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School of Materials Science and Engineering, Xi'an Jiaotong University, Xi'an 710049, China
The Engineering Institute, Air Force Engineering University, Xi'an 710038, China
a r t i c l e
i n f o
Article history:
Received 2 April 2008
Accepted in revised form 3 January 2009
Available online 22 January 2009
PACS:
81.15.-z
Keywords:
Nanocrystalline nickel
Coatings
Deposition rate
Hardness
Direct current deposition
a b s t r a c t
In this paper, nanocrystalline nickel (nc-Ni) coatings were prepared by a direct current electrodeposition
technique. Their microstructure and microhardness were investigated by a high-resolution transmission
electron microscopy and a microhardness tester. It is found that the electrodeposition parameters,
including content of C7H4NO3SNa2H2O, temperature and current density, have signicant inuences on
the electrodeposition rate and microhardness of nc-Ni coatings. The electrodeposition rate increases with
the current density stepwise. The largest electrodeposition rate is achieved at 60 C. It decrease when the
temperature is larger than 60 C. The electrodeposition rate decreases with the increased content of
C7H4NO3SNa2H2O. The microhardnesses of the nc-Ni coatings are higher on the condition of the larger
current density, lower temperature or higher content of C7H4NO3SNa2H2O. But, it remains stable when the
current density is in the range of 7001000 A m 2. The relationship between the mean grain sizes and
microhardness ts for the HallPetch function, approximately.
2009 Elsevier B.V. All rights reserved.
1. Introduction
The synthesis of nanostructured materials through electrodeposition has seen advances from a laboratory scale phenomenon to one
of practical industrial relevance. Potentially there are a very large
number of pure metals, alloys, composites, and ceramics which can be
electrodeposited with grain sizes less than 100 nm, for example, Ni,
Co, Pd, Cu, NiP, NiFe, NiW, ZnNi, NiFeCr and NiSiC [13].
Among the electrodeposited nanocrystalline materials, great attention
had been paid to nanocrystalline nickel (nc-Ni) coatings due to the
high brightness, high hardness and high corrosion resistance ability.
Erb et al. prepared nc-Ni coatings by a electropulsing deposition
method [4,5]. Imre et al. studied the nc-Ni coatings prepared by a
direct current deposition [6]. Because of the complex preparation
process, there are great differences in above investigations [714].
In order to obtain a nc-Ni coating with high quality, it is necessary
to control the electrodeposition parameters (such as, current density,
current efciency and time) and to understand the relationship between the electrodeposition parameters and the properties of nc-Ni
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Table 1
Composition of the electrodeposition solutions, the remaining is distilled water (unit:
g L 1)
Number
NiSO47H2O
NiCl26H2O
H3BO3
C12H25OSO2Na
C7H4NO3SNa2H2O
No. 1
No. 2
300
300
45
45
40
40
0.05
0.05
3
5
the matrix. The deposition rates were estimated by the ratio of the
thickness to the time. The hardness of the coatings was determined
by a MH-5 type microhardness tester. The applied load was 50 g and
the loading time was 5 s.
3. Results and discussion
3.1. Microstructure of nc-Ni coatings
Fig. 1(a) shows the mean grain sizes of nc-Ni coatings deposited
at different current densities. The deposition temperature is 60 C.
The grain size of nc-Ni deposited in No. 1 solution increases with the
increase of current density till 900 A m 2. Then the grain size decreases when the current density is greater than 900 A m 2. For No. 2
solution, the grain size decreases with the current density, similar to
Rashidi's results [15]. The decrease of grain size can be explained by
Tafel formula [1]. Overpotential of cathode increases with increase of
the current density. Therefore, the driving force of nucleation is en-
Fig. 1. (a) Mean grain sizes of nc-Ni at various current densities. The deposition
temperature is 60 C. (b)Relationships between the mean grain sizes of nc-Ni and
temperature of solutions. The current density is 1300 A m 2.
hanced and nucleation rate increases. As a result, the grain size decreases. Also, hydrogen evolution is inevitable in the cathode [2].
Hydrogen can provide more crystal nucleus during the reduction
reaction. It may lead to ne Ni grains. Fig. 1(b) illustrates the mean
grain sizes of nc-Ni at different temperatures. The current density is
1300 A m 2. It can be found that the grain size is larger at higher
temperatures. The temperature of the solutions is of particular importance in controlling the grain sizes. At higher temperatures, the
Ni ions can diffuse in longer distance. The growth rate of grain may
be larger than the nucleation rate. Therefore, the mean grain size
increases with the temperature [14]. According to the above results,
it can be concluded that the grain size of nc-Ni is in the range of 14
85 nm, no matter what electrodeposition condition was applied.
Furthermore, the effect of the temperature on the grain size is larger
than that of current density [1518].
Fig. 2(a) shows the a bright TEM eld image of a nc-Ni coating
through No. 1 solution on the condition that the applied current
density and temperature are 1300 A m 2 and 60 C, respectively. The
inserted gure is its diffraction image. It can be seen that the grain size
of the nc-Ni coating is about 30 nm. Fig. 2(b) is a HRTEM image. The
grain boundary of the grains is clear, characterized by a high-angle
boundary.
Fig. 2. A bright eld image and diffraction pattern (a) and a high-resolution electron
microscopy image (b) of a nc-Ni coating prepared through No. 1 solution, the current
density and temperature are 1300 A m 2 and 60 C, respectively.
J.-X. Kang et al. / Surface & Coatings Technology 203 (2009) 18151818
1817
ik k tE
V = 2:04910 k ik
Fig. 5. (a) Microhardness of the nc-Ni coatings deposited at various current densities.
(b) Relationship between microhardness of the nc-Ni coatings and temperatures.
Fig. 6. Relationship between the hardness and the mean grain sizes deposited at
different electrodeposition parameters.
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J.-X. Kang et al. / Surface & Coatings Technology 203 (2009) 18151818
forms and merges into the crystal lattice. Due to the obstructive
action of C7H4NO3SNa2H2O, overpotential increases when the current density increases. When the current density accumulates to
some extent, Ni2+ can break through an obstacle quickly. The process
can lead to the increase of the deposition rate. During the accumulation of current density, the current efciency decreases, and the
deposition rate keeps a constant for a while. As a result, some
terraces appear in the curve of current density vs deposition rate.
Fig. 4 shows the relationship between the temperature and the
deposition rate at 1300 A m 2. When the temperature is lower than
60 C, the deposition rate increases nonlinearly, and the acceleration
rate of the deposition rate becomes less. The deposition rate is the
largest at 60 C. When the temperature is higher than 60 C, the rate
begins to decrease.
According to Eq. (2), at a constant current density, there is a direct
relationship between the deposition rate and current efciency, rather
than temperature. When a higher current density was applied, the
solubility and electroconductivity of the salts in the electrodeposition
solutions increase with the temperature, if the temperature is lower
than 60 C. Ni2+ can diffuse to the cathode at a faster velocity. The
activity of the electrodeposition solutions enhances and the current
efciency improves. So the deposition rate increases. On the contrary,
when the temperature is higher than 60 C, the amount of evaporation
of the deposition solutions increase, and the nickel salt is easy to
decompose and nickel hydroxide is formed from the solutions. It can
result in the degradation of the cathodic polarization, the reduction
of the activity of the electrodeposition solutions and the current efciency, the decrease of the deposition rate. Therefore, the activity of
the solutions at 60 C is the largest.
From Figs. 3 and 4, the deposition rate of No. 1 is larger than that of
No. 2 at same current density and temperature. The results are caused
by different composition of the electrodeposition solutions. High
content C7H4NO3SNa2H2O can suppress the movement of Ni2+ and
reduce the activity of the solutions [1,14]. As a result, the deposition
rate decreases.
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