are suitable for cost-effective ADM-64s. Using
the XIO384F with an STM-64 interface frees six slots in the XDM-500 for PIO and SIO
cards.
The bandwidth capacities in the XDM-1000 are suitable for cost-effective ADM-64s as well
as an ADM-16 with many PIO interfaces. This is an excellent option for systems with a
large number of E1 interfaces.
The bandwidth capacities in this configuration of the XDM-1000/2000 are suitable for a
multi-ADM-16 with eight drop slots available for SDH/SONET, PDH, and Ethernet
services.
The bandwidth capacities in this configuration of the XDM-1000/2000 are a good solution
for a double ADM-64 with eight drop slots available for SDH/SONET, PDH, and Ethernet
services. Two slots are available for optical transponders and/or combiners for hybrid
applications.
417006-2009-013-A01
6-7
XDM-40, 400, 450, 500, 1000, 2000,

PDH/Async and SDH/SONET

Interface Specifications
2 Mbps (E1)
Frame ...................................................................................... Unframed, G.704, I.431 (ISDN)
Line code .......................................................................................................................... HDB3
Line impedance ..................................................................... 120 balanced/75 unbalanced
34 Mbps (E3)
Frame ................................................................................................................................ G.751
Line code .......................................................................................................................... HDB3
45 Mbps (DS-3)
Frame ................................................................................................................................ G.751
Line code ........................................................................................................................... B3ZS
52 Mpbs (STS-1)
Frame ................................................................................................................................ G.253
Line code ............................................................................................................................. CMI
STM-1 Electrical
Frame ................................................................................................................................ G.707
Line code ............................................................................................................................. CMI
6-8
417006-2009-013-A01
XDM-40, 400, 450, 500, 1000, 2000,

STM-1/OC-3 Optical
Wavelength .................................................................................................. 1310 nm, 1550 nm
Short-haul, long-haul bitrate ................................................................. 155.52 Mbps 4.6 ppm
STM-4/OC-12 Optical
Wavelength .................................................................................................. 1310 nm, 1550 nm
Short-haul, long-haul, very long-haul, ultra long-haul bitrate ................... 622 Mbps 4.6 ppm
Wavelength ................................................................................................. 1310 nm, 1550 nm
Short-haul, long-haul, very long-haul, ultra long-haul,
DWDM (G.694.1 and G.957) bitrate .................................................. 2488.32 Mbps 4.6 ppm
Physical level .......................................................................................... G.691, G.957, Table 5
Wavelength ................................................................................................. 1310 nm, 1550 nm
Short-haul, long-haul, very long-haul, DWDM (G.694.1) bitrate ...... 9953.28 Mbps 4.6 ppm
417006-2009-013-A01
6-9
XDM-40, 400, 450, 500, 1000, 2000,

STM-1/OC-3 (155.52 Mbps 4.6 ppm) I/O
Modules
OM01_4I3 99
CARD NAME
OM01_4S3
OM01_4L5
S-1.1
L-1.2
1270-1380
1261-1360
1480-1580
Source type
MLM
SLM
SLM
Max. RMS width (nm)
7.7
> 30
-19
-15
-5
-14
-8
10
8.2
10
-30
-28
-34
Min. overload (dBm)
-8
-10
-25
96
-20
-25
APPLICATION CODE
100

TRANSMITTER
RECEIVER
99
MLM transceiver for 2 km with multimode fibers.

100
6-10
417006-2009-013-A01
XDM-40, 400, 450, 500, 1000, 2000,

MECP_OSC cards
CARD NAME
MECP_OSC5
MECP_OC5OW
[MECP_OC5XOW]
MECP_OC5UOW 101
1500-1520
1500-1520
1500-1520
Signal Rate
155 Mbps
155 Mbps
2 Mbps
Source type
SLM
SLM
SLM
Max. RMS width (nm)
> 30
> 30
> 30
+1
+2
+5
+5
10
10
10
-34
-35 [-40]
-54
Min. overload (dBm)
-10
-8
-5
-25
-20
-20
-25
-25
-25
TRANSMITTER
RECEIVER
OPTICAL PATH BETWEEN S AND R
101
No interoperability possible between MECP_OC5UOW and the other MECP_OSC modules.
417006-2009-013-A01
6-11
XDM-40, 400, 450, 500, 1000, 2000,

STM-1/OC-3 SFP Optical Transceivers for

OMS01_4
Table 6-1:
STM-1 transceivers
102
APPLICATION CODE 103
OTR1_S3
OTR1_L3
OTR1_L5
S-1.1
L-1.1
L-1.2
OTR1_X5
OTR1_VL5
1261-1360
1263-1360
1480-1580
1500-1520
1500-1520
Source type
MLM 104
SLM
SLM
SLM
SLM
Max. RMS width (nm)
7.7
30
30
> 30
> 30
-15
-5
-5
+1
-8
+5
+5
8.2
10
10
10
10
-28
-34
-34
-35
-42
Min. overload (dBm)
-8
-10
-10
-8
-5
-25
96
-20
-20
-25
-25
-25

102
New optical SFP transceivers for existing SIO1&4B basecard.

104
103
6-12
417006-2009-013-A01
Table 6-2:
XDM-40, 400, 450, 500, 1000, 2000,

OTR1-S3BD
OTR1-S5BD
OTR1-L3BD
OTR1-L5BD
Application code 105
BD 3 106
BD 5 107
L3BD
L5BD
1260-1360
1480-1580
1280-1360
1480-1580
Source type
MLM
MLM
MLM
SLM
Max. RMS width (nm)
30
TRANSMITTER
-14
-14
-5
-5
-8
-8
10
10
10
10
Min. sensitivity (BER of 1 * 10-12) EOL (dBm)
-32
-32
-32
-32
Min. overload (dBm)
-8
-8
-20
-20
RECEIVER 108

Modules
OM4_1I3 109
CARD NAME
OM4_1S3
OM4_1L5
S-4.1
L-4.2
1270-1380
1274-1356
1480-1580
Source type
MLM
SLM
SLM
Max. RMS width (nm)
> 30
-19
-15
-3
-14
-8
+2
10
8.2
10

TRANSMITTER
105

108
109
MLM transceiver for 2 km with multimode fibers.
110
106
107
417006-2009-013-A01
6-13
XDM-40, 400, 450, 500, 1000, 2000,

OM4_1I3 109
CARD NAME
OM4_1S3
OM4_1L5
S-4.1
L-4.2
RECEIVER

1*10-12) EOL (dBm)
-31
-28
-28
Min. overload (dBm)
-8
-8
-27
74
-24
-27
STM-4/OC-12 SFP Optical Transceivers for

OMS04_1
Table 6-3:
STM-4 transceivers
SFP TRANSCEIVER NAME 111
OTR4_S3
OTR4_L3
OTR4_L5
S-4.1
L-4.1
L-4.2
1274-1356
1280-1335
1480-1580
TRANSMITTER
Source type
MLM 113
SLM
SLM
Max. RMS width (nm)
4/2.5
<1
30
30
-15
-3
-3
-8
+2
+2
8.2
10
10
-28
-28
-28
Min. overload (dBm)
-8
-8
-8
-14
-27
RECEIVER
74
20
24
-25
-27
111
New optical SFP transceivers for existing SIO1&4B basecard.

113
112
6-14
417006-2009-013-A01
XDM-40, 400, 450, 500, 1000, 2000,


Table 6-4:
OTR4_S3BD
OTR4_S5BD
OTR4_L3BD
OTR4_L5BD
S3BD
S5BD
L3BD
L5BD
1260-1360
1480-1580
1260-1360
1480-1580
Source type
MLM
SLM
MLM
SLM
Max. RMS width (nm)
30
30
-15
-15
-3
-3
Application code
114

TRANSMITTER
-8
-8
+2
+2
8.2
8.2
10
10
Min. sensitivity (BER of 1 * 10-12) EOL (dBm)
-28
-28
-28
-28
Min. overload (dBm)
-8
-8
-8
-8
RECEIVER 115

114
115

417006-2009-013-A01
6-15
XDM-40, 400, 450, 500, 1000, 2000,

STM-16/OC-48 (2488.32 Mbps 4.6 ppm)

I/O Modules
CARD NAME
APPLICATION CODE
116
Operating wavelength
(nm)
OM16_
1AX5xx
OM16_
1AV5xx
OM16_
1AB5xx
OM16_
1AX5
OM16_
1AL5
OM16_
1PS3
OM16_
1PI3
X-16.2
V-16.2
U-16.2
X-16.2
L-16.2
S-16.1
I-16
15301560
15301565
15301565
15301560
15301565
12601360
1260-136
0
TRANSMITTER
Source type
SLM
SLM
SLM
SLM
SLM
SLM
SLM
Max. RMS width (nm)
Min. side mode

suppression (dB)
30
30
30
30
30
30
Min. mean launched

power (dBm)
+5.5
+1
+0
+5.5
+0
-5
-10
Max. mean launched

power (dBm)
+7.5
+3
+2
+7.5
+3
-3

(dB)
8.2
8.2
8.2
8.2
8.2
8.2
8.2
Photodiode type
APD
APD
APD
APD
APD
Pin
Pin
Min. sensitivity
(BER of 1*10-12)
EOL (dBm)
-28
-28
-28
-28
-28
-18
-16
Min. overload (dBm)
-7
RECEIVER
Max. receiver reflectance -27

(dB)
-7
-7
-7
-7
-27
-27
-27
-27
-27
-27
1800
1800
3000 117
2160
1800
- 118
- 119
Min. optical return loss

of cable (dB)
-24
-24
-24
-24
-24
-24
-24
Max. discrete reflectance -27

(dB)
-27
-27
-27
-27
-27
-27
Max. optical path penalty < 2

(dB)
<2
<2
<3
<2
<2
<1
116

To reach distances of 150 km, OM16_1AB5 should be connected to a booster.
118
The dispersion value is relevant only in the 1500 nm wavelength. PS3 is for 25 km and PI3 for 2 km.
119
The dispersion value is relevant only in the 1500 nm wavelength. PS3 is for 25 km and PI3 for 2 km.
117
6-16
417006-2009-013-A01
XDM-40, 400, 450, 500, 1000, 2000,

SDH/SONET STM-16/OC-48 SFP Optical

Transceivers for OM16_1SFP and OMSC16_4
Table 6-5:
STM-16 transceivers
SFP TRANSCEIVER NAME 120
OTR16_I3 121
OTR16_S3 122
OTR16_L3 123
OTR16_L5 124
I-16
S-16.1
L-16.1
L-16.2
1260-1360
1260-1360
1280-1335
1500-1580
Source type
SLM
SLM
SLM
SLM
<1
Max. RMS width (nm)
30
30
30
-10
-5
-2
-2
APPLICATION CODE
125

TRANSMITTER
-3
+3
+3
8.2
8.2
8.2
8.2

1*10-12) EOL (dBm)
-16
-18
-27
-28
Min. overload (dBm)
-9
-9
-27
-27
-27
-27
1600

(dB)
-24
-24
-24
-24
-27
-27
-27
-27
<1
RECEIVER

120
New optical SFP transceivers for existing SIO16 basecard.

All OTR SFP transceivers can be used with SIO164 or XIO384F cards, utilizing the OMSC16_4 module (up to 4
SFP transceivers per module).
122
123
124
125
121
417006-2009-013-A01
6-17
XDM-40, 400, 450, 500, 1000, 2000,

Table 6-6:
OTR16_S3BD
OTR16_S5BD
OTR16_L3BD
OTR16_L5BD
Application code 126
S3BD
S5BD
L3BD
L5BD
1260-1360
1480-1580
1260-1360
1480-1580
Source type
SLM
SLM
SLM
SLM
Max. RMS width (nm)
30
30
30
30
-5
-5
-2
-2
+2
+2
+5
+5
8.2
8.2
8.2
8.2
Min. sensitivity (BER of 1 * 10-12) EOL

(dBm)
-18
-18
-27
-27
Min. overload (dBm)
-9
-9
TRANSMITTER
RECEIVER 127
126
127

6-18
417006-2009-013-A01
XDM-40, 400, 450, 500, 1000, 2000,

CWDM and DWDM STM-16/OC-48/OTU1

SFP Optical Transceivers for OM16_1SFP
and OMSC16_4
CWDM
SFP TRANSCEIVER
NAME 128
OTC25_PSx
x
DWDM
OTC25_1A OTR25_AVx
Lxx
x
OTR25_ABxx
129
APPLICATION CODE 133 S-C8S1-1D2/

5
G.695
S-C8L1-1D DW100L2/5
-1D2/5(C)F
DW100CG.695
-1A2/5(C)F
G.698.1/.2
Operating wavelength
(nm)
1464-1618
Source type
OTR16_I3
130
OTR16_S3
OTR16_L3
OTR16_L5
DW100L-1D2/5(C)F
DW100C-1A2/5(C)F
G.698.1/.2
I-16
S-16.1
L-16.1
L-16.2
1464-1618 1530-1565
1530-1565
1260-1360 1260-1360 1280-133
SLM
SLM
SLM
SLM
SLM
Max. -20 dB width

(nm)
0.4
0.4
Max. RMS width (nm)
Min. side mode

suppression (dB)
30
30
30
30
Min. mean launched

power (dBm)
Max. mean launched

power (dBm)
+5
+5

(dB)
8.2
8.2
Min. sensitivity (BER

of 1*10-12)
EOL (dBm)
-21.5
(-23 GbE)
Min. overload (dBm)

Max. receiver
reflectance (dB)
131
132
1500-158
0
SLM
SLM
SLM
<1
30
30
30
-10
-5
-2
-2
-3
+3
+3
8.2
8.2
8.2
8.2
8.2
8.2
-28
(-32 GbE)
-28
-28
-16
-18
-27
-28
-7
-9
-9
-9
-9
-27
-27
-27
-27
-27
-27
-27
-27
TRANSMITTER
RECEIVER
Max. dispersion
[ps/nm]
800
(40 km
G.652)
1600
(80 km
G.652)
2400
(120 km
G.652)
3600
(180 km
G.652)
-24
1600
Min. optical return loss

of cable (dB)
24
24
-24
-24
-24
-24
-27
-24
128
New optical SFP transceivers for existing SIO16 basecard.

130
131
132
133
129
417006-2009-013-A01
6-19
XDM-40, 400, 450, 500, 1000, 2000,

CWDM
DWDM
SFP TRANSCEIVER
NAME 128
OTC25_PSx
x
OTC25_1A OTR25_AVx
Lxx
x
OTR25_ABxx
Max. discrete
reflectance (dB)
-27
-27
-27
Max. optical path

penalty (dB)
1.5
2.5
<3
129
OTR16_I3
130
OTR16_S3
OTR16_L3
OTR16_L5
-27
-27
-27
-27
<2
<1
131
132
SDH/SONET STM-64/OC-192 (9953.28 Mbps

4.6 ppm) I/O Modules
CARD NAME
134
APPLICATION CODE
OM64_
1ALSxx
OM10_1AL
135
Sxx
137
L-64.2a
138
OM64_
1ASSxx
OM10_1AS
136
Sxx
S-64.2a
139
OM10_
1PSSxx
I-64.2
140
OM10_
1PLSxx
L-64.2b
141
OM10_
1PSS3
S-64.1
142
OM10_
1PIS3
I-64.1
143
1530-1565
1530-1565
1530-1565
1530-1565
1285-1330
1285-1330
Source type
EML
EML
EML
EML
EML
EML

(dBm)
-2
-2
-2
-4
-6

(dBm)
+2
+3
+3
+3
+1
-1
9.0
8.2
8.2
10
APD
TRANSMITTER
RECEIVER
Photodiode type
APD
PIN
PIN
PIN
PIN
Min. sensitivity
-23 144
(BER of 1*10-12) EOL (dBm)
-19 145
-14
-14
-15
-11
Min. overload (dBm)
-8
-8
-1
-1
-1
-1
<2
<2
<2
<2
<1
<1
-27
-27
-27
-27
-27
-27

Max. attenuation range (dB)
21
15
10
10
10
Min. attenuation range (dB)
10
10
Max. chromatic dispersion

(ps/nm) 146
1600 147
800
800
1600 148
40
134
Not supported in XDM-400.

OM10 is supported, in all three SIO64 types.
136
OM10 is supported, in all three SIO64 types.
137
138
OM64/OM10 optics are also available for DWDM applications as per the standard ITU-T G.694.1 grid (n = 1-40).
139
140
141
142
143
144
When adding FEC, there is a typical improvement of 2 dB for nonamplified networks (sensitivity of -25 dBm
instead of -23 dBm).
145
When adding FEC, there is a typical improvement of 2 dB for nonamplified networks (sensitivity of -25 dBm
instead of -23 dBm).
135
6-20
417006-2009-013-A01
XDM-40, 400, 450, 500, 1000, 2000,

SDH/SONET STM-64/OC-192 XFP Optical

Transceivers
XFP TRANSCEIVER NAME
OTR64_I3
OTR64_S5
OTR64_L5
I-64.1
P1I1_2D1
VSR2000_2R1
S-64.2b
P1S1_2D2
b
L-64.2a
P1L1-2D2
1290-1330
1529-1560
1530-1565
1529-1560
1529-1560
Source type
SLM
SLM
SLM
SLM
SLM
Central frequency (THz)
NA
NA
NA
192.1 + 0.1m
m=0 to 40
192.1 + 0.1m
m=0 to 40
Maximum central frequency

deviation (GHz)
NA
NA
NA
12.5
12.5
<1
<1
<1
<1
<1

(dB)
30
30
30
30
30

(dBm)
-6
-1
-1
-1

(dBm)
-1
+2
+4
+3
+3
8.2
8.2

1*10-12)
EOL (dBm)
-11
-14
-24
-24
-24
Min. overload (dBm)
-1
-1
-7
-8
-8
-27
-27
-27
-27
-27
APPLICATION CODE
149
OTR10_ASxx
OTR10_ALxx
1L1-2D2F
TRANSMITTER
RECEIVER
6.6
800
1600
800
1600

cable (dB)
24
24
24
-27
-27
-27
-27
-27
Max. optical path penalty (dB) 1
146
Effective optical power budget calculation for single channel with no amplification: Tx min. power minus Rx
sensitivity (EOL) minus max. optical path penalty (dB).
147
The limitation for the long-range STM-64/OC-192 laser is 68 km. When adding FEC, the range can be extended
up to 76 km.
148
The limitation for the long-range STM-64/OC-192 laser is 68 km. When adding FEC, the range can be extended
up to 76 km.
149
417006-2009-013-A01
6-21
XDM-40, 400, 450, 500, 1000, 2000,

OW Unit Specifications
The OW unit supports omnibus conference call with two separate configurable networks (A
and B). Any user within the network can select another user in its network by direct dialing
(DTMF).
Tx/Rx level .......................................................................... 7 dBm, 600 , (per CCITT G.711)
Speech coding and bit rate .......................................................................... PCM A-law 8 Kbps
Number of VF channels ................................................................................................ 10 to 12
Band pass .......................................................................................................... 300 to 3400 Hz
Subscriber side input/output level ....................................... 7 dBm, 600 , (per CCITT G.711)
Idle channel noise................................................................................................. (-) 75 dBmOp
Number of data channels ...................................................................................... 3 (E1, E2, F1)
Interface connectors type ........................................................................ Tel JACK 6P4C RCA
Data rates....................................................................................................................... 64 Kbps
XDM MPLS/Ethernet Card

Summary
The following table identifies the MPLS/Ethernet components and the platforms within
which specific modules are used. The different modules are listed by interface categories,
where the modules within a category generally share the same functionality. Specific details
may vary from module to module.
Interface
XDM-400
XDM-500
XDM-1000
XDM-2000
XDM-3000
--
MCS5 (only in 5 and 10 Gbps slots)
--
MCS10 (only in 10 Gbps slots)
--
MCS30_X10G (only in 10 Gbps slots)
--
Ethernet over SDH/SONET Layer 1
DIOB
Ethernet/MPLS Layer 1 and 2
Data Cards
Card 150
Service interfaces
DIOB
8 x FX/GbE (optical) 151 +

[8 x 10/100BaseT +
8 x 10/100/1000BaseT] 152
150
151
152
Data
handling
Network
interfaces
Bandwidth per EoS

interface
Layer 1
24 x EoS 153
(1 to 16) x VC-4
(1 to 48) x VC-3
(1 to 63) x VC-12
All data cards are not supported in XDM-40.

Optical ports on base cards, SFP for GbE or FX.
Electrical ports located on ME_16 module in the CCP.
6-22
417006-2009-013-A01
XDM-40, 400, 450, 500, 1000, 2000,

Data
handling
Network
interfaces
Bandwidth per EoS

interface
Card 150
Service interfaces
MCS5 154

4 x FX (optical) +
[12 x 10/100BaseT +
4 x 10/100/1000BaseT] 156
Layer 2
32 x EoS/MoT
(Ethernet/M
PLS)
(1 to 16) x VC-4 157

(1 to 48) x VC-3 158
(1 to 63) x VC-12 159
MCS10 160

[8 x 10/100BaseT +
8 x 10/100/1000BaseT] 162
Layer 2
32 x EoS/MoT
(Ethernet/M
PLS)
(1 to 16) x VC-4 163

(1 to 48) x VC-3 164
(1 to 63) x VC-12 165
MCS30_X10G
166
1 x 10GbE (optical) +
10 x FX/GbE (optical) 167
Layer 2
32 x EoS/MoT
(Ethernet/M
PLS)
(1 to 64) x VC-4
(1 to 192) x VC-3
(1 to 64) x VC-12
ATS 168
2 x VC-4 + 126 x E1
ATM
2 x VC-4 +
125 x E1
2 x VC-4 + 125 x E1
DIOB Specifications
........................................................................................................................... G.7042 (LCAS)
EoS capacity with VC-4 or VC-3 granularity .............................................. up to 2.5 or 5 Gbps
EoS capacity with VC-12 granularity .......................................................... up to 512 x VC-12
153
EoS Ethernet over SDH/SONET.

Can be accommodated in 5 Gbps, or 10 Gbps slots only, with 5 Gbps EoS capacity.
156
157
Maximum EoS/MoT capacity per card: 5 Gbps (32xVC-4 or 96xVC-3) and per EoS port when using LAG.
158
159
Maximum n x VC-12 per card: 512 x VC-12.
160
Can be accommodated in 10 Gbps slots only.
161
162
163
164
165
Maximum n x VC-12 per card: 512 x VC-12.
166
Can be accommodated in 10 Gbps slots only.
167
Supported starting V8.2
168
ATS resources can be software-allocated to service or network interfaces as required
154
155
417006-2009-013-A01
6-23
XDM-40, 400, 450, 500, 1000, 2000,

MCS5 Specifications
Ethernet Ring Protection (ERP) ...... <50ms FRR link and node, <50ms Dual homed/attached,
, G.8032 (ERP) ............................................................ Ethernet UNI/NNI LAG and EoS LAG,
.................................................................... Fast IOP MCS5 1+1 hot standby card protection
MPLS-based servicesVPWS (Martini encapsulation), VPLS (Full mesh and star), Hierarchical
................................. VPLS (H-VPLS) with multiple Split Horizon Groups and VPLS Spokes
......................................................................................... P2MP (Multicast drop and continue),
...................................................................................................................................... H-VPLS
................................................................................................. IGMP snooping and static MAC
Hard QoS:
...................... SVLAN-Pbits (802.1p priority bits), DHCP field, Untagged Frame, BPDU,
.......................................... 8 Classes of Service (CoS), Classification rules, CoS mapping,
........................... 2 rate policing, 3 colors marking, Connection Admission Control (CAC)
...............................WRED, Shaping, Scheduling (WFQ/WRR Weighted Fair Queuing /
....................................................................................................... Weighted Round Robin)
MAC and VLANs:
...................... 4093 x 4093 VLANs with 16K VLAN mapping rules, S-VLAN translation,
........................................ S-VLAN configurable Ether-type, FDB (Forwarding Data Base)
E2E OAM:
........................................... Tunnel OAM (ITU-T Y.1711) with Connectivity Verification,
...................... Service OAM (802.1ag) with Continuity Check, Loopback and Link Trace,
........................... Link OAM (802.3ah), Link Loss Carry Forward (LLCF), Port Mirroring
Security:
Management:
Services:
6-24
417006-2009-013-A01
XDM-40, 400, 450, 500, 1000, 2000,


........................................................................................................................... conferences
IEEE ........................................................................ 802.1D/P/Q, 802.1w, 802.1ad, 802.1ag
............................................................ 802.3-2005, 802.3ad, 802.3ah (Link OAM), 802.3x
ITU-T ........................................ G.707, G.7041, G.7042, G.8010/Y.1306, G.8011/Y.1307,
.............................................................................. G.8011.1/Y.1307.1, G.8011.2/Y.1307.2,
................................................... G.8012/Y.1308, Y.1710, Y.1711, G.783, G.8032/Y.1344
................................ RFC 4379, RFC 3812, RFC 3813, RFC 2702, RFC 4090, RFC 3916,
........................................................................................................... RFC 3985, RFC 4125
MCS10 Specifications
Total EoS/MoT capacity ............................................................................................... 10 Gbps
.............................................................................................................................. G.8032 (ERP)
.................................................................. Fast IOP MCS10 1+1 hot standby card protection
MPLS-based services ............................................................... VPWS (Martini encapsulation),
.................................................................................... VPLS (Full mesh and star), Hierarchical
.......................................................................................... VPLS (H-VPLS) with multiple Split
........................................................................................... Horizon Groups and VPLS Spokes,
Hard QoS:
....................................Eight Classes of Service (CoS), Classification rules, CoS mapping,
417006-2009-013-A01
6-25
XDM-40, 400, 450, 500, 1000, 2000,


MAC and VLANs:
....................... 4093 x 4093 VLANs with 16K VLAN mapping rules, SVLAN translation,
E2E OAM:
........................................... Tunnel OAM (ITU-T Y.1711) with Connectivity Verification,
...................... Service OAM (802.1ag) with Continuity Check, Loopback and Link Trace,
........................... Link OAM (802.3ah), Link Loss Carry Forward (LLCF), Port Mirroring
Security:
Management:
Services:
Business connectivity................................................................ VPWS and VPLS, H-VPLS
........................................................................................................................... conferences
IEEE ........................................................................ 802.1D/P/Q, 802.1w, 802.1ad, 802.1ag
............................................................ 802.3-2005, 802.3ad, 802.3ah (Link OAM), 802.3x
ITU-T ........................................ G.707, G.7041, G.7042, G.8010/Y.1306, G.8011/Y.1307,
................................................... G.8011.1/Y.1307.1, G.8011.2/Y.1307.2, G.8012/Y.1308,
.............................................................................. Y.1710, Y.1711, G.783, G.8032/Y.1344
................................................... RFC 4379, RFC 3812, RFC 3813, RFC 2702, RFC 4090,
......................................................................................... RFC 3916, RFC 3985, RFC 4125
MCS30_X10G Specifications
Interfaces .................................................................. 10GBase-SR (850nm MM), 10GBase-LR
................................ (1310nm SM), 10GBase-ER (1550nm SM), 10GBase-ER (1550nm SM),
....................................................................................... 10GBase-ER (15XXnm DWDM, SM)
Total EoS/MoT capacity ............................................................................................... 10 Gbps
6-26
417006-2009-013-A01
XDM-40, 400, 450, 500, 1000, 2000,

.............................................................................................................................. G.8032 (ERP)
...................................................... Fast IOP MCS30_X10G 1+1 hot standby card protection
MPLS-based services ............................................................... VPWS (Martini encapsulation),
.................................................................................... VPLS (Full mesh and star), Hierarchical
.......................................................................................... VPLS (H-VPLS) with multiple Split
........................................................................................... Horizon Groups and VPLS Spokes,
Hard QoS:
....................................Eight Classes of Service (CoS), Classification rules, CoS mapping,
MAC and VLANs:
....................... 4093 x 4093 VLANs with 16K VLAN mapping rules, SVLAN translation,
E2E OAM:
Security:
Management:
Services:
Business connectivity...................................................................... VPWS, VPLS, H-VPLS
........................................................................................................................... conferences
417006-2009-013-A01
6-27
XDM-40, 400, 450, 500, 1000, 2000,

IEEE ........................................................................ 802.1D/P/Q, 802.1w, 802.1ad, 802.1ag

............................................................ 802.3-2005, 802.3ad, 802.3ah (Link OAM), 802.3x
ITU-T ........................................ G.707, G.7041, G.7042, G.8010/Y.1306, G.8011/Y.1307,
................................................... G.8011.1/Y.1307.1, G.8011.2/Y.1307.2, G.8012/Y.1308,
.............................................................................. Y.1710, Y.1711, G.783, G.8032/Y.1344
................................................... RFC 4379, RFC 3812, RFC 3813, RFC 2702, RFC 4090,
......................................................................................... RFC 3916, RFC 3985, RFC 4125
ATS Specifications
Bandwidth ............................................................................................................. 622.08 Mbps
Simultaneous IMA support ....................... 84 IMA groups per card with 1 to 32 E1 links each
ATM service classes .................................................................. CBR, rt-VBR, nrt-VBR, UBR
ATM signaling ............ UNI 3.1, UNI 4.0, PNNI 1.0, PNNI SPVC Addendum V 1.0, IISP 1.0
IMA ............................................................................................................... IMA 1.0, IMA 1.1
OAM ....................................................................................................................... ITU-T I.610
Traffic management ........................................................................................... ATMF TM 4.1
6-28
417006-2009-013-A01
XDM-40, 400, 450, 500, 1000, 2000,

Data Client Transceivers for DIOB, MCS5,

MCS10, MCS30_X10G
OTGBE_SX
OTGBE_LX
OTGBE_ZX
OTFE_MM
OTFE_SM
Transmitter
type
GbE
short-reach
laser, 850
nm,
multi-mode
GbE
long-reach
laser, 1310
nm, single
mode
GbE very
long-reach
laser, 1550
nm, single
mode
FX,
short-reach
laser, 1310
multi-mode
Bidirection Bidirection Bidirection Bidirection

FX,
al SFP,
al SFP,
al
short-reach al SFP,
1490 nm
1310 nm
SFP,
laser, 1310 1310 nm
1490 nm
nm, single
mode
Data rate
(nominal)
(Mbaud)
1250
1250
1250
125
125
1250
1250
1250
1250
Average
launch
power
(dBm)
-3 Max.
-3
-8
-3 Max.
-3
+2
+2
-9.5 Min.
-11
-15
-10 Min.
-10
-5
-5
Min.
transmitter
extinction
ratio (dB)
10
10
>9
>9
>9
>9
Data format
8B/10B
8B/10B
8B/10B
N/A
N/A
8B/10B
8B/10B
8B/10B
8B/10B
Average
receiver
sensitivity
(dBm)
-20 Min.
-22
--
-28
-22
< -21
< -21
< -23
< -23
-21 Typical
-25.5
-22
-30
--
< -22
< -22
< -24
< -24
Max.
receiver
overload
(dBm)
-14
-8
-3
-3
Typical Rx
LOS level
(dBm)
-24
-29
-25
< -29
<-28
-35
-35
-33
-33
Connector
LC
LC
LC
LC
LC
LC
LC
LC
LC
10 km
(9 m SMF)
80 km
(9 m SMF)
550 m
10 km
(50/62.5 m (9 m
MMF)
SMF)
10 km
(9 m
SMF)
10 km
(9 m
SMF)
40 km
(9 m
SMF)
40 km
(9 m
SMF)
Fiber lengths 550 m

(50/62.5
m MMF)
417006-2009-013-A01
OTGBE_S
3BD
OTGBE_S
5BD
OTGBE_L
3BD
6-29
OTGBE_L
5BD
XDM-40, 400, 450, 500, 1000, 2000,

Data Client XFP Transceivers for

MCS30_X10G
Transceiver
OTR103_ER
OTR103_ZR
OTR103_SR
OTR103_LR
Application code
S-64.2b
P1S1_2D2b
10GBASE-ER
L-64.2a
P1L1-2D2
10GBASE-SR
10GBASE-LR
Source type
SLM
SLM
MLM
SLM
Modulation
External
External
Direct
Direct
1529-1560
1530-1565
840-860
1290-1330
Direct max. -20 dB width (nm)
<1
<1
NA
<1
30
30
NA
30
-1
-4
-8.2
+2
+4
-1
+0.5
8.2
Maximum attenuation (dB)
11
22
Minimum attenuation (dB)
11
800
1600
NA
6.6
Minimum optical return loss (dB)
24
24
12
12
Maximum discrete reflectance
-27
-27
-27
-27
Maximum DGD (ps)
30
30
30
30
-14
-24
-11
Stressed (-7.5)
-12.6
Sensitivity (BER of 1*10 ) (dBm)

-12
Min. overload (dBm)
-1
-7
-1
-1
Maximum optical path penalty
3.9
(Transmitter
and dispersion
penalty)
OCH switching time (ms)
<3
<3
<3
<3
6-30
417006-2009-013-A01
XDM-40, 400, 450, 500, 1000, 2000,

Data Line XFP Transceivers for MCS30_X10G

Transceiver
OTR10_ALxx
Application code
1L1-2D2F
Source type
SLM
OTR10_ASxx
SLM
Modulation
External, NRZ
1529-1560
1529-1560
192.1 + 0.1m
m=0 to 40
192.1 + 0.1m
Maximum central frequency deviation (GHz)
12.5
12.5
<1
<1
30
30
-1
+3
8.2
-24
-24
Min. overload (dBm)
-8
-8
-27
-27
Maximum DGD (ps)
30
1600
800
<3
Transmitter
m=0 to 40
Receiver
Optical Path
417006-2009-013-A01
6-31
XDM-40, 400, 450, 500, 1000, 2000,

Optical Components
The XDM optical layer can service pure optical networks as well as converged
networks that integrate WDM with data and SDH/SONET services in the same
platform. To take full advantage of the XDM platform, a variety of optical
cards and modules are used for both the modules cage and the cards cage of the
various shelves, both in I/O slots as well as in the X1/X2 slots (otherwise used
for the cross-connect matrix cards).
DWDM Mux/Demux Cards and Modules

DWDM cards (cards cage of XDM-1000 and
XDM-2000 shelves)
Card
Width
(slots)
16/32-channel DWDM mux/demux cards (slots X1, X2)
DW16VMDRE-AG
Variable mux AWG, demux diffraction grating, 16

red channels, expandable to 32 channels
DWDM modules (CCP cage of

XDM-1000/XDM-450)
Conn.
type
Width
(slots)
MO_DW16MDR-BB-AVAV
LC
Mux AWG, demux AWG, 16 red channels,

nonexpandable
MO_DW16MDRE-BB-AVAV
LC
Mux AWG, demux AWG, 16 red channels,

expandable to 32 channels
MO_DW16MDB-BB-AVAV
LC
Mux AWG, demux AWG, 16 blue channels,

expandable to 32 channels
Module
Flat Top mux/demux for

cascading applications for manual
ROADM like operation
6-32
MO_DW40MC-BB-AV
LC
Mux AWG, 40 channels, C band
MO_DW40DC-BB-AV
LC
Demux AWG, 40 channels, C band
417006-2009-013-A01
XDM-40, 400, 450, 500, 1000, 2000,

Mux (CCP Flat Top) specifications

Type
16-channel
32-channel
40-channel
Insertion loss (dB):
AWG
< 6.5
< 9.5
< 6.5
Adjacent isolation (dB):
AWG
< -27
< -27
< -27
Cumulative isolation (dB):
AWG
< -24
< -24
< -24
PDL (dB)
AWG
<0.2
<0.2
<0.2
PMD (ps)
AWG
<0.5
<0.5
<0.5
Insertion Loss Uniformity (dB)
<1
<2
<1.8
Return loss (dB)
< -40
< -40
< -40
Demux (CCP Flat Top) specifications

Type
16-channel
32-channel
40-channel
Insertion loss (dB):
AWG
< 6.5
<8
< 6.5
AWG
< -27
< -27
< -27
AWG
< -24
N/A
< -24
PDL (dB)
AWG
<0.2
<0.2
<0.2
PMD (ps)
AWG
<0.5
<0.5
<0.5
Insertion Loss Uniformity (dB)
<1
<2
<1.8
Return loss (dB)
< -40
< -40
< -40
417006-2009-013-A01
6-33
XDM-40, 400, 450, 500, 1000, 2000,

ROADM Cards
ROADM modules for XDM-1000/XDM-450
(CCP cage)
Conn.
type
Width
(Slots)
Function/
Description
MO_ROADM8A
LC
Multi-degree optical
add/drop of any combination of channels (100GHz
spacing) to 9 ports. WSS in add position.
MO_ROADM8A_50
LC
spacing) to 9 ports. WSS in add position.
MO_ROADM8D
LC
spacing) to 9 ports. WSS in drop position.
MO_ROADM40
LC
100GHz spacing 2D PLC ROADM with forty Add/Drop

ports in East/West configuration. Any channel can be
dropped or passed through via management. Add/Drop
channels are automatically equalized. Can be used as
VMUX for OTM sites.
MO_ROADM2A
LC
100GHz spacing 2D WSS ROADM with Add/Drop ports

in East/West configuration. Requires external 40 Ch. Mux
and DeMux. Can be used as VMUX for OTM sites.
MO_ROADM2A_50
LC
50GHz spacing 2D WSS ROADM with Add/Drop ports in

East/West configuration. Requires external 80 Ch. Mux
and DeMux. Can be used as VMUX for OTM sites.
Module
ROADM modules
MO_ROADM8A 100 GHz spacing Multi

Degree configuration
Basecard type
ROADM8
Through
Drop
Local
MO_ROADM8A (dB) Add module
7.5
NA
7.5
MO_ROADM8A (dB) Drop module
11.5
11.5
9.5
MO_ROADM8A (dB) multi-degree Add

+ Drop module
19
<-40
PDL (dB)
At 0 dB Atten
<0.5
At 15 dB Atten
<1.3
PMD at 0 dB attenuation (ps)
6-34
Add
NA
<1
417006-2009-013-A01
XDM-40, 400, 450, 500, 1000, 2000,

MO_ROADM8A_50 50 GHz spacing Multi

Degree configuration
Basecard type
ROADM8A_50
Through
Drop
Local
Add
MO_ROADM8A_50 (dB) Add module
6.5
NA
6.5
6.5
MO_ROADM8A_50 (dB) Drop module
11.5
11.5
9.3
NA
MO_ROADM8A_50 (dB) multi-degree

Add + Drop module
18
<40
PDL (dB)
At 0 dB Atten
<0.5
At 15 dB Atten
<0.8
<0.5
MO_ROADM8D 100 GHz spacing

Multi-Degree configuration
Basecard type
ROADM8
Through
Drop
Add
MO_ROADM8D (dB) Drop module
NA
MO_ROADM8D (dB) Add module
14
NA
14
MO_ROADM8D (dB) multi-degree Add + Drop module
21
Adjacent isolation (dB):-
<-40
<-38
PDL (dB)
<0.45
PMD (ps)
<0.2
MO_ROADM40 2D ROADM 100 GHz spacing

with equalization
Basecard type
ROADM40
Through
Drop
Add
MO_ROADM40 (dB) Drop module
4.2
10.6
MO_ROADM40 (dB) Add module
8.5
6.6
12.7
10.6
6.6
MO_ROADM40 (dB) protected
169
Add + Drop module
MO_ROADM40 used as VMUX
169
10.6 - Demux 6.6 - Mux
<-23
<-20
PDL (dB)
<1
PMD (ps)
<0.5
For protected sites using two East/West cards, the through insertion loss should be doubled.
417006-2009-013-A01
6-35
XDM-40, 400, 450, 500, 1000, 2000,

MO_ROADM2A - 100 GHz spacing - 2D

ROADM with Equalization
Basecard type
MO_ROADM2A
Through
Local Drop Local Add
MO_ROADM2A (dB) Add module
8.7
N/A
9.2
MO_ROADM2A (dB) Drop module
9.0
3.0
N/A
MO_ROADM2A (dB) two degree Add + Drop module
14.5
Add module integrated channel isolation (dB):
35
PDL (dB)
At 0 dB Atten
0.5
At 15 dB Atten
0.85
0.5
MO_ROADM2A_50 - 50 GHz spacing - 2D

ROADM with Equalization
Basecard type
ROADM2A_50
Through
Local
Drop
Local Add
MO_ROADM2A_50 (dB) Add module
8.7
N/A
9.2
MO_ROADM2A_50 (dB) Drop module
6.0
5.0
N/A
Add module integrated channel isolation (dB):
11.5
35
PDL (dB)
At 0 dB Atten
0.5
At 15 dB Atten
0.85
DGD at 0 dB attenuation (ps)
0.5
DWDM OADM Cards and Modules

DWDM OADM cards (cards cage)
Card
Width
(slots)
XDM-2000 XDM-1000 XDM-500
Active OADM basecards for I/O slots
OADM4EW
OADM4EW_SW 1
6-36
Basecard for 1 active OADM

filter; east/west configuration
Basecard for 1 active OADM

filter; east/west configuration
with 2x2 switch OADM (Ready
Site)
417006-2009-013-A01
XDM-40, 400, 450, 500, 1000, 2000,

DWDM OADM plug-in filters for OADM cards

Module
OM_AD4RQEWxx
4-channel 100 GHz OADM filter with built-in equalization for

east/west configuration, 4 skip 0, 10 bands in C-band
OM_AD4RQEW_xx 4skip0 OADM for I/O

slots
Insertion Loss
Module type
OADM4EW
170
(dB)
Through
Drop
Add
<1.8
<3.3
<4.7
OADM4EW_SW 171 (dB)
<3.2
<4.0
<5.1
<-30
Non-adjacent isolation (dB):
<-40
PDL (dB)
<0.1
PMD (ps)
<0.2
4-channel active OADM basecard only (no

filters), 2 x 2 switch through I/O slots
Type of OADM site
Basecard + 2x2 switches
E/W unprotected
2.6
E/W protected both base cards with 2x 2 switches
5.2
DWDM components (CCP cage of

XDM-40/XDM-450/XDM-500/XDM-1000)
Module
Conn. type
Basecard for CWDM mux/demux/OADM modules
MO_CW2
NA
Basecard for up to two 4/8-channel CWDM

mux/demux/OADM modules; occupies one slot
4 Channel DWDM OADM module
OM_OADM4GEW_xx
170
171
LC
4-channel, 100 GHz DWDM OADM filter, 4skipe0, 10

channels in C-band
417006-2009-013-A01
6-37
XDM-40, 400, 450, 500, 1000, 2000,

OM_OADM4GEW_xx 4 skip 0 OADM for CCP

slots
Module type
Insertion Loss
Through
Drop
Add
OM_OADM4GEW (dB)
< 1.1
< 3.1
< 3.1
<-30
Non-adjacent isolation (dB)::
<-40
PDL (dB)
<0.1
PMD (ps)
<0.2
CWDM Mux/Demux/OADM Components

CWDM components (CCP cage)
Module
Conn.
type
Basecard for CWDM mux/demux/OADM modules
MO_CW2
NA
Basecard for up to two 4/8-channel CWDM

mux/demux/OADM modules; occupies one slot
4/8-Channel CWDM mux/demux modules
OM_CWMD4C
LC
4-channel CWDM mux/demux for 1511 nm,

1531 nm, 1551 nm, 157 nm, with built-in 1310
nm OSC filter
OM_CWM8C
LC
8-channel CWDM mux for 1471 nm, 1491 nm,

1511 nm, 1531 nm, 1551 nm, 1571 nm, 1591 nm,
1611 nm with built-in 1310 nm OSC filter
OM_CWD8C
LC
8-channel CWDM demux for 1471, 1491, 1511,

1531, 1551, 1571,1591, 1611 nm with built-in
1310 nm OSC filter
OM_CWMD4C_E
LC
Upgradeable 4-channel CWDM mux/demux for

1511 nm, 1531 nm, 1551 nm, 1571 nm with
built-in 1310 nm OSC filter
OM_CWMD4SL
LC
4-channel expansion CWDM mux/demux for

1471 nm, 1491 nm, 1591 nm, 1611 nm without
OSC filter
1/2-Channel CWDM OADM modules
6-38
OM_OADMC1AB_xx
LC
1-channel OADM for channel 1xx1nm, with

built-in 1310 nm OSC filter
OM_OADMC2AB_xxyy/Gzz
LC
2-channel OADM for channels 1xx1+

1yy1nm/1zz1 + 1(z+2)(z+2)1nm, with built-in
1310 nm OSC filter
417006-2009-013-A01
XDM-40, 400, 450, 500, 1000, 2000,

Mux/demux specifications
OM-CWMD4C
OM_CWM8C &
OM_CWD8C
OM_CWMD4C-E
OM_CWMD4SL
Insertion loss mux + < 4.2

demux (dB) 172
< 5.5
< 4.9
< 7.3
Return loss (dB)
< 40
< 40
< 40
< 40
Directivity (dB)
< 45
< 45
< 45
< 45
OADM specifications
Insertion loss
173
Module type
Through
Drop
Add
OM_OADMC1AB_xx 174
< 3.9dB
< 2.6dB
< 2.2dB
OM_OADMC2AB_xxyy/Gzz 175
< 4.4dB
< 3.2dB
< 3.2dB
Transponders
TRP25_2 basecards
Card
No. of
slots
TRP25_2C
Basecard for two 2.5 Gbps transponders with 3R (50 Mbps to 2.7
Gbps). Provides PM (for SDH/SONET, SONET, GbE),
OCH/UPSR 1+1 protection, and outband FEC.
TRP25_2CT
Add/Drop bidirectional transponder with tunable laser (add) and

noncolored laser (drop) with 3R (50 Mbps to 2.7 Gbps). Provides
PM (for SDH/SONET, SONET, GbE), OCH/UPSR 1+1
protection, and outband FEC.
TRP25_2CTR
Bidirectional regenerator with two tunable lasers with 3R (50

Mbps to 2.7 Gbps). Provides PM (for SDH/SONET, SONET,
GbE), OCH/UPSR 1+1 protection, and outband FEC.
172
174
xx designates the channel dropped by the OADM.
175
xx designates the group of two channels dropped by the OADM.
173
417006-2009-013-A01
6-39
XDM-40, 400, 450, 500, 1000, 2000,

Optical transmitters and receivers for

TRP25_2
Module
Description/Function
2.5 Gbps optical transmitters and receivers for TRP25_2
OMT25_Bxx
2.5 Gbps colored transmitter type B
OMT25_S3
2.5 Gbps 1310 nm short-haul transmitter type S3
OMT25_T
Optical module tunable transmitter for C band
OMR25C_A
Type A (APD) continuous receiver
OMR25C_P
Type P (PIN diode) continuous receiver
CHTR_B basecard Configurations

Card
No. of
slots
CMBR25_2
Basecard for two SFP data (GbE/FC/FICON) modules and 2.7 Gbps
line with G.709 FEC
TRP25_4
Basecard for 2 x 2.7 Gbps transponders with G.709 FEC
CMTR25
Multi rate combiner (STM-1/4, FC1/2, GbE) to 2.7 Gbps line with
G.709 FEC, or Dense transponder for 4 x 2.7 Gbps transponder with
G.709 FEC
CMBR10_T
Basecard for 4xSTM16 OTN combiner with G.709 FEC/EFEC
TRP10_2B
Basecard for 10.7 Gbps transponders with G.709 FEC/EFEC
TRP10_LAN
Basecard for 10.3 Gbps 10GbE LAN transponders with G.709

FEC/EFEC
CHTR_B basecard modules and transceivers

Module
CMBR25 modules
OMCD25_2
2.7 Gbps Client/line card with G.709 FEC for two SFP data
(GbE/FC/FICON) modules
CMTR25 modules
OMTR27_2
Line and client module for STM16/OTU1 services. CWDM and/or DWDM.
Supports on-board protection. Two modules fit on each CHTR_B base card
OMCM25_4
Line and client module for up to four services of STM1/4, FICON, FC100,
FC200, GbE to 2.7G combiner''''. CWDM and/or DWDM. Supports
on-board protection. Two modules fit on CHTR_B base card
2.7 Gbps optical cards for TRP25_4
OMTR27
2.7 Gbps Client/line card with G.709 FEC for STM-16 SFP transceiver
2.7 Gbps line transceivers for CMBR25 & TRP25_4
OTX27_AT
6-40
Tunable 2.7 Gbps transceiver, transmitter type B (with G.709 FEC) and
APD receiver
417006-2009-013-A01
Module
XDM-40, 400, 450, 500, 1000, 2000,

2.7 Gbps line transceivers for CMTR25
OTC25_PSxx
2.7 Gbps CWDM transceiver (with or without outband FEC), short haul
with PIN receiver
OTC25_ALxx
2.7 Gbps CWDM transceiver (with or without outband FEC), long haul
with APD receiver
OTR25_AVxx
DWDM SFP: 2.5/2.7G transceiver 2400 ps/nm, channel xx, LC connectors
OTR25_ABxx
10Gbps client side cards/transceivers for CMBR10, CMBR10_T, CMBR10_8D,

TRP10_2B/LAN
OMS16_4T
Client card for four SFP STM-16 modules with timing transparency for all
clients for CMBR10_T
OMSC16_4
Client card for four SFP STM-16 modules for CMBR10
OMTX10_S
Client card for STM-64/OC-192 XFP transceivers for TRP10_2B
OMTX10_LAN
Client card for XFP 10 GBE LAN transceivers for TRP10_LAN
OMCD_8
Line and client card for 8 x GbE/FC/FICON to 10.7G combiner for

CMBR10_8D
OTR103_SR
10G LAN 10GBASE-SR transceiver module, 850nm MM fiber, PIN

receiver, 300m
OTR103_LR
10G LAN 10GBASE-LR transceiver module, 1310nm , PIN receiver,

10Km
OTR103_ER
10G LAN 10GBASE-ER transceiver module, 1550nm , PIN receiver,

40Km
OTR103_ZR
10G LAN 10GBASE-ZR transceiver module, 1550nm , APD receiver,

80Km
OTR64_I3
STM-64/OC-192 client transceiver XFP, 1310nm short reach, 2km
OTR64_S5
STM-64/OC-192 client transceiver XFP, 1550nm short reach, 40km
OTR64_L5
STM-64/OC-192 client transceiver XFP, 1550nm long reach, 80km
10.7 Gbps line cards/transceivers for CMBR10, CMBR10_D, TRP10_2B/LAN
OMTX10
10.7 Gbps line card with G.709 FEC
OMTX10_S
10.7 Gbps Line card for XFP transceivers
OMTX10_EF
10.7 Gbps line card with G.709 FEC/EFEC
OTX10_ALxx
10.7 Gbps transceiver, colored transmitter type L (with G.709 FEC) and
APD receiver
OTX10_AT
Full C band tunable 10.7 Gbps transceiver, transmitter type L (with G.709
FEC/EFEC) and APD receiver
OTX10_ATR
FEC/EFEC) and APD receiver, RZ modulation.
Client SFP transceivers for CMBR25, CMBR10 & TRP25_4, CMTR25
OTGBE_SX
Optical GbE/FC/FICON transceiver, short reach, 850 nm multimode fiber
OTGBE_LX
Optical GbE/FC/FICON transceiver, long reach, 1310 nm single-mode fiber
OTGBE_ZX
Optical GbE/FC/FICON transceiver, very long reach, 1550 nm single-mode

fiber
OTGBE_S3BD
Bi-directional GbE SFP with 1310nm TX/1490nm Rx. Short Range (10km)
OTGBE_S5BD
417006-2009-013-A01
6-41
XDM-40, 400, 450, 500, 1000, 2000,

Module
OTGBE_L3BD
Bi-directional GbE SFP with 1310nm TX/1490nm Rx. Long Range (40km)
OTGBE_L5BD
Bi-directional GbE SFP with 1490nm TX/1310nm Rx. Long Range (40km)
OTR16_I3
STM-16/OC-48 transceiver, intra-office 1310 nm
OTR16_S3
STM-16/OC-48 transceiver, short-haul 1310 nm
OTR16_L3
STM-16/OC-48 transceiver, long-haul 1310 nm
OTR16_L5
OTC25_PSxx
2.7 Gbps CWDM transceiver (with or without outband FEC), short haul
with PIN receiver
OTC25_ALxx
2.7 Gbps CWDM transceiver (with or without outband FEC), long haul
with APD receiver
OTR25_AVxx
OTR25_ABxx
10.7 Gbps line XFP transceivers for OMTX10_S
OTR10_ASxx
40 Km DWDM color XFP
OTR10_ALxx
80 Km DWDM color XFP
AoC basecard configurations

Card
No. of
slots
AoC
Basecard for multirate combiner or ADM on Card (requires two cards)

supporting 8 SFP ports of GbE, FC1/2, FICON, STM-16, OTU1
AoC basecard modules and transceivers

Module
10.7 Gbps line cards/transceivers for AoC
OMTX10
10.7 Gbps line card with G.709 FEC
OMTX10_S
10.7 Gbps Line card for XFP transceivers
OMTX10_EF
10.7 Gbps line card with G.709 FEC/EFEC
OTX10_ALxx
10.7 Gbps transceiver, colored transmitter type L (with G.709 FEC) and APD
receiver
OTX10_AT
FEC/EFEC) and APD receiver
OTX10_ATR
FEC/EFEC) and APD receiver, RZ modulation.
Client SFP transceivers for AoC
6-42
OTGBE_SX
Optical GbE/FC/FICON transceiver, short reach, 850 nm multimode fiber
OTGBE_LX
Optical GbE/FC/FICON transceiver, long reach, 1310 nm single-mode fiber
OTGBE_ZX
Optical GbE/FC/FICON transceiver, very long reach, 1550 nm single-mode

fiber
OTGBE_S3BD
OTGBE_S5BD
417006-2009-013-A01
XDM-40, 400, 450, 500, 1000, 2000,

Module
OTR16_I3
STM-16/OC-48 transceiver, intra-office 1310 nm
OTR16_S3
STM-16/OC-48 transceiver, short-haul 1310 nm
OTR16_L3
OTR16_L5
OTC25_PSxx
2.7 Gbps CWDM transceiver (with or without outband FEC), short haul with
PIN receiver
OTC25_ALxx
2.7 Gbps CWDM transceiver (with or without outband FEC), long haul with
APD receiver
OTR25_AVxx
OTR25_ABxx
TRP10_4 basecard configurations

Card
No. of
slots
TRP10_4M
Multi-service dual 10G Transponder card for 10G LAN,

STM-64/OC-192 and FC10 services. Optimized for metro DWDM
Networks - 2 x XFP client and 2 x XFP line
TRP10_4R
Multi-service dual 10G Transponder card for 10G LAN,

STM-64/OC-192 and FC10 services. Optimized for LH DWDM
Networks, 2 x XFP client and 2 x XFP-EL line
TRP40_2B and CMBR40B configurations

Card
No. of
slots
TRP40_2B
40G DWDM tunable transponder card for STM-256/OC-768

services
CMBR40B
Multi-service 40G DWDM tunable combiner card for up to 4 XFP

clients for OTU2/10G LAN, STM-64/OC-192 services
TRP10_4 basecard transceivers

Module
10Gbps client side cards/transceivers for TRP10_4M and 4R
OTR103_SR
10G LAN 10GBASE-SR/FC10 transceiver module, 850nm MM fiber, PIN

receiver, 300m
OTR103_LR
10G LAN 10GBASE-LR/FC10 transceiver module, 1310nm , PIN receiver,

10Km
OTR103_ER
10G LAN 10GBASE-ER/FC10 transceiver module, 1550nm , PIN receiver,

40Km
OTR103_ZR
10 LAN 10GBASE-ZR/FC10 transceiver module, 1550nm , APD receiver,

80Km
OTR64_I3
STM-64/OC-192/10G LAN/FC10 client transceiver XFP, 1310nm short reach,

2km
417006-2009-013-A01
6-43
XDM-40, 400, 450, 500, 1000, 2000,

Module
OTR64_S5
STM-64/OC-192/10G LAN/FC10 client transceiver XFP, 1550nm short reach,

40km
OTR64_L5
STM-64/OC-192/10G LAN/FC10 client transceiver XFP, 1550nm long reach,

80km
Line/Client transceivers for TRP10_4M
OTC10_PSxx
40 Km CWDM XFP
OTC10_ALxx 80 Km CWDM XFP

OTR10_ASxx 40 Km DWDM color XFP
OTR10_ALxx 80 Km DWDM color XFP
OTR10_AT
80 Km DWDM 80 ch. tunable XFP
Line transceivers for TRP10_4R
OTR10_ELT
80 Km DWDM 80 channels tunable XFP-EL
OMCM25_4 STM-1/OC-3 SFP Optical

Transceivers
OTR1_S3BD 176
OTR1_S5BD 177
1480-1580
Tx: 1260-1360
Rx: 1480-1580
Tx: 1480-1580
Rx: 1260-1360
SLM
SLM
SLM
SLM
7.7
30
30

(dBm)
-15
-5
-5
-14
-14

(dBm)
-8
-8
-8
8.2
10
10
10
10

1*10-12) EOL (dBm)
-28
-34
-34
-28
-28
Min. overload (dBm)
-8
-10
-10
-8
-8
-25
OTR1_L3
OTR1_L5
S-1.1
L-1.1
L-1.2
1261-1360
1263-1360
Source type
MLM 179
Max. RMS width (nm)

ratio (dB)
APPLICATION CODE
178
OTR1_S3
TRANSMITTER
RECEIVER
176
The OTR1_S3BD can only operate opposite the OTR1_S5BD, and vice versa. Total link budget is according to
OTR1_S3BD parameters.
177
The OTR1_S3BD can only operate opposite the OTR1_S5BD, and vice versa. Total link budget is according to
OTR1_S3BD parameters.
178
179
6-44
417006-2009-013-A01
XDM-40, 400, 450, 500, 1000, 2000,

OTR1_S3BD 176
OTR1_S5BD 177
-20
-25
OTR1_S3
OTR1_L3
OTR1_L5
S-1.1
L-1.1
L-1.2
96

(dB)
APPLICATION CODE
178

Transceivers
OTR4_S3
OTR4_L3
OTR4_L5
S-4.1
L-4.1
L-4.2
1274-1356
1280-1335
1480-1580
Source type
MLM 181
SLM
SLM
Max. RMS width (nm)
4/2.5
<1
30
30
-15
-3
-3
TRANSMITTER
-8
+2
+2
8.2
10
10
-28
-28
-28
Min. overload (dBm)
-8
-8
-8
-14
-27
RECEIVER
74
20
24
-25
-27
180

181
417006-2009-013-A01
6-45
XDM-40, 400, 450, 500, 1000, 2000,

OMCM25_4 & AoC GbE/FC1 SFP

Transceivers
OTGBE_SX
OTGBE_LX
OTGBE_ZX
OTGBE_S3
BD
OTGBE_S5
BD
OTGBE_L3
BD
OTGBE_L5
BD
Transmitter
type
GbE/FC/FIC
ON
short-reach
laser, 850
nm,
multimode
GbE/FC/FIC
ON
long-reach
laser, 1310
nm, single
mode
GbE/FC/FIC
ON very
long-reach
laser, 1550
nm, single
mode
Bidirection
al SFP,
1310 nm
Bidirection
al SFP,
1490 nm
Bidirection
al SFP,
1310 nm e
Bidirection
al SFP,
1490 nm
Data rate
(nominal)
(MBaud)
1250
1250
1250
1250
1250
1250
1250
Average
launch power
(dBm)
-3 Max.
-3
-3 Max.
-3
+2
+2
-9.5 Min.
-11
-10 Min.
-10
-5
-5
Min.
transmitter
extinction
ratio (dB)
>9
>9
>9
>9
Data format
8B/10B
8B/10B
8B/10B
8B/10B
8B/10B
8B/10B
8B/10B
Average
receiver
sensitivity
(dBm)
-20 Min.
-22
--
< -21
< -21
< -23
< -23
-21 Typical
-25.5
-22
< -22
< -22
< -24
< -24
Max. receiver
overload
(dBm)
-3
-3
Typical Rx
LOS level
(dBm)
-24
-29
-25
-35
-35
-33
-33
Connector
LC
LC
Fiber lengths
550 m
10 km
(50/62.5 m (9 m SMF)
MMF)
LC
LC
LC
LC
LC
80 km
(9 m SMF)
10 km
(9 m
SMF)
10 km
(9 m
SMF)
40 km
(9 m
SMF)
40 km
(9 m
SMF)
OMCM25_4 & AoC FC2G client SFPs

OTR16_MM
OTR16_I3
OTR16_S3
OTR16_L3
OTR16_L5
FC-200M5/6-SN-1
I-16
S-16.1
L-16.1
L-16.2
830-860
1260-1360
1260-1360
1280-1335
1500-1580
Source type
MM
SLM
SLM
SLM
SLM
<1
Max. RMS width (nm)
0.85
30
30
30
-9.5
-10
-5
-2
-2
-2.5
-3
+3
+3
TRANSMITTER
182
6-46
417006-2009-013-A01
XDM-40, 400, 450, 500, 1000, 2000,

OTR16_MM
OTR16_I3
OTR16_S3
OTR16_L3
OTR16_L5
8.2
8.2
8.2
8.2

1*10-12) EOL (dBm)
-13
-16
-18
-27
-28
Min. overload (dBm)
-9
-9
-27
-27
-27
-27
-27
1600

(dB)
-24
-24
-24
-24
-24
-27
-27
-27
-27
-27
<1
RECEIVER
10 Gbps Optical Client XFP Transceivers for

Transponders and CMBR40B
Transceiver
OTR64_I3
OTR64_S5/
OTR103_ER
OTR64_L5/
OTR103_ZR
OTR103_SR
OTR103_LR
Application code
I-64.1
P1I1_2D1
VSR2000_2R1
1200-SM-LL-I
S-64.2b
P1S1_2D2b
10GBASE-ER
1200-SM-LL-V
L-64.2a
P1L1-2D2
10GBASE-SR
10GBASE-LR
1200-SM-LL-L
Source type
SLM
SLM
SLM
MLM
SLM
Modulation
External
External
External
Direct
Direct
Operating output
wavelength (nm)
1290-1330
1529-1560
1530-1565
840-860
1290-1330
Direct max. -20 dB width

(nm)
<1
<1
<1
NA
<1
Min. side mode suppression 30

ratio (dB)
30
30
NA
30

(dBm)
-6
-1
-4
-8.2

(dBm)
-1
+2
+4
-1
+0.5
8.2
11
22
11
6.6
800
1600
NA
6.6
Minimum optical return loss 24

(dB)
24
24
12
12
Maximum discrete
reflectance
-27
-27
-27
-27
-27
30
30
30
30
30
-14
-24
-11
Stressed (-7.5)
-12.6
Maximum DGD (ps)
Sensitivity (BER of 1*10 ) -11

(dBm)
-12
417006-2009-013-A01
6-47
XDM-40, 400, 450, 500, 1000, 2000,

Transceiver
OTR64_I3
OTR64_S5/
OTR103_ER
OTR64_L5/
OTR103_ZR
OTR103_SR
OTR103_LR
Min. overload (dBm)
-1
-1
-7
-1
-1
Maximum optical path

penalty
3.9
(Transmitter
and dispersion
penalty)
<3
<3
<3
<3
<3
AoC/OMTR27_2 STM-16/OTU1 client

CWDM
OTC25_1P
Sxx
DWDM
OTR16_I OTR16_
3
S3
OTR16_
L3
OTR16_
L5
OTC25_1A
Lxx
OTR25_Av
xx
OTR25_ABxx
I-16
S-16.1
L-16.1
L-16.2
DW100S1
D2/5(C)
DW100S1
A2/5(C)
DW100L-1D2/5(C)F
DW100C-1A2/5(C)F
G.698.1/.2
1260-13
60
1260-13
60
1280-13
35
1500-15
80
Source type
SLM
SLM
SLM
SLM
SLM
SLM
SLM
SLM
<1
0.4
0.4
1464-1618 1464-1618 15300-156 1530-1565

5
TRANSMITTER
Max. RMS width (nm)

(dB)
30
30
30
30
30
30
30

(dBm)
-10
-5
-2
-2

(dBm)
-3
+3
+3
+5
+5
8.2
8.2
8.2
8.2
8.2
8.2
8.2
8.2
-16
-18
-27
-28
-21.5
(-23 GbE)
-28
(-32 GbE)
-28
-28
RECEIVER

1*10-12) EOL (dBm)
Min. overload (dBm)
-9
-9
-7
-9
-9
-27
-27
-27
-27
-27
-27
-27
-27
1600
800
(40 km
G.652)
1600
(80 km
G.652)
2400
(120 km
G.652)
3600
(180 km
G.652)

cable (dB)
-24
-24
-24
-24
24
24
-24
-24
-27
-27
-27
-27
-27
-27
-27
-27
1.5
2.5
<3
<2
Max. optical path penalty (dB) <1
183
6-48
417006-2009-013-A01
XDM-40, 400, 450, 500, 1000, 2000,

TRP10_4 CWDM OTU2 Line/Client

STM-64/10G LAN/FC10/OTU2 XFP Optical
Transceivers and CMBR40B Client
Transceivers
Transceiver
OTC10_PSxx
184
OTC10_ALxx
185
Application code
Source type
SLM
SLM
Modulation
NRZ
NRZ
1465-1617
1465-1617
Central wavelength (nm)
1471 + 20m
m=0 to 7
1471 + 20m
m=0 to 7
Maximum central frequency

deviation (nm)
6.5
6.5
<1
<1

(dB)
30
30
8.2
8.2
S-band, C-band -16

L- band -15
S-band, C-band -23

L- band -21
Min. overload (dBm)
-1
-7
800
1400
Transmitter
Receiver
Optical Path

Maximum DGD (ps)
184
185
CWDM client in TRP10_4/CMBR40 also supports 10GbE LAN and STM-64.

417006-2009-013-A01
6-49
XDM-40, 400, 450, 500, 1000, 2000,

TRP10_4R OTU2/OTU2e/OTU2f Optical

Transceivers
OTR10_ELT
OTR10_AT 186
Source type
SLM
SLM
Modulation
External, NRZ
External, NRZ
1529-1561
1529-1560
192.1 + 0.1m
m=0 to 39
192.05 + 0.05m
m=0 to 79
Maximum central frequency deviation

(GHz)
12.5
2.5
Transceiver
Application code
Transmitter
<1
40
35
-1
+3
12
-24
-24
Min. overload (dBm)
-5
-7
-27
-27
Maximum DGD (ps)
30
30
Receiver
Optical Path
186
1440
1440
<3
Not supported in CMBR40.
6-50
417006-2009-013-A01
XDM-40, 400, 450, 500, 1000, 2000,

TRP10_4 OTU2/OTU2e Line, STM-64/10G

LAN/FC10 Client, AoC, CMBR10,
TRP10_LAN, TRP10_2B, OTU2 XFP Line
Transceivers and CMBR40B Client
Transceivers
Transceiver
OTR10_ALxx
Application code
1L1-2D2F
Source type
SLM
187
OTR10_ASxx
188
SLM
Modulation
External, NRZ
1529-1560
1529-1560
192.1 + 0.1m
m=0 to 40
192.1 + 0.1m
m=0 to 40
12.5
12.5
<1
<1
30
30
-1
Transmitter
+3
8.2
-24
-24
Min. overload (dBm)
-8
-8
-27
-27
Maximum DGD (ps)
30
30
1600
800
<3
Receiver
Optical Path
187
188

417006-2009-013-A01
6-51
XDM-40, 400, 450, 500, 1000, 2000,

AoC, CMBR10, TRP10_LAN, TRP10_2B, OTU2

Line Transceivers
Transceiver
OTX10_AT
Application code
1L1-2D2F
Source type
SLM
SLM
1529-1560
1527-1567
192.05 + 0.05m
m=0 to 79
192.05 + 0.05m
m=0 to 79
2.5
<1
<1
Modulation
External, NRZ
External, RZ
Spacing (GHz)
50
50
1600
400
40
40
+4
+1
+6
+4
10
12
Sensitivity (BER of 1*10 ) (dBm)
-25
-24
Min. overload (dBm)
-8
-4
<3
<3
-12
6-52
OTX10_ATR
417006-2009-013-A01
XDM-40, 400, 450, 500, 1000, 2000,

STM-16/OTU1 Optical SFP Line Transceivers

for OMTR27_2 & OMCM25_4
DWDM line transceivers
Continuous client transceivers 189
OTC25_1ALxx
G.695 191
OTR25_AVx
x
OTR25_AB
xx
OTR16_I3
OTR16_S3
OTR16_L3
OTR16_L5
L-16.2
CWDM line transceivers

OTC25_1PSxx
G.695
190
Application code
S-C8S1-1D2/5
S-C8L1-1D2/5
DW100S1D2/5(C)
DW100S1A2/5(C)
DW100L-1D2/5(C)F
DW100C-1A2/5(C)F
G.698.1/.2
P1I_1D1
P1S1_1D1
P1L1_1D1
Source type
SLM
SLM
SLM
SLM
SLM
SLM
SLM
SLM
Operating output
wavelength (nm)
1464-1618
1464-1618
1530-1565
1530-1565
1285-1330
1285-1330
1280-1335
1500-1580
Spacing (nm)
20
20
100
100
NA
NA
NA
NA
Minimum side mode

suppression ratio
(dB)
30
30
30
30
30
30
30
30
Mean launched
power (min.) (dBm)
-9.5
-5
-2
-2
Mean launched
power (max.) (dBm)
+5
+5
-3
+3
+3

(dB)
8.2
8.2
8.2
8.2
8.2
8.2
8.2
8.2
Sensitivity (BER of
1*10-12) (dBm)
-21.5
(-23 GbE)
-28
(-32 GbE)
-28
-28
-18
(-22 GbE)
-18
(-22 GbE)
-27
(-30 GbE)
-28
(-30 GbE)
Max. dispersion
(ps/nm)
800
(40 km G.652)
1600
(80 km G.652)
2400
(120 km
G.652
3600
(180 km
G.652)
1600
Max. optical path

penalty (dB)
1.5
2.5
<3
<2
<3
<1
OCH switching time

(ms)
<3
<3
<3
<3
<3
<3
<3
<3
189
190
191
Continuous transceiver (50 Mbps to 2.7 Gbps) including STM16 and OTU1.
Continuous transceiver (100 Mbps to 2.7 Gbps), xx designates the transceiver's wavelength in nm.
Continuous transceiver (100 Mbps to 2.7 Gbps), xx designates the transceiver's wavelength in nm.
417006-2009-013-A01
6-53
XDM-40, 400, 450, 500, 1000, 2000,

TRP25_2 2.5 Gbps optical

transmitters/receivers for transponders,
and transceivers for combiners
Each TRP25_2 basecard can accommodate any combination of two optical
transmitters and receivers.
OMT25_T
+
OMR25C_A/
[OTX27_AT] 192
Source type
SLM
1529-1560
<1
Modulation
EA 193
Spacing (GHz)
100
3400
(200 km)
[>18000/1000 km]
30
+. 05 [+5.5]
+5 [+7]
8.2
Sensitivity (BER of 1*10-12) (dBm) 194
-30
Min. overload (dBm)
-8
OCH switching time (msec)
<3
TRP40_2B, CMBR40B Line Transceiver

Transceiver
Application code
P1S1-3C2
P1S1-3C3
P1S1-3C5
Source type
SLM
1529-1560
192.05 + 0.05m
m=0 to 79
2.5
<1
Modulation
RZ-DQPSK
Spacing (GHz)
50
1200
40
192
Data between square brackets corresponds to transceiver [OTX27_AT].

EA: External Absorption.
194
Including typical FEC improvement of 2 dB for nonamplified networks. For amplified networks, an FEC
improvement of over 4 dB is typical.
193
6-54
417006-2009-013-A01
XDM-40, 400, 450, 500, 1000, 2000,

Transceiver
+2
+4
13
-18
Min. overload (dBm)
-7
<3
TRP40_2B Client Transceiver

Transceiver
Application code
VSR2000-3R2
VSR2000-3R3
VSR2000-3R5
Source type
SLM
Modulation
External
1530-1565
Direct max. -20 dB width (nm)
<1
35
+3
8.2
40
Minimum optical return loss (dB)
24
-27
Maximum DGD (ps)
7.5
-6
Min. overload (dBm)
+3
<3
417006-2009-013-A01
6-55
XDM-40, 400, 450, 500, 1000, 2000,

Optical Amplifiers
Card/Module
Width Function/Description
(slots)
IO Cards cage
OFA2_I29I29C
Two inline amplifiers with a gain of 29 dB for the C band in a

single-slot card
OFA2_I29C
One inline amplifier with a gain of 29 dB for the C band in a

single-slot card
OFA2_I23I23C
Two inline amplifiers with a gain of 23 dB for the C band in a

single-slot card
OFA2_I23C
One inline amplifier with a gain of 23 dB for the C band in a

single-slot card
OFA2_I23I29C
Two inline amplifiers with a gain of 23 dB and 29 dB for the C

band in a single-slot card
OFA_RM
High-power 500 mW RAMAN amplifier for long spans, reverse

pumped configurations
OFA_HRM
High-power 700 mW RAMAN amplifier for long spans, in

reverse pumped configurations
MO_BAC
Optical booster for the C band
MO_PAC
Optical preamplifier for the C band
MO_BAS
Single-channel optical booster for the C band
MO_PAS
Single-channel optical preamplifier for the C band
MO_OFA_PHBC
High-power dynamic booster and pre-amplifier in E/W

configuration for extended long-haul metro applications.
Optimized for ROADM sites.
MO_OFA_HBC
High-power dynamic booster for extended long-haul metro

applications.
MO_OFA_PC
15 dBm dynamic gain pre-amp amplifier. CCP Card
MO_OFA_FBC
20 dBm fixed gain booster
MO_OFA_M
High-power dynamic multistage amplifier for extended

long-haul and metro applications
MO_OFA_MH
High power (23 dBm) regional amplifier for high capacity

applications
MO_OFA_MHe
High power (23 dBm) regional amplifier for high capacity

applications, E/W configuration
MO_OFA_FHBC
High power (21 dBm) fixed gain booster amplifier with built-in
output OSC filter
CCP Module cage
Rack Mounted
Height
6-56
RM_OFA_VHB
2 RU
Very High-power fixed booster for long single span applications
RM_OFA_HBR
2 RU
High-power 1 W RAMAN amplifier for long span, in reverse

pumped configuration
RM_OFA_FBR
2 RU
High-power 1 W RAMAN amplifier for long span, in forward

pumped configuration
417006-2009-013-A01
XDM-40, 400, 450, 500, 1000, 2000,

OFAs for single channel and DWDM

applications
OFA2_I23C/
OFA2_I23I23C
(Inline) 195
OFA2_I29C/
OFA2_I29I29C
(Inline) 196
Max. total power (dBm)
+16
+16
Gain (dB)
Typ. 21 197
Typ. 27 198
Spectrum (nm)
1529-1561
1529-1561
Gain flatness (dB)
< 1
< 1
199
< 6 200
Noise figure (dB)
<6
In/out isolation (dB)
> 40
> 40
Return loss (dB)
< 40
< 40
13
(for OFA2_
I23C)
13
(for OFA2_I29C)
Power consumption of two amplifiers (Watt)
21
(for OFA2_
I23I23C)
21
(for OFA2_
I29I29C)
RAMAN and very high power EDFA

amplifiers
OFA_RM 201
OFA_HRM 202
RM_OFA_HBR/FBR
RM_OFA_VHB
Max. total power (dBm)
+27
+28.5
+30
+30
Gain (dB)
6-15 203
10-20 204
10-20 205
14-24
Spectrum (nm)
1529-1561
1529-1561
1529-1564
1536-1562
Gain flatness (dB)
< 0.6
< 0.65
< 1
< 0.75
Noise figure (dB)
< -0.5
< -1.5
<0
<9
> 40
> 40
> 40
> 45
Return loss (dB)
< 40
< 40
< 40
< 40
195
Inline amplifiers can be accommodated in XDM-400 shelves functioning as pure inline sites. When installed in
XDM-500, XDM-1000, and XDM-2000 shelves, the site can be upgraded to a fully functional OADM site.
Inline amplifiers can be accommodated in XDM-400 shelves functioning as pure inline sites. When installed in
XDM-500, XDM-1000, and XDM-2000 shelves, the site can be upgraded to a fully functional OADM site.
197
Rating does not include the attenuation introduced by the built-in VOA.
198
Rating does not include the attenuation introduced by the built-in VOA.
199
Does not include the effect introduced by the built-in VOA.
200
Does not include the effect introduced by the built-in VOA.
201
202
203
Depends on type of fiber. Actual gain is heavily dependent on splice quality and actual attenuation of fiber and
can be drastically affected.
204
205
196
417006-2009-013-A01
6-57
XDM-40, 400, 450, 500, 1000, 2000,

CCP cage OFAs DWDM applications

MO_OFA_FBC
(Booster)
MO_OFA_PHBC/
MO_OFA_HBC
(Booster)
MO_OFA_PHBC
MO_OFA_PC
(Pre-amp)
MO_OFA_MH
MO_OFA_M
MO_OFA_FHBC
MO_OFA_MHe
Max. total power

(dBm)
+20
+20
+15
+23
+20
+21
+23
Gain (dB)
10 to 25
10 to 25
12-27
17-41
17-39
10-23
17-40
Spectrum (nm)
1529-1561
1529-1561
1529-1561
1529-1561
1529-1561
1529-1561
1529-1561
Gain flatness (dB)
< 0.75
< 0.6
< 0.6
< 0.75
< 0.75
< 0.5
< 0.5
Noise figure (dB)
< 6.5 Gain 25

< 14 Gain >17
< 21 Gain 10
<9
Gain >17
<6
Gain >19
<7
Gain >26
< 6.5
Gain >25
< 6.5 Gain 23

< 12.5 Gain >17
< 19.5 Gain 10
< 6.3 Gain >30

< 6.9 Gain >26
< 13.5 Gain >17
In/out isolation
(dB)
> 30
> 40
> 40
> 40
> 40
> 40
> 40
Return loss (dB)
> 45
< 40
< 40
< 40
< 40
< 45
< 45
CCP cage OFAs for single-channel

applications
6-58
MO_BAS
(Booster)
MO_PAS
(Preamplifier)
MO_BAC
(Booster)
MO_PAC
(Preamplifier)
Max. total power

(dBm)
+15
+12
+17
+12
Gain (dB)
Up to 16
Up to 30
Up to 18
Up to 32
Spectrum (nm)
1529-1561
1529-1561
1529-1561
1529-1561
Output power
deviation (dB)
< 1
< 5.5 at Pin 38 dBm

< 2.5 at Pin 26 dBm
< 1.0 at Pin 14 dBm
< 1
< 1
Noise figure (dB)
< 6.5
< 5.5
<9
< 5.5
> 40
> 40
> 40
> 40
Return loss (dB)
< 40
< 40
< 40
< 40
417006-2009-013-A01
XDM-40, 400, 450, 500, 1000, 2000,

Optical Auxiliary Cards and Modules

Card/Module
Cards cage cards
AUX-2I
Auxiliary basecard installed in a single I/O slot. Each basecard

accommodates any two of the modules listed below.
AUX-2X
Auxiliary basecard installed in either the X1 or X2 slot. Each

basecard accommodates any two of the modules listed below.
Modules
OM_4SP50
Four 50/50 splitters
OM_2COSC5
2 x C band/OSC filters (mux + demux) for the 1510 nm

supervisory channel
OM_2COSC5_RB

supervisory channel, and 2 x red/blue filters
OM_2COSC5_SP95

supervisory channel, and 2 x 95/5 splitters
OM_2LCOSC5
2 x C/L/T filters (mux + demux) for the 1510 nm supervisory

channel, including provision for the L band
OM_2SP95
2 x 95/5 splitters
OM_2RB
2 x red/blue filters
OM_2VOA
2 x controlled variable optical attenuators for OADM-V

implementation
OM_2COSC3

supervisory channel
OM_2COSC3_RB

supervisory channel, and 2 x red/blue filters
OM_2COSC3_SP95

supervisory channel, and 2 x 95/5 splitters
CCP module cage modules (single slot)
MO_ACC6CP
Six couplers
MO_ACC6SP50
Six 50/50 splitters
MO_ACC6SP95
MO_ACC4COSC5
Six 95/5 splitters

206
MO_ACC6CPSP
Six 50/50 splitters + six 50/50 couplers, Single-mode fiber
MO_ACC6CPSP5
Six 50/50 splitters + six 50/50 couplers, multi-mode fiber 50 m
MO_ACC6CPSP6
MO_ACC4CLOSC5
206
207
Four C/T filters
Six 50/50 splitters + six 50/50 couplers, multi-mode fiber 62.5 m

207
Four C/L/T filters
MO_ACC4COSC3
Four supervisory 1310 nm modules
MO_ACC4RB
Four red/blue filters

417006-2009-013-A01
6-59
XDM-40, 400, 450, 500, 1000, 2000,

Optical Auxiliary Cards for XDM-450

Card/Module
ACC4COSC5
Four C/T filters
DCF/DCM Units
Unit
DCF-40-LF
Dispersion compensation fiber for 160 ps/nm (40km LEAF)
DCF-80-LF
DCF-120-LF
DCF-40-TW
Dispersion compensation fiber for 180 ps/nm (40km TrueWave)
DCF-80-TW
DCF-120-TW
MO_DCM-Lxx
Single-channel dispersion compensation module for 700 ps/nm for

channel "xx" for modules cage
MO_DCM-Vxx

MO_DCM-Xxx

Rack Mounted Single Channel DCM Units
6-60
Unit
RM_DCM2
Rack-mounted tray for up to two single-channel dispersion compensation

modules as detailed below
DCM-Lxx

channel "xx" for rack-mounted tray
DCM-Vxx

DCM-Xxx

417006-2009-013-A01
XDM-40, 400, 450, 500, 1000, 2000,

Auxiliary Cards and Miscellaneous Accessory

Modules
Module type
Insertion loss (dB)
OM_ACC4SP50/ MO_ACC6SP50
OM_ACC2SP95/ MO_ACC4SP95
0.65
OM_2RB/ MO_ACC4RB
Mux
Red 0.7
Blue 1.2
Demux
Red 1.2
Blue 0.7
OM_2COSC3/ MO_ACC4COSC3
Mux/demux
C band 1.2
OSC 1310 nm 1.2
OM_2COSC5/ MO_ACC4COSC5
Mux
C band 0.6
OSC 1510 nm 0.9
Demux
C band 0.9
OM_2LCOSC5/MO_ACC4CLOSC5
Mux/demux
C band 1.1
DCF-40-LF
4.8
DCF-80-LF
6.5
DCF-120-LF
8.2
DCF-40-TW
DCF-80-TW
DCF-120-TW
MO_DCM_L_xx/ DCM_L_xx
3.5
OSC 1510 nm 1.7

L band 1.6
OSC 1510 nm 2.0
MO_DCM_V_xx/ DCM_V_xx
MO_DCM_X_xx/ DCM_X_xx
Other Optical Cards

Card
No. of
slots
OPM
Optical performance monitoring card for four fiber monitoring points
OMSP
Optical MS protection card
OPM card specifications

Wavelength range ............................................................................................... 1529-1562 nm
Power range............................................................................................................ -50 to +5 dB
OSNR range ............................................................................................................... 0 to 30 dB
OMSP card specifications

Insertion loss through two cards ..................................................................................... < 3 dB
Switching time ................................................................................................................ < 4 ms
417006-2009-013-A01
6-61
XDM-40, 400, 450, 500, 1000, 2000,

C Band Channel Frequencies and

Wavelengths (ITU-T Rec.
G.694.1 for DWDM)
ITU-T
channel
number
Sub-band
Blue
Channel
center
frequency
(THz)
Channel
200 GHz
center
channel
wavelength spacing
(nm)
Red
8ch.
20.5
192.05
1561.01
21
192.10
1560.61
21.5
192.15
1560.20
22
192.20
1559.79
22.5
192.25
1559.39
23
192.30
1558.98
23.5
192.35
1558.58
24
192.40
1558.17
192.45
1557.77
192.50
1557.36
192.55
1556.96
192.60
1556.55
192.65
1556.15
192.70
1555.75
192.75
1555.34
192.80
1554.94
1554.54
24.5
25
25.5
26
26.5
27
27.5
28
28.5
192.85
29
192.90
1554.13
29.5
192.95
1553.73
30
193.00
1553.33
30.5
193.05
1552.93
31
193.10
1552.52
31.5
193.15
1552.12
32
193.20
1551.72
32.5
193.25
1551.32
33
193.30
1550.92
33.5
193.35
1550.52
34
193.40
1550.12
6-62
16ch.
100 GHz channel

spacing
50 GHz channel spacing
16ch.
40ch.
32ch.
40ch.
80ch. interleaved
417006-2009-013-A01
ITU-T
channel
number
Sub-band
Blue
Channel
center
frequency
(THz)
XDM-40, 400, 450, 500, 1000, 2000,

Channel
200 GHz
center
channel
wavelength spacing
(nm)
Red
8ch.
34.5
193.45
1549.72
35
193.50
1549.32
35.5
193.55
1548.91
36
193.60
1548.51
36.5
193.65
1548.11
37
193.70
1547.72
37.5
193.75
1547.32
38
193.80
1546.92
38.5
193.85
1546.52
39
193.90
1546.12
39.5
193.95
1545.72
40
194.00
1545.32
40.5
194.05
1544.92
41
194.10
1544.53
41.5
194.15
1544.13
42
194.20
1543.73
42.5
194.25
1543.33
43
194.30
1542.94
43.5
194.35
1542.54
44
194.40
1542.14
44.5
194.45
1541.75
45
194.50
1541.35
45.5
194.55
1540.95
46
194.60
1540.56
46.5
194.65
1540.16
194.70
1539.77
194.75
1539.37
1538.98
47
47.5
48
194.80
48.5
194.85
1538.58
49
194.90
1538.19
49.5
194.95
1537.79
50
195.00
1537.40
50.5
195.05
1537.00
51
195.10
1536.61
417006-2009-013-A01
16ch.
100 GHz channel

spacing
16ch.
40ch.
32ch.
40ch.
80ch. interleaved
6-63
XDM-40, 400, 450, 500, 1000, 2000,

ITU-T
channel
number
Sub-band
Blue
Channel
center
frequency
(THz)
Channel
200 GHz
center
channel
wavelength spacing
(nm)
Red
8ch.
51.5
195.15
1536.22
52
195.20
1535.82
52.5
195.25
1535.43
53
195.30
1535.04
53.5
195.35
1534.64
54
195.40
1534.25
54.5
195.45
1533.86
55
195.50
1533.47
55.5
195.55
1533.07
56
195.60
1532.68
56.5
195.65
1532.29
57
195.70
1531.90
57.5
195.75
1531.51
58
195.80
1531.12
58.5
195.85
1530.72
59
195.90
1530.33
59.5
195.95
1529.94
60
196.00
1529.55
6-64
16ch.
100 GHz channel

spacing
16ch.
40ch.
32ch.
40ch.
80ch. interleaved
417006-2009-013-A01
XDM-40, 400, 450, 500, 1000, 2000,

CWDM Frequencies and

Wavelengths (ITU-T Rec.
G.694.2 for CWDM)
spacing of 20 nm
4-channel
system
8-channel
system
1471
1491
1511
1531
1551
1571
1591
1611
XDM-40 .......................................................... 256 x 447 x 285 mm (10.08 x 17.60 x 11.22 in)
XDM-400 ........................................................ 500 x 450 x 285 mm (19.68 x 17.72 x 11.22 in)
XDM-450 ........................................................ 374 x 492 x 275 mm (14.72 x 19.37 x 10.82 in)
XDM-500 ........................................................ 725 x 450 x 285 mm (28.54 x 17.72 x 11.22 in)
XDM-1000 .................................................... 1100 x 450 x 285 mm (43.31 x 17.72 x 11.22 in)
XDM-2000 ...................................................... 775 x 450 x 285 mm (30.51 x 17.72 x 11.22 in)
XDM-3000 ......................................................... 1550 x 450 x 285 mm (61 x 17.72 x 11.22 in)
MECP ...................................................................... 120 x 50 x 225 mm (4.72 x 1.97 x 8.86 in)
xMCP .................................................................... 265 x 25 x 225 mm (10.43 x 0.98 x 8.86 in)
HLXC192/384/768, XIO, SIO, PIO, DIO, ACP1000, ATS and cards cage mux/demux,
OADM, transponder, OFA, OPM, DIOB,
MCS5, MCS10 ...................................................... 415 x 25 x 225 mm (16.34 x 0.98 x 8.86 in)
Modules cage connection modules (electrical), mux/demux, OADM, OFA
............................................................................... 265 x 40 x 175 mm (10.43 x 1.57 x 6.89 in)
HLXC1536 .......................................................... 550 x 48 x 255 mm (21.65 x 1.89 x 10.04 in)
ACP3000 ................................................................ 116.5 x 38 x 220 mm (4.59 x 1.5 x 8.66 in)
417006-2009-013-A01
6-65
XDM-40, 400, 450, 500, 1000, 2000,


PRAP (optional) .................................................. 133 x 445 x 185 mm (5.24 x 17.53 x 7.29 in)
XDM-400 heat buffer....................................... 44.5 x 412 x 285 mm (1.75 x 16.22 x 11.22 in)
Heat buffer ........................................................ 125 x 450 x 285 mm (4.92 x 17.72 x 11.22 in)
Racks ........................................2200/2600 x 600 x 300 mm (86.61/102.36 x 23.62 x 11.81 in)
...................................................................................... 2134 x 584 x 305 mm (82 x 23 x 12 in)
Weight
XDM-40 ......................................................................................................... 7.5 kg (16.54 lbs)
XDM-40 fully populated ................................................................................. 16 kg (35.28 lbs)
XDM-400 ........................................................................................................ 17 kg (37.48 lbs)
XDM-400 fully populated ............................................................................... 35 kg (77.16 lbs)
XDM-450 .......................................................................................................... 11.8 kg (26 lbs)
XDM-450 fully populated ............................................................................... 19 kg (41.85 lbs)
XDM-500 ........................................................................................................ 20 kg (44.09 lbs)
XDM-500 fully populated ............................................................................. 50 kg (110.23 lbs)
XDM-1000 ...................................................................................................... 25 kg (55.12 lbs)
XDM-1000 fully populated ........................................................................... 70 kg (154.32 lbs)
XDM-2000 ...................................................................................................... 20 kg (44.09 lbs)
XDM-2000 fully populated ........................................................................... 50 kg (110.23 lbs)
XDM-3000 .................................................................................................... 50 kg (110.23 lbs)
XDM-3000 fully populated .............................................................................. 180 kg (284 lbs)
Floor Loading
Floor loading of fully equipped rack ....................................................................... 7.35 kn/m2
Power
Power requirements
Applicable specifications ............................................................ ETSI 300 132-2; FTZ 19FS1
Input voltage ......................................................................................... -40 V DC to -75 V DC
Nominal power source .................................................................. -60 V or -48 V BTNR 2511
6-66
417006-2009-013-A01
XDM-40, 400, 450, 500, 1000, 2000,

Power Supply Lines Surge Voltage

Applicable specification .............................................................................. EN61000-4-5:1996
Line to line maximum surge voltage ............................................................................... 2000 V
Line to ground maximum surge voltage ......................................................................... 4000 V
Power consumption
XDM-40 ................................................................................ Typical 380 W, maximum 450 W
XDM-400 .............................................................................. Typical 500 W, maximum 800 W
XDM-1000 .................................................................... Typical 1200 W, maximum 1800 W 208
XDM-2000 ........................................................................ Typical 1200 W, maximum 2000 W
XDM-3000 ........................................................................ Typical 3300 W, maximum 4300 W
208
Depending on shelf revision.
417006-2009-013-A01
6-67
XDM-40, 400, 450, 500, 1000, 2000,

Main equipment power consumption

NOTE: The listed power requirements do not include the
power required by modules that may be installed on the card.
Type
Component
Power requirements
Common cards
xMCP
40 W
PDH cards
6-68
xMCP-B
20 W
MECP
15 W
MECP_OSC
20 W
HLXC192/HLXC384
90 W
HLXC768
140 W
HLXC1536
670 W
XIO192
68 W
XIO384F
127 W (without optical module)
xFCU
14 W
xFCU-H
35 W
FCU3000
350 W
xFCU450
50 W
xINF450
50 W
xINF/xINF-H
8W
INF3000
64 W
PIO2_84
45 W
PIO2_84F
33 W
M2_84 (all versions)
3W
PIO345_16 (all versions)
80 W
M345P_16P
10 W
M345_16
3W
M345_8
2W
417006-2009-013-A01
XDM-40, 400, 450, 500, 1000, 2000,

Type
Component
Power requirements
STM1 and STM4 cards
SIO1&4
48 W
SIO1&4B
86 W
OMS01_4
4W
OM01_4
4W
OMS04_1
1W
OM04_1
1W
M1_8
5W
M1_16
5W
M1_16P
3W
SIO16_2
60 W
SIO16_2B
83 W
SIO16_4B
96 W
OM16_1SFP
Per specs
OMSC16_4
10 W
OM16_1
20 W
SIO64_1, SIO64_1M
125 W
SIO64_1-MF
135 W
SIO64B
106 W
SIO164
80 W
SIO164 OMSC16_4
83 W
SIO164 OMTX10
82 W
OMTX10_EF
15.5 W
OM10_1
10 W
OM64_1, OM10_1xx
18 W
DIO (all versions)
57 W
DIO1_40R
64 W
DMGE_2
7W
OMGE_1SX
1W
DM16_1
4W
DOM16_I3
1W
MCS5
100 W
MCS10
115 W
STM16 cards
STM64 cards
DIO
MCS
MCS30_X10G
125 W
ATS
ATS
48 W
Control cards
ACP1000
13.5 W
ACP3000
20 W
417006-2009-013-A01
6-69
XDM-40, 400, 450, 500, 1000, 2000,

Type
Component
Power requirements
Transponders and
combiners
TRP25_2C
40 W
AoC
83 W
TRP10_4R/M
60 W
TRP40_2B
115 W
CMBR40
110 W
CHTR_B
54 W
OMCD_8
24 W
OMD25_2
17 W
OMTR27
12 W
OMTR27_2
5W
OMCM25_4
16 W
OMTX10
8W
OMTX10_EF
13 W
OMTX10_S
7W
OMTX10_LAN
10 W
OMS16_4T
16 W
OFA_2 single
12 W
OFA_2 dual
20W
OFA_RM
17 W
OFA_HRM
21 W
MO_BAC
15 W
MO_PAC
15 W
MO_BAS
15 W
MO_PAS
15 W
MO_OFA_PHBC
20 W
MO_OFA_PC
12 W
MO_OFA_HBC
12 W
MO_OFA_FBC
14 W
MO_OFA_M
20 W
MO_OFA_MH
25 W
MO_OFA_MHe
27 W
MO_OFA_FHBC
15 W
RM_OFA_HBR
90 W
RM_OFA_FBR
90 W
RM_OFA_VHB
80 W
CHTR base card and

modules
Optical amplifier cards
Rack mounted power

amplifiers
6-70
417006-2009-013-A01
XDM-40, 400, 450, 500, 1000, 2000,

Type
Component
Power requirements
ROADM
MO_ROADM8/E/I/D
15.5 W
MO_ROADM8A
25 W
MO_ROADM8A_50
25 W
MO_ROADM2A
24 W
MO_ROADM2A_50
24 W
MO_ROADM40/E
40 W
MO_CW2
4.5 W
OM_CWM8C
4.8W
OM_CWD8C
5.8 W
OM_CWMD4C
4.8 W
OM_CWMD4CE
4.8 W
OM_CWMD4SL
4.8 W
OM_COADM1AB
4.8 W
OM_COADM2AB
4.8 W
OM_OADM4GEW
5W
OADM4_EW
5W
OM_AD4RQEWxx
5W
Optical DWDM cards for

X1/X2 slots
DW16MVDRE
15 W
DWDM modules
MO_DW16MDR-AVAV
10 W
MO_DW16MDRE-AVAV
10 W
MO_DW16MDB-AVAV
10 W
MO_DW16MDR-SAV
4.8 W
MO_DW16MDRE-SAV
4.8 W
MO_DW16MDB-SAV
4.8 W
MO_DW40MC-S
1W
MO_DW40MC-A
4.8 W
MO_DW40DC-A
4.8 W
MO_DW40VMD/E/I
47 W
AUX_2IO
15 W
AUX_2X
15 W
Each Plug-in
1W
OPM
OPM
15 W
OMSP
OMSP
10 W
CCP OADM modules
I/O OADM modules
AUX cards
417006-2009-013-A01
6-71
XDM-40, 400, 450, 500, 1000, 2000,

Type
Component
Power requirements
Accessory module
Each MO_ACC
1W
Miscellaneous and
Pluggable modules
OTX10_ALxx
15 W
OTR103_SR/LR/ER,
OTR64_PI3/PS5/AL5
3.5 W
OTX10_AT
15 W
OTR10_ELT
7W
OTR10_ALxx/ASxx
3.5 W
OTC10_ALxx/PSxx
3.5 W
OTR25_AVxx/ABxx
2W
OTC25_ALxx/PSxx
1.5 W
OTR10_AT
3.5 W
OTR1_S3/L3/L5
1W
OTR4_S3/L3/L5
1W
OTR16_I3/S3/L3/L5
1W
OTGBE_SX/LX/ZX
1W
OTX27_AT
4W
Heat dissipation
XDM-400 ............................................................. Typical 2720 Btu/hr, maximum 3400 Btu/hr
XDM-500 ............................................................. Typical 2720 Btu/hr, maximum 3400 Btu/hr
XDM-1000 ........................................................... Typical 4094 Btu/hr, maximum 5115 Btu/hr
XDM-2000 ........................................................... Typical 4094 Btu/hr, maximum 5115 Btu/hr
XDM-3000 ....................................................... Typical 11253 Btu/hr, maximum 14663 Btu/hr
6-72
417006-2009-013-A01
XDM-40, 400, 450, 500, 1000, 2000,

Operation
Applicable specification ................................................................ ETS 300 019-1-3 Class 3.1E
Temperature range ............................................................................................. -5 C to +45 C
Storage (packed)
Handling and transportation

Temperature range .......................................................................................... -40 C to +70 C
EMC
Applicable specifications ................... EMC directive 89/336, (including EN 300 386-2: 1997,
.......................................................................... Class B, emission and immunity requirements)
Safety
Applicable specificationsEN 60950 edition 2 (including A1/1992, A2/1993, A3/1995, A4/1996); EN 41003
CE safety ........................................................................................... LVD directive 73/23/EEC
Laser Safety
Applicable specification ...................... EN 60825-1&2 (including A1/1997) (AS/NZS 2211.2)
NEBS Compliance
The XDM platform complies with NEBS regulations for EMC and Safety, including
GR-1089-CORE Issue 1, October 1995 and GR-63-CORE Issue 2, December 1997 with
Revision 1, February 1999 (Level 3).
417006-2009-013-A01
6-73
XDM-40, 400, 450, 500, 1000, 2000,

Reliability
Life
Availability
Management Specifications
LightSoft server and client for managing all ECI equipment
EMS-XDM ................................................................................................. on SUN workstation

TMN; RS-232 to LCT-XDM; OverHead Access (OHA) and external alarms; orderwire;
RAP.

Alarm concept ................................................................................................................... G.783
Alarm types .................................. LED indicators, dry contacts, audible alarms (per subrack)
Alarm classes .......................................................................... Critical, Major, Minor, Warning
6-74
417006-2009-013-A01
XDM-40, 400, 450, 500, 1000, 2000,

Other Specifications
Cross-connect levels......................................................... VC-4nc, VC-4, VC-3, VC-2, VC-12
SDH/SONET switch core options192/384/768 x STM-1 with cross-connect capability of 4/3/2/1
SONET switch core options ............................................................................. 576/1152 STS-1
Traffic Protection
SNCP I/N LO, HO, UPSR ..................................................................................... within 30 ms
MSP/APS 1+1 ........................................................................................................ within 50 ms
MS-SPRing/BLSR ................................................................................................ within 50 ms
OCH ......................................................................................................................... within 5 ms
Optical line protection .............................................................................................. within 5 ms
Redundancy
I/O electrical modules protection .................................................................... 1: N (N=1 to 10)
417006-2009-013-A01
6-75
XDM-40, 400, 450, 500, 1000, 2000,

Synchronization
The XDM supports four timing references, which can be selected from multiple
timing sources, including:
From any PDH/Async tributary interface
From any SDH/SONET line 209
External 2 MHz and 2 Mbps/1.5 Mbps timing outputs (two T3 ports per
shelf)
G.813 internal clock.
Jitter and Wander

209
The XDM uses the original Synchronization Status Marker (SSM) byte from SDH/SONET tributary/aggregate
lines and transmits it over SDH/SONET lines.
6-76
417006-2009-013-A01
A
Standards and References
In this appendix:
Overview ........................................................................................................ A-1
Broadband Forum ........................................................................................... A-1
Environmental Standards ................................................................................ A-2
ETSI: European Telecommunications Standards Institute ............................. A-2
IEC: International Electrotechnical Commission ........................................... A-3
IEEE: Institute of Electrical and Electronic Engineers................................... A-4
IETF: Internet Engineering Task Force .......................................................... A-5
ISO: International Organization for Standardization ...................................... A-7
ITU-T: International Telecommunication Union ........................................... A-7
MEF: Metro Ethernet Forum ........................................................................ A-11
NIST: National Institute of Standards and Technology................................ A-12
North American Standards ........................................................................... A-12
OMG: Object Management Group ............................................................... A-13
TMF: TeleManagement Forum .................................................................... A-13
Web Protocol Standards ............................................................................... A-13
Overview
The following is a list of standards and reference documents that relate to the
XDM platform families. The standards are listed alphabetically by groups.
Broadband Forum
Af-phy-0064.000 ATM Forum E1 Physical Layer Interface.
Af-phy-0086.000 ATM Forum IMA V1.0.
Af-phy-0086.001 ATM Forum IMA V1.1.
Af-phy-00121.00 ATM Forum Traffic Management Specifications V4.1.
417006-2009-013-A01
A-1
Environmental Standards
EuP Directive 2005/32/EC: Ecodesign Requirements for Energy-Using

Products.
OHSAS 18001: Occupational Health and Safety Management Systems Requirements.
REACh Directive 2005/32/EC: Registration, Evaluation, Authorization,

and Restriction of Chemicals.
RoHS Directive 2005/747/EC: Restriction of the Use of Certain Hazardous

Substances in Electrical and Electronic Equipment.
WEEE Directive 2002/96/EC: Waste from Electrical and Electronic

Equipment.
ETSI: European
Telecommunications Standards
Institute
A-2
EN 300 019-1-1 Class 1.2: Environmental Engineering (EE);

Environmental Conditions and Environmental Tests for
Telecommunications Equipment; Part 1-1: Classification of Environmental
Conditions; Storage.

Conditions; Transportation.
EN 300 019-1-3 Classes 3.2 and 3.3: Environmental Engineering (EE);

Conditions; Stationary use at weather-protected locations.

Telecommunications Equipment; Part 2-4: Specification of Environmental
Tests; Stationary use at non-weather-protected locations.
EN 300 132 -2: Environmental Engineering (EE); Power Supply Interface

at the Input to Telecommunications Equipment.
EN 300-166: Physical and electrical characteristics of hierarchical digital

interfaces for equipment using the 2 048 kbit/s based plesiochronous or
synchronous digital hierarchies.
417006-2009-013-A01
EN 300 386: Electromagnetic compatibility and Radio spectrum Matters

(ERM); Telecommunication network equipment; Electromagnetic
Compatibility (EMC) requirements.
EN 300-417-2-1: Transmission and Multiplexing (TM); Generic

requirements of transport functionality of equipment.
EN 300-417-5-1: Generic requirements of transport functionality of

equipment.
EN 300-462-5-1: Transmission and Multiplexing (TM); Generic

requirements for synchronization networks.
EN 300-689: 34 Mbit/s digital leased lines (D34U and D34S); Terminal

equipment interface.
EN 301-164: SDH leased lines connection characteristics.
EN 301-165: SDH leased lines Network and Terminal interface

presentation.
EN 55022: Radio Disturbance Characteristics of Information Technology

Equipment.
ETR 114: Functional Architecture of SDH Transport Networks.
ETR 275: Considerations on Transmission Delay and Transmission Delay

value for components on connections supporting speech communication
over evolving digital networks.
FTZ 1TR9: Deutsche Telekom A.G. EMC Requirements.
FTZ 153 TL 1part 1: Synchronous Multiplexing Equipment (SM) for

Synchronous Multiplex Hierarchy.
IEC: International
Electrotechnical Commission
IEC 68: Environmental Testing.
IEC 917: Modular Order for the Development of Mechanical Structures for
Electronic Equipment Practices.
IEC 3309: Information Technology Telecommunications and Information

Exchange between Systems High-Level Data Link Control (HDLC)
Procedures Frame Structure.
IEC 9314-3: Information Processing Systems - Fiber Distributed Data

Interface (FDDI) Multiplex.
IEC 9595, Information Technology: Open Systems Interconnection,

Common Management Information Services.
417006-2009-013-A01
A-3
IEC 9596, Information Technology: Open Systems Interconnection,

Common Management Information Protocol.
IEC 13239: Information technology Telecommunications and

information exchange between systems High-level data link control
(HDLC) procedures.
IEC 17025: General Requirements for Competence of Testing and

Calibration Laboratories.
IEC 60825-1: Safety of Laser Products Part 1: Equipment Classification

and Requirements.
IEC 60825-2 (AS/NZS 2211.2): Safety of Laser Products Part 2: Safety

of Optical Fiber Communication System (OFCS).
IEC/EN/UL 60950-1: Information Technology Equipment - Safety General Requirements.
IS 1249-1: Safety of Laser products: Equipment classification requirements

and users guide.
IEEE: Institute of Electrical and

Electronic Engineers
A-4
IEEE 802.1ad: Virtual Bridged Local Area NetworksRevision

Amendment 4: Provider Bridges.
IEEE 802.1ag: Virtual Bridged Local Area Networks Amendment 5:

Connectivity Fault Management.
IEEE 802.1D: Media access control (MAC) Bridges (Incorporates IEEE

802.1t and IEEE 802.1w).
IEEE 802.1P: Traffic Class Expediting and Dynamic Multicast Filtering.
IEEE 802.1Q: Virtual Bridged Local Area NetworksRevision.
IEEE 802.1w: Rapid Reconfiguration of Spanning Tree.
IEEE 802.3: Carrier Sense Multiple Access with Collision Detection

(CSMA/CD) Access Method and Physical Layer Specifications.
IEEE 802.3ad: Link Aggregation.
IEEE 802.3ah: Ethernet in the First Mile (Link OAM).
IEEE 802.3x: Full Duplex Operation and Flow Control Protocol.
417006-2009-013-A01
IETF: Internet Engineering Task

Force
RFC 1493: Definition of Managed Objects for Bridges.
RFC 1643: Ethernet-like Interfaces.
RFC 1662: PPP in HDLC-Life Framing.
RFC 1757: Remote Network Monitoring Management Information Base.
RFC 1823: LDAP Application Program Interface (API).
RFC 1901: Introduction to Community-based SNMPv2.
RFC 2108: Definitions of Managed Objects for IEEE 802.3 Repeater

Devices using SMIv2.
RFC 2251: Lightweight Directory Access Protocol (v3) [specification of

the LDAP on-the-wire protocol].
RFC 2252: Lightweight Directory Access Protocol (v3): Attribute Syntax

Definitions.
RFC 2253: Lightweight Directory Access Protocol (v3): UTF-8 String

Representation of Distinguished Names.
RFC 2254: The String Representation of LDAP Search Filters.
RFC 2255: The LDAP URL Format.
RFC 2256: A Summary of the X.500(96) User Schema for use with
LDAPv3.
RFC 2401: Security Architecture for the Internet Protocol.
RFC 2409: Internet Key Exchange Protocol (IKE).
RFC 2474: Definition of the Differentiated Services Field (DS Field) in the
IPv4 and IPv6 Headers.
RFC 2597: Assured Forwarding PHB Group.
RFC 2615: PPP over SONET/SDH.
RFC 2665: Definitions of Managed Objects for the Ethernet-like Interface

Types.
RFC 2674: Bridge MIB with VLAN/Traffic Classes/Multicast Extensions.
RFC 2702: Requirements for Traffic Engineering Over MPLS.
RFC 2737: Entity MIB (Version 2).
RFC 2819: Remote Network Monitoring Management Information Base.
RFC 2829: Authentication Methods for LDAP.
417006-2009-013-A01
A-5
A-6
RFC 2830: Lightweight Directory Access Protocol (v3): Extension for

Transport Layer Security.
RFC 2863: Interfaces Group MIB.
RFC 3014: Notification Log MIB.
RFC 3031: Multiprotocol Label Switching Architecture.
RFC 3032: MPLS Label Stack Encoding.
RFC 3246: An Expedited Forwarding PHB (Per-Hop Behavior).
RFC 3270: Multi-Protocol Label Switching (MPLS) Support of

Differentiated Services.
RFC 3377: Lightweight Directory Access Protocol (v3): Technical

Specification.
RFC 3411: SNMP Framework MIB.
RFC 3414: SNMP User-Based SM MIB.
RFC 3415: SNMP Vies-Based ACM MIB.
RFC 3443: Time To Live (TTL) Processing in Multi-Protocol Label

Switching (MPLS) Networks.
RFC 3812: Multiprotocol Label Switching (MPLS) Traffic Engineering

(TE) Management Information Base (MIB).
RFC 3813: Multiprotocol Label Switching (MPLS) Label Switching Router

(LSR) Management Information Base (MIB).
RFC 3916: Requirements for Pseudo-Wire Emulation Edge-to-Edge

(PWE3).
RFC 3985: Pseudo Wire Emulation Edge-to-Edge (PWE3) Architecture.
RFC 4090: Fast Reroute Extensions to RSVP-TE for LSP Tunnels.
RFC 4125: Maximum Allocation Bandwidth Constraints Model for

Diffserv-aware MPLS Traffic Engineering.
RFC 4126: Max Allocation with Reservation Bandwidth Constraints Model

for Diffserv-aware MPLS Traffic Engineering & Performance
Comparisons.
RFC 4379: Detecting Multi-Protocol Label Switched (MPLS) Data Plane

Failures.
RFC 4448: Encapsulation Methods for Transport of Ethernet over MPLS

Networks.
RFC 5462: Multiprotocol Label Switching (MPLS) Label Stack Entry:

"EXP" Field Renamed to "Traffic Class" Field.
417006-2009-013-A01
IETF Drafts:
draft-ietf-l2vpn-vpls-ldp.
draft-ietf-l2vpn-vpls-mcast-reqts.
draft-ietf-magma-snoop.
draft-ietf-mpls-rsvp-te-p2mp.
draft-ietf-mpls-tp-nm-framework.
draft-ietf-mpls-tp-nm-req.
draft-ietf-pwe3-ethernet-encap.
draft-martini-l2circuit-encap-mpls.
draft-sajassi-l2vpn-vpls-multicast-congruency.
draft-vasseur-mpls-backup-computation.
ISO: International Organization

for Standardization
A2LA: Accredited Laboratory for Electrical and Mechanical Testing.
ISO 9001: Quality Management System Requirements.
ISO 14001: Environmental Management Systems Requirements With

Guidance for Use.
ISO 27001: Information Security Management Systems Requirements.
TL 9000, QuEST Forum: Quality Management System Requirements &

Measurements Handbooks for the Telecom Industry.
ITU-T: International
Telecommunication Union
G.650: Definition and Test Methods for the Relevant Parameters of

Single-Mode Fibers.
G.651: Characteristics of a 50/125 m Multimode Graded Index Optical

Fiber Cable.
G.652: Characteristics of a Single-Mode Optical Fiber Cable.
G.653: Characteristics of a Dispersion-Shifted Single-Mode Optical Fiber

Cable.
G.654: Characteristics of a Cut-off Shifted Single-Mode Optical Fiber

Cable.
417006-2009-013-A01
A-7
A-8
G.655: Characteristics of a Non-Zero Dispersion Shifted Single-Mode

Optical Fiber Cable.
G.661: Definition and Test Methods for the Relevant Generic Parameters of
Optical Amplifier Devices and Subsystems.
G.662: Generic Characteristics of Optical Fiber Amplifier Devices and

Subsystems.
G.663: Application Related Aspects of Optical Fiber Amplifier Devices

and Subsystems.
G.664: Optical Safety Procedures and Requirements for Optical Transport

Systems.
G.671: Transmission Characteristics of Passive Optical Components.
G.691: Optical Interfaces for Single Channel SDH Systems with Optical
Amplifiers and STM-64 Systems (Draft).
G.692: Optical Interfaces for Multi-Channel Systems with Optical

Amplifiers.
G.694.1: Spectral Grids for WDM Applications: DWDM Frequency Grid.
G.694.2: Spectral Grids for WDM Applications: CWDM Wavelength Grid.
G.695: Optical Interfaces for Coarse Wavelength Division Multiplexing

Applications.
G.703: Physical/Electrical Characteristics of Hierarchical Digital

Interfaces.
G.704: Synchronous Frame Structures Used at 1544, 6312, 2048, 8448 and
44 736 kbps Hierarchical Levels.
G.706: Frame Alignment and CRC Procedures Relating to Basic Frame

Structure Defined in Rec G.704.
G.707: Network Node Interface for the Synchronous Digital Hierarchy.
G.709: Interfaces for the Optical Transport Network (OTN).
G.752: Characteristics of digital multiplex equipments based on a second

order bit rate of 6312 kbit/s and using positive justification.
G.772: Protected Monitoring Points Provided on Digital Transmission

Systems.
G.774 & G774.n: SDH Information Model.
G.775: Loss of Signal (LOS), Alarm Indication Signal (AIS) and Remote
Defect Indication (RDI) defect detection and clearance criteria for PDH
signals.
G.781: Synchronization Layer Functions.
G.783: Characteristics of SDH Equipment Functional Blocks.
G.784: Synchronous Digital Hierarchy (SDH) Management.

417006-2009-013-A01
G.798: Characteristics of OTN Hierarchy Equipment Functional Blocks.
G.803: Architectures of Transport Networks based on the Synchronous

Digital Hierarchy.
G.805: Generic Functional Architecture of Transport Networks.
G.806: Characteristics of Transport Equipment Description Methodology

and Generic Functionality.
G.809: Functional Architecture of Connectionless Layer Networks.
G.811: Timing Characteristics of Primary Reference Clocks.
G.812: Timing Requirements of Slave Clocks Suitable for Use as Node

Clocks in Synchronization Networks.
G.813: Timing Characteristics of SDH Equipment Slave Clocks (SEC).
G.823: The Control of Jitter and Wander within Digital Networks Based on
the 2048 kbit/s Hierarchy.
G.825: The Control of Jitter and Wander within Digital Networks Based on
the SDH (Draft).
G.8251: The Control of Jitter and Wander within the Optical Transport
Network (OTN).
G.826: Error Performance Parameters and Objectives for International,

Constant Bit Rate Digital Paths at or above the Primary Rate.
G.828: Error Performance Parameters and Objectives for International,

Constant Bit Rate Synchronous Digital Paths.
G.829: Error Performance Events for SDH Multiplex and Regenerator

Sections.
G.831: Management Capabilities of Transport Networks Based on the

Synchronous Digital Hierarchy (SDH).
G.841: Types and Characteristics of SDH Network Protection

Architectures.
G.842: Inter-Working of SDH Protection Architectures.
G.872: Architecture of Optical Transport Networks.
G.874: Management Aspects of the Optical Transport Network Element.
G.874.1: Optical Transport Network (OTN): Protocol-Neutral Management

Information Model for the Network Element View.
G.957: Optical Interfaces for Equipment and Systems relating to the

Synchronous Digital Hierarchy.
G.959.1: Optical Transport Network Physical Layer Interfaces.
G.975: Forward Error Correction for Submarine Systems.
G.985: 100 Mbit/s point-to-point Ethernet based optical access system.
417006-2009-013-A01
A-9
A-10
G.7041: Generic Framing Procedure (GFP).
G.7042: Link Capacity Adjustment Scheme (LCAS) for Virtual

Concatenated Signals.
G.7713: Distributed Connection Management.
G.7713.2: RSVP-TE Implementation.
G.7714: Generalized Automatic Discovery Techniques.
G.7714.1: Protocol for Automatic Discovery in SDH & OTN network.
G.7715: ASON Routing.
G.7715.1: Based on PNNI, OSPF or IS_IS.
G.8010/Y.1306: Architecture of Ethernet Layer Networks.
G.8011/Y.1307: Ethernet Services Framework.
G.8011.1/Y.1307.1: Ethernet Private Line Service.
G.8011.2/Y.1307.2: Ethernet Virtual Private Line Service.
G.8012/Y.1308: Ethernet UNI and Ethernet NNI.
G.8261/Y. 1361: Timing and synchronization aspects in packet network.
G.8262/Y. 1362: Timing characteristics of synchronous Ethernet

equipment slave clock (EEC).
I.356: ATM Layer Cell Transfer Performance.
I.361: ATM Layer Specification.
I.371: Traffic Control and Congestion Control.
I.610: ATM Operation and Maintenance Principles.
M.3010: Principles for a Telecommunications Management Network.
M.3013: Considerations for a Telecommunications Management Network.
M.3100: Generic Network Information Model.
M.3180: Catalogue of TMN Management Information.
M.3200: TMN Management Services and Telecommunications Managed

Areas: Overview.
M.3300: TMN F Interface Requirements.
M.3400: TMN Management Functions.
Q.821: Alarm Surveillance.
Q.822: Performance Monitoring.
X.217: Open Systems Interconnection, Service Definition for the

Association Control Service Element.
X.219: Remote Operations - Model, Notation and Service Definition.

417006-2009-013-A01
X.227: Open Systems Interconnection, Connection-Oriented Protocol for

the Association Control Service Element - Protocol Specification.
X.229: Remote Operations: Protocol Specification.
X.710: Open Systems Interconnection, Common Management Information

Service.
X.720: Open Systems Interconnection, Structure of Management

Information - Management Information Model.
X.721 Information Technology: Open Systems Interconnection, Structure

of Management Information - Definition of Management Information.
X.722: Open Systems Interconnection, Structure of Management

Information - Guidelines for the Definition of Managed Objects.
X.731: Open Systems Interconnection, Systems Management - State

Management Function.
X.733: Open Systems Interconnection, Systems Management - Alarm

Reporting Function.
X.743: Open Systems Interconnection, Systems Management - Time

X.744: Open Systems Interconnection, Systems Management - Software

Y.1311: Network-based VPNs - Generic architecture and service

requirements.
Y.1710: Requirements for Operation & Maintenance functionality for

MPLS networks.
Y.1711: Operation & Maintenance mechanism for MPLS networks.
MEF: Metro Ethernet Forum
MEF4 Metro Ethernet Network Architecture Framework Part 1: Generic

Framework.
MEF6 Metro Ethernet Services Definitions.
MEF7 EMS-NMS Information Model.
MEF9 Test Suite for Ethernet Services at the UNI.
MEF10 Ethernet Service Attributes.
MEF11 User Network Interface (UNI) Requirements and Framework.
MEF12 Metro Ethernet Network Architecture Framework Part 2: Ethernet

Services Layer.
MEF14 Test Suite for Ethernet Traffic Management.
417006-2009-013-A01
A-11
NIST: National Institute of

Standards and Technology
FIPS PUB 197: Advanced Encryption Standard (AES).
FIPS PUB 140-2: Security Requirements for Cryptographic Modules.
North American Standards
A-12
ANSI FCF1-2: Fiber Channel Physical Interface REV 10.
ANSI T1.102: Digital hierarchy electrical interface.
ANSI T1.105: Synchronous Optical Network (SONET) - Basic Description

including Multiplex Structure, Rates, and Formats.
ANSI X3.296: Single-Byte Command code sets CONnection (SBCON)

architecture.
FCC CFR Title 47 Part 15: Radio Emission.
FCC Part 101.147 Fixed microwave services: (i8, i7, K7, 7)
NEBS GR1089 and GR63 (temperature aspect)
NEBS Level 3 support for N.A. platforms.
Rural Utility Service (RUS) Certification.
Telcordia GR-63-CORE: Network Equipment Building System (NEBS)

Requirements: Physical Protection.
Telcordia GR-253-CORE: Synchronous Optical Network (SONET)

Transport Systems: Common Generic Criteria.
Telcordia GR-383-CORE: COMMON LANGUAGE Equipment Codes

(CLEI Codes) Generic Requirements for Bar Code Labels.
Telcordia GR-487-CORE: Generic Requirements for Electronic Equipment

Cabinets.
Telcordia GR-499-CORE: Transport System Generic Requirements

(TSGR): Common Requirements.
Telcordia GR-1089-CORE: Electromagnetic Compatibility and Electrical

Safety Generic Criteria for Network Telecommunications Equipment.
Telcordia GR-1209-CORE: Generic Requirements for Passive Optical

Components.
Telcordia GR-1230-CORE: SONET Bidirectional Line-Switched Ring

Equipment Generic Criteria.
Telcordia GD-1244-CORE: Clock for the synchronization network:

Common generic criteria.
417006-2009-013-A01
Telcordia GR-1312-CORE: Generic Requirements for Optical Fiber

Amplifiers and Proprietary Dense Wavelength-Division Multiplexed
Systems.
Telcordia GR-1400-CORE: SONET Dual-Fed Unidirectional Path

Switched Ring (UPSR) Equipment Generic Criteria.
Telcordia GD-2979-CORE: Common Generic Requirements for Optical

Add-Drop Multiplexers (OADMs) and Optical Terminal Multiplexers
(OTMs).
OMG: Object Management Group
Notification Service Specification V 1.0.
The Common Object Request Broker: Architecture and Specification V 2.6.
TMF: TeleManagement Forum
TMF 513: MTNM Business Agreement Release 3.5.
TMF 518: Framework Document Delivery Package (DDP) Business

Agreement (BA) V1.1.
TMF 518: Resource Provisioning DDP BA V1.0.
TMF 608: Multi Technology Network Management Information

Agreement V 2.1 and V 3.5.
TMF 814: Multi Technology Network Management Solution Set V 2.1 and
V 3.5.
TMF 854: The MTOSI XML Solution Set Package Release 1.1.
Web Protocol Standards

W3C: World Wide Web Consortium
SOAP 1.1: Simple Object Access Protocol.
WSDL 1.1: Web Services Description Language.
WS-I: Web Services Interoperability Organization
WS-I Basic Profile 1.1: Web Services Interoperability.
417006-2009-013-A01
A-13
A-14
417006-2009-013-A01
Index
1
10 Gbps Optical Client XFP Transceivers
for Transponders and CMBR40B 647
10 Gbps Optical XFP Transceivers 5-13
2
2 Mbps (E1) 3-3, 4-4, 5-3, 6-8
2.5 Gbps Optical C/DWDM SFP
Transceivers 5-12
2.5 Gbps Optical CWDM SFP
Transceivers 4-12
3
34 Mbps (E3) 3-3, 4-4, 5-3, 6-8
4
45 Mbps (DS-3) 3-3, 4-4, 5-4, 6-8
4-channel active OADM basecard only
(no filters), 2 x 2 switch through I/O
slots 6-37
5
52 Mbps (STS-1) 4-4, 5-4
52 Mpbs (STS-1) 6-8
A
ADM 1-4
Aggregator for Metro-Edge NetworksSee
XDM-400 1-4
Alarms and Performance 3-4, 4-6, 5-5,
6-74
AoC basecard configurations 6-42
AoC basecard modules and transceivers
6-42
AoC, CMBR10, TRP10_LAN,
TRP10_2B, OTU2 Line Transceivers
6-52
AoC/OMTR27_2 STM-16/OTU1 client
6-48
417006-2009-013-A01
ATM 1-2, 1-4

ATS Specifications 6-28
Auxiliary Cards and Miscellaneous
Accessory Modules 6-61
Auxiliary Cards and Miscellaneous
Accessory Modules Specifications
6-61
Availability 3-14, 4-28, 5-26, 6-74
B
Basic XDM-100 shelf 2-4
Basic XDM-100 Shelf 2-35
Broadband Forum A-1
C
C Band Channel Frequencies and
Wavelengths (ITU-T Rec. G.694.1 for
DWDM) 6-62
C/DWDM and OTN Platform for
Metro-access and CPE
ApplicationsSee XDM-40 1-4
Cards 2-33, 2-37, 2-41, 2-48, 2-49, 251, 2-52, 2-54, 2-57, 2-58, 2-59
control, matrix and I/O 2-57
ECB/xECB4 2-59
ECM40 2-59
ECU 2-37
ECU50 2-33, 2-41
HLXC 2-57
HLXC192/384/768 2-57
I/O 2-51, 2-52
MECP 2-48, 2-59
MXC 2-37
I-1
Index
MXC50 2-33, 2-41

PSFU 2-48
xFCU40 2-48
XIO 2-57, 2-58
XIO192 2-49
XIO192/384F 2-58
xMCP 2-49
xMCP/xMCP_B 2-51, 2-52, 2-54, 259
xMCP_B 2-48
Cards Cage 2-52
CCP cage OFAs DWDM applications 658
CCP cage OFAs for single-channel
applications 6-58
CCP50 2-32
CCP50_2 2-2
CDWD Modules Specifications 4-19, 519
CE Compliance 3-14
CHTR_B basecard Configurations 6-40
CHTR_B basecard modules and
transceivers 6-40
Client Transceivers for EISM Cards 311
Client Transceivers for MCSM, EISM
Cards 4-18
Client Transceivers for MCSM,
EISMB_840 Cards 5-18
Compact CWDM Platform for Metroaccess NetworksSee XDM-200 1-4
Connection Module Data for Electrical
I/O Cards 6-3
Control, Matrix, and I/O Cards for Large
XDM Shelves 2-57
Cross-Connect Capacity 3-2, 4-2, 6-75
Cross-connect Capacity Specifications
6-75
Cross-Connect Levels 3-2, 4-2, 5-2, 675
Cross-connect Levels Specifications 675
Cross-connect Specifications 3-2, 4-2,
5-2
I-2
Cross-Connect Specifications 3-2, 4-2,

5-2
CWDM and DWDM STM-16/OC48/OTU1 SFP Optical Transceivers
for OM16_1SFP and OMSC16_4 619
CWDM components (CCP cage) 6-38
CWDM Frequencies and Wavelengths
(ITU-T Rec. G.694.2 for CWDM)
4-22, 5-20, 6-65
CWDM Modules 4-21, 5-20
CWDM Mux/Demux/OADM
Components 6-38
D
Data Cards 6-23
Data Cards Specifications 6-23
Data Client Transceivers for DIOB,
MCS5, MCS10, MCS30_X10G 629
Data Client XFP Transceivers for
MCS30_X10G 6-30
Data Line XFP Transceivers for
MCS30_X10G 6-31
Data Modules 3-8, 4-13, 5-14
Data Modules Specifications 3-8, 4-13,
5-14
Data-Aware Access GatewaySee XDM500 1-4
DCF/DCM Units 6-60
DCF/DCM Units Specifications 6-60
Demux (CCP Flat Top) specifications 633
Dimensions (H x W x D) 3-12, 4-23, 521, 6-65
DIOB Specifications 6-23
DIOM Specifications 3-8, 4-13, 5-14
DWDM 1-4
DWDM cards (cards cage of XDM-1000
and XDM-2000 shelves) 6-32
DWDM components (CCP cage of XDM40/XDM-450/XDM-500/
XDM-1000) 6-37
DWDM modules (CCP cage of XDM1000/XDM-450) 6-32
417006-2009-013-A01
Index
DWDM Mux/Demux Cards and Modules

6-32
DWDM OADM cards (cards cage) 6-36
DWDM OADM Cards and Modules 636
DWDM OADM plug-in filters for
OADM cards 6-37
E
ECB, xECB4, or ECB3000 2-59
ECB/xECB4 2-59
ECM40 2-59
ECU 2-4, 2-37, 2-39
ECU300 2-43, 2-44
ECU300F 2-43
ECU50 2-2, 2-32, 2-33, 2-41
ECU50 and ECU50R 2-34
ECU900 2-47, 2-48
ECU900F 2-47
EISM Specifications 3-10, 4-17
EISMB Specifications 3-9, 4-14, 5-15
Electrical GbE SFP (ETGbE) 3-11, 418, 5-19
Electrical Interface Connection Modules
6-3
Electrical, Optical and Mixed Basecard
Information Specifications 6-2
Electrical, Optical, and Mixed Basecard
Information 6-2
EMC 3-13, 4-27, 5-26, 6-73
EMC Specifications 3-13, 4-27, 5-26, 673
Environmental Conditions 3-13, 4-27,
5-25, 6-73
Environmental Conditions Specifications
3-13, 4-27, 5-25, 6-73
Environmental Standards A-2
ETSI
European Telecommunications
Standards Institute A-2
Protection 2-36
Protection 2-41
417006-2009-013-A01
Expanded XDM-300 with CWDM

Networking Capabilities 2-9
2-8
Protection 2-33
Protection 2-45
Expanded XDM-900 with CWDM
Networking Capabilities 2-14
2-12
Expansion Shelves 2-21
F
FCU 2-4
FCU40 2-15
FCU50 2-2
Floor Loading 6-66
G
GbE/FC/2 Gbps FC/FICON Optical SFP
Transceivers for
Transponders/Combiners 4-20
H
Handling and transportation 6-73
Handling and Transportation 3-13, 4-27,
5-25
Heat dissipation 6-72
HLXC192/384/768 2-57
HLXC192/384/768/1536 2-57
I
I/O Interfaces 3-3, 4-4, 5-3
I/O Interfaces Specifications 3-3, 4-4, 53
I/O Protection Options 2-8
IEC
International Electrotechnical
Commission A-3
IEEE
Institute of Electrical and Electronic
Engineers A-4
IETF
I-3
Index
Internet Engineering Task Force A-5

INF50 2-2, 2-32
ISO
International Organization for
Standardization A-7
ITU-T
International Telecommunication
Union A-7
J
Jitter and Wander 3-2, 4-4, 5-3, 6-76
Jitter and Wander Specifications 3-2, 44, 5-3, 6-76
L
Laser Safety 3-14, 4-27, 5-26, 6-73
Life 3-14, 4-28, 5-26, 6-74
M
Main equipment power consumption 668
Main Equipment Power Consumption 313
Management 3-4, 4-5, 5-5
Management and Alarm Interfaces 3-4,
4-6, 5-5, 6-74
Management Specifications 3-4, 4-5, 55, 6-74
MCS10 Specifications 6-25
MCS30_X10G Specifications 6-27
MCS5 Specifications 6-24
MCSM Specifications 4-15, 5-16
MECP 2-15, 2-19, 2-48, 2-59
MECP_OSC cards 6-11
MEF
Metro Ethernet Forum A-11
Miniature MSPP for Metro-access and
Cellular NetworksSee XDM-100 14
MO_ROADM2A - 100 GHz spacing - 2D
ROADM with Equalization 6-36
MO_ROADM2A_50 - 50 GHz spacing 2D ROADM with Equalization 6-36
I-4
MO_ROADM40 2D ROADM 100 GHz

spacing with equalization 6-35
MO_ROADM8A 100 GHz spacing
Multi Degree configuration 6-34
MO_ROADM8A_50 50 GHz spacing
Multi Degree configuration 6-35
MO_ROADM8D 100 GHz spacing
Multi-Degree configuration 6-35
Modules Cage 2-52
MSPP 1-2
MSPP for High Capacity Central
Exchange ApplicationsSee XDM1000 1-4
Multifunctional Intelligent Optical
SwitchSee XDM-2000 1-4
Mux (CCP Flat Top) specifications 6-33
Mux/Demux Modules 4-21
Mux/Demux Modules for XDM-300/900
5-20
Mux/demux specifications 6-39
MXC 2-37, 2-38
MXC and ECU Cards 2-37
MXC-100 2-4
MXC300 2-42
MXC300 and ECU300 Cards 2-41
MXC300 Cross-Connect Capacity 5-2
MXC50 2-2, 2-32, 2-33, 2-41
MXC900 2-46
MXC900 Cross-Connect Capacity 5-2
MXC-BG 2-36
N
NEBS Compliance 4-28, 5-26, 6-73
NIST
National Institute of Standards and
Technology A-12
Nonredundant XDM-100 2-5
Nonredundant XDM-100 Shelf 2-36
North American Standards A-12
NVM 2-6
417006-2009-013-A01
Index
OW Unit Specifications 6-22
OADM Modules 4-21

OADM Modules for XDM-300/900 520
OADM specifications 6-39
OFAs for single channel and DWDM
applications 6-57
OM_AD4RQEW_xx 4skip0 OADM for
I/O slots 6-37
OM_OADM4GEW_xx 4 skip 0 OADM
for CCP slots 6-38
OMCM25_4 & AoC GbE/FC1 SFP
Transceivers 6-46
OMCM25_4 FC2G client SFPs 6-46
Transceivers 6-44
Transceivers 6-45
OMG
Object Management Group A-13
OMSP card specifications 6-61
Operation 3-13, 4-27, 5-25, 6-73
OPM card specifications 6-61
Optical Amplifier Modules for TPU/OCU
4-19, 5-19
Optical Amplifiers 6-56
Optical Amplifiers Specifications 6-56
Optical Auxiliary Cards and Modules 659
Optical Auxiliary Cards and Modules
Specifications 6-59
Optical Auxiliary Cards for XDM-450
6-60
Optical Components 6-32
Optical Components Specifications 6-32
Optical SFP transceivers for I/O cards
6-5
Optical transceivers for I/O cards 6-4
Optical transmitters and receivers for
TRP25_2 6-40
Other Optical Cards 6-61
Other Specifications 6-75
Overview 1-1, A-1
417006-2009-013-A01
PDH/Async and SDH/SONET Interface

Specifications 6-8
Physical Description 2-1
Physical Specifications 3-12, 4-23, 5-21,
6-65
Power 3-12, 4-23, 5-21, 6-66
Power consumption 6-67
Power Dissipation 3-13, 4-23, 5-22
Power requirements 6-66
Power Supply Lines Surge Voltage 6-67
PSFU 2-48
Q
QoS 1-1
R
Rack Layouts 2-21
Rack Layouts and Expansion Shelves 221
Rack Mounted Single Channel DCM
Units 6-60
RAMAN and very high power EDFA
amplifiers 6-57
Redundancy 3-2, 4-3, 5-2, 6-75
Redundancy Specifications 3-2, 4-3, 52, 6-75
Reliability 3-14, 4-28, 5-26, 6-74
Reliability Specifications 3-14, 4-28, 526, 6-74
ROADM Cards 6-34
ROADM modules for XDM-1000/XDM450 (CCP cage) 6-34
S
Safety 3-14, 4-27, 5-26, 6-73
Safety Specifications 3-14, 4-27, 5-26,
6-73
SDH Interfaces 3-5
SDH/SONET Interfaces 4-6, 5-6, 6-10
SDH/SONET Interfaces Specifications
4-6, 5-6, 6-10
I-5
Index
SDH/SONET STM-16/OC-48 SFP

Optical Transceivers for OM16_1SFP
and OMSC16_4 6-17
SDH/SONET STM-64/OC-192 (9953.28
Mbps 4.6 ppm) I/O Modules 6-20
SDH/SONET STM-64/OC-192 XFP
Optical Transceivers 6-21
Shelf Layouts 2-2, 2-3, 2-6, 2-15, 2-17,
2-18, 2-19
XDM-100 2-3, 2-6
XDM-1000 2-18
XDM-2000 2-19
XDM-40 2-15
XDM-400 2-15
XDM-50 2-2
XDM-500 2-17
Specifications 3-2, 3-3, 3-4, 3-8, 3-12,
3-13, 3-14, 4-2, 4-3, 4-4, 4-5, 4-6, 413, 4-19, 4-23, 4-27, 4-28, 5-2, 5-3, 55, 5-6, 5-14, 5-19, 5-21, 5-25, 5-26, 62, 6-5, 6-8, 6-10, 6-23, 6-32, 6-56, 659, 6-60, 6-61, 6-65, 6-73, 6-74, 6-75,
6-76
auxiliary cards 6-61
cross-connect 3-2, 4-2, 5-2
cross-connect capacity 6-75
cross-connect levels 6-75
CWDM modules 4-19, 5-19
data cards 6-23
data modules 3-8, 4-13, 5-14
DCF/DCM units 6-60
DWDM cards 6-32
electrical, optical and mixed basecard
information 6-2
EMC 3-13, 4-27, 5-26, 6-73
environmental conditions 3-13, 427, 5-25, 6-73
I/O interfaces 3-3, 4-4, 5-3
jitter and wander 3-2, 4-4, 5-3, 6-76
management 3-4, 4-5, 5-5, 6-74
miscellaneous accessory modules 661
optical amplifiers 6-56
I-6
optical auxiliary cards and modules

6-59
optical components 6-32
PDH/Async and SDH/SONET
interface 6-8
physical 3-12, 4-23, 5-21, 6-65
redundancy 3-2, 4-3, 5-2, 6-75
reliability 3-14, 4-28, 5-26, 6-74
safety 3-14, 4-27, 5-26, 6-73
SDH/SONET interfaces 4-6, 5-6, 610
synchronization 3-2, 4-3, 5-3, 6-76
traffic protection 3-2, 4-3, 5-2, 6-75
XDM shelf capacities 6-5
XDM-1000 product line 6-2
Splitter/Coupler Modules 4-22
Splitter/Coupler Modules for XDM300/900 5-20
Standards and References A-1
STM-1 (155.52 Mbps 4.6 ppm) I/O
Module 3-5
STM-1 Electrical 3-3, 4-5, 5-4, 6-8
STM-1 Optical 3-3
STM-1 SFP Optical supervisory channel
transceivers for OSC1_2 4-21
STM-1/OC-3 (155.52 Mbps 4.6 ppm)
I/O Modules 4-6, 5-6, 6-10
STM-1/OC-3 Optical 4-5, 5-4, 6-9
STM-1/OC-3 SFP Optical Transceivers
for OMS01_4 6-12
STM-16/OC-48 (2488.32 Mbps 4.6
ppm) I/O Modules 4-10, 5-10, 6-16
STM-16/OC-48 Optical 4-5, 5-4, 6-9
STM-16/OTU1 Optical SFP Line
Transceivers for OMTR27_2 &
OMCM25_4 6-53
STM-4 (622 Mbps 4.6 ppm) I/O Module
3-6
STM-4 Optical 3-4
Modules 4-8, 5-8, 6-13
STM-4/OC-12 Optical 4-5, 5-4, 6-9
STM-4/OC-12 SFP Optical Transceivers
for OMS04_1 6-14
417006-2009-013-A01
Index
STM-64/OC-192 Optical 5-5, 6-9

Storage (packed) 3-13, 4-27, 5-25, 6-73
Synchronization 3-2, 4-3, 5-3, 6-76
Synchronization Specifications 3-2, 4-3,
5-3, 6-76
T
The Do-It-All MSPP for Up-and-Coming
NetworksSee XDM-50 1-4
TM 1-4
TMF
TeleManagement Forum A-13
Traffic Protection 3-2, 4-3, 5-2, 6-75
Traffic Protection Specifications 3-2, 43, 5-2, 6-75
Transponders 6-39
TRP10_4 basecard configurations 6-43
TRP10_4 basecard transceivers 6-43
TRP10_4 CWDM OTU2 Line/Client
STM-64/10G LAN/FC10/OTU2 XFP
Optical Transceivers and CMBR40B
Client Transceivers 6-49
TRP10_4 OTU2/OTU2e Line, STM64/10G LAN/FC10 Client, AoC,
CMBR10, TRP10_LAN, TRP10_2B,
OTU2 XFP Line Transceivers and
CMBR40B Client Transceivers 6-51
TRP10_4R OTU2/OTU2e/OTU2f
Optical Transceivers 6-50
TRP25_2 2.5 Gbps optical
transmitters/receivers for
transponders, and transceivers for
combiners 6-54
TRP25_2 basecards 6-39
TRP40_2B and CMBR40B
configurations 6-43
TRP40_2B Client Transceiver 6-55
TRP40_2B, CMBR40B Line Transceiver
6-54
U
Unparalleled Capabilities 1-2
W
Web Protocol Standards A-13
417006-2009-013-A01
Weight 3-12, 4-23, 5-21, 6-66
X
XDM 1-2, 1-4, 2-57
capabilities 1-2
cellular capabilities 1-2
control, matrix and I/O cards 2-57
data capabilities 1-2
optical capabilities 1-2
platforms 1-4
SDH/SONET capabilities 1-2
XDM MPLS/Ethernet Card Summary 622
XDM Platforms 1-4
XDM Shelf Capacities 6-5
XDM Shelf Capacities Specifications 65
XDM Shelf Capacities with HLXC 6-5
XDM Shelf Capacities with XIO 6-6
XDM Shelf Configurations 2-2
XDM Intelligent and Scalable Optical
Networking Platforms 1-1
XDM-100 1-4, 2-3, 2-4, 2-5, 2-6, 2-35,
2-36, 2-37, 2-40
basic shelf 2-4, 2-35, 2-40
cards and modules 2-35
expanded shelf 2-36
I/O protection 2-5
nonredundant 2-5
nonredundant shelf 2-36
NVM 2-6
shelf layout 2-3
slot allocation 2-35
XDM-100H 2-6
XDM-100H shelf 2-37
XDM-100 Card and Module Layout 235
Power Consumption 4-24, 5-22
XDM-100 Shelf Capacity 4-2
XDM-100 Shelf Layout 2-3
XDM-100 Specifications 4-1
XDM-100 with I/O protection 2-5
I-7
Index
XDM-1000 1-4, 2-18, 2-52

card layout 2-52
shelf layout 2-18
XDM-1000 Card Layout 2-52
XDM-1000 Product Line 6-2
specifications 6-2
XDM-100H 2-6
XDM-100H Shelf 2-37
XDM-200 1-4
XDM-2000 1-4, 2-19, 2-54
shelf layout 2-19
XDM-300/900 Specifications 5-1
XDM-3000 1-4, 2-20, 2-57
shelf layout 2-20
XDM-3000 card layout 2-55
XDM-40 1-4, 2-15, 2-48
card layout 2-48
shelf layout 2-15
XDM-40, 400, 450, 500, 1000, 2000, and
3000 Specifications 6-1
XDM-400 1-4, 2-15, 2-49
card layout 2-49
shelf layout 2-15
XDM-50 1-4, 2-2, 2-32, 2-33
I-8
basic shelf 2-32

expanded shelf 2-33
shelf layout 2-2
slot allocation 2-32
XDM-50 Card and Module Layout 2-32
XDM-50 Specifications 3-1
XDM-50 with I/O protection 2-3
XDM-500 1-4, 2-17, 2-51
card layout 2-51
shelf layout 2-17
xFCU 2-17, 2-18
xFCU4 2-15
xFCU40 2-48
xINF 2-17, 2-18
xINF4 2-15
xINF40 2-15
XIO192 2-49
XIO192/384F 2-58
xMCP 2-49
xMCP/xMCP_B 2-19, 2-51, 2-59
xMCP_B 2-15, 2-48
417006-2009-013-A01

XDM SPEC A01 8.2.3-8.2.4 en PDF

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XDM

XDM System Specifications

Copyright by ECI, 2008-2011. All rights reserved worldwide.

Physical Description ............................................................... 2-1

XDM-50 Specifications ............................................................ 3-1

ECI Telecom Ltd. Proprietary

XDM System Specifications

XDM-100 Specifications .......................................................... 4-1

XDM-300/900 Specifications ................................................... 5-1

XDM-40, 400, 450, 500, 1000, 2000, and 3000

ECI Telecom Ltd. Proprietary

XDM System Specifications

Data Cards ..................................................................................................... 6-22

Standards and References .................................................... A-1

Overview .......................................................................................................... A-1

Index .......................................................................................... I-1

ECI Telecom Ltd. Proprietary

XDM System Specifications

ECI Telecom Ltd. Proprietary

ECI Telecom Ltd. Proprietary

XDM System Specifications

Figure 2-31: Two XDM-1000 shelves installed in a 2600 mm ECI

ECI Telecom Ltd. Proprietary

STM-1 bidirectional transceivers ........................................................... 3-6

STM-4 bidirectional transceivers ........................................................... 3-7

STM-1 bidirectional transceivers ........................................................... 4-7

STM-4 bidirectional transceivers ........................................................... 4-9

STM-16 bidirectional transceivers ....................................................... 4-11

STM-1 bidirectional transceivers ........................................................... 5-7

STM-4 bidirectional transceivers ........................................................... 5-9

STM-16 bidirectional transceivers ....................................................... 5-11

GbE bidirectional transceivers ............................................................. 5-18

STM-1 transceivers ............................................................................. 6-12

STM-1 bidirectional transceivers ......................................................... 6-13

STM-4 transceivers ............................................................................. 6-14

STM-4 bidirectional transceivers ......................................................... 6-15

STM-16 transceivers ........................................................................... 6-17

STM-16 bidirectional transceivers ....................................................... 6-18

ECI Telecom Ltd. Proprietary

XDM System Specifications

ECI Telecom Ltd. Proprietary

XDM Intelligent and Scalable

Data-services the XDM facilitates migration from voice-oriented to

ECI Telecom Ltd. Proprietary

XDM System Specifications

Versatility and interoperability the XDM coexists in perfect harmony

Bitrates ranging from E1 all the way up to STM-64/OC-192

Large nonblocking matrix for full connectivity

High density of lambdas (40 to 80) in the C band

Ability to add/drop any lambda at any site

Ability to provide metro solutions without amplification

Long-haul solutions up to 1500 km

ECI Telecom Ltd. Proprietary

XDM System Specifications

Usable bandwidth to customers, including Layer 1 and Layer 2 Ethernet

Aggregates ATM traffic to optimize bandwidth utilization

Unifies 2G and 3G networks

Migrate from today's ring topologies to mesh architectures, segment by

Add and activate bandwidth as requirements change

Provide on-demand services across multiple network layers

Figure 1-1: Multiservice metropolitan optical network

ECI Telecom Ltd. Proprietary