1972 INTERMAG

CONFERENCE

hibited the same aging rate. Weconclude that the

629

plated wires,

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even at the highest stabilization temperature,are

not fully
stabilized, or that additional mechanisms are contributing to
the aging.

CONCLUSIONS
The NDRO character of a plated wire is determined by the
physical and metallurgical structure of t h e NiFe film, in particular, the composition fluctuation in the initial layers. Different
electrolytes produce different initial compositions, which in
turn require different processing features to develop the best
NDRO properties.
T h e maximum stabilization t e m p e r a t u r e which can be used
is determined by the thiourea concentration in the electrolyte
because of its effect on the grain size and defect structure of
the film. The change in properties above this maximum temp e r a t u r e i sconsistent with the composition gradients in t h e film
and with the differential thermal expansion between the substrate and film. Changes in magnetostriction during stabilization a r e a t t r i b u t e d to diffusion or homogenization and also reflect t h e different composition gradients in t h e films.
Aging, after the on-line stabilization, is inhibited
by using
higher stabilization temperatures and lower thiourea concentrations. The effect of the lower thiourea is attributed to the
increased grain size and decreased impurity content of the
NiFe.

REFERENCES
F. E. Luborsky, Influence of the substrate and electrolyte on
the composition and properties of thin
electrodepositedNiFe
films, IEEE Trans. Magnetics, Vol. MAG-5, June 1969, pp. 106111.
I. W. Wolf, Electrodeposition of magnetic materials, J. Appl,
Phys., Vol. 33, March 1962, pp. 1152-1159.
F. E. Luborsky, R. E. Skoda, and W. D. Barber, The origins of
non-destructive read-out in plated wires, J. Appl. Phys., Vol. 42,
March 1071, pp. 1428-1430.
F. E. Luborsky, Method for obtaining circumferential orientation ofmagnetic
films electroplatedon wires, U.S. Patent
3,556,954,June19,1971.
F. E. Luborsky, Influence of the porosity of thin gold layers
used as thesubstrate
for the electrodeposited
Permalloy,
J. Electrochem. SOC.,Vol. 117, January 1970, pp: 76-77.
Y. Sugita, N. Kumasaka, H. Nishida, and H. Fujlwara, Disturb
properties of exchange coupled
composite plated wires, IEEE
Trans. Magnetics, Vol. MAG-7, September 1971,
626-628.
p
M. Terajima, Y. Gomi and H. Ikawa, Effect ofon-line flash
anneal on aging properties of NDRO multilayer plated wire,
IEEE Trans. Magnetics, Vol. MAG-6, September 1970, pp. 716719.
J. S. Mathias and G.A. Fedde, Plated wire technology: A critical review,IEEETrans,
Magnetics, Vol. MAG-5, December
1969, pp. 728-751.
D. Barber, Kineticsofannealing
of
F.E.Luborskyand
Permalloy films
with
increasing concentrations
of
sulfur,
J. Appl. Phys., Vol. 39, February 1968, pp. 746-748.
F. E. Luborsky, Aging and stabilizationofPermalloyfdms,
IEEE Trans. Magnetics, Vol. MAG-4, September 1968, pp. 511515.
T. Iwata and F. B. Hagedorn, Annealing behavior of induced
anisotropy and related magnetic properties in Permalloy fdms,
J. A pl. Phys., Vol. 40, April 1969, pp. 2258-2266.
J. Sfinczewski, N. G. Aindie, and W. R. Beam, Agmg and skew
in Permalloy base magnetic films, J. Appl. Phys., Vol. 38, May
1967, pp. 2667-2675.
J. T. Chang, A. R. VonNeida, and C. J. Calbick, Structural and
magnetic characteristics of annealed electrodeposited Permalloy
films, J. Appl. Phys., Vol. 37, March 1966, p. 1472-1473.
A. Baltz, Annealing of cylindrical NiFe fdms, IEEE Trans.
Magnetics, Vol. MAG-5, March 1969, pp. 2-6.
M. W. Breiter and F. E. Luborsky, Identification of gold islands
on copper plated wire surfaces by cyclic voltammetry, J. Electrochem. SOC.,Vol. 118,June 1971, pp. 867-869.

W.

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F. E. Luborsky, M. W. Breiter, and B. J. Drummond, Characterization ofagold-copper

composite surface for plated wire
memory, J. Electrochem. SOC.,Vol. 119, January 1972, pp. 9296.
R. Girard,Theelectrodeposition
ofthin magneticPermalloy
films, J. Appl. Phys., Vol. 38, March 1967, p. 1423 1430.
C. Knudson and J. Kench, Annealing effects in plated wire
memoryelements,Part
I: Interdiffusion ofcopperand Permalloy, IEEE Trans. Magnetics, Vol. MAG-7, December 1971,
pp. 852-858.
0. S. Lutes, R. B. F er, J. 0. Holmen, and J. R. Kench, A study
of the reliability o?iplated wire computer components, NASA
Contract 12-2003, Final Report, December 1969.
F.E. Luborsky, Magnetic proerties and annealing behavior of
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March 1967, pp. 1445-1447.
J. McCallister and S. J. Strobl, Quantitative prodiction of aging
effects in plated wires, IEEE Trans. Magnetics, Vol. MAG-5,
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of plated wire memory element, Magnetism and Magnetic Materials 1971, AIP Conference Proc. No. 5, pp. 717-721.

Arris,''

Wire Memory Technology i n J a p a n

S. SHIMIZU AND Y . HIYAMA

Abstract-Manufacturing techniques of plated wires have rapidly developed and uniform characteristics and stable reproductivity, even for
long wires, have been accomplished. Magnetic films used in Japan are
typically from three to five multilayered in order to broaden operating
margins and for better control ofthecharacteristics.
The method of
fabricating word lines with keepers by automatic weaving machines is
one of the unique techniques of Japan. The fabrication technique used
in forming digit lines into a laminated cable eliminates connections between the planes and reduces the assembling cost. Adhesion type planes,
which have several spare bits, are suitable for manufacturing large capacity modules at low cost. Several improvements are also employed in the
tunnel structure.FSM is concentrated upon because of its miniaturization
and combination with the IC techniques.
The total number of planes and memory systems produced and sold
in Japan hasreached 3 X lo8 bits in capacity. And the annual production
quantity is nearly 10% of core memories. Further promotion of use for
wire memories is expected by realizing the following: 1)improvements
of bitdensity (more than 500 biticm); 2)
stable connection at low
cost; 3) standarizations of wire, plane, and IC for read-write circuits;
and 4) widespread and closely knit exchange of technical information
among wire people.
Paper 46.3, presented at the 1972 INTERMAG Conference, Kyoto,
Japan, April 10-13.
The authors are with the Masahino Electrical Communication Laboratory, N.T.T., Mushashino, Tokyo, Japan.

Magnetic Levitation of Trains by Means of Normal Conductive

Electromagnets
SAKAE YAMAMURA, YOSHIHISA ISHIKAWA, AND
TAKETO HAYASHI
Abstract-It has been generally believed that the magnetic levitation
of trains of the induction-repulsion type needs large ampere turn on the
train magnets, and onlysuperconductivemagnets
make the magnetic
levitation feasible. However, the magneticlevitationbecomes feasible
also with the normal conductive electromagnet if the iron magnetic path
is properly provided. An experimental example has been investigated.
For details, see Digests ofthe 1972 Intermug Conference (available from
IEEE Headquarters).
Paper 48.1, presented at the 1972 INTERMAG Conference, Kyoto,
Japan, April.10-13.
The authors are with the Electrical Engineering Department, Faculty
of Engineering, University of Tokyo, Bunkyo-ku, Tokyo,Japan.