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Thin films of gold, silver, aluminum, copper, and chromium can be deposited with the
Auto 306 thermal evaporator. The maximum film thickness allowed for each
deposition is 250 nm. To deposit thicker films or materials other than the five metals
listed above, you need to request permission from MCF staff. The request form can be
downloaded from the MCF website.
I. Quick Start.
1. Mount samples onto the sample holder plate.
2. Vent the chamber.
3. Open the top lid, remove the glass bell jar and the safety guard. Clean out vacuum
grease with IPA moistened wipes. Clean out a small window on the bell jar with
IPA, apply Bell Shine onto the window.
4. Mount metal holders (boat, rod, or coil) onto the four position turret and load
target metals. Vacuum metal flakes and other particles off the turret and the base
plate.
5. Regrease the L-gaskets. Reposition the glass bell jar onto the base plate followed
by the safety guard.
6. Mount sample holder plate onto the top shaft. Close the top lid.
7. Cycle the system.
8. Wait for the chamber pressure to reach 810 -6 mBar. Add liquid nitrogen through
the metal funnel.
9. Adjust z ratio and density parameters corresponding to the metal. Start sample
rotation before deposition. Turn on the temperature monitor. Make sure the
shutter is closed.
10. When chamber pressure reaches 2.010-6 mBar, deposition can be started. Turn
the main switch to LT position, slowly ramp up the current, when the target metal
starts to glow brightly or melt, press the Run button to open the shutter and start
deposition.
11. When desired film thickness is reached, press the Run button again to close the
shutter.
12. Turn down the electrical current then turn off the LT switch.
13. Wait for the chamber temperature to drop to 50-60 degree C.
14. Stop sample rotation.
15. Vent the chamber, open the top plate and remove the sample holder.
16. Remove the glass bell jar and safety guard. Clean out grease with IPA moistened
wipe. Remove metal source holders. Vacuum metal flakes and other particles off
the turret and the base plate.
17. Regrease the L-gaskets. Replace the glass bell jar onto the base plate followed by
the safety guard. Close the lid. Cycle the system.
18. When chamber pressure decreases to 9.010 -5 mBar. Press the Seal button.
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with the fixing screw. Gently pull the sample holder out with hands to make sure
the holder is secured to the shaft.
Pull out the safety pin and slowly lower the top lid to the glass chamber. Make
sure it fits properly.
Press CYCLE to begin evacuating the chamber. The high vacuum valve will
open automatically after 3-5 minutes. If pressure decreases more slowly than
expected, check the L-gasket and make sure the top lid is well positioned and
sealed.
Press DATA to scroll between deposition parameters. Set density and z
values of the metal using arrow buttons. Continue to press Data until the screen
displays rate reading.
Wait for the chamber pressure to reach 810-6 mBar, which will take about one
hour. Then add liquid nitrogen through the metal funnel until liquid nitrogen
overflows. Once chamber pressure drops to 2.010-6 mBar, you may start
deposition.
Make sure the shutter is in closed position and the shutter source control is in
remote mode.
Press both Start buttons (on the upper left corner of the panel) to start sample
holder rotation.
Turn on chamber temperature display by pressing the left button under the
temperature controller.
Switch the current selector to LT (the green LED should light up). Increase the
current very slowly and check the chamber pressure reading from time to time to
make sure it does not increase too fast. When the metal boat or rod starts to
turn red, put on protective welding goggles.
When the metal source glows brightly and the metal piece melts, press Run to
open the shutter and start deposition.
The chamber pressure at which metal starts to melt is usually below 1.010-5
mBar. The chamber pressure during metal deposition is usually below 2.010-5
mBar. If the pressure goes beyond 2.010-5 mBar, turn down the current and wait
for the pressure to drop before resume deposition.
Increase or decrease the current to adjust the deposition rate. Deposition rate of
0.02-0.20 nm/sec is recommended for better film quality and film to substrate
adhesion. A deposition rate of 0.4-0.5 nm/sec can be used if relatively thick film
is desired or the substrate is heat sensitive.
Wait for the desired film thickness to be reached. Press Run again to close the
shutter, then turn off source current and switch the current selector to OFF
position. If the chamber temperature exceeds 120 degree C during deposition,
stop deposition by switching off the source current and let the chamber cool down
to 50 degree then resume deposition.
Wait for the chamber temperature to drop to 50-60 degree C.
Stop sample rotation.
Vent the chamber and wait for two minutes.
Open the top plate and lock it in with the safety pin. Remove the sample holder.
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Clean out grease on the L-gasket and the top plate with IPA moistened wipes
Remove the safety guard. Remove the glass bell jar, invert it and put it on the
work bench. Remove vacuum grease from the L-gasket and the base plate with
IPA. Remove metal source holders (boat, rod, etc.). Vacuum metal flakes and
other particles off the turret and the base plate.
Regrease the L-gaskets. Replace the glass bell jar onto the base plate followed by
the safety guard. Seal the glass chamber with the top plate. Cycle the system.
Make sure chamber pressure decrease to 910 -5 mBar in 5 min.
Press Seal.
Z-ratio
23.17
16.68
20.20
8.17
28.94
400 C
180 C
40 C