Filter GSGS8EAF FM.0007.3 PDF

Wireless Development Centre
Interference Mitigation Filter

OEM General Specification
Dataset Name: GSGS8EAF
Document Status: Approved
Stream: 00 Issue: 07.3
Issue date: March 15, 2004
Security status: Proprietary
Author: Kathleen Neild
DISCLAIMER:
Refer to the Revision History section of this document for information about the status of this document. Any hardcopy of this document or unlocked softcopy must be regarded as an uncontrolled copy.
PROPRIETARY:
The information contained in this document is the property of Nortel Networks. Except as specifically authorized in
writing by Nortel Networks the holder of this document: (1) shall keep all information contained herein confidential
and shall protect same in whole or in part from disclosure and dissemination to all third parties and (2) shall use same
for operation and maintenance purposes only.
2003Nortel Networks
All rights reserved
This page intentionally left blank
page 3
Publication history
The latest controlled release of this document is located in DDME under the Dataset Name.
Please check DDME for the latest stream and issue of this document.
All other soft and hard copies are uncontrolled.
It is the responsibility of the reader to ensure that the latest release of this document is being
used.
Key Reviewers
Recommendation from the members on the key reviewers list is a crucial step in ensuring that
this general specification document is ready for final approval. Key reviewers have been
selected due to their impact on the design of the interference mitigation filter.
Function
Printed Name
Document Function
RF Systems
Sarika Kapil
Consultant
RF Hardware Advisor
Mark Willetts
Consultant
Mechanical
Mike Berry
Consultant
Supply Management
Rex Arguelles
Consultant
Supply Management
Elio Querin
Consultant
RF Hardware
Jason Yamazaki
Consultant
RF Systems
James Loo
Consultant
Safety Prime
Patrick Ma
Consultant
Regulatory Prime
Thomas Wong
Consultant
PLM
Matt Conrod
Consultant
Approval Record
The release of this document has been reviewed and approved for distribution and use by the
following:
Function
Printed Name
Originator/Decision Maker
Kathleen Neild
Functional Manager/Approver
Brad Carlson
RF Modules/ Ratifer
Ed Geeraert
BTS Systems/ Ratifier
Tom Danshin

GSGS8EAF
page 4
Revision History
Stream/issue
Revision Date
Reason for Change
Author/Department
00/00.01
10/20/98
Initial release of document
Lee Ager 2M22
00/00.02
10/21/98
Edits as per key reviewers
Lee Ager 2M22
00/00.04
11/20/98
Edits as per vendor review
Lee Ager 2M22
00/00.05
11/27/98
Includes variant frequencies
Lee Ager 2M22
00/00.06
12/03/98
Lee Ager 2M22
00/00.08
12/05/98
Lee Ager 2M22
00/01
12/22/98
Released into DDME
Lee Ager 2M22
00/01.01
03/23/99
Update to mechanical drawings
Lee Ager 2M21
00/02
03/31/99
Lee Ager 2M21
00/02.01
05/18/99
Includes only four variants to be qualified.
Lee Ager 2M21
00/03
05/21/99
Updates as per key reviewers
Lee Ager 2M21
00/04
06/17/99
change of pecs
Lee Ager 2M21
00/05
10/02/99
Update electrical specs
Lee Ager 2M21
00/06
01/10/00
Update to mechanical drawings
Lee Ager 2M23
00/06.1
23/06/03
As per CR Q00687953 Updated to

remove grounding cable
Kathleen Neild 2U41
Updated Key Reviewers

Updated Table 1 IMF Variants to add
CDMA Channel numbers
Added Figure 5 Three Carrier with
Duplexer and Figure 6 Three Carrier
without Duplexer
As per CR Q00687953 Removed Figure 8 Grounding Diagram
Table 5 Climatic Requirements
removed Low Temperature Re-start
and High Temperature Re-start
8.3 Product Safety updated the CSA
and UL requirements
00/06.2
2/07/03
Updated Table 1 from internal review
Kathleen Neild 2U41
00/07
17/07/03
Approved version submitted to DDME
Kathleen Neild 2U41
00/07.1
02/04/04
Added B-Band variant of IMF
Sarika Kapil 2U41

GSGS8EAF
page 5
Stream/issue
Revision Date
Reason for Change
Author/Department
00/07.2
03/11/04
Updated specs the following specs for

NTGS8Exx:
Sarika Kapil 2U41
- Clarified Passband max ripple.

- Increased Passband max integrated
mean square phase error spec.
- Clarified Passband max insertion
loss spec.
- Increased the spec for the return
loss.
- Increased the spec for channel
passband max group delay variation
and reduced the spec for the absolute
group delay at passband center frequency.
- Reduced the number of required
temperature cycles.
- Changed the connector requirement.
- The maximum passive intermodulation products spec is no longer applicable for this IMF.
00/07.3
03/15/04
- The PEC for NTGS8Exx is officially

NTGS8912. Updated all references
of the NTGS8Exx with NTGS8912.
Sarika Kapil 2U41
- Added Matt Conrod to the consultant

list.
Major revisions will be marked by a change bar on the left of the table.

GSGS8EAF
page 6
Preface
This document describes the general specifications of the 800 MHz Interference Mitigation
Filter (IMF) which will operate in the cellular frequency band.
Any errors or omissions should be referred to the author so that these errors can be corrected
in future issues of this document.

GSGS8EAF
page 7
Table of Contents
Publication history.................................................................................................................. 3
Key Reviewers............................................................................................................. 3
Approval Record ......................................................................................................... 3
Revision History...................................................................................................................... 4
Preface ..................................................................................................................................... 5
Table of Contents.................................................................................................................... 6
List of Figures ......................................................................................................................... 8
List of Tables........................................................................................................................... 9
Related Documents .............................................................................................................. 10
Glossary................................................................................................................................. 12
1.0) IMF Design Requirements ............................................................................................. 14
1.1) Scope.................................................................................................................. 14
1.2) General Product Architecture.............................................................................. 14
2.0) General Description ....................................................................................................... 17
2.1) Principal Functions.............................................................................................. 17
2.2) Feature List ......................................................................................................... 17
2.3) Product Identification .......................................................................................... 17
3.0) Block Diagram ............................................................................................................... 18
3.1) Block Diagram..................................................................................................... 18
4.0) Mechanical Specifications ............................................................................................. 19
4.1) General ............................................................................................................... 19
4.2) Construction and Design..................................................................................... 19
4.3) IMF Physical Dimensions.................................................................................... 19
4.4) Weight................................................................................................................. 21
4.5) Grounding Strategy............................................................................................. 21
4.6) Paint/Finish ......................................................................................................... 21
4.7) Product Marking.................................................................................................. 21
4.7.1) Product Identification Label - Rear Vendor Identification Label ........... 22
4.7.2) Serial/PEC/Release (SPR) Label......................................................... 22
4.7.3) Warranty Void Label............................................................................. 23
4.7.4) Passband Identification Label ............................................................. 23
4.7.5) Interface Panel Identification................................................................ 23
5.0) Electrical Specifications ................................................................................................. 24
5.1) General ............................................................................................................... 24
5.1.1) Operating Conditions ........................................................................... 24
5.1.2) IMF Operating Specifications ............................................................... 26
5.1.3) Interface Specifications ........................................................................ 27
6.0) Environmental Specifications......................................................................................... 28
6.1) Climatic Requirements........................................................................................ 28
6.2) Structural Dynamics Requirements .................................................................... 30
7.0) Electromagnetic Environment........................................................................................ 32
7.1) Direct/Indirect Electrostatic Discharge Immunity ................................................ 32
7.2) Radiated Immunity .............................................................................................. 32

GSGS8EAF
page 8
8.0) Regulatory Requirements .............................................................................................. 33

8.1) General ............................................................................................................... 33
8.2) Electromagnetic Interference .............................................................................. 33
8.2.1) Radiated Emissions ............................................................................. 33
8.3) Product Safety .................................................................................................... 33
8.4) Materials Flammability ........................................................................................ 33
9.0) Quality Assurance and Qualification.............................................................................. 34
9.1) General ............................................................................................................... 34
9.2) Vendor Supplied Data......................................................................................... 34
9.3) Production Test Plan........................................................................................... 34
9.4) Product Qualification Tests ................................................................................. 34
9.5) Acceptance Testing ............................................................................................ 34
9.6) Traceability.......................................................................................................... 35
9.7) Reliability Monitor................................................................................................ 35
9.8) Workmanship Evaluation .................................................................................... 35
10.0) Preparation For Delivery.............................................................................................. 36
10.1) Packaging ......................................................................................................... 36
11.0) Product Changes ......................................................................................................... 37
12.0) Reliability Assurance ................................................................................................... 38
12.1) Reliability........................................................................................................... 38
12.2) Product Reliability Growth................................................................................. 38
12.3) Shipped Product Quality Level.......................................................................... 38
12.4) Statistical Process Monitoring........................................................................... 39

GSGS8EAF
page 9
List of Figures
Figure 1: Single Carrier Block Diagram ................................................................................. 15
Figure 2: Two Carrier Block Diagram..................................................................................... 15
Figure 3: Single Carrier Block without Duplexer .................................................................... 16
Figure 4: Two Carrier Block without Duplexer ....................................................................... 16
Figure 5: IMF Block Diagram ................................................................................................. 18
Figure 6: General IMF Envelope Drawing.............................................................................. 19
Figure 7: IMF Dimensions...................................................................................................... 19
Figure 8: Grounding Diagram ................................................................................................ 19
Figure 9: Preferred Connector Locations............................................................................... 19
Figure 10: Labelling Diagram................................................................................................. 20
Figure 11: Warranty Label ..................................................................................................... 23

GSGS8EAF
page 10
List of Tables
Table 1:
Table 2:
Table 3:
Table 4:
Table 5:
Table 6:
Product Structure .................................................................................................... 17

Identification Labels ................................................................................................ 23
Summary of Operating Conditions........................................................................... 24
Physical Interface..................................................................................................... 27
Climatic Requirements............................................................................................. 28
Dynamic Requirements............................................................................................ 30

GSGS8EAF
page 11
Related Documents
The following documents, of the issue in effect on the date of purchase order, form part of this
specification to the extent specified herein:
[1]
Network Equipment - Building System, Generic Equipment Requirements, Bellcore GR63-CORE, Issue 1, October 1995.
[2]
Reliability Prediction Procedure for Electronic Equipment, Bellcore Technical Advisory

TA-NWT-000332, Issue 4, September 1992.
[3]
Electromagnetic Compatibility and Electrical Safety Generic Criteria for Network Telecommunication Equipment, Bellcore, GR-1089-CORE, Issue 1, November 1994 and revision 1, December 96.
[4]
General Requirements of OEM Material, NPS50561 General specification, Issue 3.
[5]
FCC, Part 15 of Title 47, Code of Federal Regulations, Title 47 - Telecommunications,

Part 15.
[6]
FCC, Part 22, Subpart H, Broadband PCS.
[7]
NT Corporate Standard 2701.01, Visual Determination and Instrumental Evaluation of

NT Standard Colours.
[8]
NT Corporate Standard 5014.00, Serialization Codes for Telecommunication Products.
[9]
NT Corporate Standard 9017.00, Vendor Labels.
[10]
NT Corporate Standard 9101.00, Product Safety and Policy Objective.
[11]
NT Corporate Standard 9101.01, Product Safety Reference data.
[12]
Safety of Information Technology Equipment, UL 1950, Third Edition.
[13]
Underwriter Laboratories (UL) Standard UL94.V1.
[14]
Electromagnetic Compatibility for Electrical and Electronic Equipment, Part 5: Surge Immunity Requirements, IEC 801-5.
[15]
CISPR Publication 22, First Edition 1985, Second impression 1991, International Special Committee on Radio Interference.
[16]
EIA-TIA-422-B, 1993, Electrical Characteristics of Balanced Voltage Interface Circuitry
[17]
Can/CSA-C22.2, No. 950-95, Safety of Information Technology Equipment, Including

Electrical Business Equipment, A National Standard of Canada.
[18]
Basic Environmental Testing Procedures, Tests A: Cold, IEC 68-2-1, fifth edition, 1990.
[19]
Basic Environmental Testing Procedures, Tests B: Dry Heat, IEC 68-2-2, Second Impression, 1987.
[20]
Basic Environmental Testing Procedures, Tests N: Change of Temperature, IEC 68-214, fifth edition, 1984.
[21]
Basic Environmental Testing Procedures, Tests Ea and guidance: Shock, IEC 68-2-27,
third edition, 1987.
[22]
Basic Environmental Testing Procedures, Test Ee and guidance: Bounce: IEC 68-2-55,

GSGS8EAF
page 12
first edition, 1987.

[23]
Basic Environmental Testing Procedures, Electrostatic discharge immunity, IEC 10004-2, first edition, 1995.
[24]
Basic Environmental Testing Procedures, Electrical fast transient/burst immunity test,

IEC 1000-4-4, first edition, 1995.
[25]
Degree of Protection Provided by Enclosures, IEC 60529, second edition, 1989.
[26]
Basic Environmental Testing Procedures, Testing and Measurement Techniques :

Surge Immunity, IEC 1000-4-5, 1995.
[27]
Bell Canada Design Standard for Electromagnetic Compatibility Requirements and Test
Methods, TAD 8465, Issue 3, March 1992.
[28]
General Requirements for OEM Equipment, NPS50561, Issue 3, April 91.

GSGS8EAF
page 13
Glossary
Term/Abbreviation
Meaning
ascii format
A band
North American cellular tx frequencies 869.04 - 879.99 MHz and 890.01

- 891.48 MHz
AM
amplitude modulation
B band
North American cellular tx frequencies 880.02 - 889.98 MHz and 892.51

- 893.97 MHz
BTS
800 CDMA base station
Celsius
CDMA
code division multiple access
CF
centre frequency
cm
centimeters
CPC
common product code
Cpk
capability index
CRC
cyclic redundancy check
DC
direct current
electric
EEPROM
electronically erasable and programmable read only memory
EMC
electromagnetic compatibility
ESD
electrostatic discharge
gram
GS
general specification
integer format
2
I C
inter integrated circuit
IMF
interference mitigation filter
IP3
input 3rd order intercept point
kg
kilograms
kmph
kilometres per hour
lbs
pounds
LNA
low noise amplifier
meter
mA
milliampere
MHz
megahertz
mV
millivolts

GSGS8EAF
page 14
Term/Abbreviation
Meaning
ms
millisecond
NF
noise figure
OEM
original equipment manufacturer
PA
power amplifier
PCS
personal communication system
p-p
peak to peak
rad
radians
rms
root mean square
RF
radio frequency
Rx
receiver
I8
signed integer format
SCHPA
single carrier high power amplifier
SCPA
single carrier power amplifier
SFRM
single carrier RF module of BTS system
SPR
serial/PEC/release code
Tx
transmitter
microprocessor in TRM
microsecond
microwatt
volts
Vrms
root mean squared voltage
VSWR
voltage standing wave ratio
watts

GSGS8EAF
IMF Design Requirements page 15
1.0 IMF Design Requirements

1.1 Scope
This general specification describes the interference mitigation filter (IMF) for the cellular
frequency band. This document is intended to be used by the vendor as a specification
guideline in designing and manufacturing the IMF.
1.2 General Product Architecture

The IMF is intended to be used in the cellular environment when the CDMA base station has
been identified to cause interference to other cellular systems.
Although the duplexer, post HPA, provides CDMA receive band filtering, the IMF provides
additional rejection of the CDMA transmit spurious noise over the receive or transmit bands of
other collocated cellular systems.
The five available variants are as follows,
Table 1: IMF Variants
CDMA Channels
PEC
Centre Frequency (MHz)
157, 199, 241- 42 channel spacing

160, 201, 242 - 41 channel spacing
NTGS8EBD
875.97

NTGS8EBE
877.23

NTGS8EAF
882.78

NTGS8EAG
884.04
NTGS8912
886.56
The first two variants are deployed in the cellular, transmit A band (A band) and provide high
rejection for the North American SMR frequencies (856 - 866 MHz, 896 - 906 MHz). These two
variants provide adequate filtering for deployment of the first (starting at primary channel) four
contiguous channels in the A band with the current 25 W SCPA.
The last three variants are deployed in the transmit, cellular B band (B band ) and provide high
rejection for the international GSM frequencies (890 - 915 MHz). These three variants provide
adequate filtering for deployment of the first (starting at the primary channel) six contiguous
channels in the B band with the current 75W PA (MCPA).
The unit, NTGS8EAF, may also provide adequate filtering for a 100 W PA. This remark is
supported by data from the evaluation of a prototype 100 W PA (SCHPA).

GSGS8EAF
page 16 IMF Design Requirements
Although there are five variants, there are only two configurable designs to be qualified for the
first four variants. The A band design is tunable over both A band variants and the B band
design is tunable over both B band variants. Note that the IMF filters will be configurable by IMF
vendor only and not by customer or field personnel. A configurable design refers to a common
filter housing, ceramic puck support structure and ceramic puck profile and temperature
compensation.
There are six possible electrical locations for the IMF; between the HPA and duplexer
(Figure 1 ), between the two channel combiner and duplexer (Figure 2 ), between the HPA and
antenna (Figure 3 ) , between the two channel combiner and antenna (Figure 4 ), between the
Multi-Channel Power Amplifier and duplexer (Figure 5 ) or between the Multi-Channel Power
Amplifier and antenna (Figure 6 ).
Figure 1: Single Carrier Block Diagram
HPA
IMF
Duplexer
Figure 2: Two Carrier Block Diagram

HPA #1
Combiner
IMF
Duplexer
HPA #2
Figure 3: Single Carrier Block without Duplexer
HPA

IMF
GSGS8EAF
IMF Design Requirements page 17
Figure 4: Two Carrier Block without Duplexer
HPA #1
Combiner
IMF
HPA #2
Figure 5: Three Carrier Block with Duplexer
MPAM
IMF
DPM
Figure 6: Three Carrier Block without Duplexer
MPAM
IMF

GSGS8EAF
page 18 General Description
2.0 General Description

2.1 Principal Functions
1.
High rejection over the SMR frequency band (856 - 866 MHz, 896 - 901 MHz), GSM
receive band (890 - 915 MHz) and other cellular system frequency bands.
2.2 Feature List

1.
Low insertion loss throughout entire passband bandwidth.
2.
Low phase, amplitude ripple and integrated mean square phase error over entire
passband.
3.
Low group delay over the entire passband.
4.
Environmentally hardened module.
2.3 Product Identification

Centre
Frequency
(MHz)
Engineering
Code
Common
Product
Code
875.97
NTGS8EBD
A0769989
877.23
NTGS8EBE
A0769990
882.78
NTGS8EAF
A0769981
884.04
NTGS8EAG
A0769982
886.56
NTGS8912
A0554976
Table 2: Product Structure

Note
1. Release number will be provided by the Nortel Component Engineering Department, W469.

GSGS8EAF
Block Diagram page 19
3.0 Block Diagram

3.1 Block Diagram
The IMF is passive filter with one input and one output connection. The IMF passband is at
least three CDMA channels wide (3.78 MHz) and the passband must be configurable over the
entire relevant band.
Figure 7: IMF Block Diagram
Output port
To Duplexer
Input port
From Combiner or HPA

GSGS8EAF
page 20 Mechanical Specifications
4.0 Mechanical Specifications

4.1 General
The following section provides the mechanical specifications for all IMF. Refer to ADGS8EAF
latest stream and issue for the exact requirements.
Figure 8: General IMF Envelope Drawing
4.2 Construction and Design

It shall be the responsibility of the IMF supplier to obtain from the NORTEL Component
Engineering Department all required information regarding items referred to by the CPC or
specification number.

GSGS8EAF
Mechanical Specifications page 21
4.3 IMF Physical Dimensions

Figure 9: IMF Dimensions

GSGS8EAF
Figure 10: Preferred Connector Locations

GSGS8EAF
Figure 11: Labelling Diagram
Product Identification Label
Back Face
IMF Band Label

Tx In F2
F1 Tx Out
SPR Label
Front Face

GSGS8EAF
The IMF supplier shall comply with the dimensional requirements as shown in Figure 9 , all
dimensions which are underlined are critical while dimensions not underlined can be
negotiated with Nortel. Connectors shown in Figure 10 are in the preferred sequence and
preferred locations although these may vary with Nortel approval. All dimensions are given in
inches with a tolerance of 0.005 inches for all dimensions in the range of 0 - 11.999 inches; a
tolerance of 0.01 inches for dimensions in the range of 12 - 23.999 inches unless otherwise
specified.
The IMF form factor must be approved by Nortel.
4.4 Weight
The IMF shall not exceed 17.5 lbs(8 kg).
4.5 Grounding Strategy

Grounding to the tray is provided through the PEM screws at the front of the unit.
4.6 Paint/Finish
Pretreatment: Conform to Nortel Finish #1003 Specification Section 5, Appendix A
Top Coat: Black Mini Texture, Nortel Finish 1003 Specification, per Observational Standard S30501
4.7 Product Marking

The manufacturing labels described in the following sections shall be situated as shown in
Figure 11 . The labels shall be affixed using a pressure sensitive adhesive. Any adhesive
which is found to secure the labels permanently during the product life is acceptable. Artwork
shall be plotted with a minimum resolution of 600 dots per inch. The edges of borders shall be
clean cut and as free from feathering as good commercial practice will permit. All label designs
shall be submitted to NORTEL for approval prior to production.
4.7.1 Product Identification Label - Rear Vendor Identification Label

The rear product identification label for the IMF will include:
-Vendor Model Number which is arbitrarily chosen by the vendor.

GSGS8EAF
-Vendor Product Serial Number which is arbitrarily chosen by the vendor and compliant to the
guidelines defined in the Nortel Corporate Standard 5014.00, Serialization Codes for
Telecommunications Products. The vendor must utilize an ISO accredited resource to control
their serial numbers. They must have the capability to ensure there are no duplicate serial
numbers generated.
-Nortel Common Product Code (CPC) which is compliant to the guidelines defined in the Nortel
Corporate Standard 1517.00 - Labels and Marking. See Table 1, IMF Product Structure, for
appropriate 8 digit alpha-numeric CPC.
-Product Engineering Code (PEC) which is compliant to the guidelines defined in the Nortel
Corporate Standard 1517.00 - Labels and Marking. See Table 1, IMF Product Structure, for
appropriate 8 digit alpha-numeric PEC.
-Nortel Current Release (Rel XX) which is compliant to the guidelines defined in the Nortel
Corporate Standard 1517.00 - Labels and Marking, where XX is a two-digit number assigned
by the Nortel Component Engineering.
-Product Manufacturing Date Code. This label shall indicate the week and year of manufacture
of the IMF. The week format shall follow the Nortel Week Calendar for the given year. Refer to
the Nortel Corporate Standard 1516.00 - Product Date Codes, for additional guidelines.
-Description of the IMF.
The specific rear panel location, orientation and size of the label is at the discretion of the vendor
but subject to approval by Nortel Component Engineering. Use Nortel Corporate Standard
1517.00 - Labels and Marking (Section 4.5).
4.7.2 Serial/PEC/Release (SPR) Label

The Serial/PEC/Release (SPR) barcode label is used for asset and product management by
NORTEL.
The label shall be affixed to the IMF module as shown in Figure 11 .
-Contact Nortel Component Engineering Prime for the appropriate serial number.
-Contact Nortel Component Engineering Prime for the two digit numeric release number.
-See Table 1, IMF Product Structure, for appropriate 8 digit alpha-numeric PEC.
Contact Nortel Component Engineering Prime for SPR label requirements and standards
reference internal drawing numbers 3298-01a.

GSGS8EAF
4.7.3 Warranty Void Label

The Warranty Void Label shall be affixed over a screw head or package joint so that the label
must be removed to gain access to the internal portion of the module. Any material and
adhesive combination which ensures destruction of the label upon removal is acceptable. An
example of content of label is shown in Figure 12 .
Figure 12: Warranty Label

Warranty
void if seal
broken.
4.7.4 Passband Identification Label

The module band type identification label shall be affixed to the IMF as shown in Figure 11 .
The label shall contain the following information, in Table 3, which is referenced to the module
band type:
PEC
Label
NTGS8EBD
875.97 MHz
NTGS8EBE
877.23 MHz
NTGS8EAF
882.78 MHz
NTGS8EAG
884.04 MHz
NTGS8912
886.56 MHz
Table 3: Identification Labels

4.7.5 Interface Panel Identification
All RF connectors will be identified as Approximate location for placement is given, precise
location is at discretion of the supplier
Font:
Univers 67
Size:
11pt
Color:
Font - BTS Light Grey, Pantone 427C (Nortel Observational Standard S-33470)
Background - Black, Pantone process black C

GSGS8EAF
Electrical Specifications page 27
5.0 Electrical Specifications

5.1 General
The following section provides the electrical specifications for interference mitigation filter. The
IMF must meet all electrical specifications defined herein for all environmental, material and
manufacturing variations to a 95% confidence factor. The intent of the 95% confidence factor
is to remove the measurement uncertainty of the measurement equipment out of the test
results.
5.1.1 Operating Conditions

The IMF shall start and operate within its electrical specifications over any combination of the
following conditions:
Parameter
Specification 1
Average =100 W
Average = 130 W (Note 5)
peak to average ratio =11.76 dB
Max Tx Input Power Peak Conditions

(Note 1,4)
Peak to average ratio = 11 dB

(Note 6)
Source match = 20 dB
Load match = 9 dB
Altitude = 1800 m
Temp = 85 C
CDMA source (Note 4)
Max Tx Output Power
100 W
(Note 2 )
130 W (Note 5)
min. -40 C
Temperature (Case)
(Note 3)
max. +85 C
max. +75 C (Note 7)
Table 4: Summary of Operating Conditions
Notes
1. The effective peak power resulting from the conditions stated in the peak power
specification must not create arching within the IMF with peak power and average
power applied.

GSGS8EAF
page 28 Electrical Specifications
2. VSWR at antenna port of 1.5:1

3. The electrical specifications must be also satisfied for all environmental conditions
outlined in section 6.0 - Environmental Specifications.
4. CDMA sources is as follows,
Chip rate = 1.2288 Mchips/s
Walsh codes = 0 (pilot), 1 (paging), 32 (sync), [3,5,7,9 ..., 63] (31 traffic channels)
Pilot = 20 % of total power
Paging = 3dB higher that any single traffic channel
Sync = 3dB lower than any single traffic channel
Traffic channels = equal power
All zero data pattern for pilot
Random data pattern for all other channels
5. The max Tx input and output power for the NTGS8912 will be 130 W rather than 100
W.
6. The peak to average ratio will be 11 dB rather than 11.76 dB for the NTGS8912.
7. The highest temperature will be + 75 C for outdoor deployment of the NTGS8912.

GSGS8EAF
5.1.2 IMF Operating Specifications

Parameter
Specification
A Band Configurable Bandwidth
869.0 - 880.0 MHz
B Band Configurable Bandwidth
880.0 - 893.5 MHz
Absolute Minimum Passband
3.78 MHz
Passband Max. Ripple
0.30 dB
0.60 dB/channel
Passband Max. Integrated Mean Square

Phase Error
Passband Max. Insertion Loss
0.0004 rad2
0.008 rad2 (for
NTGS8912)
1.05 dB
1.2 dB
Passband Min. Return Loss
15 dB
14 dB (for
NTGS8912)
Comment
Note 1
Note 1, 5
Note 1, 5
Note 1, 2, 3
Note 1, 2
Note 6
20 dB at room temperature
18 dB at room temperature (for NTGS8912)
Frequency Selectivity for any TX Channel with reference to Passband over the
following frequency ranges (note 6):
DC - 776 MHz
776 - 820 MHz
820 - 824 MHz
824 - 834 MHz
834 - 849 MHz
856 - 866 MHz
890 - 915 MHz (NTGS8912 only)
890 - 915 MHz (NTGS8EAG only)
890 - 915 MHz (NTGS8EAF only)
896 - 906 MHz (NTGS8EBD, NTGS8EBE
only)
920 - 1710 MHz
1710 - 1790 MHz
1790 - 2000 MHz
2600 - 2690 MHZ
60 dB
40 dB
62 dB
85 dB
90 dB
65 dB
55 dB
80 dB
65 dB
38 dB
77 dB
77 dB
98 dB
40 dB
56 dB

CDMA RX Band
CDMA RX Band
SMR Rx Band
GSM
GSM
SMR Tx Band
DCS
DCS
DCS
GSGS8EAF
page 30 Electrical Specifications
Parameter
Specification
Maximum Passive Intermodulation Products (falling with 890 - 915 MHz

and 855 - 866 MHz)
-87 dBm
Note 4
Channel Passband Max. Group Delay

Variation
75 nsec
300 nsec
Over 95% of passband

For entire passband of the
NTGS8912.
Absolute Group delay at passband Centre

Frequency
Comment
Maximum 305 nS
Minimum 255 nS
Maximum 250 nS
Minimum 175 ns
For all other variants

For NTGS8912
Notes
1. Over entire operational temperature
2. Over entire channel passband.
3. Integrated Mean Square Phase Error is defined as the integral, over any 1.26 MHz interval
in the passband, of the square of the difference between the phase and a straight line
spanning the passband which minimizes the integral.
4. Produced with two +44 dBm tones with any separation applied at the Tx input port. This
specification is not applicable to the NTGS8912.
5. Variation between maximum and minimum insertion loss in passband.
6. The insertion loss for the NTGS8912 is 1.2 dB measured as the average insertion loss/
channel.
5.1.3 Interface Specifications
Signal
Description
Connector
Type (Note 1)
Tx In
From HPA/Combiner or
MPAM
F2
N type
Tx Out
To Duplexer
F1
N type
Table 5: Physical Interface

Notes

GSGS8EAF
1. A female N type, tarnish resistant, connector with 50 microinch gold over non nickel
center pin and 200 microinch silver (or non nickel plating) over brass body. The
connector must IP67 quality; to ensure environmental and EMI containment the
connector mounting must also be an IP67 quality. The N type connectors shall be
Rosenberger or Huber & Suhner components or equivalent manufacturer provided it
meets the above detailed specification.

GSGS8EAF
page 32 Environmental Specifications
6.0 Environmental Specifications

The IMF is intended primarily for use in the MetroCell product, and as such it must allow the
entire RF module to pass the testing specified in the BTS Product Specification Agreement. The
pertinent requirements are documented below. The IMF shall be capable of meeting all
electrical specifications over the following environmental conditions.
6.1 Climatic Requirements

The IMF is intended to withstand the environments encountered during use, shipping and
installation.
The applicable standards are:
Environmental Standards:
Bellcore GR-63-CORE, Issue 1
Test Method Standard: IEC 68-2
Test Name
Requirement and Source
Test Method
High Temperature
Operation
This product shall be able to operate

within specification at 85C.
IEC 68-2-2 Test Bd: Dry Heat. Test

duration is 2 hours. The functional
performance of the unit must be
monitored for the duration of the test.
Low Temperature
Operation

within specification at 40C.
IEC 68-2-1 Test Ab: Cold. Test duration is 2 hours. The functional performance of the unit must be monitored
for the duration of the test.
Altitude

within specification from 60m below
sea level to 1800m above sea level in
accordance with Bellcore GR-63CORE Section 4.1.3.
IEC 68-2-13
Operating Relative
Humidity
This product shall be able to operate at

5% to 95% humidity (but not exceeding 0.024 kg of water per 1kg of dry
air) in accordance with Bellcore GR63-CORE Section 4.1.2.
The test procedure for operating relative humidity is defined by IEC 68-2-3
Test Ca: Damp Heat Steady State.
Table 6: Climatic Requirements

GSGS8EAF
Environmental Specifications page 33

Test Name
Test Method
Rate of Change of
Temperature

during temperature changes of 30C
per hour in accordance with Bellcore
GR-63-CORE Section 4.1.2. This rate
is applicable at the system level. At
this time, the temperature rate of
change applicable to the IMF, in its
application, is unknown but is
expected to increase.
The test procedure for rate of change is

defined by Bellcore GR-63-CORE
section 5.1.2.
Temperature
Cycling
This product shall be able to operate at

-40C and 85C when being subjected
to 20 cycles between these temperatures.Temperature dwell periods at
each temperature extreme shall be 1
hour.
IEC 68-2-14, 5th edition, 1984 including amendment 1, April 1986.
High Temperature
Storage and Thermal
Shock
The product must be exposed to 70C

for 72 hours, followed by a successful
functional test, in accordance with
Bellcore GR-63-CORE Section
4.1.1.2.
The test procedure for high temperature storage is defined by Bellcore GR63-CORE Section 5.1.1.2.
Low Temperature
Storage and Thermal
Shock
The product must be exposed to -40C

for 72 hours, followed by a successful
functional test, in accordance with
Bellcore GR-63-CORE Section
4.1.1.1.
The test procedure for low temperature

storage is defined by Bellcore GR-63CORE Section 5.1.1.1.
High Humidity Storage
The product must not sustain any damage or deterioration after 96 hours of
exposure to 40C at 90-95% RH, followed by a successful functional test,
in accordance with Bellcore GR-63CORE Section 4.1.1.3.
The test procedure for high humidity

storage is defined by Bellcore GR-63CORE Section 5.1.1.3.
Dust Tightness
The product shall be weathertight with

respect to dust accumulation after
being exposed to wind driven dust
according to Bellcore GR-487-CORE
section 3.29
The test procedure for dust tightness is

defined as per Bellcore GR-487CORE section 3.29.
The product shall be able to withstand

water intrusion as per Bellcore GR487-CORE section 3.27 and IEC
60529 Second Edition Nov. 89- IP66,
Clause 6 with respect to protection of
equipment against ingress of water
with harmful effects.
The test procedure for water tightness

is defined as per IEC 60529 Second
Edition Nov. 89-IP66 Clause 6 and
Bellcore GR-487-CORE section 3.27
with no water ingress into the module
(Protection)
Water Tightness
(Protection)

GSGS8EAF
page 34 Environmental Specifications

Test Name
Test Method
Corrosion Resistance- Salt Fog
The product shall be able to withstand

corrosion as per Bellcore GR-487CORE section 3.35.
The test procedure for corrosion resistance is defined in Bellcore GR-487CORE section 3.35.
6.2 Structural Dynamics Requirements

The applicable standards are:
Mechanical standards:
Bellcore GR-63-CORE, Issue 1
Test method standard: IEC 68-2
The table below summarizes the mechanical requirements.
Test Name
Test Method
Packaged Drop
The packaged product shall sustain no

physical or functional damage after
being subjected to a series of free falls
onto a hard surface in accordance with
Bellcore GR-63-CORE Section 4.3.1,
Category A
The test procedure for handling drop is

defined by Bellcore GR-63-CORE
Section 5.3.1.
Transportation
Shock
The packaged equipment shall function within specification after the

application of the following shock
pulses:
Test method: IEC 68-2-27 [7], Test Ea

Shock
Transportation
Bounce
50 g, 11 ms, half sine

pulse
3 successive shocks in
each direction of 3
mutually perpendicular
axes (18 shocks total).
The packaged product shall sustain no

physical or functional damage after
being subjected to repeated impact
loads. IEC-68-2-55, Test Ee:Method
A, 1.1 to 1.2g, 6 sides with a 90C horizontal rotation 1/2 thru each side. 180
minutes total test time.
IEC-68-2-55 Test Ee
Table 7: Dynamic Requirements

GSGS8EAF
Environmental Specifications page 35

Test Name
Test Method
Unpackaged Shock/
Drop
This product shall not sustain any

physical damage or deterioration in
functional performance when subjected to unpackaged drop tests in
accordance with Bellcore GR-63CORE Section 4.3.2.
This package shall not be dropped

directly on connectors as they would
be expected to be damaged. The test
procedure for unpackaged drop is
defined by Bellcore GR-CORE Section 5.3.2
Shock (Module)
The unpackaged product shall be able

to withstand three 30g, 11ms, 1/2 sine
shock pulses in each direction of the
three mutually perpendicular axes. (18
shocks total)
IEC 68-2-27 Test Ea
Operational Vibration
This product shall have no damage or

loss of function while being subjected
to vibrations of magnitude1.0 g peak
acceleration applied over the frequency range of 5 - 200Hz, @ 0.25
octaves/minute in accordance with
Bellcore GR-63-CORE Section 4.4.3.
The test procedure for Office Vibration

is defined by Bellcore GR-63-CORE
Section 5.4.2-Alternative Test Procedure for Electronic Subassemblies
Only.
Transportation
Vibration
The product shall have no physical or

functional damage after being subject
to vibrations in each axis in accordance with Bellcore GR-63-CORE
Section 4.4.4.-Curve 2
The test procedure for Shipping Vibration is defined by Bellcore GR-63CORE Section 5.4.3.
Table 7: Dynamic Requirements

GSGS8EAF
page 36 Electromagnetic Environment
7.0 Electromagnetic Environment

The IMF shall meet all electromagnetic standards detailed in this section.
7.1 Direct/Indirect Electrostatic Discharge Immunity

The IMF shall be able to withstand, without damage, direct contact ESD up to 8kV at any contact
point other than connector pins. The IMF shall be able to withstand direct air discharges upto
15kV, without damage, to any point except connector pins. Contact discharges shall be
applied in indirect mode of application up to 8 kV. The suitable tests method are defined in IEC1000-4-2.
7.2 Radiated Immunity

The IMF shall meet the radiated immunity requirements at a system level, in section 3.3.1 of the
Bellcore document GR-1089-CORE, with a 3 dB test margin. The test signal is detailed in
section 3.3 and the test procedure is found in section 3.4.
10 kHz - 1 GHz, when the interfering RF is modulated with an 80% AM 1 kHz tone.
1 GHz - 10 GHz, when the interfering RF is pulse modulated with 1s pulsewidth and 1 kHz
repetition.
7.3 Electrical Fast Transient

The IMF shall withstand Electrical Fast Transients with no perceptible loss of operation when
subjected to disturbance on Antenna port. The requirement is IEC-1000-4-4 level 2 with a
suitable test method provided by that document.

GSGS8EAF
Regulatory Requirements page 37
8.0 Regulatory Requirements

8.1 General
The IMF shall meet all Regulatory standards detailed in this section when integrated into the
RFM at a system level. All regulatory requirements and standards shall be met at the system
level, when incorporated into Nortels product, over any combination of the operating conditions
outlined in this document for all IMF configurations. Nortel will provide system level data that
verifies regulatory compliance. The vendor shall ensure that corrections to the IMF will be made
if non-compliances are found that are directly related to their design. Changes to the IMF must
continue to conform to these requirements and will be managed by a Change Review process.
8.2 Electromagnetic Interference

8.2.1 Radiated Emissions
The IMF shall comply with FCC part 15 and CISPR 22 Class B limits when integrated in to a
Nortel system. Emissions levels shall not exceed 6 dB below the limits specified.
The IMF shall not exceed 6 dB below the radiated emissions requirements for doors closed,
class B equipment in sections 3.2.1 and 3.2.2 in the Bellcore document GR-1089-CORE.
Also, the radiated emission levels should not exceed 6 dB below the objective specified in Bell
Canada TAD 8465 section E1B which is similar to GR-1089-CORE but with different limits
depending on the distance.
8.3 Product Safety

The IMF shall be designed to meet and comply with the requirements of CSA-C22.2 No. 60950 / UL
60950, since it will be evaluated in the end-use system to this standard. The IMF shall also meet the
requirements of IEC 60950.
8.4 Materials Flammability

All IMF configurations shall comply with Bellcore GR-63-CORE, Section 4.2.3-Use of FireResistance Materials, Components, Wiring and Cables

GSGS8EAF
page 38 Quality Assurance and Qualification
9.0 Quality Assurance and

Qualification
9.1 General
Requirements for quality assurance and qualification shall be in accordance with NPS50561,
except as specified differently in the section.
9.2 Vendor Supplied Data

Each IMF shall be supplied (upon request) with test data as a proof of their performance. The
test data must consist of all electrical parameters (at room temperature), serial number, CPC,
date of testing and name of person performing the test. The supplier must maintain this data
on their premises in an electronic format agreeable to the Nortel Component Engineering.
9.3 Production Test Plan

The IMF supplier testing shall be performed in accordance with the requirements specified
within this document. IMF testing shall be performed in accordance with a test plan and
procedures developed by the supplier and approved by NORTEL
9.4 Product Qualification Tests

Qualification testing shall consist of detailed measurements and environmental exposure to
determine that the major components/subsystems performance characteristics have been
achieved prior to conducting acceptance tests. NORTEL reserves the right to witness and
monitor the qualification tests to be conducted at the suppliers facility or other NORTEL
approved locations. The test plan and procedures shall include specific pass/fail criteria and
shall thoroughly demonstrate complete compliance of the equipment with all applicable
performance specifications.
It is the responsibility of the vendor to perform all tests necessary to verify the performance of
the IMF against the specifications outlined in section 6.0, of this document, refer to the current
qualification plan, OEM Module Level Qualification Plan.
9.5 Acceptance Testing

Each deliverable IMF, when fabricated, shall undergo acceptance testing to verify proper
workmanship, identify manufacturing defects and determine that all components of the IMF
function properly before delivery.

GSGS8EAF
Quality Assurance and Qualification page 39
9.6 Traceability
For auditing purposes, the IMF supplier shall retain all original notes, test data and prototypes
for a period of one calendar year. The supplier shall supply this information to NORTEL, FCC,
IC, or CSA when requested.
9.7 Reliability Monitor

The supplier shall establish a reliability program which provides for environmental stress testing
on a sample basis. The test results shall be made available to NORTEL upon request.
9.8 Workmanship Evaluation

The IMF shall be dismantled, where necessary, to allow inspection. The IMF shall conform to
NPS50561.

GSGS8EAF
page 40 Preparation For Delivery
10.0 Preparation For Delivery

10.1 Packaging
Items covered by this specification shall be packaged in a manner which will provide protection
against damage during shipment, handling and storage in reasonably dry, unheated quarters.
Packing shall be in accordance with NPS50561.
The package label (human readable format) must be clearly present on the outside of the
product packaging. The label must include the following.
-CPC
-PEC
-release number
-date code
-Nortel purchase order number
-lot number
-vendor name
-product description
The label must be clearly visible when packages are vertically stacked. The labels must be
compliant with the following standards:
Nortel Common Product Code, Corporate Standard 9017, Vendor Labels.
Nortel Product Engineering Code, Corporate Standard 9017, Vendor Labels.
Nortel Current Release Code (Contact Component Engineering Prime for current
release number), Corporate Standard 9017, Vendor Labels.
Each individual package shall not exceed 30 lbs in total weight.

GSGS8EAF
Product Changes page 41
11.0 Product Changes

Seller shall provide a Manufacturing Baseline defining the criteria requiring Change
Management Approved by Nortel, for each Product. The Manufacturing Baseline will include
(i) production processes, (ii) test processes, (iii) critical components and (iv) module pass/fail
criteria, and shall be mutually agreed upon by both Parties.
Seller shall notify the Nortel component engineering prime for a Product of all changes affecting
the design or manufacture of the product. Any change covered by the Manufacturing Baseline
will require the written approval of the Nortel component engineer.
The Manufacturing Baseline shall at the request of either party be reviewed and if mutually
agreed changed.
Approval by Nortel of a Sellers request for change shall not waive the Sellers obligation, and
in no way shall relieve the Seller of their obligation, to meet or exceed all the specifications for
a Product.

GSGS8EAF
page 42 Reliability Assurance
12.0 Reliability Assurance

The intent of this section to define the reliability and quality requirements for this product and to
ensure that it will be able to meet all technical specifications through its life time.
12.1 Reliability
The vendor shall commit, on a best efforts basis to a targeted total annualized field return rate
of the IMF in the first year of production of less than or equal to 2.25 %, less than or equal to
1.25 % for the second year and for on going years of less than or equal to 1.00 %. The field
return rate is determined from the total failures, due to random component failure workmanship,
manufacturing error and latent design flaws, of all shipped IMF product operating under normal
conditions (see sections 5.0 through 8.0). The vendor shall detail a mutually acceptable method
for calculating the field return rate.
The supplier will track and document all field performance data on all deployed products to
customers. In the event of a product failure in the field, Nortel shall ship failed units to the
supplier in a timely manner. The supplier will analyze the failed units and release a report to
NORTEL describing the failures which were found. The report should include a failure log, a
Pareto of failure causes and the corrective actions to be implemented.
The field return rate of the IMF for the second year of production must improve compared to the
first year specifically due to improved manufacturing processes and/ or better component
selection, information acquired through failure analysis which is incorporated into the
production process. The product must not require re-qualification (see sections 6.0 through
8.0) to obtain the improvement in the total field return rate.
The vendor shall submit a projected rate of return report or MTBF report at the beginning of the
project.
12.2 Product Reliability Growth

During the ongoing manufacturing of this product, it is expected, as part of a joint commitment
to high quality products, that the supplier demonstrate a continual product reliability growth.
The supplier will provide information on which reliability growth model will be used to
demonstrate ongoing product reliability growth. The supplier must continually identify the
majority contributors to poor yield on this product and take the appropriate steps to address
these issues.
A report is required quarterly that illustrates the current reliability level and a list of actions that
were used to create growth. The report is to be issued to Department W469 (component
engineering) at Nortel.
12.3 Shipped Product Quality Level

GSGS8EAF
Reliability Assurance page 43
The shipped product quality level shall be 0.8 % in the first year and 0.8 % in the following years.
The shipped product quality level refers to the percentage of the annual defective product
compared to the total annual shipped product which are discovered during factory audits or
during product installation.
12.4 Statistical Process Monitoring

The vendor will implement Statistical Process Monitoring during production testing. Supplier
must provide a quarterly report of Cpk values measured on the following critical parameters of
this product: return loss (input and output), insertion loss, rejection for A band variants at 856 866 Mhz, rejection for A band variants at 896 - 906 MHz and rejection for B band variants at
890 - 915 MHz.

GSGS8EAF
page 44 Reliability Assurance

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BTS Systems/ Ratifier

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Reason for Change

Initial release of document

Lee Ager 2M22

Edits as per key reviewers

Lee Ager 2M22

Edits as per vendor review

Lee Ager 2M22

Includes variant frequencies

Lee Ager 2M22

Edits as per key reviewers

Lee Ager 2M22

Edits as per key reviewers

Lee Ager 2M22

Released into DDME

Lee Ager 2M22

Update to mechanical drawings

Lee Ager 2M21

Edits as per key reviewers

Lee Ager 2M21

Includes only four variants to be qualified.

Lee Ager 2M21

Updates as per key reviewers

Lee Ager 2M21

Lee Ager 2M21

Update electrical specs

Lee Ager 2M21

Update to mechanical drawings

Lee Ager 2M23

As per CR Q00687953 Updated to

Kathleen Neild 2U41

Updated Key Reviewers

Updated Table 1 from internal review

Kathleen Neild 2U41

Approved version submitted to DDME

Kathleen Neild 2U41

Added B-Band variant of IMF

Sarika Kapil 2U41

Interference Mitigation Filter

Reason for Change

Updated specs the following specs for

Sarika Kapil 2U41

- Clarified Passband max ripple.

- The PEC for NTGS8Exx is officially

Sarika Kapil 2U41

- Added Matt Conrod to the consultant

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Interference Mitigation Filter

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8.0) Regulatory Requirements .............................................................................................. 33

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Product Structure .................................................................................................... 17

Interference Mitigation Filter

Reliability Prediction Procedure for Electronic Equipment, Bellcore Technical Advisory

General Requirements of OEM Material, NPS50561 General specification, Issue 3.

FCC, Part 15 of Title 47, Code of Federal Regulations, Title 47 - Telecommunications,

FCC, Part 22, Subpart H, Broadband PCS.