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Internal Use Only

North/Latin America
Europe/Africa
Asia/Oceania

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LED LCD TV
SERVICE MANUAL
CHASSIS : LP24B

MODEL: 32LS3510

32LS3150-TA

CAUTION

BEFORE SERVICING THE CHASSIS,


READ THE SAFETY PRECAUTIONS IN THIS MANUAL.

P/NO : MFL67452813 (1204-REV00)

Printed in Korea

CONTENTS

CONTENTS . ............................................................................................. 2
SAFETY PRECAUTIONS ......................................................................... 3
SERVICING PRECAUTIONS..................................................................... 4
SPECIFICATION........................................................................................ 6
ADJUSTMENT INSTRUCTION................................................................. 9
TROUBLESHOOTING GUIDE................................................................. 13
BLOCK DIAGRAM................................................................................... 16
EXPLODED VIEW .................................................................................. 17
SCHEMATIC CIRCUIT DIAGRAM ..............................................................

Copyright
LG Electronics. Inc. All rights reserved.
Only for training and service purposes

-2-

LGE Internal Use Only

SAFETY PRECAUTIONS
IMPORTANT SAFETY NOTICE
Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by
in the
Schematic Diagram and Exploded View.
It is essential that these special safety parts should be replaced with the same components as recommended in this manual to prevent
Shock, Fire, or other Hazards.
Do not modify the original design without permission of manufacturer.

General Guidance

Leakage Current Hot Check (See below Figure)


Plug the AC cord directly into the AC outlet.

An isolation Transformer should always be used during the


servicing of a receiver whose chassis is not isolated from the AC
power line. Use a transformer of adequate power rating as this
protects the technician from accidents resulting in personal injury
from electrical shocks.
It will also protect the receiver and it's components from being
damaged by accidental shorts of the circuitry that may be
inadvertently introduced during the service operation.
If any fuse (or Fusible Resistor) in this TV receiver is blown,
replace it with the specified.
When replacing a high wattage resistor (Oxide Metal Film Resistor,
over 1 W), keep the resistor 10 mm away from PCB.
Keep wires away from high voltage or high temperature parts.

Do not use a line Isolation Transformer during this check.


Connect 1.5 K / 10 watt resistor in parallel with a 0.15 uF capacitor
between a known good earth ground (Water Pipe, Conduit, etc.)
and the exposed metallic parts.
Measure the AC voltage across the resistor using AC voltmeter
with 1000 ohms/volt or more sensitivity.
Reverse plug the AC cord into the AC outlet and repeat AC voltage
measurements for each exposed metallic part. Any voltage
measured must not exceed 0.75 volt RMS which is corresponds to
0.5 mA.
In case any measurement is out of the limits specified, there is
possibility of shock hazard and the set must be checked and
repaired before it is returned to the customer.

Leakage Current Hot Check circuit

Before returning the receiver to the customer,


always perform an AC leakage current check on the exposed
metallic parts of the cabinet, such as antennas, terminals, etc., to
be sure the set is safe to operate without damage of electrical
shock.

Leakage Current Cold Check(Antenna Cold Check)

With the instrument AC plug removed from AC source, connect an


electrical jumper across the two AC plug prongs. Place the AC
switch in the on position, connect one lead of ohm-meter to the AC
plug prongs tied together and touch other ohm-meter lead in turn to
each exposed metallic parts such as antenna terminals, phone
jacks, etc.
If the exposed metallic part has a return path to the chassis, the
measured resistance should be between 1 M and 5.2 M.
When the exposed metal has no return path to the chassis the
reading must be infinite.
An other abnormality exists that must be corrected before the
receiver is returned to the customer.

Copyright
LG Electronics. Inc. All rights reserved.
Only for training and service purposes

-3-

LGE Internal Use Only

SERVICING PRECAUTIONS
CAUTION: Before servicing receivers covered by this service
manual and its supplements and addenda, read and follow the
SAFETY PRECAUTIONS on page 3 of this publication.
NOTE: If unforeseen circumstances create conflict between the
following servicing precautions and any of the safety precautions
on page 3 of this publication, always follow the safety precautions.
Remember: Safety First.
General Servicing Precautions
1. Always unplug the receiver AC power cord from the AC power
source before;
a. Removing or reinstalling any component, circuit board module or any other receiver assembly.
b. Disconnecting or reconnecting any receiver electrical plug or
other electrical connection.
c. Connecting a test substitute in parallel with an electrolytic
capacitor in the receiver.
CAUTION: A wrong part substitution or incorrect polarity
installation of electrolytic capacitors may result in an explosion hazard.
2. Test high voltage only by measuring it with an appropriate
high voltage meter or other voltage measuring device (DVM,
FETVOM, etc) equipped with a suitable high voltage probe.
Do not test high voltage by "drawing an arc".
3. Do not spray chemicals on or near this receiver or any of its
assemblies.
4. Unless specified otherwise in this service manual, clean
electrical contacts only by applying the following mixture to the
contacts with a pipe cleaner, cotton-tipped stick or comparable
non-abrasive applicator; 10 % (by volume) Acetone and 90 %
(by volume) isopropyl alcohol (90 % - 99 % strength)
CAUTION: This is a flammable mixture.
Unless specified otherwise in this service manual, lubrication of
contacts in not required.
5. Do not defeat any plug/socket B+ voltage interlocks with which
receivers covered by this service manual might be equipped.
6. Do not apply AC power to this instrument and/or any of its
electrical assemblies unless all solid-state device heat sinks are
correctly installed.
7. Always connect the test receiver ground lead to the receiver
chassis ground before connecting the test receiver positive
lead.
Always remove the test receiver ground lead last.
8. Use with this receiver only the test fixtures specified in this
service manual.
CAUTION: Do not connect the test fixture ground strap to any
heat sink in this receiver.
Electrostatically Sensitive (ES) Devices
Some semiconductor (solid-state) devices can be damaged easily by static electricity. Such components commonly are called
Electrostatically Sensitive (ES) Devices. Examples of typical ES
devices are integrated circuits and some field-effect transistors
and semiconductor chip components. The following techniques
should be used to help reduce the incidence of component damage caused by static by static electricity.
1. Immediately before handling any semiconductor component or
semiconductor-equipped assembly, drain off any electrostatic
charge on your body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging
wrist strap device, which should be removed to prevent potential shock reasons prior to applying power to the unit under test.

Copyright
LG Electronics. Inc. All rights reserved.
Only for training and service purposes

2. After removing an electrical assembly equipped with ES


devices, place the assembly on a conductive surface such as
aluminum foil, to prevent electrostatic charge buildup or exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES
devices.
4. Use only an anti-static type solder removal device. Some solder
removal devices not classified as anti-static can generate
electrical charges sufficient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate
electrical charges sufficient to damage ES devices.
6. Do not remove a replacement ES device from its protective
package until immediately before you are ready to install it.
(Most replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or
comparable conductive material).
7. Immediately before removing the protective material from the
leads of a replacement ES device, touch the protective material
to the chassis or circuit assembly into which the device will be
installed.
CAUTION: Be sure no power is applied to the chassis or circuit,
and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise harmless motion such as the
brushing together of your clothes fabric or the lifting of your
foot from a carpeted floor can generate static electricity sufficient to damage an ES device.)
General Soldering Guidelines
1. Use a grounded-tip, low-wattage soldering iron and appropriate
tip size and shape that will maintain tip temperature within the
range or 500 F to 600 F.
2. Use an appropriate gauge of RMA resin-core solder composed
of 60 parts tin/40 parts lead.
3. Keep the soldering iron tip clean and well tinned.
4. Thoroughly clean the surfaces to be soldered. Use a mall wirebristle (0.5 inch, or 1.25 cm) brush with a metal handle.
Do not use freon-propelled spray-on cleaners.
5. Use the following unsoldering technique
a. Allow the soldering iron tip to reach normal temperature.
(500 F to 600 F)
b. Heat the component lead until the solder melts.
c. Quickly draw the melted solder with an anti-static, suctiontype solder removal device or with solder braid.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
6. Use the following soldering technique.
a. Allow the soldering iron tip to reach a normal temperature
(500 F to 600 F)
b. First, hold the soldering iron tip and solder the strand against
the component lead until the solder melts.
c. Quickly move the soldering iron tip to the junction of the
component lead and the printed circuit foil, and hold it there
only until the solder flows onto and around both the component lead and the foil.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
d. Closely inspect the solder area and remove any excess or
splashed solder with a small wire-bristle brush.

-4-

LGE Internal Use Only

IC Remove/Replacement
Some chassis circuit boards have slotted holes (oblong) through
which the IC leads are inserted and then bent flat against the circuit foil. When holes are the slotted type, the following technique
should be used to remove and replace the IC. When working with
boards using the familiar round hole, use the standard technique
as outlined in paragraphs 5 and 6 above.

3. Solder the connections.


CAUTION: Maintain original spacing between the replaced
component and adjacent components and the circuit board to
prevent excessive component temperatures.
Circuit Board Foil Repair
Excessive heat applied to the copper foil of any printed circuit
board will weaken the adhesive that bonds the foil to the circuit
board causing the foil to separate from or "lift-off" the board. The
following guidelines and procedures should be followed whenever
this condition is encountered.

Removal
1. Desolder and straighten each IC lead in one operation by
gently prying up on the lead with the soldering iron tip as the
solder melts.
2. Draw away the melted solder with an anti-static suction-type
solder removal device (or with solder braid) before removing
the IC.
Replacement
1. Carefully insert the replacement IC in the circuit board.
2. Carefully bend each IC lead against the circuit foil pad and
solder it.
3. Clean the soldered areas with a small wire-bristle brush.
(It is not necessary to reapply acrylic coating to the areas).

At IC Connections
To repair a defective copper pattern at IC connections use the
following procedure to install a jumper wire on the copper pattern
side of the circuit board. (Use this technique only on IC connections).

"Small-Signal" Discrete Transistor


Removal/Replacement
1. Remove the defective transistor by clipping its leads as close
as possible to the component body.
2. Bend into a "U" shape the end of each of three leads remaining
on the circuit board.
3. Bend into a "U" shape the replacement transistor leads.
4. Connect the replacement transistor leads to the corresponding
leads extending from the circuit board and crimp the "U" with
long nose pliers to insure metal to metal contact then solder
each connection.
Power Output, Transistor Device
Removal/Replacement
1. Heat and remove all solder from around the transistor leads.
2. Remove the heat sink mounting screw (if so equipped).
3. Carefully remove the transistor from the heat sink of the circuit
board.
4. Insert new transistor in the circuit board.
5. Solder each transistor lead, and clip off excess lead.
6. Replace heat sink.
Diode Removal/Replacement
1. Remove defective diode by clipping its leads as close as possible to diode body.
2. Bend the two remaining leads perpendicular y to the circuit
board.
3. Observing diode polarity, wrap each lead of the new diode
around the corresponding lead on the circuit board.
4. Securely crimp each connection and solder it.
5. Inspect (on the circuit board copper side) the solder joints of
the two "original" leads. If they are not shiny, reheat them and if
necessary, apply additional solder.

1. Carefully remove the damaged copper pattern with a sharp


knife. (Remove only as much copper as absolutely necessary).
2. carefully scratch away the solder resist and acrylic coating (if
used) from the end of the remaining copper pattern.
3. Bend a small "U" in one end of a small gauge jumper wire and
carefully crimp it around the IC pin. Solder the IC connection.
4. Route the jumper wire along the path of the out-away copper
pattern and let it overlap the previously scraped end of the
good copper pattern. Solder the overlapped area and clip off
any excess jumper wire.
At Other Connections
Use the following technique to repair the defective copper pattern
at connections other than IC Pins. This technique involves the
installation of a jumper wire on the component side of the circuit
board.
1. Remove the defective copper pattern with a sharp knife.
Remove at least 1/4 inch of copper, to ensure that a hazardous
condition will not exist if the jumper wire opens.
2. Trace along the copper pattern from both sides of the pattern
break and locate the nearest component that is directly connected to the affected copper pattern.
3. Connect insulated 20-gauge jumper wire from the lead of the
nearest component on one side of the pattern break to the lead
of the nearest component on the other side.
Carefully crimp and solder the connections.
CAUTION: Be sure the insulated jumper wire is dressed so the
it does not touch components or sharp edges.

Fuse and Conventional Resistor


Removal/Replacement
1. Clip each fuse or resistor lead at top of the circuit board hollow
stake.
2. Securely crimp the leads of replacement component around
notch at stake top.

Copyright
LG Electronics. Inc. All rights reserved.
Only for training and service purposes

-5-

LGE Internal Use Only

SPECIFICATION

NOTE : Specifications and others are subject to change without notice for improvement.

1. Application range

3. Test method

This specification is applied to the LP24B chassis.

1) Performance: LGE TV test method followed


2) Demanded other specification
- Safety : CE, IEC specification
- EMC : CE, IEC

2. Requirement for Test

Each part is tested as below without special appointment.


1) Temperature: 25 C 5 C(77 F 9 F), CST: 40 C 5 C
2) Relative Humidity: 65 % 10 %
3) Power Voltage
: Standard input voltage (AC 100-240 V~, 50/60 Hz)
* Standard Voltage of each products is marked by models.
4) Specification and performance of each parts are followed
each drawing and specification by part number in
accordance with BOM.
5) The receiver must be operated for about 5 minutes prior to
the adjustment.

4. Model General Specification


No.

Item

Specification

Remarks

1.

Market

NON EU

2.

Broadcasting system

1) PAL/SECAM B/G/D/K
2) PAL-I/II
3) NTSC-M

3.

Channel Storage

E2-C69
S21~S47

4.

Receiving system

Upper Heterodyne

5.

Video Input

PAL, SECAM, NTSC

Rear (1EA)

6.

Component Input

Y/Cb/Cr, Y/Pb/Pr

Rear (1EA)

7.

USB Input

MP3, JPEG

Side(1EA)

8.

AV Audio Output

RF/AV/HDMI Audio Output

Rear (1EA)

PAL

NTSC
2~78
1~71

China(DK)
C1~C62
S1~S41

9.

D-SUB INPUT

S/W Upgrade Only

Rear (1EA)

10.

HDMI Input

HDMI-DTV, Only PCM MODE

Rear (1EA)

11.

Audio Input (1EA)

AV&Component

L/R Input(1EA)

Copyright
LG Electronics. Inc. All rights reserved.
Only for training and service purposes

-6-

LGE Internal Use Only

5. Component Video Input (Y, PB, PR)


No.

Resolution

H-freq(kHz)

V-freq(Hz)

Pixel clock(MHz)

Proposed

1.

720*480

15.73

59.94

13.500

SDTV, DVD 480I(525I)

2.

720*480

15.75

60.00

13.514

SDTV, DVD 480I(525I)

3.

720*576

15.625

50.00

13.500

SDTV, DVD 576I(625I) 50Hz

4.

720*480

31.47

59.94

27.000

SDTV 480P

5.

720*480

31.50

60.00

27.027

SDTV 480P

6.

720*576

31.25

50.00

27.000

SDTV 576P 50Hz

7.

1280*720

44.96

59.94

74.176

HDTV 720P

8.

1280*720

45.00

60.00

74.250

HDTV 720P

9.

1280*720

37.50

50.00

74.25

HDTV 720P 50Hz

10.

1920*1080

28.125

50.00

74.250

HDTV 1080I 50Hz,

11.

1920*1080

33.72

59.94

74.176

HDTV 1080I

12.

1920*1080

33.75

60.00

74.25

HDTV 1080I

13.

1920*1080

56.25

50

148.5

HDTV 1080P

14.

1920*1080

67.432

59.94

148.350

HDTV 1080P

15.

1920*1080

67.5

60.00

148.5

HDTV 1080P

6. HDMI Input
6.1. PC Mode

* Spec. out but it can be shown the picture at only HDMI/DVI IN 1 via DVI to HDMI Cable

No.

H-freq(kHz)

V-freq.(Hz)

Pixel clock(MHz)

1.

640480

Resolution

31.469

59.94

25.17

VESA(VGA)

Proposed

2.

800600

37.879

60.317

40.00

VESA(SVGA)

3.

1024768

48.363

60.004

65.00

VESA(XGA)

4.

1280768

47.776

59.87

79.5

VESA(WXGA)

5.

1360768

47.72

59.799

84.62

VESA(WXGA)

1366768

47.7

60.00

84.62

WXGA

7.

12801024

63.595

60.00

108.875

SXGA

8.

19201080

66.647

59.988

138.625

WUXGA

Remarks

* Monitor Range Limits


Min Vertical Freq - 58 Hz / Max Vertical Freq - 63 Hz
Min Horiz. Freq - 28 kHz / Max Horiz. Freq - 68 kHz
Pixel Clock - 150 MHz

Copyright
LG Electronics. Inc. All rights reserved.
Only for training and service purposes

-7-

LGE Internal Use Only

6.2. DTV Mode


No.

H-freq(kHz)

V-freq.(kHz)

Pixel clock(MHz)

1.

720*480

Resolution

15.73

59.94

13.500

SDTV, DVD 480I(525I)

Proposed

2.

720*480

15.75

60.00

13.514

SDTV, DVD 480I(525I)

3.

720*576

15.625

50.00

13.500

SDTV, DVD 576I(625I) 50Hz

4.

720*480

31.47

59.94

27

SDTV 480P

5.

720*480

31.5

60.00

27.027

SDTV 480P

6.

720*576

31.25

50.00

27

SDTV 576P

7.

1280*720

44.96

59.94

74.176

HDTV 720P

8.

1280*720

45

60.00

74.25

HDTV 720P

9.

1280*720

37.5

50.00

74.25

HDTV 720P

10.

1920*1080

28.125

50.00

74.25

HDTV 1080I

11

1920*1080

33.72

59.94

74.176

HDTV 1080I

12

1920*1080

33.75

60.00

74.25

HDTV 1080I

13

1920*1080

56.25

50.00

148.5

HDTV 1080P

14

1920*1080

67.432

59.94

148.350

HDTV 1080P

15

1920*1080

67.5

60.00

148.5

HDTV 1080P

16

1920*1080

27

24.00

74.25

HDTV 1080P

17

1920*1080

33.75

30.00

74.25

HDTV 1080P

18

1920*1080

26.97

23.97

74.25

HDTV 1080P

19

1920*1080

33.716

29.976

74.25

HDTV 1080P

Copyright
LG Electronics. Inc. All rights reserved.
Only for training and service purposes

-8-

Remarks
Spec. out but display.

LGE Internal Use Only

ADJUSTMENT INSTRUCTION
1. Application Range

3) Click the Config. button and Change speed


I2C Speed setting : 350Khz~400Khz

This specification sheet is applied to all of the LED LCD TV


with LP24B chassis.

2. Designation

(1) Because this is not a hot chassis, it is not necessary to


use an isolation transformer. However, the use of isolation
transformer will help protect test instrument.
(2) Adjustment must be done in the correct order.
(3) The adjustment must be performed in the circumstance of
25 C 5 C of temperature and 65 % 10 % of relative
humidity if there is no specific designation.
(4) The input voltage of the receiver must keep 100-220 V,
50/60Hz.
(5) The standard signal level is approved in 65 dBV 1 dBV.
(6) The receiver must be operated for over 5 minutes prior to
the adjustment when module is in the circumstance of
above 15 C.
In case of keeping module is in the circumstance of 0
C, it should be placed in the circumstance of above 15
C for 2 hours.
In case of keeping module is in the circumstance of
below -20 C, it should be placed in the circumstance of
above 15 C for 3 hours.

4) Read and write bin file


Click (1)Read tab, and then load download file(XXXX.
bin) by clicking Read.

3. PCB assembly adjustment method

5) Click (2)Auto tab and set as below


6) Click (3)Run.
7) After downloading, you can see the (4)Pass message.

3.1. Mstar Main S/W program download


3.1.1. Using D/L Jig

(1) Preliminary steps


1) Connect the download jig to D-sub(JK201) Jack.

3.1.2. Using the Memory Stick

(2) Download steps


1) Execute ISP Tool program, the main window(Mstar ISP
utility Vx.x.x) will be opened.
2) Click the Connect button and confirm Dialog Box.

Copyright
LG Electronics. Inc. All rights reserved.
Only for training and service purposes

-9-

** USB DOWNLOAD : Service Mode


1) Insert the USB memory Stick to the USB port. (The file
name of bin file should start as M8R. and Bin file
should not be encrypted)
2) Automatically detect the bin file and ask download or not.

LGE Internal Use Only

3.4. ADC Calibration

3) Press OK key then Message will be changed as below.

3.4.1. ADC Calibration-Component

(Using External pattern)


* Required Equipments
Remote controller for adjustment
MSPG-925F/MSPG-1025/MSPG-3233 Pattern Generator

4) Plug off and on TV set, then you can see downloading


process.

3.4.2. Process

(1) Change the Input to Component mode.


(2) Input the Component 480P@60 Hz 100% color Bar Y Pb
Pr signal into Component. (MSPG-925F Model: 212/
Pattern: 65)

5) Then, Plug off and on TV set again, and Download is


finished

3.2. Input tool option.

- Adjust tool option refer to the BOM.


Tool Option Input : PCBA Check Process
Area Option Input : Set Assembly Process

(3) Press ADJ key on R/C for adjustment.


(4) Enter Password number. Password is 0413.
(5) Select Auto-RGB and press OK() key.
(6) ADC adjustment is executed automatically.
(7) W hen ADC adjustment is finished, this OSD appear
COMPONENT - OK.

- After Input Tool Option and AC off


Before PCBA check, you have to change the Tool option and
have to AC off/on (Plug out and in)
(If missing this process, set can operate abnormally)
(1) Profile : Must be changed the option value because being
different with some setting value depend on module
maker, inch and market
(2) Equipment : adjustment remote control.
(3) Adjustment method
- T he input methods are same as other chassis. (Use
IN-START key on the Adjust Remote control.)
(If not changed the option, the input menu can differ the
model spec.)
Refer to Job Expression of each main chassis assy
(EBTxxxxxxxx) for Option value.
*Caution: Dont Press IN-STOP key after completing the
function inspection.
* Caution: D
 ont connect HDMI cable when downloading the
EDID. If the cables are connected, Downloading of
edid could be failed.

3.4.3. Confirmation

(1) Adjust by commanding AUTO_COLOR_ADJUST (0xF1)


0x00 0x02 instruction
(2) We confirm whether 0x77 (offset), 0x78 (gain) address of
EEPROM 0xBE is 0xAA or not.
(3) If 0x77, 0x78 address of EEPROM 0xBE isnt 0xAA,
we adjust once more
(4) W e can confirm the ADC values from 0x56~0x5B
addresses in a page 0xBE

3.4.4. EEPROM Address

3.3. EDID data

- EDID D/L method: The EDID data is automatically saved.


HD MODEL

EEPROM

Address

EEPROM Sub Address

0XBE

Red Gain

0X59

Green Gain

0X5A

Blue Gain

0X5B

Red Offset

0x56

Green Offset

0X57

00

FF

FF

FF

FF

FF

FF

00

1E

6D

01

00

01

01

01

01

10

01

16

01

03

80

A0

5A

78

0A

F3

30

A4

54

46

96

26

Blue Offset

0X58

20

0F

49

4B

21

08

00

45

40

01

01

61

40

01

01

01

01

30

01

01

01

01

01

01

01

1D

00

72

51

D0

1E

20

6E

28

40

55

00

C4

8E

21

00

00

1E

1B

21

50

A0

51

00

1E

30

50

48

88

35

00

BC

77

21

00

00

1C

00

00

00

FC

00

4C

60

47

20

54

56

0A

20

20

20

20

20

20

20

00

00

00

FD

70

00

3A

3F

1C

44

0F

00

0A

20

20

20

20

20

20

01

A6

80

02

03

25

F1

4F

84

07

01

16

02

03

11

12

13

14

05

90

20

22

1F

10

23

09

07

07

83

01

00

00

68

03

0C

00

A0

10

00

80

1E

00

01

1D

00

80

51

D0

1C

20

40

80

35

B0

00

BC

88

21

00

00

1E

8C

0A

D0

8A

20

E0

2D

10

10

C0

3E

96

00

13

8E

21

00

00

18

8C

0A

A0

14

51

F0

16

D0

00

26

7C

43

00

C4

8E

21

00

00

98

01

1D

80

18

71

E0

1C

16

20

58

2C

25

00

C4

8E

21

00

00

9E

00

00

00

F0

00

00

00

00

00

00

00

00

00

00

00

00

00

00

00

2A

Copyright
LG Electronics. Inc. All rights reserved.
Only for training and service purposes

- 10 -

LGE Internal Use Only

3.5. Check SW Version

4.2. Adjustment of White Balance.

P urpose: Adjust the color temperature to reduce the


deviation of the module color temperature.
Principle: To adjust the white balance without the saturation,
Fix the one of R/G/B gain to C0 and decrease the others.
Adjustment mode : Three modes - Cool / Medium / Warm
(Medium data is automatically calibrated by the Cool data)

3.5.1 Method

(1) Push In-star key on Adjust remote-controller.


(2) SW Version check
Check Main : Vx.xx :

Adj. condition: normal temperature


1) Surrounding Temperature: 25 C 5 C
2) Warm-up time: About 5 Min
3) Surrounding Humidity: 20 % ~ 80 %
Required Equipment
Remote controller for adjustment
Color Analyzer : CA100+ or CA-210 or same product - LCD
TV(CH: 9), (should be used in the calibrated ch by CS-1000)
Auto W/B adjustment instrument (only for Auto adjustment)

4.2.1. Connecting diagram of equipment for measuring


(For Automatic Adjustment)

4. SET assembly adjustment method


4.1. Input Area-Option

(1) Profile : Must be changed the Area option value because


being different of each Countrys
(2) Equipment : adjustment remote control.
(3) Adjustment method
- T he input methods are same as other chassis.(Use
IN-START key on the Adjust Remote control.)
R efer to Job Expression of each main chassis assy
(EBTxxxxxxxx) for Option value.
Tool Option
Area Option
Module 0 : CMI
Lang Group 0 : NONEU A
Maker
1 : THTF
1 : NONEU H
2 : LPL
2 : NONEU ALL
Inch
0 : 22 (Default)
Def. Lang
0 : ENGLISH
1 : 23
1 : CHINESE
2 : 32
2 : ESPANOL
3 : PORTUGUES
Frame 0 : LK230 (Default) TTX Group 0 : OFF
1 : ON
Module 0 : Rev.0 (Default)
I II SAVE
0 : OFF
Rev.
1 : Rev.1
1 : ON
HDEV
MONO
BlueBack
Country

Copyright
LG Electronics. Inc. All rights reserved.
Only for training and service purposes

(1) Enter the adjustment mode of DDC


22Set command delay time : 50ms
Enter the DDC adjustment mode at the same time heatrun mode when pushing the power on by power only key)
Maintain the DDC adjustment mode with same condition
of Heat-run Maintain after AC off/on in status of Heatrun pattern display
(2) Release the DDC adjustment mode
Release the adjust mode after AC off/on or std-by off/on
in status of finishing the Hear-run mode.
Release the Adjust mode when receiving the aging off
command(WB 00 FF) from adjustment equipment.
Need to transmit the aging off command to TV set after
finishing the adjustment.
Check DDC adjust mode release by exit key and release
DDC adjust mode.
(3) Enter the adjust mode of white balance
Enter the white balance adjustment mode with aging
command(F3, 00, 00).
(4) Release the adjust mode of white balance
Enter the white balance adjustment mode with aging
command(F3, 00, FF)
* Luminance min value is 150cd in the Cool/Medium/Warm
mode(For LCD)

- 11 -

LGE Internal Use Only

4.3. Adjustment of White Balance

(for Manual adjustment)


C olor analyzer(CA100+, CA210) should be used in the
calibrated ch by CS-1000
Operate the zero-calibration of the CA100+ or CA-210, then
stick sensor to the module when adjusting.
For manual adjustment, it is also possible by the following
sequence.
1) Select white pattern of heat-run by pressing POWER
ON key on remote control for adjustment then operate
heat run longer than 5 minutes. (If not executed this
step, the condition for W/B may be different.)
2) Push Exit key.
3) Change to the AV mode by remote control.
4) Input external pattern (85% white pattern)
5) Push the ADJ key two times (entering White Balance
mode) Enter 0413 (Password)
6) Stick the sensor to the center of the screen and select
each items (Red/Green/Blue Gain and Offset) using
/(CH +/-) key on R/C..
7) Adjust R/ G/ B Gain using /(VOL +/-) key on R/C.
8) Adjust three modes all (Cool / Medium / Warm) : Fix the
one of R/G/B gain and change the others
9) When adjustment is completed, Exit adjustment mode
using EXIT key on R/C.
* CASE
First adjust the coordinate far away from the target value(x, y).
1) x, y > target
i) Decrease the R, G.
2) x, y < target
i) First decrease the B gain,
ii) Decrease the one of the others.
3) x > target , y < target
i) First decrease B, so make y a little more than the target.
ii) Adjust x value by decreasing the R
4) x < target , y > target
i) First decrease B, so make x a little more than the target.
ii) Adjust x value by decreasing the G

3) 22 Lamp (CMI & THTF)


(Small size inchs color coordinate is different from
others, So use below table)
Mode
Cool
Medium
Warm

Color coordinate
x
y
0.280 0.002 0.283 0.002
0.290 0.002 0.295 0.002
0.308 0.002 0.319 0.002

Temp

uv

9,300 K
8,000 K
6,500 K

0.000
0.000
0.000

4) W/B table in process of time which must be applied for


LGD edge LED module (Target color coordinate is
different by aging time)
CA210 : CH 14, Test signal : Inner pattern (85IRE)
Aging time
(Min)
0-2 Minutes
3-5 Minutes
6-9 Minutes
10-19 Minutes
20-35 Minutes
36-49 Minutes
50-79 Minutes
80-149 Minutes
More than 150 Minutes

Cool
X
y
269
273
279
288
278
286
277
285
276
283
274
280
272
277
271
275
270
274
269
273

Medium
x
y
285
293
295
308
294
306
293
305
292
303
290
300
288
297
287
295
286
294
285
293

Warm
x
y
313
329
319
338
318
336
317
335
316
333
314
330
312
327
311
325
310
324
313
329

To check the Coordinates of White Balance, you have to


measure at the below conditions.
Picture Mode : Vivid(User)
Dynamic Contrast : Off , Dynamic Colour : Off
(If you miss the upper condition, the coordinates of W/B
can be lower than the spec.)

Standard color coordinate and temperature when using the


CA100+ or CA210 equipment (Small size inchs color
coordinate is different from others, So use below table)
1) All Edge LED(except LGD), lamp over 26 and None
Edge LED(LGD Direct LED 42inch) and LGD Edge LED
26inch Over
Mode
Cool
Medium
Warm

Color coordinate
x
y
0.271 0.002 0.276 0.002
0.287 0.002 0.296 0.002
0.315 0.002 0.332 0.002

Temp

uv

13,000 K
9,300 K
6,500 K

0.000
0.000
0.003

2) 22 TN Edge LED
(Small size inchs color coordinate is different from
others, so use below table)
Color coordinate
Mode
Temp
uv
x
y
Cool
0.287 0.002 0.296 0.002 9,300 K
0.000
Medium 0.297 0.002 0.308 0.002 8,000 K
0.000
Warm
0.315 0.002 0.332 0.002 6,500 K
0.003

Copyright
LG Electronics. Inc. All rights reserved.
Only for training and service purposes

- 12 -

LGE Internal Use Only

TROUBLE SHOOTING
No power
(LED indicator off)

Check 24V, 12V, 3.5V


of Power B/D

: [A] Process (for non-adapter models)

Fail

Check short of Main B/D


or Change Power B/D

Pass

Check Output of
IC701, IC702, IC705,
IC704, IC709

Fail

Check short of
IC701, IC702, IC705,
IC704, IC709

Pass

Fail
Re-soldering or Change defect part

Pass
Check Output of Q720

Check LED Assy

Fail

Change LED Assy

Pass

Check P400 Connector

No power
(LED indicator off)

Check output of adapter


(JK700 : 24V)

: [A-1] Process (for adapter models)

Fail

Check short of Main B/D


or Change adapter

Pass

Check Output of
IC701, IC702, IC704,
IC705, IC706,IC707,IC708,
IC709,IC800

Fail

Check short of
IC701, IC702, IC704,
IC705, IC706,IC707,IC708,
IC709,IC800

Pass

Fail
Re-soldering or Change defect part

Pass
Check Output of Q720

Check LED Assy

Fail

Change LED Assy

Pass

Check P400 Connector

Copyright
LG Electronics. Inc. All rights reserved.
Only for training and service purposes

- 13 -

LGE Internal Use Only

: [B] Process

No Raster

Check LED status


On Display Unit

Fail

Repeat [A]/[A-1] Process

Pass

Check Panel Link Cable


Or Module

Fail

Change Panel Link Cable


Or Module

Fail

Change Inverter Connector


Or Inverter

Pass

Check Inverter Connector


Or Inverter
Pass

Check PANEL_VCC of LVDS wafer

Fail

Check Output of Q720

Pass
Fail

Check LVDS Cable

Change LVDS Cable

No Raster on HDMI Signal

No Raster on COMPONENT Signal

Pass

Pass

Check Input source


Cable And Jack

Check Input source


Cable And Jack

Pass
Pass

Check The Input/Output


Of JK101

Check the Input/Output


Of JK203
Fail

Re-soldering or
Change the defect part

Check the Input/Output


Of IC501
Fail

Re-soldering or
Change the defect part

Fail

Re-soldering or
Change the defect part

Pass

Pass

Check the Input/Output


Of IC501

Fail

Pass

Re-soldering or
Change the defect part

Repeat [A]/[A-1], & [B] Process

Pass

Repeat [A]/[A-1], & [B] Process

Copyright
LG Electronics. Inc. All rights reserved.
Only for training and service purposes

- 14 -

LGE Internal Use Only

No Raster On AV Video Signal

No Signal On TV(RF) Signal

Pass

Pass

Check Input source


Cable And Jack

Check Input source


Cable And Jack

Pass

Check The Input/Output


Of JK101

Pass

Fail

Re-soldering or
Change the defect part

Check The Input/Output


Of TU401

Pass

Check the Input/Output


Of IC501

Fail

Re-soldering or
Change the defect part

Pass

Fail

Re-soldering or
Change the defect part

Check the Input/Output


Of IC501

Pass

Fail

Re-soldering or
Change the defect part

Pass

Repeat [A]/[A-1], & [B] Process

Repeat [A]/[A-1], & [B] Process

No Sound

Check The Input Source

Fail

Change The Source Input

Pass

Check The Input/Output


Of IC301

Fail

Re-soldering or
Change the defect part

Pass

Check The Speaker

Fail

Change Speaker

Pass

Check The Speaker Wire

Copyright
LG Electronics. Inc. All rights reserved.
Only for training and service purposes

- 15 -

LGE Internal Use Only

((

((

P301

LPF

LPF

47
48
54
53

IC301
20 21

19

18

17

Audio_SCL

D10D11

D-SUB
SCL/SDA

P9 T9

Main SCL

T8
R9
P8
R8

Main SDA

SPI_CLK
SPI_DI
SPI_CZ
SPI_DO

J15

Audio_SDA

I2S_MCLK
I2S_WS
I2S_SCK
I2S_SDO

Main_2.5V
IC702
2.5V REG

Sound AMP
NTP7500

32 33
34 35

Main_3.3V

Main_1.2V

Main_6.8V

Error Out
E16 A11 C12 B12

P Dim

H15

C15
C16
B15
B16

D1 D3

IC501

H2
K1

H3

P400

Led_PWR

Sub_SDA

Sub_SCL

J1

N2

P1

IR/KEY

B9 C11 B11 H16 F16 C10

IR

MST7833LNT

XXX

HDMI
SCL/SDA

LVDS
Output

P600

T2

OP-AMP
IC302
x4 Gain

R2

IC705
LDO

USB_5V

RF_AGC

10

A_OUT_12V

JK101

TUNER

11

IF_N
Tuner_5V

P_6.8V

IC704
LDO

B+

Tuner SDA
7 Tuner SCL

24Mhz

USB_DN
USB_DP

Audio
Out

N10

N11

T4

R3

T3

T6

R6

B13

A13

ST_3.5V

JK202

S_AMP_24V

Q710

IC701
MP20051

IC709
MP1497

IC705
To USB
IC704
To TUNER

IC503
EEPROM
24C64

IC502
Serial Flash
2Mbytes

Panel_Vcc
Q720
AO3407A

Inv. ON

24 18 22 20

A Dim

P706

KEY2

9~12

KEY1

2 3 4

Audio L-Out

Module

Audio R-Out

POWER BOARD

Common V In

- 16 Pb In

Copyright
LG Electronics. Inc. All rights reserved.
Only for training and service purposes
Pr In

P_ST 3.5V
Common L In

P_12V
Common R In

IF_P

21
19
17

BLOCK DIAGRAM

P_24V

LGE Internal Use Only

EXPLODED VIEW
IMPORTANT SAFETY NOTICE

900

* Set + Stand
* Stand Base
+ Body

A10

300

A2

A21

A4

510

A9

501

200

500

122

530

LV1

123

120

540

521

810

910

400

Many electrical and mechanical parts in this chassis have special safety-related characteristics. These
parts are identified by
in the Schematic Diagram and EXPLODED VIEW.
It is essential that these special safety parts should be replaced with the same components as
recommended in this manual to prevent X-RADIATION, Shock, Fire, or other Hazards.
Do not modify the original design without permission of manufacturer.

Copyright
LG Electronics. Inc. All rights reserved.
Only for training and service purposes

- 17 -

LGE Internal Use Only

EAX64671103
LP24B

COMPONENT / AV IN / AV AUDIO OUT


For China
E
2N3904S
Q103-*1

For China
E
2N3904S
Q104-*1

PPJ243-01

For China

For China
E

6B

[RD1]E-LUG

2N3904S
Q105-*1

2N3904S
Q106-*1

[RD1]C-SPRING

R123
ZD106
30V

4B

B
C

5B

B
C

JK101

C103
5600pF
50V

C101

1K
C
E

[RD1]CONTACT

10uF
16V

MNT_ROUT
MUTE_AOUT
NOISE

Q104
C
E

RT1C3904-T112

POP

Q103
RT1C3904-T112

5A

[WH1]C-SPRING

R124
ZD107
30V

6A

[WH1]E-LUG

C104
5600pF
50V

C102

1K
C
E

C
E

10uF
16V

MNT_LOUT

Q106
RT1C3904-T112

POP

MUTE_AOUT
NOISE

Q105
RT1C3904-T112

6G
5G

[RD3]E-LUG

[RD3]C-SPRING

4G

[RD3]CONTACT

5F

[WH2]C-SPRING

5E

[RD2]C-SPRING

7E

[RD2]E-LUG-S

5D

[BL]C-SPRING

4C

[GN]CONTACT

5C

[GN]C-SPRING

6C

R116
D105
30V

R112
220K

D104
30V

R111
220K

10K

R120
12K

READY
C105
560pF
50V

R119
12K

READY
C106
560pF
50V

R115

ZD100
SD05

R107
75

ZD101
SD05

R108
75

10K

COMMON_RIN

COMMON_LIN

COMP_PR

COMP_PB

COMMON_VIN
ZD102
SD05

R109
75

[GN]E-LUG

V-OUT Buffer(DEBUG)
P_12V

DEBUG

C
E

RT1C3904-T112
Q102
R106
47

DEBUG

JP108

MNT_VOUT

DEBUG

R101
75

E
DEBUG

R103
220

2N3904S
Q102-*1

B
C

For China

THE
SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE
SYMBOL MARK OF THE SCHEMETIC.

32CS410
INPUT1

2012/03/02
1

INPUT1

Copyright 2012 LG Electronics. Inc. All rights reserved.


Only for training and service purposes

LGE Internal Use Only

EAX64671103
LP24B

I2C Control

HDMI(REAR)
R231
1K

JK201

Q230

MMBT3904(NXP)
E

2SC3875S

5V_TUNER
HDMI_5V_DET

SHIELD

GND_2

19 HPD

RED

18 +5V_POWER

GREEN_GND

R236
10K

20

11

R235
4.7K

R237
10K

17 DDC/CEC_GND

12

DDC_DATA
GREEN

DSUB_SDA

C210
33pF
READY

ZD210
30V

H_SYNC

12 CLK-

BLUE

11 CLK_SHIELD

NC

10
9

14

V_SYNC
8
GND_1

SYNC_GND

CLK+
DATA0-

15

DDC_CLOCK
DDC_GND

16

DSUB_SCL

C211
33pF
READY

ZD211
30V

HDMI_ARC

CEC
HDMI_CKHDMI_CK+
HDMI_D0-

READY
R238
0

CEC

DATA0_SHIELD
DATA0+
DATA1-

10

DDC_SDA
DDC_SCL

15 SCL
14 NC
13 CEC

13

R232 R233
10K 10K

16 SDA

BLUE_GND

D230
KDS184S

RED_GND

A2

6630TGA004Q

A1

HPD

SPG09-DB-010

R230
10K

R234
100

CEC_C

HDMI_D0+
HDMI_D1-

DATA1_SHIELD
DATA1+

3 DATA2DATA2_SHIELD
2
DATA2+
1

HDMI_D1+
HDMI_D2HDMI_D2+

SHILED

JK203

USB(SIDE)

+5V_USB
Close to SIDE_USB

L220
C220
10uF
10V

3AU04S-305-ZC-(LG)
JK202

C221
100uF
16V

R220
0

120-ohm

AC

USB DOWN STREAM

IC202
AP2191SG-13
USB_DN

USB_DP

READY

NC

READY

D220

READY
ZD220
30V

READY
ZD221
30V

R222
510

GND

READY

OUT_2

L221

IN_1

+3.3V_M

120OHM
OUT_1

READY

IN_2

R221
1K
FLG

READY

READY

READY

R223
4.7K

C222
0.1uF
50V

C223
10uF
16V

EN

READY

THE
SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE
SYMBOL MARK OF THE SCHEMETIC.

32CS410
INPUT2

2012/03/02

INPUT2

Copyright 2012 LG Electronics. Inc. All rights reserved.


Only for training and service purposes

LGE Internal Use Only

EAX64671103
LP24B

+3.3V_M

SW_RESET
C307
1000pF
50V

R307

C311
0.1uF
16V

C312

CLK_I

GND_IO

AD

/RESET

BST1A

PGND1A

OUT1A_2

OUT1A_1

PVDD1_3

PVDD1_2

PVDD1_1

46

45

44

43

42

41

40

39

38

37

PGND1B

33

BST1B

32

VDR1

31

VCC_5

SPK_R+
SPK_R-

LF

DGND_PLL

IC301
NTP-7500L

+3.5V_ST

100

WCK

10

27

PGND2A

100

BCK

11

26

OUT2A_2

SDA

12

25

OUT2A_1

R340

C323
1uF
25V

JP301
SPK_R+

JP302
SPK_R-

1
.

C309
1uF
25V

SMAW250-H04R

P301

C326
22000pF
50V

PVDD2_3

PVDD2_2

PVDD2_1

OUT2B_2

OUT2B_1

PGND2B

SOUND_VCC

D303
1N4148W
100V
OPT

R324
12

R326
12

L305
10.0uH

C342
390pF
50V
C333

C360

0.1uF
50V

10uF
35V

D304
1N4148W
100V
OPT

C339
0.47uF
50V

L306
10.0uH

R330

0.1uF
50V

4.7K

C331

R331

0.1uF
50V

4.7K

SPEAKER_R

C337
390pF
50V
R325
12

C336

R327
12

50V
SPK_R-

R315
100

Q302
MMBT3904(NXP)

10K

SPK_L-

SPK_L-

C325
1uF
25V

JP303

SPK_R+

22000pF

HW_RESET

SPK_L+

SPK_L+

C320
22000pF
50V

24

BST2A

23

28

22

21

VDR2

SDATA

20

29

100

19

18

30

DVDD

17

AGND

C324

JP304

DGND

BST2B

+3.3V_M

R338
10K

SPK_L-

34

THERMAL
49

MONITOR2

C313
33pF
50V

C314
33pF
50V

R329
4.7K

R319
12

OUT1B_1

DVDD_PLL

SCL

READY

READY

R328
4.7K

4.7K

OUT1B_2

16

R363
I2S_SCK

100

R321

35

15

I2S_WS

R313

R317
12

C330
0.1uF
50V

36

MONITOR1

R362

AUAMP_SCL

SPEAKER_L

C322
390pF
50V

14

I2S_SDO

AUAMP_SDA

D302
1N4148W
100V
OPT

4.7K

C327
0.47uF
50V

GND_1

R361

100

C317
10uF
35V

L304
10.0uH

AVDD_PLL

MONITOR0

OPT
C310
10uF
10V

R312

C316
0.1uF
50V

R320

C329
0.1uF
50V

AGND_PLL

3.3K

/FAULT

100pF
50V

L303
10.0uH

C306
0.1uF
16V

13

C304
1000pF
50V

C301

OPT
C305
0.1uF
16V

C303
4.7uF
16V

47

16V

OPT
C302
10uF
10V

VDD_IO

[EP]

C341
10uF
10V

R318
12

R316
12
C321
390pF
50V

48

0.1uF

100

D301
1N4148W
100V
OPT

SOUND_VCC

22000pF

I2S_MCLKR360

C308

SPK_L+

50V

R306
10K
L309
BLM18PG121SN1D

C318
1000pF
50V

AUDIO_OUT AMP : GAIN X 4


IC302
AS324MTR-E1

P_12V

C350
0.1uF
16V
C

Q350
MMBT3904(NXP)
R351

1 OUT1

1K

OUT4 14

MNT_LOUT
R350
4.7K

C351
6800pF
50V

R352

C352

10K

33pF 50V

2 INPUT1-

INPUT4- 13

3 INPUT1+

INPUT4+ 12

R353
6.8K

R354

MNT_L_AMP

5.6K

P_12V

4 VCC

GND 11

C353
0.01uF
50V

R355

MNT_R_AMP

C354

5.6K

5 INPUT2+

INPUT3+ 10

6 INPUT2-

INPUT3- 9

33pF 50V

P_12V
R356

10K
R357
6.8K

C355
0.1uF
16V
C

Q351
MMBT3904(NXP)
R358

7 OUT2

1K

OUT3 8

MNT_ROUT
R359
4.7K

THE
SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE
SYMBOL MARK OF THE SCHEMETIC.

C356
6800pF
50V

32CS410
AUDIO

2012/03/02
3

AUDIO

Copyright 2012 LG Electronics. Inc. All rights reserved.


Only for training and service purposes

LGE Internal Use Only

EAX64671103
LP24B

IF

IR

TU401
TDTK-G703D
Soft/T
R420
100

SUB_SCL

SUB_SDA

NC_1

10P_S/T
P400
12507WR-10L

Soft/T
R421
100
Soft/T
ZD420
5.6V

Soft/T
ZD421
5.6V

+3.5V_ST

2
3
4

NC_2
NC_3

KEY2
R401

6
7
8
9
10
11

B+[+5V]

5V_TUNER

Near the pin


C404
0.01uF
50V

SDA

C403
10uF
10V

READY
C401
0.1uF
16V

READY
C400
0.1uF
16V

AIF+

GND

NC

GND

Non_Adapter

C422
470pF
50V

Non_Adapter

C423
470pF
50V

KEY1

KEY1

KEY1

KEY2

KEY2

KEY2

+3.5V_ST
READY

R402
4.7K

C402
100uF
16V

120-ohm
+3.5V_ST

TUNER_SDA

47

C406
47pF
50V

ST_3.5V

L424

R403
4.7K

C424
0.1uF
16V

C425
1000pF
50V

GND

ST_3.5V 6

GND

ST_3.5V 6
GND

R424
4.7K
R405

NC_5

C421
0.1uF

+3.3V_M +3.3V_M

R404

NC_4

NC

NC

RF_AGC

C405
47pF
50V

SCL

S/T_SDL

NC

15P_S/T
P402
12507WR-15L

READY

C420
0.1uF

RF_AGC

10P_S/T
R419
0

GND

L423
120-ohm
READY

S/T_SCL

L422
120-ohm

KEY1

100

R423
10K

R422
10K

10P_S/T
R418
0

12P_TACT
P401
12507WR-12L

TUNER_SCL

47

LED

10P_S/T
R415

R426
10K

READY
R406
0

LED_R

NC

NC

C426
100pF
50V
READY

IR

IR

IR

ZD422
5.6V

IR
READY
R407
0

IF_P

GND

L426
READY
C427
0.1uF
50V

120-ohm

GND

10

READY
C428
47pF
50V

11
.

NC

LED

AIF-

GND

10

NC

11

NC

12

IF_N

13
.

GND

S/T_SCL

12
S/T_SDL

10

11

12

13

14

15

SHIELD

16
.

THE
SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE
SYMBOL MARK OF THE SCHEMETIC.

32CS410
TUNER & IR

2012/03/02
4

TUNER & IR

Copyright 2012 LG Electronics. Inc. All rights reserved.


Only for training and service purposes

LGE Internal Use Only

+3.3V_M

EAX64671103
LP24B

R560

4.7K

R561

HD_Non_Mirror

+3.3V_M
R562

4.7K

4.7K

R563

HD_Non_Mirror

FHD_8Bit

R560-*1 4.7K

R561-*1 4.7K

HD_Mirror

FHD_10Bit

R562-*1

+3.3V_M

4.7K

R658

HD_Mirror

4.7K

R563-*1

FHD_8BIT

4.7K

R659

Ready

*H/W OPTION

4.7K
Ready

4.7K

MODEL_OPT1
LOW
LOW
HIGH
HIGH

HD_Non_Mirror
HD_Mirror
FHD_8BIT
FHD_10BIT

FHD_10BIT

MODEL_OPT3

MODEL_OPT2
LOW
HIGH
LOW
HIGH

MODEL_OPT2

MSTAR Vcc
ST 1.26V

L500

MODEL_OPT1

+1.2V_VDDC

VDDC

120-ohm

C501
10uF

C503
0.1uF

C502
0.1uF

C504
0.1uF

C505
0.1uF

C506
0.1uF

C500
0.1uF

DDR 2.5V
L501
VDDC

AVDD_25

AVDD_DDR

+2.5V_M

AVDD_PLL

AVDD_ST33

AVDD_DDR

120-ohm

C507
10uF

C508
0.1uF

C509
0.1uF

C511
0.1uF

C510
0.1uF

L502

N1
COMMON_LIN

C535 2.2uF

N2

2.2uF

P1

COMMON_RIN

L3

C536
C533
10uF

L506

C534
0.1uF

M4
P2
R1

120-ohm

M3
N3
N4
C532
220pF

R547
220K

MNT_L_AMP

P3
R548
100

R2
T2

MNT_R_AMP

K4

H4
AVDD_DVI

J4

AVDD_33

AVDD_DMPLL

M6

K5

L5

J5

M5

L6
AVDD_MOD_3

AVDD_MOD_4

AVDD_MOD_1

AVDD_MOD_2

AVDD_PLL

AVDD_AU33

K6

H6

J6
AVDD_AU25

AVDD_REF

N5

NC_3

AVDD_25

M11

E13

D9

G8

M10
AVDD_DDR_4

AVDD_DDR_5

AVDD_DDR_2

AVDD_DDR_1

AVDD_DDR_3

H8

J7

J8

K7

K8

L7

H7
AVDD_1P2

VDDC_1

VDDC_2

VDDC_3

VDDC_4

VDDC_5

L8

VDDC_7

VDDC_6

G13

F13

A12

K11

K10

K9

J11

J10

J9

H11

H10

H9

T7

R7

P7

P6

T5

R5

R4

P4

G3

N6
GND_16

GND_6

GND_2

GND_1

GND_15

GND_14

GND_13

GND_12

GND_11

GND_10

GND_9

GND_8

GND_7

GND_24

GND_22

GND_19

GND_18

GND_23

GND_21

GND_20

GND_17

G2

GPIO68

GIN1M

GPIO69

1.2K

C13
R504
0

EEPROM(64K)

R505
LED

C11

R506

B11

R507 100

IC503
AT24C64D-SSHM-T

100
KEY1

VSYNC1

100

B15

A0

SPI_CZ

B16

INT/GPIO65

CVBS1

GPIO63

CVBS0

GPIO64

VCOM

GPIO62

CVBSOUT

SPDIF_IN/GPIO61

AUL0

SPDIF_OUT/GPIO60

AUR0

I2S_MUTE_OUT/GPIO59

AUL1

I2S_SD_OUT/GPIO58

AUR1

I2S_BCK_OUT/GPIO57

AUVAG

I2S_MCK_OUT/GPIO56

AUREFM

I2S_WS_OUT/GPIO55

A1

SPI_DI

C15

GND

USB_DN

A14

AUR2
AUL3
AUR3
AUOUTL1
AUOUTR1
AUOUTL0

VIFP

XIN

VIFM

N13

N12

N11

N10

E15

H14

J14

E16

J15

H15

J16

L14

H16

F16

G15

D15

D16

D14

E14

F14

F15

G16

K15

L15

K16

K14

L16

M16

M15

M14

N15

N14

P16

P15

R16

R15

T15

T14

R14

P14

R13

P13

R12

T12

P12

T11

R11

P11

R10

T4

P10

T6

R6

P5

R3

T3

R564
4.7K

B9

DSUB_SCL

R513
100

+3.5V_ST

IR

R565
4.7K

HW_RESET

SERIAL FLASH(2MB)

A_DIM
PWM_DIM
R558
R535

100
100
R536

R537
100

R538
4.7K

INV_ON

C9

SPI_MACRONIX

100

R518
100

POWER_SW

R570
10K

+3.5V_ST

R517
100

+3.5V_ST

C14
N9
P9
T9
N8
P8
R9
R8
T8

R523
100

R572 SO/SIO1

SPI_DO

+3.3V_M
READY
R520
4.7K

WP#/AGC

GND

AUAMP_SDA
R522
100

C570
0.1uF
16V

HOLD#

SCLK Adapter_Model R574

C571
33pF

SW_RESET
R521
100

VCC

VCC

HOLD[IO3]

CLK

DI[IO0]

SPI_WINBOND

100
R573
100

FLASH_WP

CS#

R571
100

SPI_CZ

HDMI_5V_DET

B14

DO[IO1]

%WP[IO2]

GND

MUTE_AOUT
R519
4.7K

IC502-*1
W25Q16BVSSIG(TRAY)
CS

IC502
MX25L1606EM2I-12G

PANEL_ON

A10
B10

R515
1K

FLASH_WP

R514
1K

SI/SIO0

100
R575
100

SPI_CLK
SPI_DI

AUAMP_SCL
I2S_SDO
I2S_SCK
I2S_MCLK
I2S_WS

H/W RESET
R580
B

For China
C

33K
RL_ON

Q580
MMBT3904(NXP)

E
B

Q581-*1
MMBT3906(NXP)
E

R588
2K

ISA1530AC1
Q581

R583

P_24V

R581

R589
10K

1K

0
KDS181
D582

READY
0

R584

P_12V

R587
150

1K

D581
KDS181
R586
5.1K

C582
47uF
25V
LIFE_1000H

C582-*1
47uF
25V
LIFE_2000H

C580
4.7uF 10V

R591
100

D583
KDS181

R590
33K

HW_RESET
C581
0.1uF
16V

EEP_SDA

ERROR_OUT
EEP_SCL

MODEL_OPT3

MODEL_OPT2

MODEL_OPT1

RXO4-

RXO4+

RXO3-

RXOCKRXO3+

RXOCK+

RXO2-

RXO2+

RXO1-

RXO1+

RXO0-

RXO0+

RXE4-

RXE4+

RXE3-

RXECKRXE3+

RXECK+

RXE2+
RXE2-

RXE1-

RXE1+

RXE0-

RXE0+
IF_P

THE
SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE
SYMBOL MARK OF THE SCHEMETIC.

SUB_SDA SUB_SCL

TUNER_SDA

RXO4-

RXO4+

RXO3-

+3.5V_ST

RL_ON

RL_ON

RL_ON

+3.5V_ST

+3.5V_ST

Close to MSTAR

IF_N

+3.5V_ST

C12
A11

EEP_SDA

R579
22

C574
33pF
READY

DSUB_SDA

R511 22
R512 22

A9

D12

EEP_SCL

R578
22

SDA

R526
100

R534
10K

R533
10K
RXO3+

RXOCK-

RXOCK+

RXO2-

RXO2+

RXO1-

RXO1+

RXO0-

RXO0+

RXE4-

RXE4+

C520
0.1uF
50V

RXE3-

C519
0.1uF
50V

RXE3+

RF_AGC

RXECK-

Close to MSTAR

RXECK+

+3.3V_M

R567
33

R566
33

R529
100

R530
100

R527
R528 100
100

TUNER_SCL

C522
0.022uF
16V

RXE2-

L521
100NH

C523
0.1uF
L505
120-ohm

RXE2+

READY
C524
390pF

RXE1-

C528
33pF

For PAL

22LV2130-TD Must be applied 2000H


REASON : CAP LIFE for CST TEST

R531
100

RL_ON
R539
100

RXE1+

C529
33pF

READY
C525
390pF

R532
100

R540
10K

RXE0-

24MHz

R541
10K

RXE0+

R543
51

C573
33pF
READY

R559
0

X501

R576 R577
4.7K 4.7K

SCL

A15

D10

C572
0.01uF
50V

WP

USB_DP

A13

R585
11K 1%
READY

C530-*1
C526
120pF
0.1uF
50V
50V
For NTSC R542
C530
51
220pF
50V

AUL2

R546
220K

C527
0.1uF
50V

SPI_CLK

R582

R545
1M

VCC

SPI_DO

C16

G14

CVBS2

+3.5V_ST

KEY2

GPIO70

RIN1P

AUOUTR0

R549
100
C531
220pF

GPIO67

GIN1P

GPIO27/TTL_LVSYNC/RLV0N

M2

SOGIN1

GPIO28/TTL_LHSYNC/RLV0P

M1

GPIO66

GPIO29/TTL_LDE/RLV1N

0.047uF

MNT_VOUT

BIN1P

GPIO30/TTL_LCK/RLV1P

L2

PWM1/GPIO25

GPIO0/TCON0/POL

68

PWM0/GPIO26

VSYNC0

GPIO1/TCON1/VST

L1
C537

R550

RIN0P

GPIO2/TCON2/GCLK1

K2

C538
0.047uF

AVDD_PLL

B12

GPIO3/TCON3/GCLK2

K1
R551
33

GIN0M

GPIO4/TCON4/GCLK3

K3

C541
0.047uF

AVDD_ST33
C548
0.1uF

C545
10uF

HWRESET

GPIO5/TCON5/SOE

J1

IRIN

IC501
LGE7833

GIN0P

GPIO6/TCON6/FLK

R554
33

0.047uF

SOGIN0

GPIO7/TCON7/FLK2

68

DDCA_CK

GPIO8/TCON8/FLK3

COMP_PR

J2

BIN0P

GPIO9/TCON9/OTP_P

C540

R553

DDCA_DA

GPIO10/TCON10/OTP_N

C542
0.047uF

C547
0.1uF

L504

D11

HSYNC0

NC_4

R555
33

ARC

GPIO11/TCON11/HCON

J3

USB0_DM

GPIO12/TCON12/DPM

H2

USB0_DP

DDCDA_CK

GPIO13/TCON13/LEDON

H3

RX2P_A

RFAGC

C543
1000pF

USB1_DM

XOUT

R556
33

COMMON_VIN

F4

C544
0.047uF

R557
33

USB1_DP

RX2N_A

GPIO14/TCON14/SCAN_BLK

COMP_PB

C521
0.1uF

L4

C518
0.1uF

C517
0.1uF

120-ohm

B13

DDCDA_DA

GPIO15/TCON15/SCAN_BLK1

F1

RX1P_A

GPIO16/TCON16/WPWM

F2

READY
1%
R503

A2

GPIO17/TCON17/GLKC4

F3

SPI_CK

GPIO18/TCON18/GLKC5

E2

0.047uF

RX1N_A

GPIO19/TCON19/GCLK6

C539

SPI_DI

GPIO20/TCON20/VGH_EVEN

E3

SPI_DO

RX0P_A

GPIO21/TCON21/VGH_ODD

E4

RX0N_A

LVB0N/TTL_R7/RLV2N

HDMI_ARC

SPI_CZ

LVB0P/TTL_R6/RLV2P

D2

SAR0/GPIO75

RXCKP_A

LVB1N/TTL_R5/RLV3N

D1
DDC_SCL

RXCKN_A

LVB1P/TTL_R4/RLV3P

C2

HDMI_D2+

SAR1/GPIO74

LVB2N/TTL_R3/RLV4N

C1

HOTPLUGA

LVB2P/TTL_R2/RLV4P

D3
DDC_SDA
HDMI_D2-

SAR2/GPIO73

LVBCKN/TTL_R1/RLV5N

C3
HDMI_D1+

D7

C10

DDCDD_CK

LVBCKP/TTL_R0/RLV5P

B1
HDMI_D1-

READY
1%
R502

1.2K

C516
0.1uF

C515
0.1uF

3.3

K13

TESTPIN

RX2P_D

LVB3N/TTL_G7/RLV6N

B2
HDMI_D0+

GND_EFUSE

RX2N_D

LVB3P/TTL_G6/RLV6P

B3
HDMI_D0-

DDCDD_DA

LVB4N/TTL_G5/LLV0N

A2
HDMI_CK+

C514
10uF

D13

LVB4P/TTL_G4/LLV0P

A3
HDMI_CK-

NC_2

RX1P_D

LVA0N/TTL_G3/LLV1N

D4

HPD

RX1N_D

LVA0P/TTL_G2/LLV1P

B4

NC_1

LVA1N/TTL_G1/LLV2N

B5

RX0P_D

LVA1P/TTL_G0/LLV2P

A5

MVREF

LVA2N/TTL_B7/LLV3N

C4

RX0N_D

LVA2P/TTL_B6/LLV3P

C5

RXCKP_D

LVACKN/TTL_B5/LLV4N

A6

AVDD 2.5V
ST 3.3V

3.3
R509

AVDD_DDR

LVACKP/TTL_B4/LLV4P

B6

C513
0.1uF

L503

RXCKN_D

LVA3N/TTL_B3/LLV5N

C6

C512
0.1uF

120-ohm

R508

+3.5V_ST

HOTPLUGD

LVA3P/TTL_B2/LLV5P

B7

LVA4N/TTL_B1/LLV6N

C7

CEC

LVA4P/TTL_B0/LLV6P

D5

68

GND_5

D6

CEC_C

R552

GND_4

GND_3

G1

AVDD_25
120-ohm

32CS410
MAIN SOC

2012/03/02
5

MAIN SOC

Copyright 2012 LG Electronics. Inc. All rights reserved.


Only for training and service purposes

LGE Internal Use Only

EAX64671103
LP24B

[51Pin LVDS Connector]


(For FHD 60Hz_Large)

[30Pin LVDS Connector]


(For HD 60Hz_Large)

[30Pin LVDS Connector]


(For HD 60Hz_19"/22")

PANEL_VCC
P602

WAFER_FHD_51P
P600
FI-RE51S-HF-J-R1500

1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
51

FF10001-30
WAFER_HD_19_22

[01]
[02]

R602
0
FHD_51P_IPS

1
2

[03]

[04]

+3.3V_M
READY
R628
4.7K

[06]

6
1

READY
R629
10K

[09]
[10]

2
3

R603

[11]

0
42" AUO

4
5

[12]
RXE0+

RXE0-

RXE1+

[13]
[14]
[15]
RXE1-

RXE2+

10

[16]
[17]
RXE2-

11

[18

12

[19]
RXECK+

13

RXECK-

14

[20]
[21]

15

[22]
RXE3+

16

[23]
RXE3-

17

[24]
RXE4+

18

RXE4-

19

[25]
[26]
[27]
[28]

R604
R601

10K

WAFER_HD_LARGE

[07]
[08]

P603
FF10001-30

[05]

0
42" AUO

20
21

FHD_51P_BIT_SEL_LOW
RXO0+

22

RXO0-

23

RXO1+

24

RXO1-

25

RXO2+

26

RXO2-

27

[29]
[30]
[31]
[32]
[33]
[34]

28

[35]
RXOCK+

29

RXOCK-

30

[36]
[37]
31

[38]
RXO3+
[39]
RXO3-

[30]
[29]

7
R622

READY

[28]

[27]

10

[26]

11

[25]

12
RXE3-

[24]

13
RXE3+

[23]

14

[22]

15
RXECK-

[21]

16
RXECK+

[20]

17

[19]

18
RXE2-

[18]

19
RXE2+

[17]

20

[16]

21
RXE1-

[15]

22
RXE1+

[14]

23

[13]

24
RXE0-

[12]

25
RXE0+

[11]
[10]

26
R623

READY

27

[09]
[08]

28
R624

HD_LARGE

29

[07]

30

[06]

L620
120-ohm
HD_19_22

[30]
[29]
C622
10uF
16V
READY

[28]
[27]

C621
1000pF
50V
READY

C620
0.1uF
16V
HD_19_22

[26]
[25]
[24]

22_THTF
R625

LVDS_SEL

+3.3V_M
[23]
R620
4.7K
READY

[22]
[21]
[20]

R621
10K
READY

[19]
[18]
RXE3[17]
RXE3+
[16]
[15]
RXECK[14]
RXECK+
[13]
[12]
RXE2[11]
RXE2+
[10]
[09]
RXE1[08]
RXE1+
[07]
[06]
RXE0[05]
RXE0+
[04]
[03]
[02]
[01]

31

[05]
.

[04]

PANEL_VCC

[03]
L621
120-ohm

[02]

26_32 inch

[01]

C628
10uF
16V
READY

C627
1000pF
50V
READY

C626
0.1uF
16V

26_32 inch

[40]
RXO4+
[41]
RXO4[42]

+3.3V_M

[43]

JEIDA

VESA

LGD

L/NC

CMI

L/NC

AUO

H/NC

IPS

TBD

TBD

READY
R626
4.7K

[44]
[45]
[46]

READY
R627
10K

[47]
[58]

PANEL_VCC

[59]
L601
120-ohm

[50]

42 Inch

[51]

52
.

C603
10uF
16V
READY

C602
C601
1000pF 0.1uF
50V
16V
READY
42 Inch

THE
SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE
SYMBOL MARK OF THE SCHEMETIC.

32CS410
LVDS

2012/03/02
6

LVDS

Copyright 2012 LG Electronics. Inc. All rights reserved.


Only for training and service purposes

LGE Internal Use Only

EAX64671103
LP24B

[Pinmap for EEFL]

P_24V_ADAPTER

RL_ON

L704
120-ohm
ADAPTER

RL_ON

NORMAL_EXPEPT_32
P701
FW20020-24S

RL_ON
R703
4.7K

+3.5V_ST
NON_ADAPTER
L701
C702
0.1uF
16V
NON_ADAPTER

120-ohm

P_12V
C705
0.1uF
50V
NON_ADAPTER

120-ohm

R706

NON_ADAPTER
C704
47uF
25V

NON_ADAPTER
L702

24V

GND

GND

GND

GND

10

3.5V

3.5V

11

12

3.5V

GND

13

14

GND

LGD(PSU)

GND

GND

18(12)

INV_ON

INV_ON

INV_ON

INV_ON

INV_ON

20(13)

VBR-A

NC

NC

NC

VBR-A

22(14)

PWM_DIM

PWM_DIM

PWM_DIM

PWM_DIM

PWM_DIM

[EP]GND

24(11)

ERR_OUT

ERR_OUT

ERR_OUT

ERR_OUT

ERR_OUT

IN_2

23

GND

NC

NC

NC

NC

IN_1

15

16

GND/V-sync

12V

17

18

INV ON

12V

19

10

20

A.DIM

12V

21

11

22

P.DIM1

GND/P.DIM2

23

12

24

Err OUT

R710
100

SLIM_32~52
P703

SMAW200-H24S2

R715
10K

PIN

LPB

CMI(PSU)

AUO(PSU)

IPS(PSU)

LGD(PSU)

16

NC

GND

GND

GND

GND

18(12)

INV_ON

INV_ON

INV_ON

INV_ON

INV_ON

20(13)

NC

NC

NC

NC

NC

22(14)

PWM_DIM

PWM_DIM

PWM_DIM

PWM_DIM

PWM_DIM

24(11)

ERR_OUT

ERR_OUT

ERR_OUT

ERR_OUT

ERR_OUT

R716
10K

R718

10K

A_DIM

POWER_18_A_DIM
R721

R722

R723

C712
0.1uF
50V
ADAPTER

R724

R726

PWM_DIM_26INCH

R729

1K

READY

C746
10uF
6.3V

R741
4.7K

IC702
AP2114H-2.5TRG1

NC

C743
10uF
10V

NC

+2.5V_M

2 VOUT

C744
0.1uF
16V

R743
1

GND

C745
10uF
6.3V

PWM_DIM

[Power for EEFL]

R730
6.2K

LGD

R727

PWM_DIM_LED_DRIVER

[Power for LED]


LGD

OS

OS

LED_DRIVER

32"

32"

11 PSU

24V

11 PSU
ADAPTER_NON_LED_DRIVER
C713
C714
0.1uF
0.01uF
50V
50V
ADAPTER_NON_LED_DRIVER

R732

1O LIPS

37"

100

11 PSU

** +3.5V_ST -> 3.3V_M

37"

ERROR_OUT

POWER_20_ERROR_OUT
R733

42"

100

1O LIPS

11 PSU

42"

11 LPB

11 PSU

+3.5V_ST

POWER_24_ERROR_OUT

24V

R734

24V

100

47"

ADAPTER_NON_LED_DRIVER

1O LIPS

11 LPB

47"

Q710-*1
AO3435
AOS

Q710
RSR025P03

11 PSU

L750
BLM18PG121SN1D
D
Rohm

+3.3V_M

GND

C750
0.1uF
16V

Q734
S AO3407A

R785
18K

EN

C732

COMP

GND

L781
500

Closed IC706

C791
10uF
25V

R784
68K

IN

C792
0.1uF
50V

SW

R787
105K

FB

R786
30K
1/10W
1%

GND

1/10W
1%

IC708
MP8670DN-LF-Z
C785
0.1uF
50V

IN

R793
0

R1

R795
1%
120K

R796
6.8K
1%

BST

$0.37
FB
R2
GND

VCC

Placed on SMD-TOP

C788
10uF
25V

C789
10uF
25V

L770
500
C790
0.1uF
50V

Closed IC709

C770
10uF
25V

C772
0.1uF
50V

IN

SW

GND
BG

3A

R799
0

Q730

S_2

S_1

D_1

D_2

D_3

C771
1uF
25V

3A

FB

VCC

R761
33K

R2

R789
47K

VCC

THE
SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE
SYMBOL MARK OF THE SCHEMETIC.

PANEL_VCC

Q720
AO3407A
C761
0.1uF
16V

1%

C760
1uF
25V

R765
4.7K

R766
4.7K

READY
R767
4.7K

R791
5.6K
1%

C795
0.1uF
16V

EN

PANEL_12V
R762
33K
PANEL_5V
R762-*1
10K
Q721
E MMBT3904(NXP)
C

BST

R792
10K

R764
10K

V0 = 0.8*(1+(R1/R2))
NR8040T3R6N
L771
3.6uH
Closed IC709

OUT:6.8V
R1
R770
51K

C776
10uF
10V

C777
10uF
10V
READY

C778
0.1uF
50V

1%

R771
33

R763
10K

R773
110

R774
330
5V_TUNER

R2

R778
47K

R772
6.8K

C775
0.1uF
16V
C779
0.1uF
50V

BST

R777
10K
C773
0.1uF
16V

PANEL_ON
+3.3V_M

C780
0.1uF
16V

+3.3V_M

R775
110

R776
330
+5V_USB

D_4

SI4124DY-T1-GE3(VISHAY)

close to IC1009

PANEL_12V
L761
120-ohm

C798
0.1uF
16V

C799
10uF
10V

1%
EN

C787
1uF 50V

S_3

R797
1.6K
1%

SP-7850_4.7

C786
1uF 25V

R798
22

C774
0.1uF

P_12V

SW

IC709
MP1497DJ

P_12V
SS

EN/SYNC

RL_ON2

real output : 12.3V

L790
4.7uH

**12V->TUNER 5V

P_24V

C784
3.3uF
50V

R794
33

C796
0.1uF
16V

* Option block : ADAPTER

+12V/+15V

READY

C737
0.1uF
50V

R790
30K

C797
10uF
10V

OUTPUT

$0.21

D730
MBRA340T3G

SW_2

C736
10uF
10V
READY

R1

C781
0.1uF
16V

OUTPUT

C735
22uF
16V

FB

Closed IC706

P_12V

PANEL_5V
L760
120-ohm

INPUT

C734
22uF
16V

C793
0.01uF
SS

3.6uH

C794
1uF
25V

+5V_PANEL

+5V_PANEL

NR8040T3R6N
L782

P_12V

Placed on SMD-TOP

NR8040T3R6N

** Switch Panel-Vcc

INPUT

L780
3.6uH

SW_1

C728
0.01uF
50V

5V_LDO_BCD
IC704-*1
AZ1117BH-ADJTRE1

+3.5V_ST

220pF 50V

C783
3.3uF
50V

Q733
MMBT3904(NXP)
E

5V_LDO_BCD
IC705-*1
AZ1117BH-ADJTRE1

11

AO3407A Vgs : 10.8V

3 IN

FREQ

R783
200K
1/8W
1%

RL_ON2

VIN_1

10
THERMAL

VIN_2

C731
3.3uF
50V

R756
10K

PANEL_5V
IC706
MP1497DJ

50V

IC707
MP4460DQ-LF-Z

close to pin
BST

C730
0.1uF
50V

C725
68uF
35V
READY

V0 = 0.8*(1+(R1/R2))

0CZZB00110A : 22uF 20% 10V X7R 3216


EAE58111001 : 22uF 20% 16V X5R 3216
EAE62281601 : 22uF 20% 10V X5R 2012

C733

0.1uF
EP_GND

R781
22

C724
0.01uF
50V

IN

Switching noise reducing [MPS recommend]

*12V -> PANEL_5V (OPTION)

* Option block : ADAPTER


R782
100K

P_24V

C723
3.3uF
50V

Close to AMP IC

+3.5V_ST

Q732
AO3407A

R757
27K

C722
0.01uF
50V

R759
0
READY

Q711
2SC3052

POWER_SW
S

Q731
MMBT3904(NXP)

PWM_DIM_26INCH

R755
22K

ADJ/GND 1

C
B

PWM_DIM

C726
0.1uF
50V

L731 3.3uH
D CPI2520NHL3R3ME 2520

R747
10K

ADJ/GND

R753
10K

NC

GND

C727
2.2uF
50V

G
R752
27K

INV_CTL_26INCH

15

+24V_LED_driver

ERROR_OUT_26INCH
INV_ON

R749
2.2K

ADAPTER
L730
MLB-201209-0120P-N2

SOUND_VCC

ERROR_OUT

C754
10uF
10V

READY
R750
10K

C752
0.1uF
16V

* Option block : ADAPTER

P_24V

R751
22K

OUT 2

C721
2.2uF
50V

ADJ/GND

C720
0.1uF
50V

R748
22K

+24V_LED Driver

AO3407A Vgs : 10.8V(24V input)


AO3407A Vgs : 8.3V(15V input)

GND

GND

* Option block : ADAPTER

P_24V

READY
C751
4.7uF
16V

ADJ/GND 1

+24V_AMP

GND

GND

POWER_SW
14

NC

NC

13

C742
10uF
6.3V

R740
2.74K

R2
1%

GND

C741
0.1uF
16V

OUT

12

** 3.3V_M -> 2.5V_M

5V_LDO_DIODE
IC704
AP1117EG-13

11

NC

23

5V_LDO_DIODE
IC705
AP1117EG-13

10

EN

ADAPTER_NON_LED_DRIVER

ERROR_OUT_26INCH

POWER_22_PWM_DIM

+24V_LED_driver

R1

POWER_20_PWM_DIM

SM14B-SRSS-TB

R742

FB

VIN 3

POWER_24_PWM_DIM

OUT_2

+3.3V_M

C709
2.2uF

POWER_22_A_DIM

ADAPTER_NON_LED_DRIVER
P705

NON_LED_DRIVER

P_24V_ADAPTER

24V

OUT_1

INV_ON

Q703
2SC3052

R707
0

24V

OUT:1.27V

NON_LED_DRIVER

POWER_24_INV_CTL

R725

R744
10K

[Pinmap for Edge LED]

POWER_20_A_DIM

NC

INV_CTL_26INCH

24V

+1.2V_VDDC

IC701
MP20051

1%

+3.5V_ST

R714
1K

R711
100

25

V0 = 0.8*(1+(R2/R1))

C740
10uF
10V

NON_LED_DRIVER

POWER_18_INV_CTL

POWER_24_GND

GND

+3.5V_ST

R712
100

GND

ADAPTER
JK700

SW

** 3.5V_ST -> 1.26V VDDC

ADAPTER_NON_LED_DRIVER

R720

JPD003N-M432-4F

IPS(PSU)

GND

+3.3V_M

3.5V

POWER_23_GND

C701
100uF
16V
NON_ADAPTER

24V

C708
68uF
35V
READY

22_LAMP
R700
0

C707
0.1uF
50V

120-ohm
NON_ADAPTER

POWER_16_GND

Q702
2SC3052

SOUND_VCC
NON_ADAPTER
R708

R735

PWR ON 1
24V
3

RL_ON

RL_ON

AUO(PSU)

GND

THERMAL

P_24V

L703

NORMAL_32
P702
FM20020-24

P706 22_LAMP
SMAW200-12

RL_ON
R702
10K

CMI(PSU)

GND

RL_ON2

Q701
2SC3052

R701
4.7K

LIPS

16

+3.5V_ST

PIN

FROM LIPS & POWER B/D

READY
C782
100uF
16V

32CS410
POWER

2012/03/02
7

POWER

Copyright 2012 LG Electronics. Inc. All rights reserved.


Only for training and service purposes

LGE Internal Use Only

EAX64671103
LP24B

TN_module_LED_DRIVER_CIRCUIT

D801
PDS5100H-13

L801
33uH

+24V_LED_driver

C802
2.2uF
50V

C801
2.2uF
50V

+3.3V_M

R810
5.1
READY
R811
C805
1000pF
3.3
1/10W
50V
READY
5%

C804
0.1uF
50V

C803
0.1uF
50V
close to IC100

3.3K -> 1K (threshold voltage up)

R803

R812
3K

1K

1/8W

R804

R120 : 6.8K --> 3K


R121 : 0.03 --> 0.1
2010.06.30 HWSON

R826
10K
1/10W
READY

NDRV

PGND

CS

17

16

11

OUT1

RT
FLT

R820
C813
0.33uF
50V

DRV

51K 1%
READY

R822
R821
51K
47K
1/10W 1/10W
5%
1%
AUO_TN AUO_TN

R825
100
ERROR_OUT

16K 1%

COMP

THERMAL

10

C812
2200pF
50V

R828

OUT3

DIM

R819
390
1/10W

OUT4

EN

R818
100K
1/10W

C811
100pF
50V

15

14
21
IC800
13
MAX16814
12

IN

SGND

1/10W

18

R113/R114
Operating Freq.
F=7.35x10^9/RT

C819
1uF
10V

R817
100

2010.06.30. hwson
for thermal Issue

WLED_ENABLE

C104 : 10uF --> 2.2nF


C106 : 0.68uF --> 0.33uF
R111 : 470 --> 390
2010.02.07 for PQ/19V_LED

RSDT

close to IC100

SETI

C810
0.1uF
50V

VCC

[EP]PGND/LEDGND

R816
4.7
1/10W

19

READY

20

Q800
MMBT3904(NXP) E

R815-*1
R815
11K
13K
1/10W 5%
1/10W 5%
22_CMI_EDGE 21.5_AUO_LGD_EDGE

C806
1000pF
50V
READY

6.8K

R801
10K
READY

C
B

C809
2.2uF
100V

OVP setting
R813
0.1
1%

WLED_ENABLE
R802
10K

C808
10uF
100V

OVP

R800
10K
INV_ON

C807
2.2uF
100V

Q801
AP18T10GH

must be modifed

+3.5V_ST

R814
560K
1/10W

1/10W
READY

R824
10K
1/8W
R823
7.5K
1/8W

must be modifed

wafer modify & resister add

LEDGND

P800
12507WR-06L

OUT2

R821-*1
27K
1/10W
1%
LGD_TN
R822-*1
27K
1/10W
1%
LGD_TN

C815
1000pF
50V

R821-*2
59K
1/16W 1%
CMI_TN

C816
1000pF
50V

C817
1000pF
50V

C818
1000pF
50V

ESD protection solution

R822-*2
59K
1/16W 1%
CMI_TN

6
7

R827
100
PWM_DIM_LED_DRIVER

1/10W
C814
100pF
50V

ILED=1500/RSETI
Module

ILED spec

R10011

OVP setting
R10013

Remark

AUO_18.5_HD
AUO_21.5_FHD
LGD_21.5_FHD

60mA_Typ
63mA_Max

47Kohm

51Kohm

61.35mA

110mA_Typ
120mA_Max

27Kohm

27Kohm

111.11mA

CMI_18.5_HD
CMI_21.5_FHD

THE
SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE
SYMBOL MARK OF THE SCHEMETIC.

50mA_Typ
56mA_Max

59Kohm

59Kohm

OVP=1.23x(1+R1/R2)

Module

Vs spec

R10018

R10019

Remark

min

Typ

Max

AUO_18.5

34V_Typ
36V_Max

560Kohm

16Kohm

44.28V

18.5 AUO

30

34

36

AUO_21.5

52.8V_Typ
57.6V_Max

560Kohm

11Kohm

63.85V

21.5 AUO

48

52.8

57.6

LGD_21.5

51.2V_Typ
56V_Max

560Kohm

11Kohm

63.85V

21.5 LGD

51.2

56

CMI_18.5

33V_Typ
34V_Max

560Kohm

18Kohm

39.5V

18.5 CMI

28

33

34

CMI_21.5

44.8V_Typ
47.6V_Max

560Kohm

13Kohm

54.26V

21.5 CMI

39.2

44.8

47.6

50.85mA

32CS410
LED DRIVER

2012/03/02
8

LED DRIVER

Copyright 2012 LG Electronics. Inc. All rights reserved.


Only for training and service purposes

LGE Internal Use Only

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