ADXL375 Example

3-Axis, 200 g
Digital MEMS Accelerometer

ADXL375
Data Sheet
FEATURES
GENERAL DESCRIPTION
Low power: as low as 35 A in measurement mode and

0.1 A in standby mode at VS = 2.5 V
Power consumption scales automatically with bandwidth
Embedded, 32-level FIFO buffer minimizes processor load
Bandwidth of up to 1 kHz
Bandwidth selectable via serial command
Shock event detection
Activity/inactivity monitoring
Supply voltage range: 2.0 V to 3.6 V
I/O voltage range: 1.7 V to VS
SPI (3- or 4-wire) and I2C digital interfaces
Wide temperature range: 40C to +85C
10,000 g shock survival
Pb free/RoHS compliant
Small and thin: 3 mm 5 mm 1 mm LGA package
The ADXL375 is a small, thin, 3-axis accelerometer that provides

low power consumption and high resolution measurement up
to 200 g. The digital output data is formatted as 16-bit, twos
complement data and is accessible through a SPI (3- or 4-wire)
or I2C digital interface.
An integrated memory management system with a 32-level first in,
first out (FIFO) buffer can be used to store data to minimize host
processor activity and lower overall system power consumption.
Low power modes enable intelligent motion-based power
management with threshold sensing and active acceleration
measurement at extremely low power dissipation.
The ADXL375 is supplied in a small, thin, 3 mm 5 mm
1 mm, 14-lead LGA.
APPLICATIONS
Concussion and head trauma detection
High force event detection
FUNCTIONAL BLOCK DIAGRAM

VS
ADXL375
VDD I/O
POWER
MANAGEMENT
ADC
3-AXIS
SENSOR
DIGITAL
FILTER
32-LEVEL
FIFO
CONTROL
AND
INTERRUPT
LOGIC
INT1
INT2
SDA/SDI/SDIO
SERIAL I/O
SDO/ALT
ADDRESS
SCL/SCLK
CS
GND
11669-001
SENSE
ELECTRONICS
Figure 1.
Rev. B
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ADXL375
Data Sheet
TABLE OF CONTENTS
Features .............................................................................................. 1
Serial Communications ................................................................. 15
Applications ....................................................................................... 1
SPI Mode ..................................................................................... 15
General Description ......................................................................... 1
I2C Mode...................................................................................... 18
Functional Block Diagram .............................................................. 1
Register Map ................................................................................... 20
Revision History ............................................................................... 2
Register Descriptions ................................................................. 21
Specifications..................................................................................... 3
Applications Information .............................................................. 26
Absolute Maximum Ratings ............................................................ 4
Power Supply Decoupling ......................................................... 26
Thermal Resistance ...................................................................... 4
Mechanical Considerations for Mounting .............................. 26
ESD Caution .................................................................................. 4
Shock Detection ......................................................................... 26
Soldering Profile ........................................................................... 5
Threshold Detection and Bandwidth ...................................... 27
Pin Configuration and Function Descriptions ............................. 6
Link Mode ................................................................................... 27
Typical Performance Characteristics ............................................. 7
Sleep Mode vs. Low Power Mode............................................. 28
Theory of Operation ...................................................................... 10
Offset Calibration ....................................................................... 28
Power Sequencing ...................................................................... 10

Current Consumption and Output Data Rate ........................ 10
Data Formatting at Output Data Rates of 3200 Hz

and 1600 Hz ................................................................................ 28
Power Saving Modes .................................................................. 11
Using Self-Test ............................................................................ 29
FIFO Buffer ................................................................................. 11
Axes of Acceleration Sensitivity ............................................... 30
Self-Test........................................................................................ 12
Layout and Design Recommendations ................................... 31
Interrupts ......................................................................................... 13
Package Information .................................................................. 31
Enabling and Disabling Interrupts ........................................... 13
Outline Dimensions ....................................................................... 32
Clearing Interrupts ..................................................................... 13
Ordering Guide .......................................................................... 32
Bits in the Interrupt Registers ................................................... 13
REVISION HISTORY
4/14Rev. A to Rev. B
Changes to Figure 24 ...................................................................... 15
Changes to Register 0x1E, Register 0x1F, Register 0x20OFSX,
OFSY, OFSZ (Read/Write) Section .............................................. 21
9/13Rev. 0 to Rev. A
Added MEMS to Product Title ....................................................... 1
8/13Revision 0: Initial Version
Rev. B | Page 2 of 32
Data Sheet
ADXL375
SPECIFICATIONS
TA = 25C, VS = 2.5 V, VDD I/O = 2.5 V, acceleration = 0 g, CS = 10 F tantalum, CI/O = 0.1 F, output data rate (ODR) = 800 Hz, unless
otherwise noted.
Table 1.
Parameter
SENSOR INPUT
Measurement Range2
Nonlinearity
Cross-Axis Sensitivity3
SENSITIVITY
Sensitivity at XOUT, YOUT, ZOUT2, 4
Scale Factor at XOUT, YOUT, ZOUT2, 4
Sensitivity Change Due to Temperature
0 g OFFSET
0 g Output for XOUT, YOUT, ZOUT
0 g Offset vs. Temperature
NOISE
OUTPUT DATA RATE AND BANDWIDTH5
Output Data Rate (ODR)4, 6
SELF-TEST7
Output Change in Z-Axis
POWER SUPPLY
Operating Voltage Range (VS)
Interface Voltage Range (VDD I/O)
Supply Current
Measurement Mode
Standby Mode
Turn-On and Wake-Up Time8
TEMPERATURE
Operating Temperature Range
WEIGHT
Device Weight
Test Conditions/Comments
Each axis
Min
Typ1
180
200
0.25
2.5
18.4
44
20.5
49
0.02
22.6
54
LSB/g
mg/LSB
%/C
6000
400
10
5
+6000
mg
mg/C
mg/Hz
3200
Hz
Percentage of full scale

Each axis
ODR 800 Hz
ODR 800 Hz
Max
Unit
g
%
%
Each axis
X-, y-, and z-axes

User selectable
0.1
6.4
2.0
1.7
ODR 100 Hz
ODR 3 Hz
2.5
1.8
3.6
VS
145
35
0.1
1.4
ODR = 3200 Hz
40
A
A
A
ms
+85
30
V
V
C
mg
Typical specifications are for at least 68% of the population of parts and are based on the worst case of mean 1 distribution, except for sensitivity, which represents
the target value.
2
Minimum and maximum specifications represent the worst case of mean 3 distribution and are not guaranteed in production.
3
Cross-axis sensitivity is defined as coupling between any two axes.
4
The output format for the 1600 Hz and 3200 Hz output data rates is different from the output format for the other output data rates. For more information, see the
Data Formatting at Output Data Rates of 3200 Hz and 1600 Hz section.
5
Bandwidth is the 3 dB frequency and is half the output data rate: bandwidth = ODR/2.
6
Output data rates < 6.25 Hz exhibit additional offset shift with increased temperature.
7
Self-test change is defined as the output (g) when the SELF_TEST bit = 1 (DATA_FORMAT register, Address 0x31) minus the output (g) when the SELF_TEST bit = 0.
Due to device filtering, the output reaches its final value after 4 when enabling or disabling self-test, where = 1/(data rate). For the self-test to operate correctly,
the part must be in normal power operation (LOW_POWER bit = 0 in the BW_RATE register, Address 0x2C).
8
Turn-on and wake-up times are determined by the user-defined bandwidth. At a 100 Hz data rate, the turn-on and wake-up times are each approximately 11.1 ms. For
other data rates, the turn-on and wake-up times are each approximately + 1.1 ms, where = 1/(data rate).
1
ADXL375
Data Sheet
ABSOLUTE MAXIMUM RATINGS

THERMAL RESISTANCE
Table 2.
Parameter
Acceleration, Any Axis
Unpowered
Powered
VS
VDD I/O
Digital Pins
Output Short-Circuit Duration
(Any Pin to Ground)
Temperature Range
Powered
Storage
JA is specified for the worst-case conditions, that is, a device

soldered in a circuit board for surface-mount packages.
Rating
10,000 g
10,000 g
0.3 V to +3.9 V
0.3 V to +3.9 V
0.3 V to VDD I/O + 0.3 V or 3.9 V,
whichever is less
Indefinite
Table 3. Package Characteristics

Package Type
14-Terminal LGA
ESD CAUTION
40C to +105C
40C to +105C
Stresses above those listed under Absolute Maximum Ratings

may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
JA
150
JC
85
Unit
C/W
Data Sheet
ADXL375
SOLDERING PROFILE
Figure 2 and Table 4 provide information about the recommended soldering profile.
CRITICAL ZONE
TL TO TP
tP
TP
tL
TSMAX
TSMIN
tS
RAMP-DOWN
PREHEAT
11669-015
TEMPERATURE
RAMP-UP
TL
t25C TO PEAK
TIME
Figure 2. Recommended Soldering Profile
Table 4. Recommended Soldering Profile Limits1, 2

Profile Feature
Average Ramp Rate (TL to TP)
Preheat
Minimum Temperature (TSMIN)
Maximum Temperature (TSMAX)
Time from TSMIN to TSMAX (tS)
Ramp-Up Rate (TSMAX to TL)
Liquidous Temperature (TL)
Time Maintained Above TL (tL)
Peak Temperature (TP)
Time Within 5C of Actual TP (tP)
Ramp-Down Rate
Time 25C (t25C) to Peak Temperature
1
2
Sn63/Pb37
3C/sec maximum
Pb-Free
3C/sec maximum
100C
150C
60 sec to 120 sec
3C/sec maximum
183C
60 sec to 150 sec
240C +0C/5C
10 sec to 30 sec
6C/sec maximum
6 minutes maximum
150C
200C
60 sec to 180 sec
3C/sec maximum
217C
60 sec to 150 sec
260C +0C/5C
20 sec to 40 sec
6C/sec maximum
8 minutes maximum
Based on JEDEC Standard J-STD-020D.1.

For best results, the soldering profile should be in accordance with the recommendations of the manufacturer of the solder paste used.
ADXL375
Data Sheet
PIN CONFIGURATION AND FUNCTION DESCRIPTIONS

ADXL375
TOP VIEW
(Not to Scale)
SCL/SCLK
VDD I/O
GND
RESERVED
14
13
SDA/SDI/SDIO
12
SDO/ALT ADDRESS
11
RESERVED
10
NC
INT2
INT1
+X
GND
GND
VS
+Y
+Z
11669-002
CS
NOTES
1. NC = NOT INTERNALLY CONNECTED.
Figure 3. Pin Configuration
Table 5. Pin Function Descriptions

Pin No.
1
2
3
4
5
6
7
8
9
10
11
12
13
14
Mnemonic
VDD I/O
GND
RESERVED
GND
GND
VS
CS
INT1
INT2
NC
RESERVED
SDO/ALT ADDRESS
SDA/SDI/SDIO
SCL/SCLK
Description
Digital Interface Supply Voltage.
Ground. This pin must be connected to ground.
Reserved. This pin must be connected to VS or left open.
Supply Voltage.
Chip Select.
Interrupt 1 Output.
Interrupt 2 Output.
Not Internally Connected.
Reserved. This pin must be connected to ground or left open.
SPI 4-Wire Serial Data Output (SDO)/I2C Alternate Address Select (ALT ADDRESS).
I2C Serial Data (SDA)/SPI 4-Wire Serial Data Input (SDI)/SPI 3-Wire Serial Data Input and Output (SDIO).
I2C Serial Communications Clock (SCL)/SPI Serial Communications Clock (SCLK).
Data Sheet
ADXL375
TYPICAL PERFORMANCE CHARACTERISTICS

25
1.0
0.6
OFFSET DRIFT (g)
20
15
10
0.4
0.2
0
0.2
0.4
0.8
1.0
50
3.0
2.6
2.2
1.8
1.4
1.0
0.6
0.2
0.2
0.6
1.0
1.4
1.8
2.2
2.6
3.0
11669-203
0.6
5
11669-200
PERCENT OF POPULATION (%)
0.8
35
20
10
25
40
55
TEMPERATURE (C)
70
85
100
OFFSET (g)
Figure 7. X-Axis Offset Drift, 15 Parts Soldered to PCB, VS = 2.5 V
Figure 4. X-Axis Zero g Offset at 25C, VS = 2.5 V
25
1.0
OFFSET DRIFT (g)
0.6
15
10
0.4
0.2
0
0.2
0.4
0.8
1.0
50
3.0
2.6
2.2
1.8
1.4
1.0
0.6
0.2
0.2
0.6
1.0
1.4
1.8
2.2
2.6
3.0
11669-204
0.6
5
11669-201
0.8
20
35
20
10
25
40
55
TEMPERATURE (C)
70
85
100
OFFSET (g)
Figure 5. Y-Axis Zero g Offset at 25C, VS = 2.5 V
Figure 8. Y-Axis Offset Drift, 15 Parts Soldered to PCB, VS = 2.5 V
16
1.0
0.8
0.6
OFFSET DRIFT (g)
12
10
8
6
0.4
0.2
0
0.2
0.4
4
11669-202
0.8
1.0
50
3.0
2.6
2.2
1.8
1.4
1.0
0.6
0.2
0.2
0.6
1.0
1.4
1.8
2.2
2.6
11669-205
0.6
3.0
14
35
20
10
25
40
55
TEMPERATURE (C)
70
85
100
OFFSET (g)
Figure 6. Z-Axis Zero g Offset at 25C, VS = 2.5 V
Figure 9. Z-Axis Offset Drift, 15 Parts Soldered to PCB, VS = 2.5 V
ADXL375
Data Sheet
25
23.0
SENSITIVITY (LSB/g)
22.0
15
10
21.5
21.0
20.5
20.0
19.5
18.5
18.0
50
18.0
18.2
18.4
18.6
18.8
19.0
19.2
19.4
19.6
19.8
20.0
20.2
20.4
20.6
20.8
21.0
21.2
21.4
21.6
21.8
22.0
22.2
22.4
22.6
22.8
23.0
11669-209
19.0
11669-206
22.5
20
35
20
10
25
40
55
70
85
100
TEMPERATURE (C)
SENSITIVITY (LSB/g)
Figure 10. X-Axis Sensitivity at 25C, VS = 2.5 V
Figure 13. X-Axis Sensitivity vs. Temperature, 16 Parts Soldered to PCB,

VS = 2.5 V
25
23.0
20
SENSITIVITY (LSB/g)
22.0
15
10
21.5
21.0
20.5
20.0
19.5
18.5
18.0
50
18.0
18.2
18.4
18.6
18.8
19.0
19.2
19.4
19.6
19.8
20.0
20.2
20.4
20.6
20.8
21.0
21.2
21.4
21.6
21.8
22.0
22.2
22.4
22.6
22.8
23.0
11669-210
19.0
11669-207
22.5
35
20
10
25
40
55
70
85
100
TEMPERATURE (C)
SENSITIVITY (LSB/g)
Figure 14. Y-Axis Sensitivity vs. Temperature, 16 Parts Soldered to PCB,

VS = 2.5 V
Figure 11. Y-Axis Sensitivity at 25C, VS = 2.5 V
23.0
16
22.5
22.0
SENSITIVITY (LSB/g)
12
10
8
6
21.5
21.0
20.5
20.0
19.5
4
11669-208
11669-211
19.0
18.5
18.0
50
18.0
18.2
18.4
18.6
18.8
19.0
19.2
19.4
19.6
19.8
20.0
20.2
20.4
20.6
20.8
21.0
21.2
21.4
21.6
21.8
22.0
22.2
22.4
22.6
22.8
23.0
14
35
20
10
25
40
55
70
85
100
TEMPERATURE (C)
SENSITIVITY (LSB/g)
Figure 12. Z-Axis Sensitivity at 25C, VS = 2.5 V
Figure 15. Z-Axis Sensitivity vs. Temperature, 16 Parts Soldered to PCB,

VS = 2.5 V
Data Sheet
ADXL375
200
SUPPLY CURRENT (A)
20
15
10
150
100
50
5
11669-212
0
2.0
80
85
90
95
100
105
110
115
120
125
130
135
140
145
150
155
160
165
170
175
180
2.4
2.8
11669-215
25
3.6
3.2
SUPPLY VOLTAGE (V)
SELF-TEST RESPONSE (LSB)
Figure 19. Supply Current vs. Supply Voltage (VS) at 25C
Figure 16. Z-Axis Self-Test Response at 25C, VS = 2.5 V
200
X-AXIS, DUT1
X-AXIS, DUT2
Y-AXIS, DUT1
Y-AXIS, DUT2
Z-AXIS, DUT1
Z-AXIS, DUT2
20
150
OUTPUT (g)
15
10
100
0
100
110
120
130
140
150
160
170
180
190
11669-216
50
5
11669-213
25
200
50
CURRENT CONSUMPTION (A)
100
150
200
REFERENCE ACCELERATION (g)
Figure 20. Output Linearity over the Dynamic Range
Figure 17. Current Consumption at 25C, 100 Hz Output Data Rate, VS = 2.5 V
160
1.2
1.0
NORMALIZED SENSITIVITY
120
100
80
60
40
0.8
X-AXIS
Y-AXIS
Z-AXIS
0.6
0.4
0
10
1.60 3.12 6.25 12.50 25 50 100 200 400 800 1600 3200
OUTPUT DATA RATE (Hz)
11669-217
0.2
20
11669-214
CURRENT CONSUMPTION (A)
140
100
FREQUENCY (Hz)
Figure 21. Frequency Response
Figure 18. Current Consumption vs. Output Data Rate at 25C,

10 Parts Soldered to PCB, VS = 2.5 V
1000
ADXL375
Data Sheet
THEORY OF OPERATION
The ADXL375 is a complete 3-axis acceleration measurement
system with a measurement range of 200 g. It measures both
dynamic acceleration resulting from motion or shock and static
acceleration, such as gravity.
When the device is in standby mode, any register can be written

to or read from. It is recommended that the device be configured
in standby mode before enabling measurement mode. Clearing
the measure bit returns the device to standby mode.
The sensor is a polysilicon surface-micromachined structure

built on top of a silicon wafer. Polysilicon springs suspend the
structure over the surface of the wafer and provide resistance
against forces due to applied acceleration.
CURRENT CONSUMPTION AND OUTPUT DATA RATE
Deflection of the structure is measured using differential capacitors that consist of independent fixed plates and plates attached
to the moving mass. Acceleration deflects the proof mass and
unbalances the differential capacitor, resulting in a sensor output
whose amplitude is proportional to acceleration. Phase sensitive
demodulation is used to determine the magnitude and polarity
of the acceleration.
POWER SEQUENCING
Power can be applied to VS or VDD I/O in any sequence without
damaging the ADXL375. Table 7 provides a description of all
the power modes. The interface voltage level is set using the
interface supply voltage, VDD I/O, which must be present to ensure
that the ADXL375 does not create a conflict on the communication bus. For single-supply operation, VDD I/O can be the same
as the main supply, VS. In a dual-supply application, however,
VDD I/O can differ from VS to accommodate the desired interface
voltage, as long as VS is greater than or equal to VDD I/O.
After VS is applied, the device enters standby mode. In standby
mode, power consumption is minimized; the device waits for
VDD I/O to be applied and for the command to enter measurement
mode. This command can be initiated by setting the measure bit
(Bit D3) in the POWER_CTL register (Address 0x2D).
The ADXL375 automatically modulates its current consumption

in proportion to its output data rate (see Table 6). The device
bandwidth and output data rate are specified using the rate bits
(Bits[D3:D0]) in the BW_RATE register (Address 0x2C).
Table 6. Typical Current Consumption vs. Data Rate
(TA = 25C, VS = 2.5 V, VDD I/O = 1.8 V)
Rate Bits
1111
1110
1101
1100
1011
1010
1001
1000
0111
0110
0101
0100
0011
0010
0001
0000
Output Data
Rate (Hz)
3200
1600
800
400
200
100
50
25
12.5
6.25
3.13
1.56
0.78
0.39
0.20
0.10
Bandwidth
(Hz)
1600
800
400
200
100
50
25
12.5
6.25
3.13
1.56
0.78
0.39
0.20
0.10
0.05
IDD (A)
145
90
140
140
140
140
90
60
50
40
35
35
35
35
35
35
Table 7. Power Modes

Power Mode
Power Off
VS
Off
VDD I/O
Off
Bus Disabled
On
Off
Bus Enabled
Standby or Measurement
Off
On
On
On
Description
The device is completely off, but it is still possible for the device to create a conflict on the
communication bus.
The device is on in standby mode, but communication is unavailable and the device can create
a conflict on the communication bus. Minimize the duration of the bus disabled state during
power-up to prevent a conflict on the communication bus.
No functions are available, but the device does not create a conflict on the communication bus.
At power-up, the device is in standby mode, awaiting a command to enter measurement
mode, and all sensor functions are off. After the device is instructed to enter measurement
mode, all sensor functions are available.
Data Sheet
ADXL375
POWER SAVING MODES
FIFO BUFFER
Low Power Mode
The ADXL375 contains patented technology for an embedded

memory management system with a 32-level FIFO buffer that
can be used to minimize host processor burden. This buffer has
four modes: bypass, FIFO, stream, and trigger. Each mode can
be selected by setting the FIFO_MODE bits (Bits[D7:D6]) in
the FIFO_CTL register (Address 0x38; see Table 9).
A low power mode is available for additional power savings. In

low power mode, the internal sampling rate is reduced, allowing
for power savings in the 12.5 Hz to 400 Hz data rate range at the
expense of slightly greater noise. To enter low power mode, set
the LOW_POWER bit (Bit D4) in the BW_RATE register
(Address 0x2C). Table 8 shows the current consumption in low
power mode for output data rates where there is an advantage to
using low power mode.
Table 8. Typical Current Consumption vs. Data Rate,
Low Power Mode (TA = 25C, VS = 2.5 V, VDD I/O = 1.8 V)
Rate Bits
1100
1011
1010
1001
1000
0111
Output Data
Rate (Hz)
400
200
100
50
25
12.5
Bandwidth
(Hz)
200
100
50
25
12.5
6.25
IDD (A)
90
60
50
45
40
35
Table 9. FIFO Modes (FIFO_CTL Register, Address 0x38)

Setting
D7
D6
0
0
0
1
FIFO
Mode
Bypass
FIFO
Stream
Trigger
Description
FIFO buffer is bypassed.
FIFO buffer collects up to 32 samples and
then stops collecting data, collecting new
data only when the buffer is not full.
FIFO buffer holds the last 32 samples.
When the buffer is full, the oldest data
is overwritten with newer data.
FIFO buffer holds the last samples before
the trigger event and continues to collect
data until full. New data is collected only
when the buffer is not full.
For data rates not shown in Table 8, the use of low power mode
does not provide any advantage over normal power mode. Therefore, it is recommended that low power mode be used only for
the data rates shown in Table 8.
For an in-depth description of the FIFO buffer and FIFO modes,

see the AN-1025 Application Note, Utilization of the First In, First
Out (FIFO) Buffer in Analog Devices, Inc., Digital Accelerometers.
Autosleep Mode
In bypass mode, the FIFO buffer is not operational and, therefore, remains empty.
Additional power can be saved if the ADXL375 automatically

switches to sleep mode during periods of inactivity. To enable
the autosleep mode feature,
1.
2.
Set the THRESH_INACT register (Address 0x25) and

the TIME_INACT register (Address 0x26) to values that
signify inactivity. The appropriate values depend on the
application.
Set the AUTO_SLEEP bit (Bit D4) and the link bit (Bit D5)
in the POWER_CTL register (Address 0x2D).
Current consumption at the sub-12.5 Hz data rates that are used

in autosleep mode is typically 35 A for VS = 2.5 V.
For information about the advantages of using low power
mode vs. autosleep mode, see the Sleep Mode vs. Low Power
Mode section.
Standby Mode
For even lower power operation, standby mode can be used. In
standby mode, current consumption is reduced to 0.1 A (typical).
In this mode, no measurements are made, but the contents of the
FIFO buffer are preserved. To enter standby mode, clear the
measure bit (Bit D3) in the POWER_CTL register (Address 0x2D).
Bypass Mode
FIFO Mode
In FIFO mode, data from measurements of the x-, y-, and z-axes
is stored in the FIFO buffer. When the number of samples in the
FIFO buffer equals the level specified by the samples bits of the
FIFO_CTL register (Address 0x38), the watermark interrupt is
set (see the Watermark Bit section). The FIFO buffer continues
to accumulate samples until it is full (32 samples from measurements of the x-, y-, and z-axes) and then stops collecting data.
After the FIFO buffer stops collecting data, the device continues
to operate; therefore, features such as shock detection can be used
after the FIFO buffer is full. The watermark interrupt bit remains
set until the number of samples in the FIFO buffer is less than
the value stored in the samples bits of the FIFO_CTL register.
Stream Mode
In stream mode, data from measurements of the x-, y-, and z-axes
is stored in the FIFO buffer. When the number of samples in the
FIFO buffer equals the level specified by the samples bits of the
FIFO_CTL register (Address 0x38), the watermark interrupt is set
(see the Watermark Bit section). The FIFO buffer continues to
accumulate samples; the buffer stores the latest 32 samples from
measurements of the x-, y-, and z-axes, discarding older data as
new data arrives. The watermark interrupt bit remains set until
the number of samples in the FIFO buffer is less than the value
stored in the samples bits of the FIFO_CTL register.
ADXL375
Data Sheet
Trigger Mode
In trigger mode, the FIFO buffer accumulates samples, storing
the latest 32 samples from measurements of the x-, y-, and z-axes.
After a trigger event occurs, an interrupt is sent to the INT1 or
INT2 pin (determined by the trigger bit in the FIFO_CTL register),
and the FIFO_TRIG bit (Bit D7) is set in the FIFO_STATUS
register (Address 0x39).
The FIFO buffer keeps the last n samples (n is the value specified
by the samples bits in the FIFO_CTL register) and then operates
in FIFO mode, collecting new samples only when the FIFO buffer
is not full. A delay of at least 5 s must elapse between the occurrence of the trigger event and the start of data readback from the
FIFO buffer to allow the buffer to discard and retain the necessary
samples.
Additional trigger events cannot be recognized until the part is
reset to trigger mode. To reset the part to trigger mode,
1.
2.
3.
If desired, read data from the FIFO buffer (see the Retrieving
Data from the FIFO Buffer section).
Before resetting the part to trigger mode, read back the
FIFO data; placing the device into bypass mode clears the
FIFO buffer.
Configure the device for bypass mode by setting Bits[D7:D6]
at Address 0x38 to 00.
Configure the device for trigger mode by setting Bits[D7:D6]
at Address 0x38 to 11.
Retrieving Data from the FIFO Buffer

When the FIFO buffer operates in FIFO, stream, or trigger mode,
FIFO data can be read from the data registers (Address 0x32 to
Address 0x37). Each time data is read from the FIFO buffer, the
oldest x-, y-, and z-axis data is moved into the DATAX, DATAY,
and DATAZ registers.
If a single-byte read operation is performed, the remaining bytes
of data for the current FIFO sample are lost. Therefore, data for
all axes of interest must be read in a burst (multiple-byte) read
operation. To ensure that the FIFO buffer is empty (that is, all
new data has moved into the data registers), an interval of at
least 5 s must elapse between the end of the readback from the
data registers and the start of a new read of the data registers or
the FIFO_STATUS register (Address 0x39). The end of a read
operation from the data registers is signified by the transition
from Register 0x37 to Register 0x38 or by the CS pin going high.
When SPI operation is enabled at a frequency of 1.6 MHz or

lower, the register addressing portion of the transmission provides
a sufficient delay to ensure that the FIFO buffer has completely
emptied. When SPI operation is enabled at a frequency higher
than 1.6 MHz, the CS pin must be deasserted to ensure a total
delay of 5 s; otherwise, the delay is not sufficient. When SPI
operation is enabled at 5 MHz, the total delay necessary is at
most 3.4 s.
When I2C mode is enabled on the part, the communication rate
is low enough to ensure a sufficient delay between FIFO reads.
SELF-TEST
The ADXL375 incorporates a self-test feature that effectively
tests its mechanical and electronic systems simultaneously. When
the self-test function is enabled (via the SELF_TEST bit in the
DATA_FORMAT register, Address 0x31), an electrostatic force
is exerted on the mechanical sensor.
This electrostatic force moves the mechanical sensing element in
the same manner as acceleration, and it is additive to the external
acceleration experienced by the device. This added electrostatic
force results in an output change in the x-, y-, and z-axes. Because
the electrostatic force is proportional to VS2, the output change
varies with VS.
The self-test response in the x- and y-axes exhibits bimodal
behavior and, therefore, is not always a reliable indicator of
sensor health or potential shift in device sensitivity. For this
reason, perform the self-test check in the z-axis.
Use of the self-test feature at data rates of less than 100 Hz or at
1600 Hz may yield values outside the limits shown in Figure 16.
For the self-test function to operate correctly, the part must be in
normal power operation (LOW_POWER bit = 0 in the BW_RATE
register, Address 0x2C) and be configured for a data rate from
100 Hz to 800 Hz, or for a data rate of 3200 Hz (see Table 6).
For more information about the self-test feature, see the Using
Self-Test section.
Data Sheet
ADXL375
INTERRUPTS
The ADXL375 provides two output pins for driving interrupts:
INT1 and INT2. Both interrupt pins are push-pull, low impedance
pins (see Table 10 for output specifications). The default configuration of the interrupt pins is active high. The polarity can be
changed to active low by setting the INT_INVERT bit (Bit D5)
in the DATA_FORMAT register (Address 0x31). All interrupt
functions can be enabled simultaneously, but some functions
may need to share the same interrupt pin.
ENABLING AND DISABLING INTERRUPTS

Interrupts are enabled by setting the appropriate bits in the
INT_ENABLE register (Address 0x2E); the interrupt is mapped
to the INT1 pin or the INT2 pin based on the contents of the
INT_MAP register (Address 0x2F). When the user configures
the interrupt pins for the first time, it is recommended that the
functions and interrupt mapping be configured before the
interrupts are enabled.
BITS IN THE INTERRUPT REGISTERS

This section describes the interrupts that can be set in the
INT_ENABLE register (Address 0x2E) and monitored in the
INT_SOURCE register (Address 0x30).
For an in-depth description of the FIFO buffer and the interrupt bits, see the AN-1025 Application Note, Utilization of the
First In, First Out (FIFO) Buffer in Analog Devices, Inc., Digital
Accelerometers.
DATA_READY Bit
The DATA_READY bit is set when new data is available and
is cleared when no new data is available.
SINGLE_SHOCK Bit
When changing the configuration of an interrupt, follow this

procedure.
The SINGLE_SHOCK bit is set when a single acceleration event

that is greater than the value in the THRESH_SHOCK register
(Address 0x1D) occurs for less time than is specified by the DUR
register (Address 0x21). For more information, see the Shock
Detection section.
1.
DOUBLE_SHOCK Bit
Disable the interrupt by clearing the bit corresponding

to the function in the INT_ENABLE register.
Reconfigure the interrupt function.
Reenable the interrupt in the INT_ENABLE register.
CLEARING INTERRUPTS
The DOUBLE_SHOCK bit is set when two acceleration events

that are greater than the value in the THRESH_SHOCK register
(Address 0x1D) occur for less time than is specified by the DUR
register (Address 0x21). The second shock event starts after the
time specified by the latent register (Address 0x22) but within
the time specified by the window register (Address 0x23). For
more information, see the Shock Detection section.
The interrupt functions are latched and can be cleared as follows:
Activity Bit
1.
The activity bit is set when acceleration greater than the value
stored in the THRESH_ACT register (Address 0x24) is experienced on any participating axis. Participating axes are specified
by the ACT_INACT_CTL register (Address 0x27).
2.
3.
Configuration of the functions while the interrupts are disabled

helps to prevent the accidental generation of an interrupt.
2.
Read the data registers (Address 0x32 to Address 0x37)

to clear the data-related interrupts.
Read the INT_SOURCE register (Address 0x30) to clear
the remaining interrupts.
Table 10. Interrupt Pin Digital Output Specifications

Parameter
DIGITAL OUTPUT
Low Level Output Voltage (VOL)
High Level Output Voltage (VOH)
Low Level Output Current (IOL)
High Level Output Current (IOH)
PIN CAPACITANCE
RISE/FALL TIME
Rise Time (tR)2
Fall Time (tF)3
IOL = 300 A
IOH = 150 A
VOL = VOL, MAX
VOH = VOH, MIN
fIN = 1 MHz, VS = 2.5 V
CLOAD = 150 pF
Limits based on characterization results; not production tested.

Rise time is measured as the transition time from VOL, MAX to VOH, MIN of the interrupt pin.
3
Fall time is measured as the transition time from VOH, MIN to VOL, MAX of the interrupt pin.
1
2
Min
Limit1
Max
0.2 VDD I/O
Unit
150
8
V
V
A
A
pF
210
150
ns
ns
0.8 VDD I/O

300
ADXL375
Data Sheet
Inactivity Bit
Overrun Bit
The inactivity bit is set when acceleration less than the value stored
in the THRESH_INACT register (Address 0x25) is experienced
for more time than is specified by the TIME_INACT register
(Address 0x26) on all participating axes. Participating axes are
specified by the ACT_INACT_CTL register (Address 0x27). The
maximum value for TIME_INACT is 255 sec.
The overrun bit is set when new data replaces unread data. The
precise operation of the overrun function depends on the FIFO
mode (see the FIFO Buffer section).
Watermark Bit
The watermark bit is set when the number of samples in the FIFO
buffer equals the value stored in the samples bits (Bits[D4:D0])
of the FIFO_CTL register (Address 0x38). The watermark bit
is cleared automatically when the FIFO buffer is read and the
FIFO contents return to a value below the value specified by the
samples bits.
In bypass mode, the overrun bit is set when new data

replaces unread data in the data registers (Address 0x32
to Address 0x37).
In FIFO mode, stream mode, and trigger mode, the
overrun bit is set when the FIFO buffer is full.
The overrun bit is automatically cleared when the FIFO buffer

contents are read.
Data Sheet
ADXL375
SERIAL COMMUNICATIONS
The ADXL375 supports I2C and SPI digital communications. In
both cases, the ADXL375 operates as a slave device. When the CS
pin is tied high to VDD I/O, I2C mode is enabled. The CS pin must
be tied high to VDD I/O or be driven by an external controller. If the
CS pin is left unconnected, the user may not be able to communicate with the part. In SPI mode, the CS pin is controlled by the
bus master. In both SPI and I2C modes of operation, ignore data
transmitted from the ADXL375 to the master device during writes
to the ADXL375.
SPI MODE
The ADXL375 can be configured for 3-wire SPI mode or 4-wire
SPI mode, as shown in Figure 22 and Figure 23. Clearing the SPI
bit (Bit D6) in the DATA_FORMAT register (Address 0x31) selects
4-wire mode; setting the SPI bit selects 3-wire mode. The maximum SPI clock speed is 5 MHz with 100 pF maximum loading.
The timing scheme requires clock polarity (CPOL) = 1 and clock
phase (CPHA) = 1. If power is applied to the ADXL375 before the
clock polarity and phase of the host processor are configured, take
the CS pin high before changing the clock polarity and phase.
When using 3-wire SPI mode, it is recommended that the SDO
pin be either pulled up to VDD I/O or pulled down to GND via a
10 k resistor.
SDIO
PROCESSOR
D OUT
SCLK
D OUT
Figure 22. 3-Wire SPI Connection Diagram
CS
SDI
SDO
SCLK
PROCESSOR
D OUT
D OUT
D IN
D OUT
11669-003
ADXL375
Use of the 3200 Hz and 1600 Hz output data rates is recommended only with SPI communication speeds greater than or
equal to 2 MHz. The 800 Hz output data rate is recommended
only with communication speeds greater than or equal to 400 kHz,
and the remaining data rates scale proportionally. For example,
the minimum recommended communication speed for a 200 Hz
output data rate is 100 kHz. Operation at an output data rate above
the recommended maximum value may result in undesirable
effects on the acceleration data, including missing samples or
additional noise.
Preventing Bus Traffic Errors
D IN/OUT
SDO
Figure 25 and Figure 26 show the timing diagrams for 4-wire

SPI writes and reads, respectively. Figure 27 shows the timing
diagram for 3-wire SPI reads or writes. For correct operation of
the part, the logic thresholds and timing parameters in Table 11
and Table 12 must be met at all times.
Figure 23. 4-Wire SPI Connection Diagram
CS is the serial port enable line and is controlled by the SPI master.
This line must go low at the start of a transmission and high at the
end of a transmission, as shown in Figure 25 to Figure 27. SCLK
is the serial port clock and is supplied by the SPI master. SCLK
should idle high during a period of no transmission. In 4-wire
SPI mode, SDI and SDO are the serial data input and output,
respectively. In 3-wire SPI mode, SDIO functions as both the
serial data input and output. Data is updated on the falling edge
of SCLK and should be sampled on the rising edge of SCLK.
The ADXL375 CS pin is used both for initiating SPI transactions

and for enabling I2C mode. When the ADXL375 is used on a SPI
bus with multiple devices, its CS pin is held high while the master
communicates with the other devices. There may be conditions
where a SPI command transmitted to another device looks like
a valid I2C command. In this case, the ADXL375 interprets this
command as an attempt to communicate in I2C mode and may
interfere with other bus traffic. Unless bus traffic can be adequately controlled to ensure that such a condition never occurs,
it is recommended that a logic gate be added in front of Pin 13
(SDA/SDI/SDIO), as shown in Figure 24. This OR gate holds the
SDA line high when CS is high to prevent SPI bus traffic at the
ADXL375 from appearing as an I2C start command.
ADXL375
CS
SDA/SDI/SDIO
SDO
SCLK
PROCESSOR
D OUT
D IN/OUT
D IN
D OUT
11669-104
CS
11669-004
ADXL375
To read or write multiple bytes in a single transmission, the

multiple-byte bit (MB in Figure 25 to Figure 27), located after
the R/W bit in the first byte transfer, must be set. After the
register address byte and the first byte of data, each subsequent
set of eight clock pulses causes the ADXL375 to point to the next
register for a read or write. This shifting continues until the clock
pulses cease and CS is deasserted. To perform reads or writes on
different, nonsequential registers, CS must be deasserted between
transmissions and the new register must be addressed separately.
Figure 24. Recommended SPI Connection Diagram

When Using Multiple SPI Devices on a Single Bus
ADXL375
Data Sheet
CS
tM
tSCLK
tDELAY
tS
tQUIET
tCS, DIS
SCLK
tHOLD
MB
SDI
A5
tSDO
X
SDO
A0
D7
ADDRESS BITS
X
D0
tDIS
DATA BITS
11669-017
tSETUP
Figure 25. SPI 4-Wire Write Timing Diagram
CS
tM
tSCLK
tDELAY
tS
tCS, DIS
tQUIET
SCLK
tHOLD
R
SDI
MB
A5
tSDO
X
SDO
A0
tDIS
ADDRESS BITS
X
D7
D0
11669-018
tSETUP
DATA BITS
Figure 26. SPI 4-Wire Read Timing Diagram
CS
tDELAY
tM
tSCLK
tS
tQUIET
tCS, DIS
SCLK
tSETUP
SDIO
tHOLD
R/W
tSDO
MB
A5
A0
D0
DATA BITS
11669-019
ADDRESS BITS
D7
NOTES
1. tSDO IS ONLY PRESENT DURING READS.
Figure 27. SPI 3-Wire Read/Write Timing Diagram
Data Sheet
ADXL375
Table 11. SPI Digital Input/Output Specifications

Parameter
DIGITAL INPUT
Low Level Input Voltage (VIL)
High Level Input Voltage (VIH)
Low Level Input Current (IIL)
High Level Input Current (IIH)
DIGITAL OUTPUT
High Level Output Voltage (VOH)
High Level Output Current (IOH)
PIN CAPACITANCE
1
Min
Limit1
Max
0.3 VDD I/O
0.7 VDD I/O

VS = VDD I/O
VS = 0 V
0.1
0.1
IOL = 10 mA
IOH = 4 mA
VOL = VOL, MAX
VOH = VOH, MIN
fIN = 1 MHz, VS = 2.5 V
0.2 VDD I/O

0.8 VDD I/O
10
4
8
Unit
V
V
A
A
V
V
mA
mA
pF
Table 12. SPI Timing (TA = 25C, VS = 2.5 V, VDD I/O = 1.8 V)1
Parameter
fSCLK
tSCLK
tDELAY
tQUIET
tDIS
tCS, DIS
tS
tM
tSETUP
tHOLD
tSDO
tR4
tF4
Min
Limit2, 3
Max
5
200
5
5
10
150
0.3 tSCLK
0.3 tSCLK
5
5
40
20
20
Unit
MHz
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
Description
SPI clock frequency
Mark-space ratio (1/(SPI clock frequency)) for the SCLK input is 40/60 to 60/40
CS falling edge to SCLK falling edge
SCLK rising edge to CS rising edge
CS rising edge to SDO/SDIO disabled
CS deassertion between SPI communications
SCLK low pulse width (space)
SCLK high pulse width (mark)
SDI/SDIO valid before SCLK rising edge
SDI/SDIO valid after SCLK rising edge
SCLK falling edge to SDO/SDIO output transition
SDO/SDIO output high to output low transition
SDO/SDIO output low to output high transition
The CS, SCLK, SDI, and SDO pins are not internally pulled up or down; they must be driven for proper operation.
Limits based on characterization results, with fSCLK = 5 MHz and bus load capacitance of 100 pF; not production tested.
3
The timing values are referred to the input thresholds (VIL and VIH) given in Table 11.
4
Output rise and fall times measured with capacitive load of 150 pF. tR and tF are not shown in Figure 25 to Figure 27.
1
2
ADXL375
Data Sheet
I2C MODE
VDD I/O
When the CS pin is tied high to VDD I/O, the ADXL375 is

configured for I2C mode. I2C mode requires a simple 2-wire
connection, as shown in Figure 28. The ADXL375 conforms to
the UM10204 I2C-Bus Specification and User Manual, Rev. 03
19 June 2007, available from NXP Semiconductors. The ADXL375
supports standard (100 kHz) and fast (400 kHz) data transfer
modes if the bus parameters given in Table 13 and Table 14 are met.
ADXL375
RP
RP
PROCESSOR
CS
SDA
D IN/OUT
ALT ADDRESS
SCL
11669-008
D OUT
Figure 28. I2C Connection Diagram (Address 0x53)
Single- or multiple-byte reads and writes are supported, as shown

in Figure 29. When the ALT ADDRESS pin (Pin 12) is tied high
to VDD I/O, the 7-bit I2C address for the device is 0x1D, followed
by the R/W bit. In this configuration, the write address is 0x3A,
and the read address is 0x3B. An alternate I2C address of 0x53 can
be selected by grounding the ALT ADDRESS pin (see Figure 28).
In this configuration, the write address is 0xA6, and the read
address is 0xA7.
Due to communication speed limitations, the maximum output

data rate when using 400 kHz I2C mode is 800 Hz, which scales
linearly with a change in the I2C communication speed. For
example, using I2C mode at 100 kHz limits the maximum ODR
to 200 Hz. Operation at an output data rate above the recommended maximum value may result in undesirable effects on the
acceleration data, including missing samples or additional noise.
Unused pins have no internal pull-up or pull-down resistors;

therefore, the CS and ALT ADDRESS pins have no known state
or default state if the pins are left floating or unconnected. When
using I2C mode, it is required that the CS pin be connected to
VDD I/O and that the ALT ADDRESS pin be connected to either
VDD I/O or GND.
If other devices are connected to the same I2C bus, the nominal
operating voltage level of the other devices cannot exceed VDD I/O
by more than 0.3 V. External pull-up resistors, RP, are necessary
for proper I2C operation (see Figure 28). To ensure proper operation, refer to the UM10204 I2C-Bus Specification and User Manual,
Rev. 0319 June 2007, when selecting pull-up resistor values.
SINGLE-BYTE WRITE
MASTER START
SLAVE ADDRESS + WRITE
SLAVE
DATA
REGISTER ADDRESS
ACK
ACK
STOP
ACK
MULTIPLE-BYTE WRITE
MASTER START
DATA
DATA
REGISTER ADDRESS
ACK
SLAVE
ACK
STOP
ACK
ACK
SINGLE-BYTE READ
MASTER START
SLAVE
START1
REGISTER ADDRESS
ACK
SLAVE ADDRESS + READ
ACK
NACK
ACK
DATA
ACK
DATA
STOP
MULTIPLE-BYTE READ
MASTER START
SLAVE
ACK
SLAVE ADDRESS + READ
ACK
NACK
START IS EITHER A REPEATED START OR A STOP FOLLOWED BY A START.
NOTES
1. THE SHADED AREAS REPRESENT WHEN THE DEVICE IS LISTENING.
Figure 29. I2C Device Addressing
Table 13. I2C Digital Input/Output Specifications

Parameter
DIGITAL INPUT
Low Level Input Voltage (VIL)
High Level Input Voltage (VIH)
Low Level Input Current (IIL)
High Level Input Current (IIH)
DIGITAL OUTPUT
PIN CAPACITANCE
1
STOP
DATA
11669-033
1THIS
START1
REGISTER ADDRESS
ACK
Min
Limit1
Max
0.3 VDD I/O
0.7 VDD I/O

VS = VDD I/O
VS = 0 V
0.1
0.1
VDD I/O < 2 V, IOL = 3 mA

VDD I/O 2 V, IOL = 3 mA
VOL = VOL, MAX
fIN = 1 MHz, VS = 2.5 V
0.2 VDD I/O

400
3
8
Unit
V
V
A
A
V
mV
mA
pF
Data Sheet
ADXL375
Table 14. I2C Timing (TA = 25C, VS = 2.5 V, VDD I/O = 1.8 V)
Parameter
fSCL
t1
t2
t3
t4
t5
t63, 4, 5
t7
t8
t9
t10
Min
Limit1, 2
Max
400
2.5
0.6
1.3
0.6
100
0
0.6
0.6
1.3
0.9
300
0
t11
300
250
400
Cb
Unit
kHz
s
s
s
s
ns
s
s
s
s
ns
ns
ns
ns
pF
Description
SCL clock frequency
SCL cycle time
SCL high time
SCL low time
Hold time for start/repeated start condition
Data setup time
Data hold time
Setup time for repeated start condition
Setup time for stop condition
Bus-free time between a stop condition and a start condition
Rise time of SCL and SDA when receiving
Rise time of SCL and SDA when receiving or transmitting
Fall time of SCL and SDA when receiving
Fall time of SCL and SDA when transmitting
Capacitive load for each bus line
Limits based on characterization results, with fSCL = 400 kHz and a 3 mA sink current; not production tested.
The timing values are referred to the input thresholds (VIL and VIH) given in Table 13.
3
t6 is the data hold time that is measured from the falling edge of SCL. It applies to data during the transmission and acknowledge phases.
4
To bridge the undefined region of the falling edge of SCL, a transmitting device must internally provide an output hold time of at least 300 ns for the SDA signal (with
respect to VIH, MIN of the SCL signal).
5
The maximum value for t6 must be met only if the device does not stretch the low period (t3) of the SCL signal. The maximum value for t6 is a function of the clock low
time (t3), the clock rise time (t10), and the minimum data setup time (t5(MIN)). This value is calculated as t6(MAX) = t3 t10 t5(MIN).
2
SDA
t3
t9
t10
t4
t11
SCL
t6
t2
t5
t7
REPEATED
START
CONDITION
Figure 30. I2C Timing Diagram
t1
t8
STOP
CONDITION
11669-034
t4
START
CONDITION
ADXL375
Data Sheet
REGISTER MAP
All registers in the ADXL375 are eight bits in length.
Table 15. Register Map
Address
Hex
Decimal
0x00
0
0x01 to 0x1C 1 to 28
0x1D
29
0x1E
30
0x1F
31
0x20
32
0x21
33
0x22
34
0x23
35
0x24
36
0x25
37
0x26
38
0x27
39
0x2A
42
0x2B
43
0x2C
44
0x2D
45
0x2E
46
0x2F
47
0x30
48
0x31
49
0x32
50
0x33
51
0x34
52
0x35
53
0x36
54
0x37
55
0x38
56
0x39
57
Register Name
DEVID
Reserved
THRESH_SHOCK
OFSX
OFSY
OFSZ
DUR
Latent
Window
THRESH_ACT
THRESH_INACT
TIME_INACT
ACT_INACT_CTL
SHOCK_AXES
ACT_SHOCK_STATUS
BW_RATE
POWER_CTL
INT_ENABLE
INT_MAP
INT_SOURCE
DATA_FORMAT
DATAX0
DATAX1
DATAY0
DATAY1
DATAZ0
DATAZ1
FIFO_CTL
FIFO_STATUS
Access Type
R
N/A
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R
R/W
R/W
R/W
R/W
R
R/W
R
R
R
R
R
R
R/W
R
Reset Value
11100101
N/A
00000000
00000000
00000000
00000000
00000000
00000000
00000000
00000000
00000000
00000000
00000000
00000000
00000000
00001010
00000000
00000000
00000000
00000010
00000000
00000000
00000000
00000000
00000000
00000000
00000000
00000000
00000000
Description
Device ID
Reserved; do not access
Shock threshold
X-axis offset
Y-axis offset
Z-axis offset
Shock duration
Shock latency
Shock window
Activity threshold
Inactivity threshold
Inactivity time
Axis enable control for activity and inactivity detection
Axis control for single shock/double shock
Source of single shock/double shock
Data rate and power mode control
Power saving features control
Interrupt enable control
Interrupt mapping control
Interrupt source
Data format control
X-Axis Data 0
X-Axis Data 1
Y-Axis Data 0
Y-Axis Data 1
Z-Axis Data 0
Z-Axis Data 1
FIFO control
FIFO status
Data Sheet
ADXL375
REGISTER DESCRIPTIONS
Register 0x25THRESH_INACT (Read/Write)
All registers in the ADXL375 are eight bits in length.
The THRESH_INACT register contains the unsigned threshold

value for detecting inactivity. The magnitude of the inactivity
event is compared with the value in the THRESH_INACT
register. The scale factor is 780 mg/LSB. A value of 0 may result
in undesirable behavior if the inactivity interrupt is enabled.
Register 0x00DEVID (Read Only)

D7
1
D6
1
D5
1
D4
0
D3
0
D2
1
D1
0
D0
1
The read-only DEVID register holds the fixed device ID code

of 0xE5 (345 octal).
Register 0x1DTHRESH_SHOCK (Read/Write)

The THRESH_SHOCK register contains the unsigned threshold
value for shock interrupts. The magnitude of the shock event is
compared with the value in the THRESH_SHOCK register for
shock detection. The scale factor is 780 mg/LSB. A value of 0 may
result in undesirable behavior if single shock/double shock interrupts are enabled.
Register 0x1E, Register 0x1F, Register 0x20OFSX,

OFSY, OFSZ (Read/Write)
The OFSX, OFSY, and OFSZ registers contain user-configured
offset adjustments in twos complement format with a scale factor
of 0.196 g/LSB. The value stored in the offset registers is
automat-ically added to the acceleration data, and the resulting
value is stored in the output data registers (Address 0x32 to
Address 0x37). For more information about offset calibration
and the use of the offset registers, see the Offset Calibration
section.
Register 0x21DUR (Read/Write)

The DUR register contains an unsigned time value representing
the maximum time that an event must be above the THRESH_
SHOCK threshold to qualify as a shock event. The scale factor
is 625 s/LSB. A value of 0 disables the single shock and double
shock functions.
Register 0x22Latent (Read/Write)

The latent register contains an unsigned time value representing
the wait time from the detection of a shock event to the start of
the time window (specified by the window register) during which
a possible second shock event can be detected. The scale factor
is 1.25 ms/LSB. A value of 0 disables the double shock function.
Register 0x23Window (Read/Write)

The window register contains an unsigned time value representing the amount of time after the expiration of the latency
time (specified by the latent register) during which a second
valid shock can begin. The scale factor is 1.25 ms/LSB. A value
of 0 disables the double shock function.
Register 0x24THRESH_ACT (Read/Write)

The THRESH_ACT register contains the unsigned threshold
value for detecting activity. The magnitude of the activity event
is compared with the value in the THRESH_ACT register. The
scale factor is 780 mg/LSB. A value of 0 may result in undesirable
behavior if the activity interrupt is enabled.
Register 0x26TIME_INACT (Read/Write)

The TIME_INACT register contains an unsigned time value
representing the amount of time that acceleration must be less
than the value in the THRESH_INACT register for inactivity
to be detected. The scale factor is 1 sec/LSB. Unlike the other
interrupt functions, which use unfiltered output data (see the
Threshold Detection and Bandwidth section), the inactivity
function uses filtered output data.
At least one output sample must be generated for the inactivity
interrupt to be triggered. For this reason, the inactivity function
may appear to be unresponsive if the TIME_INACT register is
set to a value less than the time constant of the output data rate.
A value of 0 results in an interrupt when the output data is less
than the value in the THRESH_INACT register. The maximum
value for TIME_INACT is 255 sec.
Register 0x27ACT_INACT_CTL (Read/Write)

D7
ACT AC/DC
D3
INACT AC/DC
D6
ACT_X enable
D2
INACT_X enable
D5
ACT_Y enable
D1
INACT_Y enable
D4
ACT_Z enable
D0
INACT_Z enable
The ACT_INACT_CTL register selects dc-coupled or ac-coupled

operation and selects the axes that participate in activity and
inactivity detection.
ACT AC/DC and INACT AC/DC Bits

A setting of 0 for the ACT AC/DC and INACT AC/DC bits
selects dc-coupled operation; a setting of 1 selects ac-coupled
operation. In dc-coupled operation, the current acceleration
magnitude is compared directly with the values in the THRESH_
ACT and THRESH_INACT registers to determine whether
activity or inactivity is detected.
In ac-coupled operation for activity detection, the acceleration
value at the start of activity detection is taken as a reference value.
New samples of acceleration data are then compared to this reference value and, if the magnitude of the difference exceeds the
THRESH_ACT value, an activity interrupt is triggered.
Similarly, in ac-coupled operation for inactivity detection, a reference value is used for comparison and is updated whenever the
device exceeds the inactivity threshold. After the reference value
is selected, the device compares the magnitude of the difference
between the reference value and the current acceleration with the
THRESH_INACT value. If the difference is less than the value
in the THRESH_INACT register for the time specified in the
TIME_INACT register, the device is considered inactive, and
the inactivity interrupt is triggered.
ADXL375
Data Sheet
ACT_x Enable and INACT_x Enable Bits
Asleep Bit
A setting of 1 for the ACT_x enable and INACT_x enable bits

enables x-, y-, or z-axis participation in detecting activity or
inactivity. A setting of 0 excludes the selected axis from participation. If all axes are excluded, the function is disabled. For activity
detection, all participating axes are logically ORed, causing the
activity function to be triggered when any participating axis
exceeds the activity threshold. For inactivity detection, all participating axes are logically ANDed, causing the inactivity function
to be triggered only if all participating axes are below the inactivity
threshold for the specified time.
A setting of 1 in the asleep bit indicates that the part is asleep; a

setting of 0 indicates that the part is not asleep. This bit toggles
only if the device is configured for autosleep. For more information about the autosleep mode, see the AUTO_SLEEP Bit section.
Register 0x2ASHOCK_AXES (Read/Write)

D7
0
D3
Suppress
D6
0
D2
SHOCK_X enable
D5
0
D1
SHOCK_Y enable
D4
0
D0
SHOCK_Z enable
The SHOCK_AXES register specifies the participation of each

of the three axes in single shock/double shock detection.
Suppress Bit
Setting the suppress bit suppresses double shock detection if
acceleration greater than the value in the THRESH_SHOCK
register is present during the latency time between shocks. For
more information, see the Shock Detection section.
SHOCK_x Enable Bits

A setting of 1 in the SHOCK_X enable, SHOCK_Y enable, or
SHOCK_Z enable bit enables x-, y-, or z-axis participation in
shock detection. A setting of 0 excludes the selected axis from
participation in shock detection.
Register 0x2BACT_SHOCK_STATUS (Read Only)

D7
0
D3
Asleep
D6
ACT_X source
D2
SHOCK_X source
D5
ACT_Y source
D1
SHOCK_Y source
D4
ACT_Z source
D0
SHOCK_Z source
The read-only ACT_SHOCK_STATUS register indicates the

first axis involved in an activity or shock event.
ACT_x Source and SHOCK_x Source Bits

The ACT_x source and SHOCK_x source bits indicate the
first axis involved in an activity or shock event. A setting of 1
corresponds to involvement in the event; a setting of 0 corresponds to no involvement. When new data is available, these
bits are not cleared but are overwritten by the new data. Read
the ACT_SHOCK_STATUS register before clearing the interrupt. Disabling an axis from participation in activity or shock
events clears the corresponding source bit in this register when
the next activity or single shock/double shock event occurs.
Register 0x2CBW_RATE (Read/Write)

D7
0
D6
0
D5
0
D4
LOW_POWER
D3
D2
D1
Rate
D0
The BW_RATE register configures the device bandwidth

and output data rate; this register also enables and disables
low power mode.
LOW_POWER Bit
A setting of 0 in the LOW_POWER bit selects normal operation; a setting of 1 selects reduced power operation, which has
somewhat higher noise. For more information, see the Low
Power Mode section.
Rate Bits
The rate bits select the device bandwidth and output data rate
(see Table 6 and Table 8). The default value for these bits is 0x0A,
which translates to a 100 Hz output data rate. The selected output
data rate must be appropriate for the communication protocol
and frequency selected. Selecting an output data rate that is too
high for the communication speed may result in samples being
discarded (for more information, see the Serial Communications
section).
Register 0x2DPOWER_CTL (Read/Write)

D7
0
D6
0
D5
Link
D4
AUTO_SLEEP
D3
Measure
D2
Sleep
D1
D0
Wakeup
The POWER_CTL register can be used to configure the device

for autosleep mode; this register is also used to set the device to
measurement mode or standby mode.
Link Bit
The link bit serially links the activity and inactivity functions. If
both the activity and inactivity functions are enabled, a setting of
1 in the link bit delays the start of the activity detection function
until inactivity is detected. After activity is detected, inactivity
detection begins, preventing the detection of activity. When this
bit is set to 0, the inactivity and activity functions are concurrent.
For more information about the link feature, see the Link Mode
section.
Before clearing the link bit, it is recommended that the part be
placed in standby mode (set the measure bit, Bit D3, to 0). After
clearing the link bit, reset the part to measurement mode (set the
measure bit, Bit D3, to 1). This configuration sequence ensures
that the device is properly biased if sleep mode is manually
disabled; otherwise, the first few samples of data after the link
bit is cleared may have additional noise, especially if the device
is asleep when the bit is cleared.
Data Sheet
ADXL375
AUTO_SLEEP Bit
Table 16. Sampling Rate in Sleep Mode
If the link bit is set, a setting of 1 in the AUTO_SLEEP bit

enables the autosleep function. In autosleep mode, the ADXL375
automatically switches to sleep mode if the inactivity function is
enabled and inactivity is detected (that is, when acceleration is
below the THRESH_INACT value for at least the time specified
by the TIME_INACT value). If activity detection is also enabled,
the ADXL375 automatically wakes up from sleep after detecting
activity and returns to operation at the output data rate set in
the BW_RATE register. A setting of 0 in the AUTO_SLEEP bit
disables automatic switching to sleep mode.
If the link bit is not set, the AUTO_SLEEP feature is disabled and
setting the AUTO_SLEEP bit has no effect on device operation.
For more information about the link feature, see the Link Bit
section and the Link Mode section. For more information about
autosleep mode, see the Autosleep Mode section.
Before clearing the AUTO_SLEEP bit, it is recommended that the
part be placed in standby mode (set the measure bit, Bit D3, to 0).
After clearing the AUTO_SLEEP bit, reset the part to measurement mode (set the measure bit, Bit D3, to 1). This configuration
sequence ensures that the device is properly biased if sleep mode
is manually disabled; otherwise, the first few samples of data after
the AUTO_SLEEP bit is cleared may have additional noise,
especially if the device is asleep when the bit is cleared.
Measure Bit
A setting of 0 in the measure bit places the part into standby
mode; a setting of 1 places the part into measurement mode.
The ADXL375 powers up in standby mode with minimum
power consumption (see the Power Sequencing section).
Sleep Bit
A setting of 0 in the sleep bit places the part into the normal
mode of operation; a setting of 1 places the part into sleep mode.
Sleep mode suppresses the DATA_READY interrupt, stops transmission of data to the FIFO buffer, and switches the sampling
rate to the rate specified by the wakeup bits (Bits[D1:D0]). In
sleep mode, only the activity function can be used. When the
DATA_READY interrupt is suppressed, the output data registers
(Register 0x32 to Register 0x37) are still updated at the sampling
rate set by the wakeup bits.
Before clearing the sleep bit, it is recommended that the part be
placed in standby mode (set the measure bit, Bit D3, to 0). After
clearing the sleep bit, reset the part to measurement mode (set the
measure bit, Bit D3, to 1).
Wakeup Bits
The wakeup bits control the sampling rate during sleep mode
(see Table 16).
D1
0
0
1
1
Setting
D0
0
1
0
1
Frequency (Hz)
8
4
2
1
Register 0x2EINT_ENABLE (Read/Write)

D7
DATA_READY
D3
Inactivity
D6
SINGLE_SHOCK
D2
0
D5
DOUBLE_SHOCK
D1
Watermark
D4
Activity
D0
Overrun
A setting of 1 for any bit in the INT_ENABLE register enables

the specified function to generate interrupts; a setting of 0 for
any bit in this register prevents the function from generating
interrupts. The DATA_READY, watermark, and overrun bits
enable only the interrupt output; the functions are always
enabled. It is recommended that interrupts be configured in
Register 0x2F before their outputs are enabled in this register.
For more information about the interrupts, see the Bits in the
Interrupt Registers section.
Register 0x2FINT_MAP (Read/Write)

D7
DATA_READY
D3
Inactivity
D6
SINGLE_SHOCK
D2
0
D5
DOUBLE_SHOCK
D1
Watermark
D4
Activity
D0
Overrun
A setting of 0 for any bit in the INT_MAP register causes the

specified interrupt to be sent to the INT1 pin; a setting of 1 for
any bit in this register causes the specified interrupt to be sent to
the INT2 pin. All selected interrupts for a given pin are ORed.
Register 0x30INT_SOURCE (Read Only)

D7
DATA_READY
D3
Inactivity
1
D6
SINGLE_SHOCK
D2
X1
D5
DOUBLE_SHOCK
D1
Watermark
D4
Activity
D0
Overrun
X = ignore this bit.
A setting of 1 for any bit in the INT_SOURCE register indicates

that the specified function has triggered an interrupt; a setting of
0 for any bit in this register indicates that the specified function
has not triggered an interrupt. The DATA_READY, watermark,
and overrun bits are always set if the corresponding interrupt
occurs, regardless of the settings in the INT_ENABLE register;
these bits are cleared by reading data from the data registers
(Address 0x32 to Address 0x37). The DATA_READY and watermark bits may require multiple reads to be cleared. Other bits,
and their corresponding interrupts, are cleared by reading the
INT_SOURCE register.
ADXL375
Data Sheet
Register 0x31DATA_FORMAT (Read/Write)

D7
D6
SELF_TEST SPI
D5
D4
INT_INVERT 0
D3
1
D2
Justify
Register 0x38FIFO_CTL (Read/Write)

D1
1
D0
1
D7
D6
FIFO_MODE
D5
Trigger
D4
D3
D2
D1
Samples
D0
The DATA_FORMAT register controls the presentation of data

to Register 0x32 through Register 0x37.
The FIFO_CTL register is used to configure the FIFO buffer for

the device. For more information, see the FIFO Buffer section.
SELF_TEST Bit
For an in-depth description of the FIFO buffer, see the AN-1025

Application Note, Utilization of the First In, First Out (FIFO) Buffer
in Analog Devices, Inc., Digital Accelerometers.
A setting of 1 in the SELF_TEST bit applies a self-test force to the

sensor, causing a shift in the output data. A value of 0 disables the
self-test force. For more information about the self-test function,
see the Self-Test section and the Using Self-Test section.
SPI Bit
A value of 1 in the SPI bit configures the device for 3-wire SPI
mode; a value of 0 configures the device for 4-wire SPI mode.
INT_INVERT Bit
A value of 0 in the INT_INVERT bit sets the polarity of the
interrupt pins to active high; a value of 1 sets the polarity of
the interrupt pins to active low.
FIFO_MODE Bits
These bits set the FIFO mode, as described in Table 17.
Table 17. FIFO Modes
Setting
D7
D6
0
0
0
1
FIFO
Mode
Bypass
FIFO
Stream
Trigger
Justify Bit
A setting of 1 in the justify bit selects left justified (MSB) mode; a
setting of 0 selects right justified (LSB) mode with sign extension.
Register 0x32 to Register 0x37DATAX0, DATAX1,

DATAY0, DATAY1, DATAZ0, DATAZ1 (Read Only)
These six bytes (Register 0x32 to Register 0x37) are each eight
bits in length and contain the output data for each axis.
Register 0x32 and Register 0x33 contain the output data

for the x-axis.
for the y-axis.
for the z-axis.
The output data is in twos complement format. DATAx0 is

the least significant byte, and DATAx1 is the most significant
byte (x represents X, Y, or Z). The DATA_FORMAT register
(Address 0x31) controls the format of the data. It is recommended
that a multiple-byte read of all six registers be performed to
prevent a change in data between reads of sequential registers.
When using the 3200 Hz or 1600 Hz output data rate, the LSB of
the output data-word is always 0. When the data is right justified,
the LSB corresponds to Bit D0 of the DATAx0 register; when the
data is left justified, the LSB corresponds to Bit D3 of the DATAx0
register.
Description
FIFO buffer is bypassed.
FIFO buffer collects up to 32 samples and
then stops collecting data, collecting new
data only when the buffer is not full.
FIFO buffer holds the last 32 samples.
When the buffer is full, the oldest data
is overwritten with newer data.
FIFO buffer holds the last samples before
the trigger event and continues to collect
data until full. New data is collected only
when the buffer is not full.
Trigger Bit
A value of 0 in the trigger bit links the trigger event of trigger
mode to the INT1 pin, and a value of 1 links the trigger event
to the INT2 pin.
Samples Bits
The function of the samples bits depends on the FIFO mode
selected (see Table 18). Entering a value of 0 in the samples bits
immediately sets the watermark bit in the INT_SOURCE register,
regardless of the FIFO mode selected. Undesirable operation may
occur if a value of 0 is used for the samples bits when trigger
mode is used.
Table 18. Samples Bits Functions
FIFO Mode
Bypass
FIFO
Stream
Trigger
Samples Bits Function

None.
Specifies how many FIFO entries are needed to
trigger a watermark interrupt.
Specifies how many FIFO entries are needed to
trigger a watermark interrupt.
Specifies how many FIFO samples are retained in
the FIFO buffer before a trigger event.
Data Sheet
ADXL375
Register 0x39FIFO_STATUS (Read Only)

D7
FIFO_TRIG
D6
0
D5
D4
D3
D2
Entries
Entries Bits
D1
D0
The read-only FIFO_STATUS register indicates whether a

trigger event has occurred and reports the number of data
values stored in the FIFO buffer.
FIFO_TRIG Bit
When the FIFO_TRIG bit is set to 1, a trigger event has occurred;
when the FIFO_TRIG bit is set to 0, no trigger event has occurred.
The entries bits report how many data values are stored in the
FIFO buffer. The data stored in the FIFO buffer is accessed by
reading the data registers (Address 0x32 to Address 0x37). FIFO
reads must be done in burst mode (multiple-byte mode) because
each FIFO level is cleared after any read (single- or multiplebyte) of the FIFO buffer. The FIFO buffer stores a maximum of
32 entries, which equates to a maximum of 33 entries available
at any given time because an additional entry is available at the
output filter of the device.
ADXL375
Data Sheet
APPLICATIONS INFORMATION
POWER SUPPLY DECOUPLING
SHOCK DETECTION
A 1 F tantalum capacitor (CS) at VS and a 0.1 F ceramic capacitor (CI/O) at VDD I/O placed close to the ADXL375 supply pins are
recommended to adequately decouple the accelerometer from
noise on the power supply. If additional decoupling is necessary,
a resistor or ferrite bead (no larger than 100 ) in series with VS
may be helpful. Additionally, increasing the bypass capacitance
on VS to a 10 F tantalum capacitor in parallel with a 0.1 F
ceramic capacitor may also improve noise performance.
The shock interrupt function can detect mechanical shock events

based on amplitude and pulse width. Figure 33 illustrates the
following parameters for a valid single shock event and a valid
double shock event.
Make sure that the connection from the ADXL375 ground to

the power supply ground has low impedance because noise transmitted through ground has an effect similar to noise transmitted
through VS. It is recommended that VS and VDD I/O be separate
supplies to minimize digital clocking noise on the VS supply. If
it is not possible to use separate supplies, additional filtering of
the supplies, as previously mentioned, may be necessary.
Shock detection thresholddefined by the THRESH_

SHOCK register (Address 0x1D).
Maximum shock duration time (time limit for shocks)
defined by the DUR register (Address 0x21).
Shock latency timedefined by the latent register (Address
0x22). The latency time is the waiting period from the end
of the first shock until the start of the time window, when a
second shock can be detected.
Time window for second shockdefined by the window
register (Address 0x23). The time window is the interval
after the latency time (set by the latent register). Although
a second shock must begin after the latency time expires, it
need not finish before the end of the time defined by the
window register.
VDD I/O
VS
CI/O
CS
VDD I/O
ADXL375
FIRST SHOCK
INT1 SDO/ALT ADDRESS

SCL/SCLK
INT2
CS
11669-016
GND
3- OR 4-WIRE
SPI OR I2C
INTERFACE
Figure 31. Application Diagram
ACCELEROMETERS
INTERRUPTS
LATENCY
TIME
(LATENT)
TIME WINDOW FOR

SECOND SHOCK
(WINDOW)
SINGLE SHOCK
INTERRUPT
DOUBLE SHOCK
INTERRUPT
Figure 33. Shock Interrupt Function with Valid Single and Double Shocks
If only the single shock function is in use, the single shock

interrupt is triggered when the acceleration goes below the
threshold, as long as the duration time is not exceeded. If
both the single and double shock functions are in use, the
single shock interrupt is triggered when the double shock
event is either validated or invalidated.
11669-036
PCB
MOUNTING POINTS
THRESHOLD
(THRESH_SHOCK)
TIME LIMIT FOR

SHOCKS (DUR)
MECHANICAL CONSIDERATIONS FOR MOUNTING

Mount the ADXL375 on the PCB in a location close to a hard
mounting point of the PCB to the case. Mounting the ADXL375
at an unsupported PCB location, as shown in Figure 32, may result
in large, apparent measurement errors due to undampened PCB
vibration. Locating the accelerometer near a hard mounting point
ensures that any PCB vibration at the accelerometer is above the
mechanical sensor resonant frequency of the accelerometer and
is, therefore, effectively invisible to the accelerometer. Multiple
mounting points, close to the sensor, and/or a thicker PCB also
help to reduce the effects of system resonance on the performance
of the sensor.
SECOND SHOCK
ACCELERATION
SDA/SDI/SDIO
INTERRUPT
CONTROL
11669-037
VS
Figure 32. Incorrectly Placed Accelerometers
Data Sheet
ADXL375
Several events invalidate the second shock of a double shock event.
If the suppress bit in the SHOCK_AXES register (Bit D3,

Address 0x2A) is set, any acceleration spike above the
threshold during the latency time (set by the latent register)
invalidates the double shock detection (see Figure 34).
INVALIDATES DOUBLE SHOCK IF
SUPPRESS BIT SET
Every mechanical system has somewhat different shock responses

based on the mechanical characteristics of the system. Therefore,
some experimentation with values for the DUR, latent, window,
and THRESH_SHOCK registers is required.
LATENCY
TIME (LATENT)
TIME WINDOW FOR SECOND

SHOCK (WINDOW)
11669-038
ACCELERATION
TIME LIMIT
FOR SHOCKS
(DUR)
Figure 34. Double Shock Event Invalid Due to High g Event

When the Suppress Bit Is Set
A double shock event can be invalidated if acceleration

above the threshold is detected at the start of the time
window for the second shock (set by the window register),
resulting in an invalid double shock at the start of this
window (see Figure 35).
A double shock event can be invalidated if acceleration
exceeds the time limit for shocks (set by the DUR register),
resulting in an invalid double shock at the end of the DUR
time limit for the second shock event (see Figure 35).
ACCELERATION
INVALIDATES DOUBLE SHOCK

AT START OF WINDOW
Setting a very low value in the latent, window, or THRESH_

SHOCK register can result in unpredictable responses due to
the accelerometer picking up echoes of the shock inputs.
After a shock interrupt is received, the first axis to exceed the
THRESH_SHOCK level is reported in the ACT_SHOCK_
STATUS register (Address 0x2B). This register is never cleared
but is overwritten with new data.
THRESHOLD DETECTION AND BANDWIDTH

Lower output data rates are achieved by decimating a common
sampling frequency inside the device. The activity and single
shock/double shock detection functions are performed using
undecimated data. Because the bandwidth of the output data
varies with the data rate and is lower than the bandwidth of the
undecimated data, the high frequency and high g data that is used
to determine activity and single shock/double shock events may
not be present if the output of the accelerometer is examined. This
may result in the triggering of these functions when acceleration
data does not appear to meet the conditions set by the user for
the corresponding function.
LINK MODE
The link bit (Bit D5) in the POWER_CTL register (Address 0x2D)
can be used to reduce the number of activity interrupts that the
processor must service. The link bit configures the device to look
for activity only after inactivity.
TIME LIMIT
FOR SHOCKS
(DUR)
TIME LIMIT
FOR SHOCKS
(DUR)
LATENCY
TIME
(LATENT)
For proper operation of this feature, the processor must still

respond to the activity and inactivity interrupts by reading the
INT_SOURCE register (Address 0x30) and, therefore, clearing
the interrupts. If an activity interrupt is not cleared, the part
cannot enter autosleep mode. The asleep bit (Bit D3) in the
ACT_SHOCK_STATUS register (Address 0x2B) indicates
whether the part is asleep.
TIME WINDOW FOR

SECOND SHOCK (WINDOW)
INVALIDATES
DOUBLE SHOCK AT
END OF DUR
11669-039
TIME LIMIT
FOR SHOCKS
(DUR)
ACCELERATION
Single shocks, double shocks, or both can be detected by setting

the appropriate bits in the INT_ENABLE register (Address 0x2E).
Participation of each of the three axes in single shock/double
shock detection is controlled by setting the appropriate bits in
the SHOCK_AXES register (Address 0x2A). For the double
shock function to operate, both the latent and window registers
must be set to a nonzero value.
Figure 35. Shock Interrupt Function with Invalid Double Shocks
ADXL375
Data Sheet
SLEEP MODE vs. LOW POWER MODE

In applications where a low data rate and low power consumption
are desired (at the expense of noise performance), it is recommended that low power mode be used. Low power mode preserves
the functionality of the DATA_READY interrupt and the FIFO
buffer for postprocessing of the acceleration data. To enable low
power mode, set the LOW_POWER bit (Bit D4) in the BW_RATE
register (Address 0x2C).
Sleep mode also provides a low data rate and low power consumption, but it is not intended for data acquisition. However, when
sleep mode is used in conjunction with the autosleep and link
modes, the part can automatically switch to a low power, low
sampling rate mode when inactivity is detected. To prevent the
generation of redundant inactivity interrupts, the inactivity
interrupt is automatically disabled and the activity interrupt is
enabled. To enable autosleep mode, set the AUTO_SLEEP bit
(Bit D4) and the link bit (Bit D5) in the POWER_CTL register
(Address 0x2D).
When the ADXL375 is in sleep mode, the host processor can also
be placed into sleep mode or low power mode to save significant
system power. When activity is detected, the accelerometer automatically switches back to the original data rate of the application
and provides an activity interrupt that can be used to wake up the
host processor. Similar to when inactivity occurs, detection of
activity events is disabled and detection of inactivity is enabled.
OFFSET CALIBRATION
Accelerometers are mechanical structures containing elements
that are free to move. These moving parts can be very sensitive
to mechanical stresses, much more so than solid-state electronics.
The 0 g bias, or offset, is an important accelerometer metric
because it defines the baseline for measuring acceleration.
Additional stresses can be applied during assembly of a system
containing an accelerometer. These stresses can come from, but
are not limited to, component soldering, board stress during
mounting, and application of any compounds on or over the
component. If calibration is deemed necessary, it is recommended
that it be performed after system assembly to compensate for
these effects.
A simple method of calibration is to measure the offset while
assuming that the sensitivity of the ADXL375 is as specified in
Table 1. The offset can then be automatically accounted for by
using the built-in offset registers. The result of this calibration is
that the data acquired from the data registers already compensates
for any offset.
In a no-turn or single-point calibration scheme, the part is
oriented such that one axis, typically the z-axis, is in the 1 g field
of gravity, and the remaining axes, typically the x- and y-axes, are
in a 0 g field. The output is then measured by taking the average
of a series of samples.
The number of samples averaged is selected by the system

designer, but a recommended starting point is 0.1 sec worth of
data for data rates of 100 Hz or greaterthat is, 10 samples at
the 100 Hz data rate. For data rates less than 100 Hz, it is recommended that at least 10 samples be averaged. These values are
stored as X0g, Y0g, and Z+1g for the 0 g measurements on the xand y-axes and the 1 g measurement on the z-axis, respectively.
The values measured for X0g and Y0g correspond to the x- and
y-axis offsets, and compensation is performed by subtracting
these values from the output of the accelerometer to obtain the
actual acceleration, as follows:
XACTUAL = XMEAS X0g
YACTUAL = YMEAS Y0g
Because the z-axis measurement is performed in a +1 g field,
a no-turn or single-point calibration scheme assumes an ideal
sensitivity, SZ, for the z-axis. This value is subtracted from Z+1g
to obtain the z-axis offset, which is then subtracted from future
measured values to obtain the actual value, as follows:
Z0g = Z+1g SZ
ZACTUAL = ZMEAS Z0g
The ADXL375 can automatically compensate the output for offset
by using the offset registers (Register 0x1E, Register 0x1F, and
Register 0x20). These registers contain an 8-bit, twos complement
value that is automatically added to all measured acceleration
values; the result is then placed into the data registers. Because
the value placed in an offset register is additive, a negative value
in the register eliminates a positive offset, and a positive value in
the register eliminates a negative offset. The register has a scale
factor of 1.56 g/LSB.
As with all registers in the ADXL375, the offset registers do not
retain the values written into them when power is removed from
the part. Power cycling the ADXL375 returns the offset registers
to their default value of 0x00.
Because the no-turn or single-point calibration method assumes
an ideal sensitivity in the z-axis, any error in the sensitivity results
in offset error.
DATA FORMATTING AT OUTPUT DATA RATES OF

3200 HZ AND 1600 HZ
When using the 3200 Hz or 1600 Hz output data rate, the
LSB of the output data-word is always 0. When the data is right
justified, the LSB corresponds to Bit D0 of the DATAx0 register;
when the data is left justified, the LSB corresponds to Bit D3 of
the DATAx0 register.
Data Sheet
ADXL375
7.
USING SELF-TEST
The self-test change is defined as the difference between the
acceleration output of an axis with self-test enabled and the
acceleration output of the same axis with self-test disabled. Due
to device filtering, the output reaches its final value after 4
when enabling or disabling self-test, where = 1/(data rate).
This definition assumes that the sensor does not move between
these two measurements; if the sensor moves, a non-self-test
related shift corrupts the test.
Proper configuration of the ADXL375 is necessary for an
accurate self-test measurement. To configure the part for selftest, follow this procedure.
1.
2.
3.
4.
5.
6.
Set the data rate from 100 Hz to 800 Hz, or set the data rate
to 3200 Hz by writing to the rate bits (Bits[D3:D0]) in the
BW_RATE register (Address 0x2C). Write a value from
0x0A to 0x0D, or write 0x0F to the BW_RATE register.
For accurate self-test measurements, configure the part for
normal power operation by clearing the LOW_POWER bit
(Bit D4) in the BW_RATE register (Address 0x2C).
After the part is configured for accurate self-test measurement, retrieve samples of x-, y-, and z-axis acceleration
data from the sensor and average them together.
The number of samples averaged is selected by the system
designer, but a recommended starting point is 0.1 sec worth
of data for data rates of 100 Hz or greaterthat is, 10 samples
at the 100 Hz data rate.
Store the averaged values and label them appropriately
as the values with self-test disabled, that is, XST_OFF,
YST_OFF, and ZST_OFF.
Enable self-test by setting the SELF_TEST bit (Bit D7)
in the DATA_FORMAT register (Address 0x31).
The output requires some time (approximately four samples)
to settle after self-test is enabled.
After allowing the output to settle, retrieve samples of x-, y-,
and z-axis acceleration data and average them together.
It is recommended that the same number of samples be taken
for the self-test average as was done for the non-self-test
average.
8.
Store the averaged values and label them appropriately

as the values with self-test enabled, that is, XST_ON,
YST_ON, and ZST_ON.
Disable self-test by clearing the SELF_TEST bit (Bit D7)
in the DATA_FORMAT register (Address 0x31).
With the stored values for self-test enabled and disabled, the
self-test change is as follows:
XST = XST_ON XST_OFF
YST = YST_ON YST_OFF
ZST = ZST_ON ZST_OFF
Because the measured output for each axis is expressed in LSBs,
XST, YST, and ZST are also expressed in LSBs. These values can be
converted to acceleration (g) by multiplying each value by the
49 mg/LSB scale factor.
If the self-test change is within the valid range, the test is considered
successful. Generally, a part is considered to pass if the minimum
magnitude of change is achieved. However, a part that changes by
more than the maximum magnitude is not necessarily a failure.
The self-test response in the x- and y-axes exhibits bimodal
behavior and, therefore, is not always a reliable indicator of
sensor health or potential shift in device sensitivity. For this
reason, perform the self-test check in the z-axis.
Another effective method for using the self-test to verify accelerometer functionality is to toggle the self-test at a certain rate
and then perform an FFT on the output. The FFT should have
a corresponding tone at the frequency where the self-test was
toggled. Using an FFT in this way removes the dependency of
the test on supply voltage and self-test magnitude, which can
vary within a rather wide range.
ADXL375
Data Sheet
AXES OF ACCELERATION SENSITIVITY

AZ
AX
11669-021
AY
Figure 36. Axes of Acceleration Sensitivity (Corresponding Output Voltage Increases When Accelerated Along the Sensitive Axis)
XOUT = 1g
YOUT = 0g
ZOUT = 0g
TOP
TOP
TOP
GRAVITY
XOUT = 0g
YOUT = 1g
ZOUT = 0g
XOUT = 1g
YOUT = 0g
ZOUT = 0g
XOUT = 0g
YOUT = 0g
ZOUT = 1g
Figure 37. Output Response vs. Orientation to Gravity
XOUT = 0g
YOUT = 0g
ZOUT = 1g
11669-022
TOP
XOUT = 0g
YOUT = 1g
ZOUT = 0g
Data Sheet
ADXL375
LAYOUT AND DESIGN RECOMMENDATIONS

Figure 38 shows the recommended printed wiring board land pattern.
3.3400
1.0500
0.5500
0.2500
3.0500
11669-014
5.3400
0.2500
1.1450
Figure 38. Recommended Printed Wiring Board Land Pattern (Dimensions shown in millimeters)
PACKAGE INFORMATION
375B
#yww
vv v v
CNTY
11669-102
Figure 39 and Table 19 provide information about the package branding for the ADXL375.
Figure 39. Product Information on Package (Top View)
Table 19. Package Branding Information

Branding Key
375B
#
yww
vvvv
CNTY
Field Description
Part identifier for the ADXL375
RoHS-compliant designation
Date code
Factory lot code
Country of origin
ADXL375
Data Sheet
OUTLINE DIMENSIONS
PAD A1
CORNER
3.00
BSC
0.49
BOTTOM VIEW
13
14
0.813 0.50
0.80
BSC
5.00
BSC
0.50
8
TOP VIEW
END VIEW
1.01
0.79
0.74
0.69
0.49
1.50
03-16-2010-A
1.00
0.95
0.85
SEATING
PLANE
Figure 40. 14-Terminal Land Grid Array [LGA]

(CC-14-1)
Dimensions shown in millimeters
ORDERING GUIDE
Model1
ADXL375BCCZ
ADXL375BCCZ-RL
ADXL375BCCZ-RL7
EVAL-ADXL375Z
EVAL-ADXL375Z-M
Temperature
Range
40C to +85C
40C to +85C
40C to +85C
40C to +85C
Measurement
Range (g)
200
200
200
Specified
Voltage (V)
2.5
2.5
2.5
EVAL-ADXL375Z-S
1
Package Description
14-Terminal Land Grid Array [LGA]
Evaluation Board
Inertial Sensor Evaluation System, Includes
ADXL375 Satellite
ADXL375 Satellite, Standalone (can be used
with other inertial sensor evaluation systems)
Z = RoHS Compliant Part.
I2C refers to a communications protocol originally developed by Philips Semiconductors (now NXP Semiconductors).
20132014 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D11669-0-4/14(B)
Package
Option
CC-14-1
CC-14-1
CC-14-1

ADXL375 Example

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3-Axis, 200 g

Digital MEMS Accelerometer

Low power: as low as 35 A in measurement mode and

The ADXL375 is a small, thin, 3-axis accelerometer that provides

FUNCTIONAL BLOCK DIAGRAM

Information furnished by Analog Devices is believed to be accurate and reliable. However, no

One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.

Serial Communications ................................................................. 15

SPI Mode ..................................................................................... 15

General Description ......................................................................... 1

Functional Block Diagram .............................................................. 1

Register Map ................................................................................... 20

Revision History ............................................................................... 2

Register Descriptions ................................................................. 21

Applications Information .............................................................. 26

Absolute Maximum Ratings ............................................................ 4

Power Supply Decoupling ......................................................... 26

Thermal Resistance ...................................................................... 4

Mechanical Considerations for Mounting .............................. 26

ESD Caution .................................................................................. 4

Shock Detection ......................................................................... 26

Soldering Profile ........................................................................... 5

Threshold Detection and Bandwidth ...................................... 27

Pin Configuration and Function Descriptions ............................. 6

Link Mode ................................................................................... 27

Typical Performance Characteristics ............................................. 7

Sleep Mode vs. Low Power Mode............................................. 28

Theory of Operation ...................................................................... 10

Offset Calibration ....................................................................... 28

Power Sequencing ...................................................................... 10

Data Formatting at Output Data Rates of 3200 Hz

Power Saving Modes .................................................................. 11

Using Self-Test ............................................................................ 29

FIFO Buffer ................................................................................. 11

Axes of Acceleration Sensitivity ............................................... 30

Layout and Design Recommendations ................................... 31

Package Information .................................................................. 31

Enabling and Disabling Interrupts ........................................... 13

Outline Dimensions ....................................................................... 32

Clearing Interrupts ..................................................................... 13

Ordering Guide .......................................................................... 32

Bits in the Interrupt Registers ................................................... 13

Percentage of full scale

X-, y-, and z-axes

ABSOLUTE MAXIMUM RATINGS

JA is specified for the worst-case conditions, that is, a device

Table 3. Package Characteristics

Stresses above those listed under Absolute Maximum Ratings

Figure 2. Recommended Soldering Profile

Table 4. Recommended Soldering Profile Limits1, 2

Based on JEDEC Standard J-STD-020D.1.

PIN CONFIGURATION AND FUNCTION DESCRIPTIONS

Figure 3. Pin Configuration

Table 5. Pin Function Descriptions

TYPICAL PERFORMANCE CHARACTERISTICS

OFFSET DRIFT (g)

PERCENT OF POPULATION (%)

Figure 7. X-Axis Offset Drift, 15 Parts Soldered to PCB, VS = 2.5 V

Figure 4. X-Axis Zero g Offset at 25C, VS = 2.5 V

OFFSET DRIFT (g)

PERCENT OF POPULATION (%)

Figure 5. Y-Axis Zero g Offset at 25C, VS = 2.5 V

Figure 8. Y-Axis Offset Drift, 15 Parts Soldered to PCB, VS = 2.5 V