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MDF13N50
N-Channel MOSFET 500V, 13.0 A, 0.5
General Description
Features
Applications
VDS = 500V
VDS = 550V @ Tjmax
ID = 13.0A
@ VGS = 10V
RDS(ON) 0.5
@ VGS = 10V
Power Supply
HID
Lighting
Symbol
Drain-Source Voltage
Drain-Source Voltage @ Tjmax
Gate-Source Voltage
TC=25 C
o
VDSS
500
550
VGSS
30
13
8.2
52
41
0.33
W
W/ oC
Dv/dt
4.5
V/ns
EAS
580
mJ
TJ, Tstg
-55~150
Symbol
Rating
RJA
62.5
RJC
3.05
ID
TC=100 C
Pulsed Drain Current(1)
IDM
TC=25oC
Power Dissipation
Derate above 25 oC
Unit
VDSS @ Tjmax
Rating
PD
Thermal Characteristics
Characteristics
Thermal Resistance, Junction-to-Ambient
(1)
(1)
Unit
o
C/W
Ordering Information
Part Number
Temp. Range
Package
Packing
RoHS Status
MDF13N50TH
-55~150oC
TO-220F
Tube
Halogen Free
Symbol
Test Condition
Min
Typ
Max
Unit
Static Characteristics
Drain-Source Breakdown Voltage
BVDSS
ID = 250A, VGS = 0V
500
VGS(th)
3.0
5.0
IDSS
IGSS
RDS(ON)
gfs
Forward Transconductance
100
nA
0.39
0.5
13
33
10.4
Dynamic Characteristics
Total Gate Charge
Qg
Gate-Source Charge
Qgs
Gate-Drain Charge
Qgd
13
Input Capacitance
Ciss
1390
Crss
6.3
Output Capacitance
Coss
173
td(on)
30.2
52.8
60.8
tf
33.8
IS
13
Rise Time
tr
td(off)
nC
pF
ns
VSD
trr
IS = 13A, VGS = 0V
IF = 13A, dl/dt = 100A/s(3)
Qrr
1.4
325
ns
2.9
Note :
1. Pulse width is based on RJC & RJA and the maximum allowed junction temperature of 150C.
2. Pulse test: pulse width 300us, duty cycle2%, pulse width limited by junction temperature TJ(MAX)=150C.
3. ISD 9.0A, di/dt200A/us, VDD=50V, Rg =25, Starting TJ=25C
4. L=6.2mH, IAS=13.0A,
0.9
Vgs=5.5V
=6.0V
=6.5V
=7.0V
=8.0V
=10.0V
25
20
0.8
RDS(ON) [ ]
30
15
10
Notes
1. 250 Pulse Test
2. TC=25
0.7
0.6
VGS=10.0V
VGS=20V
0.5
0.4
5
10
15
20
10
20
25
30
35
1.2
1.8
Notes :
1. VGS = 10 V
2. ID = 5 A
1.6
BVDSS, (Normalized)
Drain-Source Breakdown Voltage
RDS(ON), (Normalized)
Drain-Source On-Resistance
15
1.4
VGS=10V
1.2
VGS=4.5V
1.0
0.8
0.6
-50
-25
25
50
75
100
125
Notes :
1. VGS = 0 V
2. ID = 250
1.1
1.0
0.9
0.8
-50
150
50
100
150
200
100
Notes :
1. VGS = 0 V
2. ID = 250
IDR
Reverse Drain Current [A]
* Notes ;
1. VDS=30V
ID [A]
10
150
25
150
10
25
-55
0.1
0.0
1
4
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
VGS [V]
3000
100V
250V
400V
Coss
2800
Note : ID = 13.0A
2600
2400
2200
Capacitance [pF]
10
Ciss
2000
1800
1600
1400
1200
800
Notes ;
1. VGS = 0 V
2. f = 1 MHz
1000
Crss
600
400
0
200
0
0
0.1
8 10 12 14 16 18 20 22 24 26 28 30 32 34 36 38 40
10
10
14
10 s
12
10
100 s
1 ms
10 ms
100 ms
DC
10
10
-1
Single Pulse
TJ=Max rated
TC=25
10
10
0
25
-2
10
-1
10
10
10
50
75
100
125
150
14000
single Pulse
RthJC = 3.0/W
TC = 25
10
12000
D=0.5
10000
0.2
Power (W)
Z JC(t),
Normalized Thermal Response
0.1
-1
10
0.05
0.02
single pulse
6000
4000
Notes :
Duty Factor, D=t1/t2
PEAK TJ = PDM * Z JC* R JC(t) + TC
R JC=3.0/W
0.01
8000
2000
-2
10
-5
10
-4
10
-3
10
-2
10
-1
10
10
0
1E-5
10
1E-3
0.01
0.1
10
1E-4
Physical Dimensions
3 Leads, TO-220F
Dimensions are in millimeters unless otherwise specified
S y mbol
A
b
b1
C
D
E
e
F
G
L
L1
Q
Q1
R
Min
4.50
0.63
1.15
0.33
15.47
9.60
Nom
Max
4.93
0.91
1.47
0.63
16.13
10.71
2.54
2.34
6.48
12.24
2.79
2.52
3.10
3.00
2.84
6.90
13.72
3.67
2.96
3.50
3.55
China
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Japan
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DISCLAIMER:
The Products are not designed for use in hostile environments, including, without limitation, aircraft, nuclear power
generation, medical appliances, and devices or systems in which malfunction of any Product can reasonably be
expected to result in a personal injury. Sellers customers using or selling Sellers products for use in such
applications do so at their own risk and agree to fully defend and indemnify Seller.
MagnaChip reserves the right to change the specifications and circuitry without notice at any time. MagnaChip does not consider responsibility
for use of any circuitry other than circuitry entirely included in a MagnaChip product.
is a registered trademark of MagnaChip
Semiconductor Ltd.